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STP5NK100Z产品简介:
ICGOO电子元器件商城为您提供STP5NK100Z由STMicroelectronics设计生产,在icgoo商城现货销售,并且可以通过原厂、代理商等渠道进行代购。 STP5NK100Z价格参考。STMicroelectronicsSTP5NK100Z封装/规格:晶体管 - FET,MOSFET - 单, 通孔 N 沟道 1000V 3.5A(Tc) 125W(Tc) TO-220AB。您可以下载STP5NK100Z参考资料、Datasheet数据手册功能说明书,资料中有STP5NK100Z 详细功能的应用电路图电压和使用方法及教程。
STP5NK100Z 是由 STMicroelectronics(意法半导体)生产的一款 N 沟道 MOSFET,属于晶体管 - FET、MOSFET - 单类别的产品。以下是其主要应用场景: 1. 开关电源 (SMPS) - STP5NK100Z 的高耐压特性(100V)使其非常适合用于开关电源中的功率开关。它可以高效地控制电压和电流的通断,广泛应用于 DC-DC 转换器、AC-DC 适配器等场景。 2. 电机驱动 - 在小型电机驱动应用中,这款 MOSFET 可以作为开关元件使用。它适用于低功率到中功率的电机控制,例如家用电器中的风扇、水泵或无人机的微型电机。 3. 负载切换 - 由于其低导通电阻(典型值为 40mΩ),STP5NK100Z 可以用作负载切换开关,确保在高电流负载下仍能保持较低的功耗和热量产生。常见于汽车电子、工业设备中的负载管理。 4. 电池管理系统 (BMS) - 在电池保护电路中,STP5NK100Z 可用于充放电控制,防止过流、短路等情况。它的快速开关特性和低损耗特性使其成为电池管理系统中的理想选择。 5. LED 驱动 - 该 MOSFET 可用于 LED 照明系统的恒流驱动电路中,通过 PWM 调光技术调节亮度,同时保持高效率和稳定性。 6. 逆变器 - 在小型逆变器中,STP5NK100Z 可用于将直流电转换为交流电,适用于太阳能逆变器、不间断电源 (UPS) 等场景。 7. 消费电子 - 此款 MOSFET 广泛应用于各种消费电子产品中,如笔记本电脑适配器、手机充电器、游戏机电源模块等,提供高效的电力传输和保护功能。 总结 STP5NK100Z 凭借其高耐压、低导通电阻和出色的开关性能,适用于多种电力电子应用领域。无论是工业设备、汽车电子还是消费类产品,都可以找到它的身影。
| 参数 | 数值 |
| 产品目录 | |
| ChannelMode | Enhancement |
| 描述 | MOSFET N-CH 1KV 3.5A TO-220MOSFET N-Ch 1000 Volt 3.5A Zener SuperMESH |
| 产品分类 | FET - 单分离式半导体 |
| FET功能 | 标准 |
| FET类型 | MOSFET N 通道,金属氧化物 |
| Id-ContinuousDrainCurrent | 3.5 A |
| Id-连续漏极电流 | 3.5 A |
| 品牌 | STMicroelectronics |
| 产品手册 | |
| 产品图片 |
|
| rohs | 符合RoHS无铅 / 符合限制有害物质指令(RoHS)规范要求 |
| 产品系列 | 晶体管,MOSFET,STMicroelectronics STP5NK100ZSuperMESH3™ |
| 数据手册 | |
| 产品型号 | STP5NK100Z |
| Pd-PowerDissipation | 125 W |
| Pd-功率耗散 | 125 W |
| Qg-栅极电荷 | 42 nC |
| RdsOn-Drain-SourceResistance | 3.7 Ohms |
| RdsOn-漏源导通电阻 | 3.7 Ohms |
| Vds-Drain-SourceBreakdownVoltage | 1 kV |
| Vds-漏源极击穿电压 | 1 kV |
| Vgs-Gate-SourceBreakdownVoltage | +/- 30 V |
| Vgs-栅源极击穿电压 | 30 V |
| 上升时间 | 7.7 ns |
| 下降时间 | 19 ns |
| 不同Id时的Vgs(th)(最大值) | 4.5V @ 100µA |
| 不同Vds时的输入电容(Ciss) | 1154pF @ 25V |
| 不同Vgs时的栅极电荷(Qg) | 59nC @ 10V |
| 不同 Id、Vgs时的 RdsOn(最大值) | 3.7 欧姆 @ 1.75A,10V |
| 产品目录页面 | |
| 产品种类 | MOSFET |
| 供应商器件封装 | TO-220AB |
| 其它名称 | 497-4382-5 |
| 其它有关文件 | http://www.st.com/web/catalog/sense_power/FM100/CL824/SC1168/PF83586?referrer=70071840 |
| 典型关闭延迟时间 | 51.5 ns |
| 功率-最大值 | 125W |
| 包装 | 管件 |
| 单位重量 | 1.438 g |
| 商标 | STMicroelectronics |
| 安装类型 | 通孔 |
| 安装风格 | Through Hole |
| 封装 | Tube |
| 封装/外壳 | TO-220-3 |
| 封装/箱体 | TO-220-3 |
| 工厂包装数量 | 1000 |
| 晶体管极性 | N-Channel |
| 最大工作温度 | + 150 C |
| 最小工作温度 | - 55 C |
| 标准包装 | 50 |
| 正向跨导-最小值 | 4 S |
| 漏源极电压(Vdss) | 1000V(1kV) |
| 电流-连续漏极(Id)(25°C时) | 3.5A (Tc) |
| 系列 | STP5NK100Z |
| 通道模式 | Enhancement |
| 配置 | Single |
STP5NK100Z, STF5NK100Z STW5NK100Z N-channel 1000 V, 2.7 Ω, 3.5 A, TO-220, TO-220FP, TO-247 SuperMESH3™ Power MOSFET Features V Type DSS R max I (@T ) DS(on) D JMAX 3 2 STF5NK100Z 1000 V < 3.7 Ω 3.5 A 1 TO-220 TO-220FP STP5NK100Z 1000 V < 3.7 Ω 3.5 A STW5NK100Z 1000 V < 3.7 Ω 3.5 A ■ Extremely high dv/dt capability ■ 100% avalanche tested 3 2 ■ Gate charge minimized 1 ■ Very low intrinsic capacitances TO-247 ■ Very good manufacturing repeatibility Applications ■ Switching application Figure 1. Internal schematic diagram D(2) Description The new SuperMESH™ series of Power MOSFETS is the result of further design improvements on ST's well-established strip- G(1) based PowerMESH™ layout. In addition to significantly lower on-resistance, the device offers superior dv/dt capability to ensure optimal performance even in the most demanding applications. The SuperMESH™ devices further complement an already broad range of innovative high voltage MOSFETs, which includes the S(3) revolutionary MDmesh™ products. AM01476v1 T able 1. Device summary Order code Marking Package Packaging STF5NK100Z F5NK100Z TO-220FP Tube STP5NK100Z P5NK100Z TO-220 Tube STW5NK100Z W5NK100Z TO-247 Tube May 2009 Doc ID 10850 Rev 5 1/15 www.st.com 15
Contents STP5NK100Z, STF5NK100Z, STW5NK100Z Contents 1 Electrical ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 2 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 2.1 Electrical characteristics (curves) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 3 Test circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 4 Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 5 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 2/15 Doc ID 10850 Rev 5
STP5NK100Z, STF5NK100Z, STW5NK100Z Electrical ratings 1 Electrical ratings Table 2. Absolute maximum ratings Value Symbol Parameter Unit TO-220, TO-247 TO-220FP V Drain-source voltage (V = 0) 1000 V DS GS V Gate-source voltage ± 30 V GS ID Drain current (continuous) at TC = 25°C 3.5 3.5 (1) A ID Drain current (continuous) at TC=100°C 2.2 2.2 (1) A IDM(2) Drain current (pulsed) 14 14 (1) A P Total dissipation at T = 25°C 125 30 W TOT C Derating factor 1 0.24 W/°C Gate source ESD V 4000 V ESD(G-S) (HBM-C=100pF, R=1.5 kΩ) dv/dt (3) Peak diode recovery voltage slope 4.5 V/ns Insulation withstand voltage (RMS) from all V three leads to external heat sink 2500 V ISO (t=1 s; Tc= 25°C) TJ Operating junction temperature -55 to 150 °C T Storage temperature stg 1. Limited only by maximum temperature allowed 2. Pulse width limited by safe operating area 3. I ≤ 3.5 A, di/dt ≤ 200 A/µs, V ≤ V , T ≤ T SD DD (BR)DSS j JMAX. Table 3. Thermal data Value Symbol Parameter Unit TO-220, TO-247 TO-220FP R Thermal resistance junction-case max 1 4.2 °C/W thj-case R Thermal resistance junction-ambient max 62.5 °C/W thj-a Maximum lead temperature for soldering T 300 °C l purpose Table 4. Avalanche characteristics Symbol Parameter Value Unit Avalanche current, repetitive or not-repetitive I 3.5 A AR (pulse width limited by T ) JMAX Single pulse avalanche energy E 250 mJ AS (starting T=25 °C, Id=Iar, Vdd=50 V) j Doc ID 10850 Rev 5 3/15
Electrical characteristics STP5NK100Z, STF5NK100Z, STW5NK100Z 2 Electrical characteristics (T =25°C unless otherwise specified) CASE Table 5. On/off states Symbol Parameter Test conditions Min. Typ. Max. Unit Drain-source breakdown V I = 1 mA, V = 0 1000 V (BR)DSS voltage D GS V = Max rating, Zero gate voltage drain DS 1 µA I V = Max rating, DSS current (VGS = 0) DS 50 µA Tc = 125 °C Gate body leakage current IGSS (V = 0) VGS = ± 20 V ±10 µA GS V Gate threshold voltage V = V , I = 100 µA 3 3.75 4.5 V GS(th) DS GS D Static drain-source on R V = 10 V, I = 1.75 A 2.7 3.7 Ω DS(on) resistance GS D Table 6. Dynamic Symbol Parameter Test conditions Min. Typ. Max. Unit g (1) Forward transconductance V =15 V, I = 1.75 A - 4 S fs DS D Input capacitance C 1154 pF iss Output capacitance V =25 V, f=1 MHz, C DS - 106 pF oss Reverse transfer VGS=0 C 21.3 pF rss capacitance Equivalent output C (2) V =0, V =0 V to 800 V - 46.8 pF osseq capacitance GS DS t Turn-on delay time 22.5 ns d(on) V =500 V, I = 1.75 A, t Rise time DD D 7.7 ns r R =4.7 Ω, V =10 V - t Off-voltage rise time G GS 51.5 ns d(off) (see Figure21) t Fall time 19 ns f Q Total gate charge V =800 V, I = 3.5 A 42 59 nC g DD D Q Gate-source charge V =10 V - 7.3 nC gs GS Q Gate-drain charge (see Figure22) 21.7 nC gd 1. Pulsed: pulse duration=300 µs, duty cycle 1.5% 2. C is defined as a constant equivalent capacitance giving the same charging time as C when V oss eq. oss DS increases from 0 to 80% V DSS 4/15 Doc ID 10850 Rev 5
STP5NK100Z, STF5NK100Z, STW5NK100Z Electrical characteristics Table 7. Source drain diode Symbol Parameter Test conditions Min. Typ. Max. Unit I Source-drain current - 3.5 A SD I (1) Source-drain current (pulsed) - 14 A SDM V (2) Forward on voltage I = 3.5 A, V =0 - 1.6 V SD SD GS I = 3.5 A, t Reverse recovery time SD 605 ns rr di/dt = 100 A/µs, Q Reverse recovery charge - 3.09 µC rr V =30 V I Reverse recovery current DD 10.5 A RRM (see Figure23) I = 3.5 A, t Reverse recovery time SD 742 ns rr di/dt = 100 A/µs, Q Reverse recovery charge - 4.2 µC rr V =35 V, T=150 °C I Reverse recovery current DD j 11.2 A RRM (see Figure23) 1. Pulse width limited by safe operating area 2. Pulsed: pulse duration=300 µs, duty cycle 1.5% Table 8. Gate-source Zener diode Symbol Parameter Test conditions Min. Typ. Max. Unit BV Gate-source breakdown voltage Igs=± 1 mA (open drain) 30 V GSO The built-in back-to-back Zener diodes have specifically been designed to enhance not only the device’s ESD capability, but also to make them safely absorb possible voltage transients that may occasionally be applied from gate to source. In this respect the Zener voltage is appropriate to achieve an efficient and cost-effective intervention to protect the device’s integrity. These integrated Zener diodes thus avoid the usage of external components. Doc ID 10850 Rev 5 5/15
Electrical characteristics STP5NK100Z, STF5NK100Z, STW5NK100Z 2.1 Electrical characteristics (curves) Figure 2. Safe operating area for TO-220FP Figure 3. Thermal impedance for TO-220FP Figure 4. Safe operating area for TO-220 Figure 5. Thermal impedance for TO-220 Figure 6. Safe operating area for TO-247 Figure 7. Thermal impedance for TO-247 6/15 Doc ID 10850 Rev 5
STP5NK100Z, STF5NK100Z, STW5NK100Z Electrical characteristics Figure 8. Output characteristics Figure 9. Transfer characteristics Figure 10. Transconductance Figure 11. Static drain-source on resistance Figure 12. Gate charge vs gate-source voltage Figure 13. Capacitance variations Doc ID 10850 Rev 5 7/15
Electrical characteristics STP5NK100Z, STF5NK100Z, STW5NK100Z Figure 14. Normalized gate threshold voltage Figure 15. Normalized on resistance vs vs temperature temperature Figure 16. Source-drain diode forward Figure 17. Normalized BVdss vs temperature characteristics Figure 18. Maximum avalanche energy vs temperature 8/15 Doc ID 10850 Rev 5
STP5NK100Z, STF5NK100Z, STW5NK100Z Test circuits 3 Test circuits Figure 19. Unclamped inductive load test Figure 20. Unclamped inductive waveform circuit Figure 21. Switching times test circuit for Figure 22. Gate charge test circuit resistive load Figure 23. Test circuit for inductive load switching and diode recovery times Doc ID 10850 Rev 5 9/15
Package mechanical data STP5NK100Z, STF5NK100Z, STW5NK100Z 4 Package mechanical data In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. 10/15 Doc ID 10850 Rev 5
STP5NK100Z, STF5NK100Z, STW5NK100Z Package mechanical data TO-220FP mechanical data mm Dim. Min. Typ. Max. A 4.4 4.6 B 2.5 2.7 D 2.5 2.75 E 0.45 0.7 F 0.75 1 F1 1.15 1.70 F2 1.15 1.5 G 4.95 5.2 G1 2.4 2.7 H 10 10.4 L2 16 L3 28.6 30.6 L4 9.8 10.6 L5 2.9 3.6 L6 15.9 16.4 L7 9 9.3 Dia 3 3.2 L7 E A B D Dia L5 L6 F1 F2 F H G G1 L2 L4 L3 7012510_Rev_J Doc ID 10850 Rev 5 11/15
Package mechanical data STP5NK100Z, STF5NK100Z, STW5NK100Z TO-220 mechanical data mm inch Dim Min Typ Max Min Typ Max A 4.40 4.60 0.173 0.181 b 0.61 0.88 0.024 0.034 b1 1.14 1.70 0.044 0.066 c 0.48 0.70 0.019 0.027 D 15.25 15.75 0.6 0.62 D1 1.27 0.050 E 10 10.40 0.393 0.409 e 2.40 2.70 0.094 0.106 e1 4.95 5.15 0.194 0.202 F 1.23 1.32 0.048 0.051 H1 6.20 6.60 0.244 0.256 J1 2.40 2.72 0.094 0.107 L 13 14 0.511 0.551 L1 3.50 3.93 0.137 0.154 L20 16.40 0.645 L30 28.90 1.137 ∅P 3.75 3.85 0.147 0.151 Q 2.65 2.95 0.104 0.116 12/15 Doc ID 10850 Rev 5
STP5NK100Z, STF5NK100Z, STW5NK100Z Package mechanical data TO-247 Mechanical data mm. Dim. Min. Typ Max. A 4.85 5.15 A1 2.20 2.60 b 1.0 1.40 b1 2.0 2.40 b2 3.0 3.40 c 0.40 0.80 D 19.85 20.15 E 15.45 15.75 e 5.45 L 14.20 14.80 L1 3.70 4.30 L2 18.50 øP 3.55 3.65 øR 4.50 5.50 S 5.50 Doc ID 10850 Rev 5 13/15
Revision history STP5NK100Z, STF5NK100Z, STW5NK100Z 5 Revision history Table 9. Document revision history Date Revision Changes 12-Oct-2004 1 First release 08-Sep-2005 2 Complete datasheet 16-Dec-2005 3 Inserted ecopack indication 16-Aug-2006 4 New template, no content change 15-May-2009 5 Modified: Section2.1: Electrical characteristics (curves) 14/15 Doc ID 10850 Rev 5
STP5NK100Z, STF5NK100Z, STW5NK100Z Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. © 2009 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco - Philippines - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com Doc ID 10850 Rev 5 15/15
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