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9794条产品,ICGOO在线商城所选择的供货商都经过严格筛选,垂直采购渠道透明,质量有保障。
零件状态
  • 在售
  • 停產
  • 最後搶購
  • 初步
  • Obsolete
  • Active
  • Discontinued at Digi-Key
  • Last Time Buy
  • Preliminary
  • Not For New Designs
安装类型
  • 表面贴装
  • 通孔
  • -
  • Surface Mount
  • Through Hole
包装
  • 托盘
  • 管件
  • Digi-Reel®
  • 剪切带(CT)
  • 带卷(TR)
  • 散装
  • -
  • Bulk
  • Tray
  • Cut Tape (CT)
  • Tape & Reel (TR)
  • Tube
  • Strip
  • Can
应用
  • -
  • DLP® Pico™ 投影仪
  • 手机,数码相机,媒体播放器
  • 手机,媒体播放器
  • 网络和通信
  • 远程安全访问,无键输入
  • PCB,网络节点,设备识别/注册
  • 基于处理器的系统
  • 消费电子,DVD-RW 播放器,机顶盒
  • 3D,医疗成像
  • 模拟 I/O
  • RF,IR
  • 自动测试设备
  • 音频
  • 无线基础架构
  • 图像处理和控制
  • 移动通信
  • 转换器,ACDC
  • 汽车级
  • 8 位 MCU 外设
  • 控制系统
  • 安全
  • 显示器
  • 心率监测
  • 工业,照明
  • 电池测试/化成系统
  • 端口开关/网络接口
  • 振荡器调谐
  • 无匙门禁系统,家庭自动化,无线音频/视频
  • 仪表
  • 8 位或 16 位 MCU 外设
  • 数据传输
  • 宽带电话线网络
  • 医用型
  • LED 照明
  • Authentication,Security
  • Embedded, Smart Card
  • 16 位 MCU 外设
  • 无线网络
  • Port Switch/Network Interface
  • Cell Phones, Digital Cameras, Media Players
  • Networking and Communications
  • Wireless Infrastructure
  • Automatic Test Equipment
  • Authentication, Security
  • Heart Rate Monitoring
  • Consumer Electronics, DVD-RW Players, Set Top Box
  • 3D, Medical Imaging
  • Maximum Power Point Tracking (MPPT)
  • Video
  • Processor-Based Systems
  • Battery Test/Formation Systems
  • RF, IR
  • Audio/Video, VCR's, Set-Top Boxes
  • 16-Bit MCU Peripherals
  • Instrumentation
  • Security
  • Keyless Entry, Home Automation, Wireless Audio/Video
  • DLP® Pico™ Projectors
  • Automotive
  • Access Control Systems
  • Image Processing and Control
  • PCB, Network Node, Equipment Identification/Registration
  • Cell Phones, Media Players
  • T1/CEPT
  • Ultrasound Imaging
  • Remote Secure Access, Keyless Entry
  • Accessory ID and Control, Industrial Controllers, LED Control, System Monitoring
  • 8-Bit MCU Peripherals
  • Wireless Networking
  • Wireless
  • Battery Level Indication
  • Power Supply Controller
  • HDTV, MPEG, Image Processing
  • Health, Home, Security
  • Control Systems
  • Automation Control
  • DLP® Pico™ Projectors, Mobile Sensing
  • CAN Automotive
  • Medical
  • Digital Camera
  • Factory/Home Automation
  • Data Transport
  • Wireless Communication Systems
  • Power Line Networking
  • Instrumentation Amplifiers
  • DVI, HDMI Signal Switching
  • Converter, ACDC
  • Oscillator Tuning
  • Remote Control
  • Analog I/O
  • Broadband Wireline Networking
  • Cable Modem, Set Top Boxes
  • Imaging, Video
  • T1/E1/J1
  • Displays
  • PC's, PDA's
  • Cable/DSL/PON Modems
  • LED Lighting
  • Industrial
  • Mobile Communications
  • Industry 4.0
  • Automation
类型
  • 数字微镜芯片(DMD)
  • DLP PMIC, LED 驱动器
  • 多路复用器
  • 过压保护控制器
  • 验证芯片
  • 跳码编码器
  • 硅序列号
  • 处理器辅助元件
  • HDMI 发射器
  • 传感器接口
  • 浮点协处理器
  • 解码器
  • DCL
  • 功率放大器
  • Serial RapidIO® 开关
  • 数字控制器
  • RGB LED 驱动器
  • 电容器放电
  • 驱动器
  • 安全辅助芯片
  • 可编程外设 IC
  • 过压防护
  • 存储器
  • 跳码解码器
  • 生物电势 AFE
  • 差分链路
  • AFE/PWM 控制器
  • 频率转换器
  • 10/100 集成开关
  • ECG 前端
  • 数字电容器
  • 电子微调电容器
  • 输出电路(放大器)
  • 自动放电
  • 收发器
  • 机械样品
  • TDM(分时复用)
  • 宽带前端
  • 八通道电爆驱动器和四通道传感器接口 ASIC
  • LIN System Basis Chip
  • 数据采集系统(DAS)
  • -
  • 参数测量单元
  • PFC/PSR 控制器
  • 端子
  • Secure Memory
  • HDMI 端口保护
  • 点火线圈驱动器
  • RF DAC
  • 安全身份验证器
  • 传动系统开关
  • 低压侧开关
  • 缓冲器,收发器
  • 多队列流量控制
  • 电源
  • 每引脚参数测量单元(PPMU)
  • 10/100 Integrated Switch
  • Multiplexer
  • Authentication Chip
  • Terminal
  • Power Supply
  • ECG Front End
  • Per-Pin Parametric Measurement Unit (PPMU)
  • HDMI Port Protection
  • Digital Micromirror Device (DMD)
  • Cell-String Optimizer
  • MPPT Controller
  • Serial RapidIO® Switch
  • Video Processor
  • Processor Companion
  • AFE/PWM Controller
  • Multi-Queue Flow-Control
  • Decoder
  • NTSC/PAL Modulator
  • Programmable Peripherals IC
  • Transceiver
  • Low-Side Switch
  • Memory
  • Electronically Trimmable Capacitor
  • DLP PMIC, LED Driver
  • Overvoltage Protection Controller
  • Code Hopping Encoder and Transponder
  • Digital Controller
  • Powertrain Switch
  • Piezo Sounder Driver
  • Silicon Serial Number
  • Jitter Attenuator
  • Ultrasound Pulser
  • Code Hopping Encoder
  • Cryptographic Controller
  • Addressable Switch
  • Data Acquisition Systems (DASs)
  • HDMI Transmitter
  • Broadband Front-End
  • Digital Capacitor
  • Driver
  • Digital Micromirror Device (DMD), Driver
  • Flyback, Forward Converter
  • CCD Signal Processor
  • Floating-Point Co-Processor
  • Overvoltage Protection
  • Configuration PROM
  • Digital Input
  • Digital Micromirror Device (DMD), DLP PMIC, LED Driver
  • Capacitor Discharge
  • Frequency Translator
  • Biopotential AFE
  • Secure Authenticator
  • System Basis Chip (SBC)
  • Digital Micromirror Device (DMD), DLP PMIC
  • TDM (Time Division Multiplexing)
  • Sigma-Delta Modulator
  • GUI Processor
  • CCD Signal Processor, 14-Bit
  • Error Detection and Handling (EDH)
  • EDH Coprocessor
  • Imaging Signal Processor
  • Manchester Encoder/Decoder
  • Clock Generator
  • Resistor Network
  • HDMI/DVI Switch
  • Octal Squib Driver and Quad Sensor Interface ASIC
  • Code Hopping Decoder
  • Quad Squib Driver ASIC
  • Quad Squib Driver and Dual Sensor Interface ASIC
  • Encoder
  • Passive Optical Network (PON) Triplexer
  • Cellular Phone Data Formatter
  • Electronic Circuit Breaker
  • Fixed Code Encoder
  • Sensor Interface
  • Fire Lighting Circuit
  • MMIC Oscillator
  • Automatic Discharge
  • Signal Retimer
  • Security Companion Chip
  • Sensor
  • Protection Switch
  • Holder
  • Color Scanner
  • TFT VCOM Calibrator
  • Microcontroller
  • Storage Capacitor Control IC
  • Transmission Line Clamp
  • PFC/PSR Controller
  • Toaster Controller
  • Output Driver
  • RGB LED Driver
  • Mechanical Sample
  • IoT Secure Element
  • CAN FD Controller
封装/外壳
  • 100-BFCLGA
  • 100-TQFP 裸露焊盘
  • 24-UFQFN
  • 10-WFDFN 裸露焊盘
  • 8-SOIC(0.154",3.90mm 宽)
  • TO-236-3,SC-59,SOT-23-3
  • 14-SOIC(0.154",3.90mm 宽)
  • 38-TFSOP(0.173",4.40mm 宽)
  • 模块
  • 16-VFQFN 裸露焊盘
  • 68-LCC(J 形引线)
  • 18-SOIC(0.295",7.50mm 宽)
  • 18-DIP(0.300",7.62mm)
  • PowerSO-36 裸露顶部焊盘
  • 399-BGA 裸露焊盘
  • 176-VFBGA
  • 49-UFBGA,DSBGA
  • -
  • 9-SIP
  • 20-SOIC(0.295",7.50mm 宽)
  • 14-TSSOP(0.173",4.40mm 宽)
  • 80-LQFP
  • 14-DIP(0.300",7.62mm)
  • 92-BFCLGA
  • 30-WFBGA,WLBGA
  • 20-WFQFN 裸露焊盘
  • TO-226-3,TO-92-3(TO-226AA)(成形引线)
  • 8-WFDFN
  • 48-LQFP
  • 40-VFQFN 裸露焊盘
  • 128-BFQFP
  • 20-WFQFN 裸露焊盘,CSP
  • 400-BBGA,FCBGA
  • 8-WQFN 裸露焊盘
  • SOT-23-6 细型,TSOT-23-6
  • 6-TSSOP,SC-88,SOT-363
  • 128-BQFP
  • 10-SIP
  • 16-LBGA,FCBGA
  • 576-BBGA,FCBGA
  • 675-BGA 裸露焊盘
  • 256-BGA,CSBGA
  • 64-VFQFN 裸露焊盘,CSP
  • 8-UFDFN 裸露焊盘
  • 784-BBGA,FCBGA
  • 64-LQFP
  • 8-TSSOP(0.173",4.40mm 宽)
  • 8-VDFN 裸露焊盘
  • 40-WFQFN 裸露焊盘
  • 6-WDFN 裸露焊盘
  • 100-LQFP
  • 64-TQFP 裸露焊盘
  • 28-WFQFN 裸露焊盘
  • 289-PBGA
  • 208-BFQFP
  • SOT-23-6
  • 3-SMD,无引线
  • TO-261-4,TO-261AA
  • 52-LCC(J 形引线)
  • 52-BQFP
  • 6-WFDFN 裸露焊盘
  • 8-TDFN
  • 8-DIP(0.300",7.62mm)
  • M2 J,智能卡模块(TWI)
  • M2 J,智能卡模块(ISO)
  • TO-263-7,D²Pak(6 引线 + 接片)
  • 399-BBGA,FCBGA
  • 144-FBGA
  • 6-XDFN 裸露焊盘
  • SC-74A,SOT-753
  • 20-BFSOP(0.295",7.50mm 宽)裸露焊盘
  • 24-WFQFN 裸露焊盘
  • 72-VFQFN 裸露焊盘,CSP
  • 36-BFSOP(0.295",7.50mm 宽)裸露焊盘
  • 52-QFP
  • 6-LSOJ(0.148",3.76mm 宽)
  • TO-226-3,TO-92-3 标准主体(!--TO-226AA)
  • 16-TSSOP(0.173",4.40mm 宽)裸露焊盘
  • 256-BBGA
  • 80-TQFP 裸露焊盘
  • 3-SMD, No Lead
  • 8-SOIC (0.154", 3.90mm Width)
  • 8-VDFN Exposed Pad
  • 8-UFDFN Exposed Pad
  • 64-TQFP Exposed Pad
  • 6-WDFN Exposed Pad
  • 20-WFQFN Exposed Pad, CSP
  • 80-TQFP Exposed Pad
  • 38-TFSOP (0.173", 4.40mm Width)
  • 203-LCCC
  • 10-PowerVQFN
  • 28-TSSOP (0.173", 4.40mm Width)
  • 8-TSSOP (0.173", 4.40mm Width)
  • 784-BBGA, FCBGA
  • 80-TQFP
  • 14-SOIC (0.154", 3.90mm Width)
  • 350-BFCPGA
  • 8-SOIC (0.209", 5.30mm Width)
  • 18-SOIC (0.295", 7.50mm Width)
  • 18-DIP (0.300", 7.62mm)
  • 20-VQFN Exposed Pad
  • 30-WFBGA, WLBGA
  • 516-BGA
  • 98-CLCC
  • 16-VFQFN Exposed Pad
  • 24-WFQFN Exposed Pad
  • 36-BFSOP (0.295", 7.50mm Width) Exposed Pad
  • 400-BBGA, FCBGA
  • 576-BBGA, FCBGA
  • Module
  • 6-TSSOP, SC-88, SOT-363
  • 8-WQFN Exposed Pad
  • 419-BGA
  • 8-DIP (0.300", 7.62mm)
  • 20-BFSOP (0.295", 7.50mm Width) Exposed Pad
  • 6-LSOJ (0.148", 3.76mm Width)
  • 16-UFQFN Exposed Pad
  • SC-74A, SOT-753
  • 50-CLCC
  • TO-236-3, SC-59, SOT-23-3
  • 10-WFDFN Exposed Pad
  • 16-SOIC (0.295", 7.50mm Width)
  • 56-VFLGA
  • 14-TSSOP (0.173", 4.40mm Width)
  • 52-LCC (J-Lead)
  • 14-LFLGA
  • 100-TQFP Exposed Pad
  • 84-VFQFN Exposed Pad, CSP
  • 72-VFQFN Exposed Pad, CSP
  • 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
  • 14-WFDFN Exposed Pad
  • 676-BBGA, FCBGA
  • 10-TFSOP, 10-MSOP (0.118", 3.00mm Width)
  • 20-SOIC (0.295", 7.50mm Width)
  • 32-VFQFN Exposed Pad, CSP
  • 68-LCC (J-Lead)
  • 28-WFQFN Exposed Pad
  • 48-TFBGA, DSBGA
  • 355-BCLGA
  • 399-BBGA, FCBGA
  • M2 J, Smart Card Module (TWI)
  • 48-VFQFN Exposed Pad
  • 40-VFQFN Exposed Pad
  • 6-XDFN Exposed Pad
  • 24-TSSOP (0.154", 3.90mm Width) Exposed Pad
  • 100-BFCLGA Module
  • 8-WFBGA, WLBGA
  • 2-FlipChip
  • 9-WFBGA, WLBGA
  • 203-BECLGA
  • 40-BFCLGA
  • 399-BGA Exposed Pad
  • 355-CLCC
  • 780-BGA
  • 484-BGA
  • 64-VFQFN Exposed Pad, CSP
  • 84-TFBGA, CSPBGA
  • 256-BGA, CSBGA
  • 201-VFBGA
  • 225-LFBGA
  • 100-LFBGA, CSPBGA
  • 44-QFP
  • 72-TFBGA, CSPBGA
  • 28-SSOP (0.154", 3.90mm Width)
  • 56-VFQFN Exposed Pad, CSP
  • 20-SSOP (0.209", 5.30mm Width)
  • 12-VFLGA
  • 8-WFDFN Exposed Pad
  • 14-DIP (0.300", 7.62mm)
  • 20-TSSOP (0.173", 4.40mm Width)
  • 8-XFDFN
  • 6-WFDFN
  • 6-WDFN
  • 6-WFDFN Exposed Pad
  • TO-226-3, TO-92-3 (TO-226AA) (Formed Leads)
  • TO-252-3, DPak (2 Leads + Tab), SC-63
  • SOT-563, SOT-666
  • 345-BFBGA, FCBGA
  • 20-UFBGA, WLCSP
  • 6-UFLGA
  • 18-LFLGA
  • M2 J, Smart Card Module (ISO)
  • 675-BGA, FCBGA
  • 80-BFCLGA
  • 80-CLCC
  • 32-WFQFN Exposed Pad
  • 40-WFQFN Exposed Pad
  • 28-SOIC (0.295", 7.50mm Width)
  • 57-BFCLGA
  • SOT-23-6 Thin, TSOT-23-6
  • 12-UFQFN Exposed Pad
  • 16-LBGA, FCBGA
  • TO-251-3, IPak, Short Leads
  • TO-226-3, TO-92-3 (TO-226AA)
  • 80-BQFP
  • 10-WFDFN
  • 10-VFDFN Exposed Pad, 10-MLF®
  • 176-TFBGA
  • 2-WDFN
  • 250-BCLGA Module
  • 4-SSIP
  • 36-BSSOP (0.295", 7.50mm Width) Exposed Pad
  • 2-UDFN, FC
  • 2-UFBGA, CSPBGA
  • TO-261-4, TO-261AA
  • 49-UFBGA, DSBGA
  • 456-BBGA
  • M2 P, Smart Card Module (TWI)
  • 20-XFQFN Exposed Pad
  • 149-BFCPGA Exposed Pad
  • 20-VFQFN Exposed Pad
供应商器件封装
  • 100-CLGA(24.5x11)
  • 100-HTQFP(14x14)
  • 24-UMLP(3.4x2.5)
  • 10-SON(2x2)
  • 8-SOIC
  • SOT-23-3
  • 14-SOIC
  • 38-TSSOP
  • 80-LCCC
  • 16-QFN-EP(3x3)
  • 68-PLCC(25x25)
  • 18-SOIC
  • 18-DIP
  • 100-TQFP-EP(14x14)
  • PowerSO-36
  • 399-TEPBGA(21x21)
  • 176-NFBGA(7x7)
  • 49-DSBGA
  • -
  • 9-PSIL
  • 8-SO
  • 20-SOIC
  • 14-TSSOP
  • 80-LQFP(12x12)
  • 18-PDIP
  • 模块
  • 14-PDIP
  • 92-CLGA(19.25x7.2)
  • 30-WLP(2.74x2.93)
  • 20-QFN(5x4)
  • TO-92-3
  • 8-uDFN(2x2)
  • 48-LQFP(7x7)
  • 40-VFQFPN(6x6)
  • 128-PQFP(14x20)
  • 20-LFCSP-WQ(4x4)
  • 400-FCBGA(21x21)
  • 8-TQFN(3x3)
  • 6-TSOT
  • SC-70-6
  • 10-SIP H/S
  • 16-FCBGA(4x4)
  • 576-FCBGA(25x25)
  • 675-TEPBGA(27x27)
  • 256-CSBGA(17x17)
  • 64-LFCSP-VQ(9x9)
  • 8-UDFN(2x3)
  • 784-FCBGA(29x29)
  • 64-TQFP(10x10)
  • 8-TSSOP
  • 8-VDFN(3x3)
  • 40-TQFN(6x6)
  • 6-TDFN-EP(3x3)
  • 100-LQFP(14x14)
  • 64-TQFP-EP(10x10)
  • 16-QFN(3x3)
  • 6-TDFN(3x3)
  • 28-TQFN(5x5)
  • 289-PBGA(19x19)
  • 208-PQFP(28x28)
  • 10-TDFN (3x4)
  • SOT-26
  • 3-SMD
  • SOT-223-3
  • 52-PLCC(19.1x19.1)
  • 52-PQFP(10x10)
  • 8-LAP(8x5)
  • 8-PDIP
  • M2 - J 模块(TWI)
  • M2 - J 模块(ISO)
  • TO-263-7
  • 399-FCBGA(21x21)
  • 144-BGA-ED(10x10)
  • 6-HXSON(2x2)
  • SOT-23-5
  • PG-DSO-20-88
  • 24-MLP(3.5x4.5)
  • 72-LFCSP-VQ(10x10)
  • PG-DSO-36-72
  • 6-TSOC
  • 16-TSSOP-EP
  • 256-BGA(17x17)
  • 8-Mini Map(2x3)
  • 64-LQFP(10x10)
  • 80-TQFP-EP(12x12)
  • 128-PQFP (14x20)
  • 24-UMLP (3.4x2.5)
  • 8-VDFN (3x3)
  • 52-PQFP (10x10)
  • 8-UDFN (2x3)
  • 144-BGA-ED (10x10)
  • 64-TQFP-EP (10x10)
  • 6-TDFN-EP (3x3)
  • 20-LFCSP-WQ (4x4)
  • 80-TQFP-EP (12x12)
  • 203-LCCC (40.64x31.75)
  • 10-FCQFN (5.8x3)
  • 28-TSSOP
  • 784-FCBGA (29x29)
  • 80-TQFP (12x12)
  • 48-LQFP (7x7)
  • 256-BGA (17x17)
  • 350-CPGA (35x32.2)
  • 20-QFN (5x5)
  • 30-WLP (2.74x2.93)
  • 516-BGA (27x27)
  • 98-LCCC (20.7x9.1)
  • 80-LQFP (12x12)
  • 16-QFN (3x3)
  • 24-MLP (3.5x4.5)
  • 400-FCBGA (21x21)
  • 576-FCBGA (25x25)
  • 208-PQFP (28x28)
  • Module
  • 8-TQFN (3x3)
  • 419-BGA (23x23)
  • 16-UQFN (3x3)
  • 50-LCCC
  • 10-SON (2x2)
  • 16-SOIC
  • 56-TFLGA (8x8)
  • 52-PLCC (19.1x19.1)
  • 14-OLGA (2.9x4.3)
  • 100-HTQFP (14x14)
  • 84-LFCSP-VQ (10x10)
  • 72-LFCSP-VQ (10x10)
  • 8-MSOP
  • 14-TDFN-EP (3x3)
  • 676-FCBGA (27x27)
  • 80-HTQFP (12x12)
  • 10-MSOP
  • 32-LFCSP-VQ (5x5)
  • 68-PLCC (24.21x24.21)
  • 16-UQFN-EP (3x3)
  • 28-TQFN (5x5)
  • 48-DSBGA (8x9)
  • SOT-6
  • 355-CLGA (42.2x42.2)
  • 399-FCBGA (21x21)
  • 289-PBGA (19x19)
  • 8-Mini Map (2x3)
  • M2 - J Module (TWI)
  • 48-VQFN (6x6)
  • 40-VFQFPN (6x6)
  • 6-HXSON (2x2)
  • PG-TSDSO-24-1
  • 100-CLGA (24.5x11)
  • 8-WLP
  • 2-FCP
  • 9-WLP (1.23x1.23)
  • 203-CLGA (40.64x31.75)
  • 40-CLGA (15.9x5.3)
  • 399-TEPBGA (21x21)
  • 355-LCCC (42.16x42.16)
  • 780-BGA (29x29)
  • 484-TEBGA (23x23)
  • 64-LFCSP-VQ (9x9)
  • 84-CSPBGA (9x9)
  • 256-CSBGA (17x17)
  • 201-NFBGA (13x13)
  • 225-BGA (13x13)
  • 100-CSBGA (9x9)
  • 44-PQFP
  • 72-CSPBGA (8x8)
  • 64-LQFP (14x14)
  • 80-LQFP (14x14)
  • 28-SSOP
  • 16-VFQFPN (3x3)
  • 56-LFCSP-VQ (8x8)
  • 64-TQFP (10x10)
  • 20-SSOP
  • 8-DIP
  • 12-VFLGA (3x3)
  • 8-DFN (3x2)
  • 8-SOIJ
  • 20-TSSOP
  • SOT-23-6
  • 6-DFN (2x2)
  • 8-SON
  • 6-uDFN (1.5x1.0)
  • 6-µDFN (2x2)
  • 6-MLP (2x2)
  • 16-QFN-EP (3x3)
  • DPAK
  • 6-SCH
  • 345-FCBGA (13x20)
  • 20-WLCSP
  • 100-TQFP-EP (14x14)
  • 6-UTLGA (1.5x1.0)
  • 18-OLGA (2.8x4.3)
  • 6-TDFN (3x3)
  • M2 - J Module (ISO)
  • 64-LQFP (10x10)
  • 100-LQFP (14x14)
  • 675-FCBGA (27x27)
  • 80-CLGA (21.3x11)
  • 80-LCCC (20.7x9.1)
  • 32-TQFN-EP (5x5)
  • 40-TQFN (6x6)
  • 28-SOIC
  • 57-CLGA (18.2x7)
  • 8-uDFN (2x2)
  • 92-CLGA (19.25x7.2)
  • 8-TDFN (2x3)
  • 10-WSON (3x3)
  • U-QFN3030-12
  • 16-FCBGA (4x4)
  • I-PAK
  • TO-92
  • 80-PQFP (14x20)
  • 10-µDFN (2x2)
  • 10-MLF® (3x3)
  • 176-NFBGA (7x7)
  • 64-TQFP (14x14)
  • SOT-363-6 (SC-70)
  • 2-SFN (3.5x6.5)
  • 250-CLGA (25.65x16.9)
  • TO-94-4
  • PG-DSO-36-38
  • 2-FlipChip
  • 2-CSP
  • 20-VQFN (5x5)
  • 456-FBGA (23x23)
  • M2 - P Module (TWI)
  • 20-HX2QFN (3x3)
  • 149-CPGA (22.3x32.2)
  • 20-VQFN (3.5x4.5)
基本零件编号
  • DLPA3005
  • TPD4S014
  • CM2020
  • DLPC2607
  • SLE5542
  • DS2401
  • MAX4945
  • MAX4944
  • MAX4946
  • MAX4949
  • MAX30001
  • MAX6499
  • FM31256
  • TEA1708
  • NBSG16
  • IDTTSI620
  • HCS200
  • DS34S104
  • AD9869
  • ATSHA204
  • L9658
  • ATSHA204A
  • KSZ8995
  • MAX30003
  • NBSG16VS
  • AD8452
  • KSZ8695
  • MAX9951
  • AT88SC25616
  • FSSD07
  • TSI578
  • DS28C36
  • ATECC608A
  • IDT80HCPS1848
  • HCS301
  • PSD813F
  • AD8232
  • SM72441
  • FM31278
  • ATAES132
  • MC44BS373
  • MAX6496
  • AT88SC0404
  • KSZ8993
  • MAXQ1061
  • AD9172
  • AD9173
  • PQJ7981AHN
  • MAX17263
  • LT3750
  • ATECC508A
  • DLP7000
  • L9708
  • KS8995
  • DS28EL22
  • ATAES132A
  • AGB75LC04
  • L9709
  • L9737
  • L9660
  • CM2021
  • SL2FCS5301
  • DS9100
  • KSZ8999
  • DS28E50
  • DLPA2005
  • MAX22191
  • MAX4845
  • AD5560
  • DS28E15
  • MICRF302
  • PAD1000
  • DLP3000
  • MAX4925
  • AT88SC0104
  • DLP9500
  • IDTTSI577
  • DLP5500
  • AD9942
  • DLPC410
  • ATA663231
已选条件:
序号 图片 型号 制造商 环保 参考价格 描述
1 TLE9104SHXUMA1 Infineon Technologies Y ¥询价-¥询价
询价
Powertrain Switch PG-DSO-20-88
2 TLE9104SHXUMA1 Infineon Technologies Y ¥询价-¥询价
询价
Powertrain Switch PG-DSO-20-88
3 TLE9104SHXUMA1 Infineon Technologies Y ¥询价-¥询价
询价
Powertrain Switch PG-DSO-20-88
4 TLE9104SHXUMA1 Infineon Technologies Y ¥询价-¥询价
询价
Powertrain Switch PG-DSO-20-88
5 TLE9104SHXUMA1 Infineon Technologies Y ¥询价-¥询价
询价
Powertrain Switch PG-DSO-20-88
6 TLE9104SHXUMA1 Infineon Technologies Y ¥询价-¥询价
询价
Powertrain Switch PG-DSO-20-88
7 ATECC508A-MAHDA-T Microchip Technology Y
询价
Authentication Chip 8-UDFN (2x3)
8 ATECC508A-MAHDA-T Microchip Technology Y
询价
Authentication Chip 8-UDFN (2x3)
9 ATECC508A-MAHDA-T Microchip Technology Y
询价
Authentication Chip 8-UDFN (2x3)
10 暂无 SE050C1HQ1/Z01SCZ NXP USA Inc. Y
询价
IoT Secure Element 20-HX2QFN (3x3)
11 暂无 SE050C1HQ1/Z01SCZ NXP USA Inc. Y
询价
IoT Secure Element 20-HX2QFN (3x3)
12 暂无 SE050C1HQ1/Z01SCZ NXP USA Inc. Y
询价
IoT Secure Element 20-HX2QFN (3x3)
13 DS28E15P+ Maxim Integrated Y ¥6.00-¥10.97
询价
Authentication Chip 6-TSOC
14 DS28E15P+T Maxim Integrated Y
询价
Authentication Chip 6-TSOC
15 DS28E15P+T Maxim Integrated Y
询价
Authentication Chip 6-TSOC
16 DS28E15P+T Maxim Integrated Y
询价
Authentication Chip 6-TSOC
17 DS28E15P+ Maxim Integrated Y ¥6.00-¥10.97
询价
Authentication Chip 6-TSOC
18 DS28E15P+T Maxim Integrated Y
询价
Authentication Chip 6-TSOC
19 DS28E15P+T Maxim Integrated Y
询价
Authentication Chip 6-TSOC
20 DS28E15P+T Maxim Integrated Y
询价
Authentication Chip 6-TSOC