当前“
传感器芯片,探测器芯片
”共1216条产品，ICGOO在线商城所选择的供货商都经过严格筛选，垂直采购渠道透明，质量有保障。包装
- 管件
- Digi-Reel®
- 带卷（TR）
- 托盘
- Tape & Reel (TR)
- Tube
- Cut Tape (CT)
- -
- Tray
零件状态
- 在售
- 停產
- 最後搶購
- Active
- Obsolete
- Discontinued at Digi-Key
- Not For New Designs
- Last Time Buy
封装/外壳
- 14-SOIC（0.154"，3.90mm 宽）
- 40-VFQFN 裸露焊盘
- 20-VQFN 裸露焊盘
- 8-SOIC（0.154"，3.90mm 宽）
- 16-SOIC（0.295"，7.50mm 宽）
- 32-TQFP 裸露焊盘
- 8-VDFN 裸露焊盘
- 14-DIP（0.300"，7.62mm）
- 24-VFQFN 裸露焊盘
- 14-LSSOP（0.173"，4.40mm 宽）
- 100-LFBGA，CSPBGA
- 10-TFSOP，10-MSOP（0.118"，3.00mm 宽）
- 48-VFQFN 裸露焊盘，CSP
- 8-TSSOP，8-MSOP（0.118"，3.00mm 宽）
- 16-SSOP（0.209"，5.30mm 宽）
- 16-TSSOP（0.173"，4.40mm 宽）
- 10-WFDFN 裸露焊盘
- 16-DIP（0.300"，7.62mm）
- 64-LQFP
- 32-WFQFN 裸露焊盘
- 28-WFQFN 裸露焊盘
- -
- 28-SOIC（0.173"，4.40mm 宽）裸露焊盘
- 16-VQFN 裸露焊盘
- 24-WFQFN 裸露焊盘
- 32-VFQFN 裸露焊盘
- 16-SOIC（0.154"，3.90mm 宽）
- 8-DIP（0.300"，7.62mm）
- 16-VFQFN
- 8-DIP (0.300", 7.62mm)
- 28-SSOP (0.209", 5.30mm Width)
- 20-CDIP (0.300", 7.62mm)
- 16-SOIC (0.295", 7.50mm Width)
- 28-VFQFN Exposed Pad
- 8-SOIC (0.154", 3.90mm Width)
- 16-SOIC (0.154", 3.90mm Width)
- 6-WDFN Exposed Pad
- 20-VQFN Exposed Pad
- 16-TSSOP (0.173", 4.40mm Width)
- 36-UFBGA, DSBGA
- 36-VFQFN Exposed Pad
- 24-VFQFN Exposed Pad
- 16-WFQFN Exposed Pad
- 12-WFDFN Exposed Pad
- 20-PowerTSSOP (0.173", 4.40mm Width)
- 16-DIP (0.300", 7.62mm)
- 28-TSSOP (0.220", 5.60mm Width)
- 32-VFQFN Exposed Pad
- 14-TSSOP (0.173", 4.40mm Width)
- 16-VQFN Exposed Pad
- 16-SSOP (0.154", 3.90mm Width)
- 16-CDIP (0.300", 7.62mm)
- 10-TFSOP, 10-MSOP (0.118", 3.00mm Width) Exposed Pad
- 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
- 24-SSOP (0.154", 3.90mm Width)
- 20-SOIC (0.295", 7.50mm Width)
- 25-TFBGA
- 28-LCC (J-Lead)
- 10-VFDFN Exposed Pad
- 64-VFQFN Exposed Pad
- 14-SOIC (0.154", 3.90mm Width)
- 20-LCC (J-Lead)
- 28-TSSOP (0.173", 4.40mm Width)
安装类型
- 表面贴装
- 通孔
- -
- Surface Mount
- Through Hole
供应商器件封装
- 14-SO
- 14-SOIC
- 40-QFN（6x6）
- 20-MQFN（5x5）
- 8-SOIC
- 16-SOIC
- 32-TQFP（5x5）
- 8-SON（3x3）
- 14-PDIP
- 24-QFN（4x5）
- 14-SSOPB
- 100-CSBGA（9x9）
- 10-MSOP
- 48-LFCSP-VQ（7x7）
- 8-MSOP
- 16-SSOP
- 16-TSSOP
- 10-TDFN-EP（3x4）
- 16-PDIP
- -
- PG-LQFP-64
- 32-TQFN（5x5）
- 28-TQFN（5x5）
- 28-TSSOP
- 28-TSSOP-EP
- 16-QFN（4x4）
- 24-QFN（3.5x3.5）
- 16-SOP
- 8-DIP
- 16-VQFN (4x4)
- 8-PDIP
- 28-SSOP
- 20-CDIP
- VQFN028V5050
- 6-TDFN-EP (3x3)
- 20-VQFN (5x5)
- 36-DSBGA (3.72x3.56)
- 36-VQFN (6x6)
- VQFN024V4040
- 16-WQFN (4x4)
- 12-WSON (4x4)
- 20-HTSSOP
- P-DSO-16-1
- 28-SSOPB
- 32-QFN
- 14-TSSOP
- 16-MLPQ (4x4)
- 32-QFN (5x5)
- 16-QSOP
- 16-CDIP
- 10-MSOP-PowerPad
- Micro8™
- 24-SSOP/QSOP
- 20-SOIC
- PG-DSO-16-1
- 25-NFBGA (4x4)
- 28-PLCC (11.51x11.51)
- 10-VSON (3x3)
- 8-VSSOP
- 64-QFP (10x10)
- 64-QFN (9x9)
- 20-PLCC (9x9)
工作温度
- -40°C ~ 85°C
- -40°C ~ 125°C
- 0°C ~ 70°C
- -30°C ~ 75°C
- -25°C ~ 85°C
- -10°C ~ 60°C
- 0°C ~ 50°C
- -55°C ~ 150°C
- -
- -40°C ~ 125°C（TA）
- -40°C ~ 95°C
- -40°C ~ 150°C
- -40°C ~ 85°C（TA）
- 150°C
- -55°C ~ 125°C
- -20°C ~ 85°C
- -40°C ~ 105°C
- -40°C ~ 110°C
- -25°C ~ 75°C
- -40°C ~ 120°C
类型
- 电流发送器
- 电阻
- 热电偶到数字转换器
- 传感器接口
- 飞行时间数字转换器
- 前置放大器
- CCD 信号处理器，14 位
- 电容数字转换器
- 烟雾探测器
- 热电偶放大器
- 转换器
- 信号调节器
- 串行器
- SFP 激光控制器
- 喇叭驱动器
- 传感器调节器
- 数据采集系统（DAS）
- 前端
- 电容性传感器
- 近距探测装置
- Capacitive Sensor Controller
- Horn Driver
- Signal Conditioner
- Sensor Interface
- Current Loop Protector
- Current Transmitter
- Sensor Conditioner
- Signal Processor
- Pressure Sensor
- Interface
- Relay/Load Driver
- Proximity Detector
- Variable Reluctance
- Smoke Detector
- Converter
- Thermocouple to Digital Converter
- Data Acquisition System (DAS)
- Thermocouple Conditioner
- Temperature Sensor
- Time to Flight to Digital Converter
- Image Sensor
- Front End
输入类型
- 差分
- -
- 热电偶
- 电压
- CMOS
- 热电偶（多重）
- 逻辑
- 光电
- 模拟
- 离子化
- 数字
- 电容性
- Logic
- Ionization
- Analog
- Voltage
- 4 ~ 20mA
- Capacitive
- Photoelectric
- Thermocouple
- Differential
- Thermocouple (K)
- Ultrasound
- Serial
- LVDS
输出类型
- 电压
- -
- 数字
- 模拟
- CMOS
- 电流
- 逻辑
- I²C
- SPI
- Logic
- Voltage
- Analog
- 4 ~ 20mA
- Digital
- Thermocouple
- Current
- Differential
- Serial
- LVDS
接口
- 3 线
- I²C，SPI
- I²C
- 差分
- -
- 串行
- 2 线
- SPI
- 2 线串口
- 3 线串口
- 4 线 SPI 串行
电流 - 电源
- 20mA
- 2.5µA
- 300µA
- 200µA
- 23mA
- 900µA
- 55mA
- 70µA
- 48mA
- 8µA
- 250µA
- 100nA
- 2.5mA
- 1.2mA
- 9µA
- 2.1mA
- 10mA
- 1.4mA
- 457µA
- 150nA
- 250mA
- 173µA
- 476µA
- 12mA
- 90µA
- 890µA
- 18mA
- 3.5mA
- 14µA
- 40µA
- 6.8mA
- 500µA
- 13.6mA
- 5mA
- 550µA
- 6µA
- 1.9µA
- 800µA
- 4mA
- 150µA
- 1.5mA
- 1.35mA
- 125mA
- 75mA
- 2.7mA
- 15mA
- 2mA
- 6mA
基本零件编号
- MAX31855
- AD8494
- TDA0161
- BU21010
- AD598
- RE46C107
- PGA400
- TPL9202
- RE46C166
- MAX9926
- LT1025
- AD698
通知
- QPL or Military Specs are for reference only. Parts are not for military use. See Terms and Conditions.
已选条件：
| 序号 | 图片 | 产品名称 | 型号 | 制造商 | 环保 | 参考价格 | 描述 |
|---|---|---|---|---|---|---|---|
| 1 | 暂无 | 传感器芯片,探测器芯片 | ZSSC3154BE1D | Renesas Electronics America Inc. | 询价 |
DICE (WAFER SAWN) - WAFFLE PACK | |
| 2 | 暂无 | 传感器芯片,探测器芯片 | PT8A261WEX | - | 询价 |
||
| 3 | 暂无 | 传感器芯片,探测器芯片 | ZSSC3016CI1B | Renesas Electronics America Inc. | 询价 |
WAFER (UNSAWN) - BOX | |
| 4 |  |
传感器芯片,探测器芯片 | MLX90320LFR-BBA-000-SP | Melexis Technologies NV | 询价 |
||
| 5 | 暂无 | 传感器芯片,探测器芯片 | ZSSC3026CI6B | IDT, Integrated Device Technology Inc | 询价 |
||
| 6 | 暂无 | 传感器芯片,探测器芯片 | PT8A2642WEX | Diodes Incorporated | Y | 询价 |
PIR CONTROLLER SO-16 |
| 7 | 暂无 | 传感器芯片,探测器芯片 | AD9840JST | Analog Devices Inc. | 询价 |
||
| 8 |  |
传感器芯片,探测器芯片 | XTR116UA/2K5 | Texas Instruments | Y | 询价 |
|
| 9 | 暂无 | 传感器芯片,探测器芯片 | LT1025ACJ8 | Linear Technology/Analog Devices | 询价 |
||
| 10 | 暂无 | 传感器芯片,探测器芯片 | MAX6674ISA | Maxim Integrated | 询价 |
||
| 11 | 暂无 | 传感器芯片,探测器芯片 | SSC7150-ML-AB0 | Microchip Technology Inc | 询价 |
||
| 12 | 暂无 | 传感器芯片,探测器芯片 | XTR103AP | Texas Instruments | 询价 |
||
| 13 | 暂无 | 传感器芯片,探测器芯片 | AD9843AJSTRL | Analog Devices Inc. | 询价 |
||
| 14 | 暂无 | 传感器芯片,探测器芯片 | MAX14540AEEWP+ | Maxim Integrated | 询价 |
||
| 15 | 暂无 | 传感器芯片,探测器芯片 | ZSSC3240BI3R | - | 询价 |
||
| 16 | 暂无 | 传感器芯片,探测器芯片 | XR18910ILMTR-67 | - | 询价 |
||
| 17 |  |
传感器芯片,探测器芯片 | MAX6675ISA | Maxim Integrated | 询价 |
||
| 18 | 暂无 | 传感器芯片,探测器芯片 | ZSSC3240CC5B | - | 询价 |
||
| 19 |  |
传感器芯片,探测器芯片 | AD7150BRMZ | Analog Devices Inc. | Y | 询价 |
|
| 20 | 暂无 | 传感器芯片,探测器芯片 | ZSSC3018BA2DES | - | 询价 |
||
| 21 |  |
传感器芯片,探测器芯片 | MC145012P | NXP USA Inc. | 询价 |
||
| 22 | 暂无 | 传感器芯片,探测器芯片 | AD9846AJSTRL | Analog Devices Inc. | 询价 |
||
| 23 | 暂无 | 传感器芯片,探测器芯片 | ZSSC3170EE1D | IDT, Integrated Device Technology Inc | 询价 |
DICE (WAFER SAWN) - WAFFLE PACK | |
| 24 | 暂无 | 传感器芯片,探测器芯片 | MAX3983UGK+TD | Maxim Integrated | Y | 询价 |
IC SIGNAL COND QUAD 68-QFN |
| 25 |  |
传感器芯片,探测器芯片 | TDC-GP21 TRA | ams | Y | 询价 |
|
| 26 | 暂无 | 传感器芯片,探测器芯片 | ZSSC3240AI3VES | - | 询价 |
||
| 27 | 暂无 | 传感器芯片,探测器芯片 | TDC-GPX2TRA | ams | 询价 |
ICCONVERTERTIME-FLIGHT64QFN | |
| 28 | |
传感器芯片,探测器芯片 | XTR115U | Texas Instruments | Y | 询价 |
|
| 29 |  |
传感器芯片,探测器芯片 | RE46C107S16F | Microchip Technology | Y | 询价 |
|
| 30 | 暂无 | 传感器芯片,探测器芯片 | ZSC31150GEC | Renesas Electronics America Inc. | 询价 |
DICE (WAFER SAWN) - FRAME | |
| 31 | 暂无 | 传感器芯片,探测器芯片 | AD694AR | Analog Devices Inc. | 询价 |
||
| 32 |  |
传感器芯片,探测器芯片 | AD9822JRSZ | Analog Devices Inc. | Y | 询价 |
|
| 33 | 暂无 | 传感器芯片,探测器芯片 | PT8A261WE | - | 询价 |
||
| 34 | 暂无 | 传感器芯片,探测器芯片 | ZSSC3154BA1D | Renesas Electronics America Inc. | 询价 |
DICE (WAFER SAWN) - WAFFLE PACK | |
| 35 | 暂无 | 传感器芯片,探测器芯片 | ZSSC4151AE1C | Renesas Electronics America Inc. | 询价 |
DICE (WAFER SAWN) - FRAME | |
| 36 | 暂无 | 传感器芯片,探测器芯片 | ZSSC3240BI1BES | - | 询价 |
||
| 37 |  |
传感器芯片,探测器芯片 | PS021 | ams | Y | 询价 |
|
| 38 |  |
传感器芯片,探测器芯片 | APDS-9700-020 | Broadcom Limited | Y | 询价 |
|
| 39 | 暂无 | 传感器芯片,探测器芯片 | AD9842AJSTZ | Analog Devices Inc. | 询价 |
||
| 40 |  |
传感器芯片,探测器芯片 | MAX1455AAE | Maxim Integrated | Y | 询价 |
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