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  • 型号: PUMD6,115
  • 制造商: NXP Semiconductors
  • 库位|库存: xxxx|xxxx
  • 要求:
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PUMD6,115产品简介:

ICGOO电子元器件商城为您提供PUMD6,115由NXP Semiconductors设计生产,在icgoo商城现货销售,并且可以通过原厂、代理商等渠道进行代购。 PUMD6,115价格参考¥0.20-¥0.25。NXP SemiconductorsPUMD6,115封装/规格:晶体管 - 双极 (BJT) - 阵列 - 预偏置, Pre-Biased Bipolar Transistor (BJT) 1 NPN, 1 PNP - Pre-Biased (Dual) 50V 100mA 300mW Surface Mount 6-TSSOP。您可以下载PUMD6,115参考资料、Datasheet数据手册功能说明书,资料中有PUMD6,115 详细功能的应用电路图电压和使用方法及教程。

产品参数 图文手册 常见问题
参数 数值
产品目录

分立半导体产品

描述

TRANS PREBIAS NPN/PNP 6TSSOP开关晶体管 - 偏压电阻器 TRNS DOUBL RET TAPE7

产品分类

晶体管(BJT) - 阵列﹐预偏压式分离式半导体

品牌

NXP Semiconductors

产品手册

点击此处下载产品Datasheet

产品图片

rohs

符合RoHS无铅 / 符合限制有害物质指令(RoHS)规范要求

产品系列

晶体管,开关晶体管 - 偏压电阻器,NXP Semiconductors PUMD6,115-

数据手册

点击此处下载产品Datasheet

产品型号

PUMD6,115

PCN设计/规格

点击此处下载产品Datasheet

不同 Ib、Ic时的 Vce饱和值(最大值)

100mV @ 250µA, 5mA

不同 Ic、Vce 时的DC电流增益(hFE)(最小值)

200 @ 1mA,5V

产品目录绘图

产品目录页面

点击此处下载产品Datasheet

产品种类

开关晶体管 - 偏压电阻器

供应商器件封装

6-TSSOP

其它名称

568-5040-2
934055430115
PUMD6 T/R
PUMD6 T/R-ND
PUMD6,115-ND

典型输入电阻器

4.7 kOhms

功率-最大值

300mW

包装

带卷 (TR)

商标

NXP Semiconductors

安装类型

表面贴装

安装风格

SMD/SMT

封装

Reel

封装/外壳

6-TSSOP,SC-88,SOT-363

封装/箱体

SOT-363-6

峰值直流集电极电流

100 mA

工厂包装数量

3000

晶体管极性

NPN/PNP

晶体管类型

1 个 NPN,1 个 PNP - 预偏压式(双)

最大工作温度

+ 150 C

最小工作温度

- 65 C

标准包装

3,000

特色产品

http://www.digikey.com/cn/zh/ph/NXP/I2C.html

电压-集射极击穿(最大值)

50V

电流-集电极(Ic)(最大值)

100mA

电流-集电极截止(最大值)

1µA

电阻器-发射极基底(R2)(Ω)

-

电阻器-基底(R1)(Ω)

4.7k

配置

Dual

集电极—发射极最大电压VCEO

50 V

零件号别名

PUMD6 T/R

频率-跃迁

-

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PDF Datasheet 数据手册内容提取

Important notice Dear Customer, On 7 February 2017 the former NXP Standard Product business became a new company with the tradename Nexperia. Nexperia is an industry leading supplier of Discrete, Logic and PowerMOS semiconductors with its focus on the automotive, industrial, computing, consumer and wearable application markets In data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below. Instead of http://www.nxp.com, http://www.philips.com/ or http://www.semiconductors.philips.com/, use http://www.nexperia.com Instead of sales.addresses@www.nxp.com or sales.addresses@www.semiconductors.philips.com, use salesaddresses@nexperia.com (email) Replace the copyright notice at the bottom of each page or elsewhere in the document, depending on the version, as shown below: - © NXP N.V. (year). All rights reserved or © Koninklijke Philips Electronics N.V. (year). All rights reserved Should be replaced with: - © Nexperia B.V. (year). All rights reserved. If you have any questions related to the data sheet, please contact our nearest sales office via e-mail or telephone (details via salesaddresses@nexperia.com). Thank you for your cooperation and understanding, Kind regards, Team Nexperia

DISCRETE SEMICONDUCTORS DATA SHEET PEMD6; PUMD6 NPN/PNP resistor-equipped transistors; R1 = 4.7 kΩ, R2 = open Product data sheet 2004 Apr 07 Supersedes data of 2003 Nov 04

NXP Semiconductors Product data sheet NPN/PNP resistor-equipped transistors; PEMD6; PUMD6 R1 = 4.7 kΩ, R2 = open FEATURES DESCRIPTION • Built-in bias resistors NPN/PNP resistor-equipped transistors (see “_Data_Sheet_Remark Supersedes data of 2003 Nov 04” • Simplified circuit design for package details). • Reduction of component count • Reduced pick and place costs. QUICK REFERENCE DATA APPLICATIONS SYMBOL PARAMETER TYP. MAX. UNIT V collector-emitter − 50 V • Low current peripheral driver CEO voltage • Replacement of general purpose transistors in digital I output current (DC) − 100 mA applications O TR1 NPN − − − • Control of IC inputs. TR2 PNP − − − R1 bias resistor 4.7 − kΩ R2 open − − − PRODUCT OVERVIEW PACKAGE NPN/NPN PNP/PNP TYPE NUMBER MARKING CODE COMPLEMENT COMPLEMENT PHILIPS EIAJ PEMD6 SOT666 − D6 PEMH7 PEMB3 PUMD6 SOT363 SC-88 D*6(1) PUMH7 PUMB3 Note 1. * = p: Made in Hong Kong. * = t: Made in Malaysia. SIMPLIFIED OUTLINE, SYMBOL AND PINNING PINNING TYPE NUMBER SIMPLIFIED OUTLINE AND SYMBOL PIN DESCRIPTION PEMD6; PUMD6 6 5 4 1 emitter TR1 handbook, halfpa6ge 5 4 2 base TR1 3 collector TR2 R1 TR2 4 emitter TR2 TR1 5 base TR2 R1 6 collector TR1 1 2 3 1 2 3 Top view MHC028 2004 Apr 07 2

NXP Semiconductors Product data sheet NPN/PNP resistor-equipped transistors; PEMD6; PUMD6 R1 = 4.7 kΩ, R2 = open ORDERING INFORMATION PACKAGE TYPE NUMBER NAME DESCRIPTION VERSION PEMD6 − plastic surface mounted package; 6 leads SOT666 PUMD6 − plastic surface mounted package; 6 leads SOT363 LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134). SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT Per transistor; for the PNP transistor with negative polarity V collector-base voltage open emitter − 50 V CBO V collector-emitter voltage open base − 50 V CEO V emitter-base voltage open collector − 5 V EBO I output current (DC) − 100 mA O I peak collector current − 100 mA CM P total power dissipation T ≤ 25 °C; note 1 tot amb SOT363 note 1 − 200 mW SOT666 notes 1 and 2 − 200 mW T storage temperature −65 +150 °C stg T junction temperature − 150 °C j T operating ambient temperature −65 +150 °C amb Per device P total power dissipation T ≤ 25 °C; note 1 tot amb SOT363 note 1 − 300 mW SOT666 notes 1 and 2 − 300 mW Notes 1. Transistor mounted on an FR4 printed-circuit board, single-sided copper, standard footprint. 2. Reflow soldering is the only recommended soldering method. 2004 Apr 07 3

NXP Semiconductors Product data sheet NPN/PNP resistor-equipped transistors; PEMD6; PUMD6 R1 = 4.7 kΩ, R2 = open THERMAL CHARACTERISTICS SYMBOL PARAMETER CONDITIONS VALUE UNIT Per transistor R thermal resistance from junction to note 1 th(j-a) ambient SOT363 625 K/W SOT666 625 K/W Per device R thermal resistance from junction to note 1 th(j-a) ambient SOT363 416 K/W SOT666 416 K/W Note 1. Transistor mounted on an FR4 printed-circuit board, single-sided copper, standard footprint. CHARACTERISTICS T = 25 °C; unless otherwise specified. amb SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT Per transistor; for the PNP transistor with negative polarity I collector-base cut-off current V = 50 V; I = 0 − − 100 nA CBO CB E I collector-emitter cut-off current V = 30 V; I = 0 − − 1 μA CEO CE B V = 30 V; I = 0; T = 150 °C − − 50 μA CE B j I emitter-base cut-off current V = 5 V; I = 0 − − 100 nA EBO EB C h DC current gain V = 5 V; I = 1 mA 200 − − FE CE C V collector-emitter saturation voltage I = 5 mA; I = 0.25 mA − − 100 mV CEsat C B R1 input resistor 3.3 4.7 6.1 kΩ C collector capacitance I = I = 0; V = 10 V; f = 1 MHz c E e CB TR1 (NPN) − − 2.5 pF TR2 (PNP) − − 3 pF 2004 Apr 07 4

NXP Semiconductors Product data sheet NPN/PNP resistor-equipped transistors; PEMD6; PUMD6 R1 = 4.7 kΩ, R2 = open PACKAGE OUTLINES Plastic surface-mounted package; 6 leads SOT666 D A E X S Y S HE 6 5 4 pin 1 index A 1 2 3 c e1 bp w M A Lp e detail X 0 1 2 mm scale DIMENSIONS (mm are the original dimensions) UNIT A bp c D E e e1 HE Lp w y 0.6 0.27 0.18 1.7 1.3 1.7 0.3 mm 1.0 0.5 0.1 0.1 0.5 0.17 0.08 1.5 1.1 1.5 0.1 OUTLINE REFERENCES EUROPEAN ISSUE DATE VERSION IEC JEDEC JEITA PROJECTION 04-11-08 SOT666 06-03-16 2004 Apr 07 5

NXP Semiconductors Product data sheet NPN/PNP resistor-equipped transistors; PEMD6; PUMD6 R1 = 4.7 kΩ, R2 = open Plastic surface-mounted package; 6 leads SOT363 D B E A X y HE v M A 6 5 4 Q pin 1 index A A1 1 2 3 c e1 bp w M B Lp e detail X 0 1 2 mm scale DIMENSIONS (mm are the original dimensions) A1 UNIT A max bp c D E e e1 HE Lp Q v w y 1.1 0.30 0.25 2.2 1.35 2.2 0.45 0.25 mm 0.1 1.3 0.65 0.2 0.2 0.1 0.8 0.20 0.10 1.8 1.15 2.0 0.15 0.15 OUTLINE REFERENCES EUROPEAN ISSUE DATE VERSION IEC JEDEC JEITA PROJECTION 04-11-08 SOT363 SC-88 06-03-16 2004 Apr 07 6

NXP Semiconductors Product data sheet NPN/PNP resistor-equipped transistors; PEMD6; PUMD6 R1 = 4.7 kΩ, R2 = open DATA SHEET STATUS DOCUMENT PRODUCT DEFINITION STATUS(1) STATUS(2) Objective data sheet Development This document contains data from the objective specification for product development. Preliminary data sheet Qualification This document contains data from the preliminary specification. Product data sheet Production This document contains the product specification. Notes 1. Please consult the most recently issued document before initiating or completing a design. 2. The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. DISCLAIMERS above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for General ⎯ Information in this document is believed to be extended periods may affect device reliability. accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, Terms and conditions of sale ⎯ NXP Semiconductors expressed or implied, as to the accuracy or completeness products are sold subject to the general terms and of such information and shall have no liability for the conditions of commercial sale, as published at consequences of use of such information. http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights Right to make changes ⎯ NXP Semiconductors infringement and limitation of liability, unless explicitly reserves the right to make changes to information otherwise agreed to in writing by NXP Semiconductors. In published in this document, including without limitation case of any inconsistency or conflict between information specifications and product descriptions, at any time and in this document and such terms and conditions, the latter without notice. This document supersedes and replaces all will prevail. information supplied prior to the publication hereof. No offer to sell or license ⎯ Nothing in this document Suitability for use ⎯ NXP Semiconductors products are may be interpreted or construed as an offer to sell products not designed, authorized or warranted to be suitable for that is open for acceptance or the grant, conveyance or use in medical, military, aircraft, space or life support implication of any license under any copyrights, patents or equipment, nor in applications where failure or malfunction other industrial or intellectual property rights. of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe Export control ⎯ This document as well as the item(s) property or environmental damage. NXP Semiconductors described herein may be subject to export control accepts no liability for inclusion and/or use of NXP regulations. Export might require a prior authorization from Semiconductors products in such equipment or national authorities. applications and therefore such inclusion and/or use is at Quick reference data ⎯ The Quick reference data is an the customer’s own risk. extract of the product data given in the Limiting values and Applications ⎯ Applications that are described herein for Characteristics sections of this document, and as such is any of these products are for illustrative purposes only. not complete, exhaustive or legally binding. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values ⎯ Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions 2004 Apr 07 7

NXP Semiconductors Customer notification This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal definitions and disclaimers. No changes were made to the technical content, except for package outline drawings which were updated to the latest version. Contact information For additional information please visit: http://www.nxp.com For sales offices addresses send e-mail to: salesaddresses@nxp.com © NXP B.V. 2009 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands R75/04/pp8 Date of release: 2004 Apr 07 Document order number: 9397 750 13085