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专用 IC
”共9794条产品，ICGOO在线商城所选择的供货商都经过严格筛选，垂直采购渠道透明，质量有保障。零件状态
- 在售
- 停產
- 最後搶購
- 初步
- Obsolete
- Active
- Discontinued at Digi-Key
- Last Time Buy
- Preliminary
- Not For New Designs
安装类型
- 表面贴装
- 通孔
- -
- Surface Mount
- Through Hole
包装
- 托盘
- 管件
- Digi-Reel®
- 剪切带（CT）
- 带卷（TR）
- 散装
- 带
- -
- Bulk
- Tray
- Cut Tape (CT)
- Tape & Reel (TR)
- Tube
- Strip
- Can
应用
- -
- DLP® Pico™ 投影仪
- 手机，数码相机，媒体播放器
- 手机，媒体播放器
- 网络和通信
- 远程安全访问，无键输入
- PCB，网络节点，设备识别/注册
- 基于处理器的系统
- 消费电子，DVD-RW 播放器，机顶盒
- 3D，医疗成像
- 模拟 I/O
- RF，IR
- 自动测试设备
- 音频
- 无线基础架构
- 图像处理和控制
- 移动通信
- 转换器，ACDC
- 汽车级
- 8 位 MCU 外设
- 控制系统
- 安全
- 显示器
- 心率监测
- 工业，照明
- 电池测试/化成系统
- 端口开关/网络接口
- 振荡器调谐
- 无匙门禁系统，家庭自动化，无线音频/视频
- 仪表
- 8 位或 16 位 MCU 外设
- 数据传输
- 宽带电话线网络
- 医用型
- LED 照明
- Authentication，Security
- Embedded, Smart Card
- 16 位 MCU 外设
- 无线网络
- Port Switch/Network Interface
- Cell Phones, Digital Cameras, Media Players
- Networking and Communications
- Wireless Infrastructure
- Automatic Test Equipment
- Authentication, Security
- Heart Rate Monitoring
- Consumer Electronics, DVD-RW Players, Set Top Box
- 3D, Medical Imaging
- Maximum Power Point Tracking (MPPT)
- Video
- Processor-Based Systems
- Battery Test/Formation Systems
- RF, IR
- Audio/Video, VCR's, Set-Top Boxes
- 16-Bit MCU Peripherals
- Instrumentation
- Security
- Keyless Entry, Home Automation, Wireless Audio/Video
- DLP® Pico™ Projectors
- Automotive
- Access Control Systems
- Image Processing and Control
- PCB, Network Node, Equipment Identification/Registration
- Cell Phones, Media Players
- T1/CEPT
- Ultrasound Imaging
- Remote Secure Access, Keyless Entry
- Accessory ID and Control, Industrial Controllers, LED Control, System Monitoring
- 8-Bit MCU Peripherals
- Wireless Networking
- Wireless
- Battery Level Indication
- Power Supply Controller
- HDTV, MPEG, Image Processing
- Health, Home, Security
- Control Systems
- Automation Control
- DLP® Pico™ Projectors, Mobile Sensing
- CAN Automotive
- Medical
- Digital Camera
- Factory/Home Automation
- Data Transport
- Wireless Communication Systems
- Power Line Networking
- Instrumentation Amplifiers
- DVI, HDMI Signal Switching
- Converter, ACDC
- Oscillator Tuning
- Remote Control
- Analog I/O
- Broadband Wireline Networking
- Cable Modem, Set Top Boxes
- Imaging, Video
- T1/E1/J1
- Displays
- PC's, PDA's
- Cable/DSL/PON Modems
- LED Lighting
- Industrial
- Mobile Communications
- Industry 4.0
- Automation
类型
- 数字微镜芯片（DMD）
- DLP PMIC, LED 驱动器
- 多路复用器
- 过压保护控制器
- 验证芯片
- 跳码编码器
- 硅序列号
- 处理器辅助元件
- HDMI 发射器
- 传感器接口
- 浮点协处理器
- 解码器
- DCL
- 功率放大器
- Serial RapidIO® 开关
- 数字控制器
- RGB LED 驱动器
- 电容器放电
- 驱动器
- 安全辅助芯片
- 可编程外设 IC
- 过压防护
- 存储器
- 跳码解码器
- 生物电势 AFE
- 差分链路
- AFE/PWM 控制器
- 频率转换器
- 10/100 集成开关
- ECG 前端
- 数字电容器
- 电子微调电容器
- 输出电路（放大器）
- 自动放电
- 收发器
- 机械样品
- TDM（分时复用）
- 宽带前端
- 八通道电爆驱动器和四通道传感器接口 ASIC
- LIN System Basis Chip
- 数据采集系统（DAS）
- -
- 参数测量单元
- PFC/PSR 控制器
- 端子
- Secure Memory
- HDMI 端口保护
- 点火线圈驱动器
- RF DAC
- 安全身份验证器
- 传动系统开关
- 低压侧开关
- 缓冲器，收发器
- 多队列流量控制
- 电源
- 每引脚参数测量单元（PPMU）
- 10/100 Integrated Switch
- Multiplexer
- Authentication Chip
- Terminal
- Power Supply
- ECG Front End
- Per-Pin Parametric Measurement Unit (PPMU)
- HDMI Port Protection
- Digital Micromirror Device (DMD)
- Cell-String Optimizer
- MPPT Controller
- Serial RapidIO® Switch
- Video Processor
- Processor Companion
- AFE/PWM Controller
- Multi-Queue Flow-Control
- Decoder
- NTSC/PAL Modulator
- Programmable Peripherals IC
- Transceiver
- Low-Side Switch
- Memory
- Electronically Trimmable Capacitor
- DLP PMIC, LED Driver
- Overvoltage Protection Controller
- Code Hopping Encoder and Transponder
- Digital Controller
- Powertrain Switch
- Piezo Sounder Driver
- Silicon Serial Number
- Jitter Attenuator
- Ultrasound Pulser
- Code Hopping Encoder
- Cryptographic Controller
- Addressable Switch
- Data Acquisition Systems (DASs)
- HDMI Transmitter
- Broadband Front-End
- Digital Capacitor
- Driver
- Digital Micromirror Device (DMD), Driver
- Flyback, Forward Converter
- CCD Signal Processor
- Floating-Point Co-Processor
- Overvoltage Protection
- Configuration PROM
- Digital Input
- Digital Micromirror Device (DMD), DLP PMIC, LED Driver
- Capacitor Discharge
- Frequency Translator
- Biopotential AFE
- Secure Authenticator
- System Basis Chip (SBC)
- Digital Micromirror Device (DMD), DLP PMIC
- TDM (Time Division Multiplexing)
- Sigma-Delta Modulator
- GUI Processor
- CCD Signal Processor, 14-Bit
- Error Detection and Handling (EDH)
- EDH Coprocessor
- Imaging Signal Processor
- Manchester Encoder/Decoder
- Clock Generator
- Resistor Network
- HDMI/DVI Switch
- Octal Squib Driver and Quad Sensor Interface ASIC
- Code Hopping Decoder
- Quad Squib Driver ASIC
- Quad Squib Driver and Dual Sensor Interface ASIC
- Encoder
- Passive Optical Network (PON) Triplexer
- Cellular Phone Data Formatter
- Electronic Circuit Breaker
- Fixed Code Encoder
- Sensor Interface
- Fire Lighting Circuit
- MMIC Oscillator
- Automatic Discharge
- Signal Retimer
- Security Companion Chip
- Sensor
- Protection Switch
- Holder
- Color Scanner
- TFT VCOM Calibrator
- Microcontroller
- Storage Capacitor Control IC
- Transmission Line Clamp
- PFC/PSR Controller
- Toaster Controller
- Output Driver
- RGB LED Driver
- Mechanical Sample
- IoT Secure Element
- CAN FD Controller
封装/外壳
- 100-BFCLGA
- 100-TQFP 裸露焊盘
- 24-UFQFN
- 10-WFDFN 裸露焊盘
- 8-SOIC（0.154"，3.90mm 宽）
- TO-236-3，SC-59，SOT-23-3
- 14-SOIC（0.154"，3.90mm 宽）
- 38-TFSOP（0.173"，4.40mm 宽）
- 模块
- 16-VFQFN 裸露焊盘
- 68-LCC（J 形引线）
- 18-SOIC（0.295"，7.50mm 宽）
- 18-DIP（0.300"，7.62mm）
- PowerSO-36 裸露顶部焊盘
- 399-BGA 裸露焊盘
- 176-VFBGA
- 49-UFBGA，DSBGA
- -
- 9-SIP
- 20-SOIC（0.295"，7.50mm 宽）
- 14-TSSOP（0.173"，4.40mm 宽）
- 80-LQFP
- 14-DIP（0.300"，7.62mm）
- 92-BFCLGA
- 30-WFBGA，WLBGA
- 20-WFQFN 裸露焊盘
- TO-226-3，TO-92-3（TO-226AA）（成形引线）
- 8-WFDFN
- 48-LQFP
- 40-VFQFN 裸露焊盘
- 128-BFQFP
- 20-WFQFN 裸露焊盘，CSP
- 400-BBGA，FCBGA
- 8-WQFN 裸露焊盘
- SOT-23-6 细型，TSOT-23-6
- 6-TSSOP，SC-88，SOT-363
- 128-BQFP
- 10-SIP
- 16-LBGA，FCBGA
- 576-BBGA，FCBGA
- 675-BGA 裸露焊盘
- 256-BGA，CSBGA
- 64-VFQFN 裸露焊盘，CSP
- 8-UFDFN 裸露焊盘
- 784-BBGA，FCBGA
- 64-LQFP
- 8-TSSOP（0.173"，4.40mm 宽）
- 8-VDFN 裸露焊盘
- 40-WFQFN 裸露焊盘
- 6-WDFN 裸露焊盘
- 100-LQFP
- 64-TQFP 裸露焊盘
- 28-WFQFN 裸露焊盘
- 289-PBGA
- 208-BFQFP
- SOT-23-6
- 3-SMD，无引线
- TO-261-4，TO-261AA
- 52-LCC（J 形引线）
- 52-BQFP
- 6-WFDFN 裸露焊盘
- 8-TDFN
- 8-DIP（0.300"，7.62mm）
- M2 J，智能卡模块（TWI）
- M2 J，智能卡模块（ISO）
- TO-263-7，D²Pak（6 引线 + 接片）
- 399-BBGA，FCBGA
- 144-FBGA
- 6-XDFN 裸露焊盘
- SC-74A，SOT-753
- 20-BFSOP（0.295"，7.50mm 宽）裸露焊盘
- 24-WFQFN 裸露焊盘
- 72-VFQFN 裸露焊盘，CSP
- 36-BFSOP（0.295"，7.50mm 宽）裸露焊盘
- 52-QFP
- 6-LSOJ（0.148"，3.76mm 宽）
- TO-226-3，TO-92-3 标准主体（!--TO-226AA）
- 16-TSSOP（0.173"，4.40mm 宽）裸露焊盘
- 256-BBGA
- 80-TQFP 裸露焊盘
- 3-SMD, No Lead
- 8-SOIC (0.154", 3.90mm Width)
- 8-VDFN Exposed Pad
- 8-UFDFN Exposed Pad
- 64-TQFP Exposed Pad
- 6-WDFN Exposed Pad
- 20-WFQFN Exposed Pad, CSP
- 80-TQFP Exposed Pad
- 38-TFSOP (0.173", 4.40mm Width)
- 203-LCCC
- 10-PowerVQFN
- 28-TSSOP (0.173", 4.40mm Width)
- 8-TSSOP (0.173", 4.40mm Width)
- 784-BBGA, FCBGA
- 80-TQFP
- 14-SOIC (0.154", 3.90mm Width)
- 350-BFCPGA
- 8-SOIC (0.209", 5.30mm Width)
- 18-SOIC (0.295", 7.50mm Width)
- 18-DIP (0.300", 7.62mm)
- 20-VQFN Exposed Pad
- 30-WFBGA, WLBGA
- 516-BGA
- 98-CLCC
- 16-VFQFN Exposed Pad
- 24-WFQFN Exposed Pad
- 36-BFSOP (0.295", 7.50mm Width) Exposed Pad
- 400-BBGA, FCBGA
- 576-BBGA, FCBGA
- Module
- 6-TSSOP, SC-88, SOT-363
- 8-WQFN Exposed Pad
- 419-BGA
- 8-DIP (0.300", 7.62mm)
- 20-BFSOP (0.295", 7.50mm Width) Exposed Pad
- 6-LSOJ (0.148", 3.76mm Width)
- 16-UFQFN Exposed Pad
- SC-74A, SOT-753
- 50-CLCC
- TO-236-3, SC-59, SOT-23-3
- 10-WFDFN Exposed Pad
- 16-SOIC (0.295", 7.50mm Width)
- 56-VFLGA
- 14-TSSOP (0.173", 4.40mm Width)
- 52-LCC (J-Lead)
- 14-LFLGA
- 100-TQFP Exposed Pad
- 84-VFQFN Exposed Pad, CSP
- 72-VFQFN Exposed Pad, CSP
- 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
- 14-WFDFN Exposed Pad
- 676-BBGA, FCBGA
- 10-TFSOP, 10-MSOP (0.118", 3.00mm Width)
- 20-SOIC (0.295", 7.50mm Width)
- 32-VFQFN Exposed Pad, CSP
- 68-LCC (J-Lead)
- 28-WFQFN Exposed Pad
- 48-TFBGA, DSBGA
- 355-BCLGA
- 399-BBGA, FCBGA
- M2 J, Smart Card Module (TWI)
- 48-VFQFN Exposed Pad
- 40-VFQFN Exposed Pad
- 6-XDFN Exposed Pad
- 24-TSSOP (0.154", 3.90mm Width) Exposed Pad
- 100-BFCLGA Module
- 8-WFBGA, WLBGA
- 2-FlipChip
- 9-WFBGA, WLBGA
- 203-BECLGA
- 40-BFCLGA
- 399-BGA Exposed Pad
- 355-CLCC
- 780-BGA
- 484-BGA
- 64-VFQFN Exposed Pad, CSP
- 84-TFBGA, CSPBGA
- 256-BGA, CSBGA
- 201-VFBGA
- 225-LFBGA
- 100-LFBGA, CSPBGA
- 44-QFP
- 72-TFBGA, CSPBGA
- 28-SSOP (0.154", 3.90mm Width)
- 56-VFQFN Exposed Pad, CSP
- 20-SSOP (0.209", 5.30mm Width)
- 12-VFLGA
- 8-WFDFN Exposed Pad
- 14-DIP (0.300", 7.62mm)
- 20-TSSOP (0.173", 4.40mm Width)
- 8-XFDFN
- 6-WFDFN
- 6-WDFN
- 6-WFDFN Exposed Pad
- TO-226-3, TO-92-3 (TO-226AA) (Formed Leads)
- TO-252-3, DPak (2 Leads + Tab), SC-63
- SOT-563, SOT-666
- 345-BFBGA, FCBGA
- 20-UFBGA, WLCSP
- 6-UFLGA
- 18-LFLGA
- M2 J, Smart Card Module (ISO)
- 675-BGA, FCBGA
- 80-BFCLGA
- 80-CLCC
- 32-WFQFN Exposed Pad
- 40-WFQFN Exposed Pad
- 28-SOIC (0.295", 7.50mm Width)
- 57-BFCLGA
- SOT-23-6 Thin, TSOT-23-6
- 12-UFQFN Exposed Pad
- 16-LBGA, FCBGA
- TO-251-3, IPak, Short Leads
- TO-226-3, TO-92-3 (TO-226AA)
- 80-BQFP
- 10-WFDFN
- 10-VFDFN Exposed Pad, 10-MLF®
- 176-TFBGA
- 2-WDFN
- 250-BCLGA Module
- 4-SSIP
- 36-BSSOP (0.295", 7.50mm Width) Exposed Pad
- 2-UDFN, FC
- 2-UFBGA, CSPBGA
- TO-261-4, TO-261AA
- 49-UFBGA, DSBGA
- 456-BBGA
- M2 P, Smart Card Module (TWI)
- 20-XFQFN Exposed Pad
- 149-BFCPGA Exposed Pad
- 20-VFQFN Exposed Pad
供应商器件封装
- 100-CLGA（24.5x11）
- 100-HTQFP（14x14）
- 24-UMLP（3.4x2.5）
- 10-SON（2x2）
- 8-SOIC
- SOT-23-3
- 14-SOIC
- 38-TSSOP
- 80-LCCC
- 16-QFN-EP（3x3）
- 68-PLCC（25x25）
- 18-SOIC
- 18-DIP
- 100-TQFP-EP（14x14）
- PowerSO-36
- 399-TEPBGA（21x21）
- 176-NFBGA（7x7）
- 49-DSBGA
- -
- 9-PSIL
- 8-SO
- 20-SOIC
- 14-TSSOP
- 80-LQFP（12x12）
- 18-PDIP
- 模块
- 14-PDIP
- 92-CLGA（19.25x7.2）
- 30-WLP（2.74x2.93）
- 20-QFN（5x4）
- TO-92-3
- 8-uDFN（2x2）
- 48-LQFP（7x7）
- 40-VFQFPN（6x6）
- 128-PQFP（14x20）
- 20-LFCSP-WQ（4x4）
- 400-FCBGA（21x21）
- 8-TQFN（3x3）
- 6-TSOT
- SC-70-6
- 10-SIP H/S
- 16-FCBGA（4x4）
- 576-FCBGA（25x25）
- 675-TEPBGA（27x27）
- 256-CSBGA（17x17）
- 64-LFCSP-VQ（9x9）
- 8-UDFN（2x3）
- 784-FCBGA（29x29）
- 64-TQFP（10x10）
- 8-TSSOP
- 8-VDFN（3x3）
- 40-TQFN（6x6）
- 6-TDFN-EP（3x3）
- 100-LQFP（14x14）
- 64-TQFP-EP（10x10）
- 16-QFN（3x3）
- 6-TDFN（3x3）
- 28-TQFN（5x5）
- 289-PBGA（19x19）
- 208-PQFP（28x28）
- 10-TDFN (3x4)
- SOT-26
- 3-SMD
- SOT-223-3
- 52-PLCC（19.1x19.1）
- 52-PQFP（10x10）
- 8-LAP（8x5）
- 8-PDIP
- M2 - J 模块（TWI）
- M2 - J 模块（ISO）
- TO-263-7
- 399-FCBGA（21x21）
- 144-BGA-ED（10x10）
- 6-HXSON（2x2）
- SOT-23-5
- PG-DSO-20-88
- 24-MLP（3.5x4.5）
- 72-LFCSP-VQ（10x10）
- PG-DSO-36-72
- 6-TSOC
- 16-TSSOP-EP
- 256-BGA（17x17）
- 8-Mini Map（2x3）
- 64-LQFP（10x10）
- 80-TQFP-EP（12x12）
- 128-PQFP (14x20)
- 24-UMLP (3.4x2.5)
- 8-VDFN (3x3)
- 52-PQFP (10x10)
- 8-UDFN (2x3)
- 144-BGA-ED (10x10)
- 64-TQFP-EP (10x10)
- 6-TDFN-EP (3x3)
- 20-LFCSP-WQ (4x4)
- 80-TQFP-EP (12x12)
- 203-LCCC (40.64x31.75)
- 10-FCQFN (5.8x3)
- 28-TSSOP
- 784-FCBGA (29x29)
- 80-TQFP (12x12)
- 48-LQFP (7x7)
- 256-BGA (17x17)
- 350-CPGA (35x32.2)
- 20-QFN (5x5)
- 30-WLP (2.74x2.93)
- 516-BGA (27x27)
- 98-LCCC (20.7x9.1)
- 80-LQFP (12x12)
- 16-QFN (3x3)
- 24-MLP (3.5x4.5)
- 400-FCBGA (21x21)
- 576-FCBGA (25x25)
- 208-PQFP (28x28)
- Module
- 8-TQFN (3x3)
- 419-BGA (23x23)
- 16-UQFN (3x3)
- 50-LCCC
- 10-SON (2x2)
- 16-SOIC
- 56-TFLGA (8x8)
- 52-PLCC (19.1x19.1)
- 14-OLGA (2.9x4.3)
- 100-HTQFP (14x14)
- 84-LFCSP-VQ (10x10)
- 72-LFCSP-VQ (10x10)
- 8-MSOP
- 14-TDFN-EP (3x3)
- 676-FCBGA (27x27)
- 80-HTQFP (12x12)
- 10-MSOP
- 32-LFCSP-VQ (5x5)
- 68-PLCC (24.21x24.21)
- 16-UQFN-EP (3x3)
- 28-TQFN (5x5)
- 48-DSBGA (8x9)
- SOT-6
- 355-CLGA (42.2x42.2)
- 399-FCBGA (21x21)
- 289-PBGA (19x19)
- 8-Mini Map (2x3)
- M2 - J Module (TWI)
- 48-VQFN (6x6)
- 40-VFQFPN (6x6)
- 6-HXSON (2x2)
- PG-TSDSO-24-1
- 100-CLGA (24.5x11)
- 8-WLP
- 2-FCP
- 9-WLP (1.23x1.23)
- 203-CLGA (40.64x31.75)
- 40-CLGA (15.9x5.3)
- 399-TEPBGA (21x21)
- 355-LCCC (42.16x42.16)
- 780-BGA (29x29)
- 484-TEBGA (23x23)
- 64-LFCSP-VQ (9x9)
- 84-CSPBGA (9x9)
- 256-CSBGA (17x17)
- 201-NFBGA (13x13)
- 225-BGA (13x13)
- 100-CSBGA (9x9)
- 44-PQFP
- 72-CSPBGA (8x8)
- 64-LQFP (14x14)
- 80-LQFP (14x14)
- 28-SSOP
- 16-VFQFPN (3x3)
- 56-LFCSP-VQ (8x8)
- 64-TQFP (10x10)
- 20-SSOP
- 8-DIP
- 12-VFLGA (3x3)
- 8-DFN (3x2)
- 8-SOIJ
- 20-TSSOP
- SOT-23-6
- 6-DFN (2x2)
- 8-SON
- 6-uDFN (1.5x1.0)
- 6-µDFN (2x2)
- 6-MLP (2x2)
- 16-QFN-EP (3x3)
- DPAK
- 6-SCH
- 345-FCBGA (13x20)
- 20-WLCSP
- 100-TQFP-EP (14x14)
- 6-UTLGA (1.5x1.0)
- 18-OLGA (2.8x4.3)
- 6-TDFN (3x3)
- M2 - J Module (ISO)
- 64-LQFP (10x10)
- 100-LQFP (14x14)
- 675-FCBGA (27x27)
- 80-CLGA (21.3x11)
- 80-LCCC (20.7x9.1)
- 32-TQFN-EP (5x5)
- 40-TQFN (6x6)
- 28-SOIC
- 57-CLGA (18.2x7)
- 8-uDFN (2x2)
- 92-CLGA (19.25x7.2)
- 8-TDFN (2x3)
- 10-WSON (3x3)
- U-QFN3030-12
- 16-FCBGA (4x4)
- I-PAK
- TO-92
- 80-PQFP (14x20)
- 10-µDFN (2x2)
- 10-MLF® (3x3)
- 176-NFBGA (7x7)
- 64-TQFP (14x14)
- SOT-363-6 (SC-70)
- 2-SFN (3.5x6.5)
- 250-CLGA (25.65x16.9)
- TO-94-4
- PG-DSO-36-38
- 2-FlipChip
- 2-CSP
- 20-VQFN (5x5)
- 456-FBGA (23x23)
- M2 - P Module (TWI)
- 20-HX2QFN (3x3)
- 149-CPGA (22.3x32.2)
- 20-VQFN (3.5x4.5)
基本零件编号
- DLPA3005
- TPD4S014
- CM2020
- DLPC2607
- SLE5542
- DS2401
- MAX4945
- MAX4944
- MAX4946
- MAX4949
- MAX30001
- MAX6499
- FM31256
- TEA1708
- NBSG16
- IDTTSI620
- HCS200
- DS34S104
- AD9869
- ATSHA204
- L9658
- ATSHA204A
- KSZ8995
- MAX30003
- NBSG16VS
- AD8452
- KSZ8695
- MAX9951
- AT88SC25616
- FSSD07
- TSI578
- DS28C36
- ATECC608A
- IDT80HCPS1848
- HCS301
- PSD813F
- AD8232
- SM72441
- FM31278
- ATAES132
- MC44BS373
- MAX6496
- AT88SC0404
- KSZ8993
- MAXQ1061
- AD9172
- AD9173
- PQJ7981AHN
- MAX17263
- LT3750
- ATECC508A
- DLP7000
- L9708
- KS8995
- DS28EL22
- ATAES132A
- AGB75LC04
- L9709
- L9737
- L9660
- CM2021
- SL2FCS5301
- DS9100
- KSZ8999
- DS28E50
- DLPA2005
- MAX22191
- MAX4845
- AD5560
- DS28E15
- MICRF302
- PAD1000
- DLP3000
- MAX4925
- AT88SC0104
- DLP9500
- IDTTSI577
- DLP5500
- AD9942
- DLPC410
- ATA663231
已选条件：
| 序号 | 图片 | 型号 | 制造商 | 环保 | 参考价格 | 描述 |
|---|---|---|---|---|---|---|
| 1 |  |
TLE9104SHXUMA1 | Infineon Technologies | Y | ￥询价-￥询价 询价 |
Powertrain Switch PG-DSO-20-88 |
| 2 | |
TLE9104SHXUMA1 | Infineon Technologies | Y | ￥询价-￥询价 询价 |
Powertrain Switch PG-DSO-20-88 |
| 3 | |
TLE9104SHXUMA1 | Infineon Technologies | Y | ￥询价-￥询价 询价 |
Powertrain Switch PG-DSO-20-88 |
| 4 | |
TLE9104SHXUMA1 | Infineon Technologies | Y | ￥询价-￥询价 询价 |
Powertrain Switch PG-DSO-20-88 |
| 5 | |
TLE9104SHXUMA1 | Infineon Technologies | Y | ￥询价-￥询价 询价 |
Powertrain Switch PG-DSO-20-88 |
| 6 | |
TLE9104SHXUMA1 | Infineon Technologies | Y | ￥询价-￥询价 询价 |
Powertrain Switch PG-DSO-20-88 |
| 7 |  |
ATECC508A-MAHDA-T | Microchip Technology | Y | 询价 |
Authentication Chip 8-UDFN (2x3) |
| 8 | |
ATECC508A-MAHDA-T | Microchip Technology | Y | 询价 |
Authentication Chip 8-UDFN (2x3) |
| 9 | |
ATECC508A-MAHDA-T | Microchip Technology | Y | 询价 |
Authentication Chip 8-UDFN (2x3) |
| 10 | 暂无 | SE050C1HQ1/Z01SCZ | NXP USA Inc. | Y | 询价 |
IoT Secure Element 20-HX2QFN (3x3) |
| 11 | 暂无 | SE050C1HQ1/Z01SCZ | NXP USA Inc. | Y | 询价 |
IoT Secure Element 20-HX2QFN (3x3) |
| 12 | 暂无 | SE050C1HQ1/Z01SCZ | NXP USA Inc. | Y | 询价 |
IoT Secure Element 20-HX2QFN (3x3) |
| 13 |  |
DS28E15P+ | Maxim Integrated | Y | ￥6.00-￥10.97 询价 |
Authentication Chip 6-TSOC |
| 14 | |
DS28E15P+T | Maxim Integrated | Y | 询价 |
Authentication Chip 6-TSOC |
| 15 | |
DS28E15P+T | Maxim Integrated | Y | 询价 |
Authentication Chip 6-TSOC |
| 16 | |
DS28E15P+T | Maxim Integrated | Y | 询价 |
Authentication Chip 6-TSOC |
| 17 | |
DS28E15P+ | Maxim Integrated | Y | ￥6.00-￥10.97 询价 |
Authentication Chip 6-TSOC |
| 18 | |
DS28E15P+T | Maxim Integrated | Y | 询价 |
Authentication Chip 6-TSOC |
| 19 | |
DS28E15P+T | Maxim Integrated | Y | 询价 |
Authentication Chip 6-TSOC |
| 20 | |
DS28E15P+T | Maxim Integrated | Y | 询价 |
Authentication Chip 6-TSOC |
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