图片仅供参考

详细数据请看参考数据手册

Datasheet下载
  • 型号: DSK5J01Q0L
  • 制造商: Panasonic Corporation
  • 库位|库存: xxxx|xxxx
  • 要求:
数量阶梯 香港交货 国内含税
+xxxx $xxxx ¥xxxx

查看当月历史价格

查看今年历史价格

DSK5J01Q0L产品简介:

ICGOO电子元器件商城为您提供DSK5J01Q0L由Panasonic Corporation设计生产,在icgoo商城现货销售,并且可以通过原厂、代理商等渠道进行代购。 DSK5J01Q0L价格参考。Panasonic CorporationDSK5J01Q0L封装/规格:晶体管 - JFET, JFET N-Channel 30mA 150mW Surface Mount SMini3-F2-B。您可以下载DSK5J01Q0L参考资料、Datasheet数据手册功能说明书,资料中有DSK5J01Q0L 详细功能的应用电路图电压和使用方法及教程。

产品参数 图文手册 常见问题
参数 数值
产品目录

分立半导体产品

Ciss-输入电容

6 pF

描述

JFET N-CH 30MA 150MW SMINI3-F2-BJFET Junction FET

产品分类

JFET(结点场效应分离式半导体

FET类型

N 沟道

Id-连续漏极电流

30 mA

品牌

PanasonicPanasonic Electronic Components - Semiconductor Products

产品手册

点击此处下载产品Datasheet

产品图片

rohs

符合RoHS无铅 / 符合限制有害物质指令(RoHS)规范要求

产品系列

晶体管,JFET,Panasonic DSK5J01Q0L-

数据手册

http://industrial.panasonic.com/www-cgi/jvcr13pz.cgi?E+SC+3+AJD7001+DSK5J01+8+WW

产品型号

DSK5J01Q0LDSK5J01Q0L

Pd-功率耗散

150 mW

Vgs-栅源极击穿电压

- 55 V

Vgs=0时的漏-源电流

6.5 mA

不同Id时的电压-截止(VGS关)

5V @ 10µA

不同Vds(Vgs=0)时的电流-漏极(Idss)

2mA @ 10V

不同Vds时的输入电容(Ciss)

6pF @ 10V

产品种类

JFET

供应商器件封装

SMini3-F2-B

其它名称

DSK5J01Q0LDKR

功率-最大值

150mW

功率耗散

150 mW

包装

Digi-Reel®

商标

Panasonic

安装类型

表面贴装

安装风格

SMD/SMT

封装

Reel

封装/外壳

SC-85

封装/箱体

SMini3-F2-B

工厂包装数量

3000

晶体管极性

N-Channel

最大工作温度

+ 85 C

最小工作温度

- 40 C

标准包装

1

正向跨导-最小值

2.5 mS

漏极电流(Id)-最大值

30mA

漏极电流Id-最大值

30 mA

漏源极电压(Vdss)

55V

电压-击穿(V(BR)GSS)

-

电阻-RDS(开)

-

输入电容

6 pF

配置

Single

闸/源击穿电压

- 55 V

闸/源截止电压

- 5 V

推荐商品

型号:2N5457_D75Z

品牌:ON Semiconductor

产品名称:分立半导体产品

获取报价

型号:MMBF5460LT1

品牌:ON Semiconductor

产品名称:分立半导体产品

获取报价

型号:2SK23800QL

品牌:Panasonic Electronic Components

产品名称:分立半导体产品

获取报价

型号:KSK30RBU

品牌:ON Semiconductor

产品名称:分立半导体产品

获取报价

型号:MMBF4118

品牌:ON Semiconductor

产品名称:分立半导体产品

获取报价

型号:PMBFJ310,215

品牌:NXP USA Inc.

产品名称:分立半导体产品

获取报价

型号:U1898_D27Z

品牌:ON Semiconductor

产品名称:分立半导体产品

获取报价

型号:BFR30LT1

品牌:ON Semiconductor

产品名称:分立半导体产品

获取报价

样品试用

万种样品免费试用

去申请
DSK5J01Q0L 相关产品

MMBFJ175

品牌:ON Semiconductor

价格:

PN4117

品牌:ON Semiconductor

价格:

2SK2145-BL(TE85L,F

品牌:Toshiba Semiconductor and Storage

价格:

MMBFJ271

品牌:ON Semiconductor

价格:

MMBFJ305

品牌:ON Semiconductor

价格:¥0.76-¥0.76

2N4416A

品牌:Vishay Siliconix

价格:

PN4302

品牌:ON Semiconductor

价格:

2N5461RLRAG

品牌:ON Semiconductor

价格:

PDF Datasheet 数据手册内容提取

Doc No. TT4-EA-12789 Revision. 2 Product Standards Junction FETs DSK5J010L DSK5J010L Silicon N-channel Junciton FET Unit: mm For low frequency amplificaton / For pyroelctric sensor DSK2J01 in SMini3 type package 2.0 0.3 0.13  Features 3  High gate-drain Voltage(Source open)VGDO  Halogen-free / RoHS compliant (EU RoHS / UL-94 V-0 / MSL:Level 1 compliant) 1.252.1 1 2  Marking Symbol: B6 0.9  Packaging (0.65)(0.65) Embossed type (Thermo-compression sealing) : 3 000 pcs / reel (standard) 1.3 1. Source 2. Drain 3. Gate Panasonic SMini3-F2-B JEITA SC-85  Absolute Maximum Ratings Ta = 25 C Code ― Parameter Symbol Rating Unit Gate-drain voltage (Source short) VGDS -55 V Drain current ID 30 mA Internal Connection Gate current IG 10 mA (G) 3 Power dissipation PD 150 mW Channel temperature Tch 150 °C Operating ambient temperature Topr -40 to +85 °C Storage temperature Tstg -55 to +150 °C 1 2 (S) (D)  Electrical Characteristics Ta = 25 C  3 C Parameter Symbol Conditions Min Typ Max Unit Gate-drain voltage (Source short) VGDS IG = -100 μA, VDS = 0 -55 V Drain current *1 IDSS VDS = 10 V , VGS = 0 1.0 12.0 mA Gate-source cutoff current IGSS VGS = -30 V, VDS = 0 -10 nA Gate-source cutoff voltage VGSC VDS = 10 V, ID = 10 μA -5 V Forward transfer admittance |Yfs| VDS = 10 V, ID = 5 mA, f =1 kHz 2.5 7.5 mS Small-signal short-circuit input capacitance Ciss 6.0 pF VDS = 10 V, VGS = 0, f = 1 MHz Small-signal reverse transfer capacitance Crss 2.5 pF Note) Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7030 Measuring methods for transistors. *1 Rank classification Code P Q R Rank P Q R IDSS (mA) 1.0 to 3.0 2.0 to 6.5 5.0 to 12.0 Marking symbol B6P B6Q B6R Page 1 of 3 Established :2010-10-26 Revised :2014-03-25

Doc No. TT4-EA-12789 Revision. 2 Product Standards Junction FETs DSK5J010L Technical Data ( reference ) PD-Ta ID-VGS 200 8 VDS = 10V -40 ℃ W)150 6 D (m mA) 25 ℃ ation P100 ent ID ( 4 sip urr s c wer Di 50 Drain 2 Ta = 85 ℃ o P 0 0 0 20 40 60 80 100 120 140 160 180 200 -1.5 -1 -0.5 0 0.5 Temperature Ta (℃) Gate-source voltage VGS (V) ID-VDS |Yfs|-ID 4 100 Ta= 25 ℃ Ta = 25 ℃ VGS= 0 V e 3 nc VDS = 10 V mA) mitta 10 ent ID ( 2 -0.2 V nsfer ads| (mS) ain curr 1 -0.4 V word tra|Yf 1 Dr or F -0.6 V 0 0.1 0 2 4 6 8 10 12 0.01 0.1 1 10 Drain-source voltage VDS (V) Drain current ID (mA) Cx-VDS 12 Ta= 25 ℃ 10 Ciss Coss F) 8 p e C ( 6 c n Crss a 4 cit a p a 2 C 0 0 5 10 15 20 Drain-source voltage VDS (V) Page 2 of 3 Established :2010-10-26 Revised :2014-03-25

Doc No. TT4-EA-12789 Revision. 2 Product Standards Junction FETs DSK5J010L SMini3-F2-B Unit: mm 2.0±0.2 +0.05 +0.05 0.13-0.02 0.30-0.02 3 0 1 1 . . 0 0 ± ± 5 1 2 . . 2 1 ) ° 5 1 2 ( 0 (0.65) (0.65) 05 . 0 ± 1.3±0.1 5 2 4 . 0 (5°) ) 9 4 9) 0.1 0. 8 ± ( (0. 0.9 1 . 0 o t 0  Land Pattern (Reference) (Unit: mm) 0.9 8 . 0 9 . 1 1.3 Page 3 of 3 Established :2010-10-26 Revised :2014-03-25

Request for your special attention and precautions in using the technical information and semiconductors described in this book (1) If anyof theproductsor technicalinformationdescribedinthisbook is tobe exported or provided to non-residents, the lawsandregulationsoftheexportingcountry,especially,thosewithregardtosecurityexportcontrol,mustbeobserved. (2)Thetechnicalinformationdescribedinthisbookisintendedonlytoshowthemaincharacteristicsandapplicationcircuit examples of the products. No license is granted in and to any intellectual property right or other right owned by Panasonic Corporation or any other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other company which may arise as a result of the use of technical informationde-scribedinthisbook. (3) The products described in this book are intended to be used for general applications (such as office equipment, communicationsequipment,measuringinstrumentsandhouseholdappliances),orforspecificapplicationsasexpressly statedinthisbook. Please consult with our sales staff in advance for information on the following applications, moreover please exchange documentsseparatelyontermsofuseetc.:Specialapplications(suchasforin-vehicleequipment,airplanes,aerospace, automotive equipment, traffic signaling equipment, combustion equipment, medical equipment and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardizelifeorharmthehumanbody. Unlessexchangingdocumentsontermsofuseetc.inadvance,itistobeunderstoodthatourcompanyshallnotbeheld responsiblefor anydamageincurred asaresult of or inconnection with your usingthe productsdescribed inthisbook foranyspecialapplication. (4) The products and product specifications described in this book are subject to change without notice for modification and/orimprovement.Atthefinalstageofyourdesign,purchasing,oruseoftheproducts,therefore,askforthemostup- to-dateProductStandardsinadvancetomakesurethatthelatestspecificationssatisfyyourrequirements. (5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions(operatingpowersupplyvoltageandoperatingenvironmentetc.).Especially,pleasebecarefulnottoexceed the range of absolute maximum rating on the transient state, such as power-on, power-off and mode-switching. Other- wise,wewillnotbeliableforanydefectwhichmayariselaterinyourequipment. Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arrestingthespreadoffireorpreventingglitcharerecommendedinordertopreventphysicalinjury,fire,socialdamages, forexample,byusingtheproducts. (6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS, thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. We do notguaranteequalityfordisassembledproductsortheproductre-mountedafterremovingfromthemountingboard. Whenusingproductsforwhichdamp-proofpackingisrequired,satisfytheconditions,suchasshelflifeandtheelapsed timesincefirstopeningthepackages. (7) When reselling products described in this book to other companies without our permission and receiving any claim of requestfromtheresaledestination,pleaseunderstandthatcustomerswillbeartheburden. (8) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of our company. No.010618