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  • 型号: IRFR9220TRPBF
  • 制造商: Vishay
  • 库位|库存: xxxx|xxxx
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IRFR9220TRPBF产品简介:

ICGOO电子元器件商城为您提供IRFR9220TRPBF由Vishay设计生产,在icgoo商城现货销售,并且可以通过原厂、代理商等渠道进行代购。 IRFR9220TRPBF价格参考。VishayIRFR9220TRPBF封装/规格:晶体管 - FET,MOSFET - 单, 表面贴装 P 沟道 200V 3.6A(Tc) 2.5W(Ta),42W(Tc) D-Pak。您可以下载IRFR9220TRPBF参考资料、Datasheet数据手册功能说明书,资料中有IRFR9220TRPBF 详细功能的应用电路图电压和使用方法及教程。

产品参数 图文手册 常见问题
参数 数值
产品目录

分立半导体产品

ChannelMode

Enhancement

描述

MOSFET P-CH 200V 3.6A DPAKMOSFET P-Chan 200V 3.6 Amp

产品分类

FET - 单分离式半导体

FET功能

标准

FET类型

MOSFET P 通道,金属氧化物

Id-ContinuousDrainCurrent

3.6 A

Id-连续漏极电流

3.6 A

品牌

Vishay / SiliconixVishay Siliconix

产品手册

点击此处下载产品Datasheet

产品图片

rohs

RoHS 合规性豁免无铅 / 符合限制有害物质指令(RoHS)规范要求

产品系列

晶体管,MOSFET,Vishay / Siliconix IRFR9220TRPBF-

数据手册

点击此处下载产品Datasheet

产品型号

IRFR9220TRPBFIRFR9220TRPBF

Pd-PowerDissipation

2.5 W

Pd-功率耗散

2.5 W

RdsOn-Drain-SourceResistance

1.5 Ohms

RdsOn-漏源导通电阻

1.5 Ohms

Vds-Drain-SourceBreakdownVoltage

- 200 V

Vds-漏源极击穿电压

- 200 V

Vgs-Gate-SourceBreakdownVoltage

+/- 20 V

Vgs-栅源极击穿电压

20 V

上升时间

27 ns

下降时间

19 ns

不同Id时的Vgs(th)(最大值)

4V @ 250µA

不同Vds时的输入电容(Ciss)

340pF @ 25V

不同Vgs时的栅极电荷(Qg)

20nC @ 10V

不同 Id、Vgs时的 RdsOn(最大值)

1.5 欧姆 @ 2.2A,10V

产品目录页面

点击此处下载产品Datasheet

产品种类

MOSFET

供应商器件封装

D-Pak

其它名称

*IRFR9220TRPBF
IRFR9220PBFCT

典型关闭延迟时间

7.3 ns

功率-最大值

2.5W

功率耗散

2.5 W

包装

剪切带 (CT)

商标

Vishay / Siliconix

安装类型

表面贴装

安装风格

SMD/SMT

导通电阻

1.5 Ohms

封装

Reel

封装/外壳

TO-252-3,DPak(2 引线+接片),SC-63

封装/箱体

DPAK-2

工厂包装数量

2000

晶体管极性

P-Channel

最大工作温度

+ 150 C

最小工作温度

- 55 C

标准包装

1

汲极/源极击穿电压

- 200 V

漏极连续电流

3.6 A

漏源极电压(Vdss)

200V

电流-连续漏极(Id)(25°C时)

3.6A (Tc)

通道模式

Enhancement

配置

Single

闸/源击穿电压

+/- 20 V

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PDF Datasheet 数据手册内容提取

IRFR9220, IRFU9220, SiHFR9220, SiHFU9220 www.vishay.com Vishay Siliconix Power MOSFET FEATURES PRODUCT SUMMARY • Dynamic dV/dt Rating V (V) - 200 DS • Repetitive Avalanche Rated RDS(on) () VGS = - 10 V 1.5 • Surface Mount (IRFR9220, SiHFR9220) Q (Max.) (nC) 20 g • Straight Lead (IRFUFU9220, SiHFU9220) Q (nC) 3.3 gs • Available in Tape and Reel Q (nC) 11 gd • P-Channel Configuration Single • Fast Switching S • Material categorization: For definitions of compliance please see www.vishay.com/doc?99912 DPAK IPAK (TO-252) (TO-251) DESCRIPTION G D Third power MOSFETs technology is the key to Vishay D advanced line of Power MOSFET transistors. The efficient geometry and unique processing of the Power MOSFETs G S D S design achieve very low on-state resistance combined with G high transconductance and extreme device ruggedness. D The DPAK is designed for surface mounting using vapor P-Channel MOSFET phase, infrared, or wave soldering techniques. The straight lead version (IRFU, SiHFU series) is for through-hole mounting applications. Power dissipation levels up to 1.5 W are possible in typical surface mount applications. ORDERING INFORMATION Package DPAK (TO-252) DPAK (TO-252) DPAK (TO-252) DPAK (TO-252) IPAK (TO-251) Lead (Pb)-free and SiHFR9220-GE3 SiHFR9220TRL-GE3a SiHFR9220TRR-GE3a SiHFR9220TR-GE3a SiHFU9220-GE3 Halogen-free IRFR9220PbF IRFR9220TRLPbFa IRFR9220TRRPbFa IRFR9220TRPbFa IRFU9220PbF Lead (Pb)-free SiHFR9220-E3 SiHFR9220TL-E3a SiHFR9220TR-E3a SiHFR9220T-E3a SiHFU9220-E3 Note a. See device orientation. ABSOLUTE MAXIMUM RATINGS (T = 25 °C, unless otherwise noted) C PARAMETER SYMBOL LIMIT UNIT Drain-Source Voltage V - 200 DS V Gate-Source Voltage V ± 20 GS T = 25 °C - 3.6 C Continuous Drain Current V at - 10 V I GS D T = 100 °C - 2.3 A C Pulsed Drain Currenta I - 14 DM Linear Derating Factor 0.33 W/°C Linear Derating Factor (PCB Mount)e 0.020 Single Pulse Avalanche Energyb E 310 mJ AS Repetitive Avalanche Currenta I - 3.6 A AR Repetitive Avalanche Energya E 4.2 mJ AR Maximum Power Dissipation T = 25 °C 42 C P W Maximum Power Dissipation (PCB Mount)e T = 25 °C D 2.5 A Peak Diode Recovery dV/dtc dV/dt - 5.0 V/ns Operating Junction and Storage Temperature Range T , T - 55 to + 150 J stg °C Soldering Recommendations (Peak Temperature)d for 10 s 260 Notes a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11). b. VDD = - 50 V, Starting TJ = 25 °C, L = 35 mH, Rg = 25 , IAS = - 3.6 A (see fig. 12). c. ISD  - 3.9 A, dI/dt  95 A/μs, VDD  VDS, TJ  150 °C. d. 1.6 mm from case. e. When mounted on 1" square PCB (FR-4 or G-10 material). S13-0166-Rev. E, 04-Feb-13 1 Document Number: 91283 For technical questions, contact: hvm@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

IRFR9220, IRFU9220, SiHFR9220, SiHFU9220 www.vishay.com Vishay Siliconix THERMAL RESISTANCE RATINGS PARAMETER SYMBOL MIN. TYP. MAX. UNIT Maximum Junction-to-Ambient R - - 110 thJA Maximum Junction-to-Ambient R - - 50 °C/W (PCB Mount)a thJA Maximum Junction-to-Case (Drain) R - - 3.0 thJC Note a. When mounted on 1" square PCB (FR-4 or G-10 material). SPECIFICATIONS (T = 25 °C, unless otherwise noted) J PARAMETER SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNIT Static Drain-Source Breakdown Voltage V V = 0 V, I = - 250 μA - 200 - - V DS GS D VDS Temperature Coefficient VDS/TJ Reference to 25 °C, ID = - 1 mA - - 0.22 - V/°C Gate-Source Threshold Voltage V V = V , I = - 250 μA - 2.0 - - 4.0 V GS(th) DS GS D Gate-Source Leakage I V = ± 20 V - - ± 100 nA GSS GS V = - 200 V, V = 0 V - - - 100 DS GS Zero Gate Voltage Drain Current I μA DSS V = - 160 V, V = 0 V, T = 125 °C - - - 500 DS GS J Drain-Source On-State Resistance RDS(on) VGS = - 10 V ID = - 2.2 Ab - - 1.5  Forward Transconductance g V = - 50 V, I = - 2.2 A 1.1 - - S fs DS D Dynamic Input Capacitance C - 340 - iss V = 0 V, GS Output Capacitance C V = - 25 V, - 110 - pF oss DS f = 1.0 MHz, see fig. 5 Reverse Transfer Capacitance C - 33 - rss Total Gate Charge Q - - 20 g I = - 3.9 A, V = - 160 V, Gate-Source Charge Q V = - 10 V D DS - - 3.3 nC gs GS see fig. 6 and 13b Gate-Drain Charge Q - - 11 gd Turn-On Delay Time t - 8.8 - d(on) Rise Time tr VDD = - 100 V, ID = - 3.9 A, - 27 - ns Turn-Off Delay Time td(off) Rg = 18 , RD = 24 , see fig. 10b - 7.3 - Fall Time t - 19 - f Internal Drain Inductance L Between lead, D - 4.5 - D 6 mm (0.25") from nH package and center of Internal Source Inductance LS die contact G - 7.5 - S Drain-Source Body Diode Characteristics Continuous Source-Drain Diode Current IS MOSFET symbol D - - - 3.6 showing the A integral reverse Pulsed Diode Forward Currenta ISM p - n junction diode G - - - 14 S Body Diode Voltage V T = 25 °C, I = - 3.6 A, V = 0 Vb - - - 6.3 V SD J S GS Body Diode Reverse Recovery Time t - 150 300 ns rr T = 25 °C, I = - 3.9 A, dI/dt = 100 A/μsb J F Body Diode Reverse Recovery Charge Q - 0.97 2.0 μC rr Forward Turn-On Time t Intrinsic turn-on time is negligible (turn-on is dominated by L and L ) on S D Notes a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11). b. Pulse width  300 μs; duty cycle  2 %. S13-0166-Rev. E, 04-Feb-13 2 Document Number: 91283 For technical questions, contact: hvm@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

IRFR9220, IRFU9220, SiHFR9220, SiHFU9220 www.vishay.com Vishay Siliconix TYPICAL CHARACTERISTICS (25 °C, unless otherwise noted) Fig. 1 - Typical Output Characteristics, T = 25 °C Fig. 3 - Typical Transfer Characteristics C Fig. 2 - Typical Output Characteristics, TC = 150 °C Fig. 4 - Normalized On-Resistance vs. Temperature S13-0166-Rev. E, 04-Feb-13 3 Document Number: 91283 For technical questions, contact: hvm@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

IRFR9220, IRFU9220, SiHFR9220, SiHFU9220 www.vishay.com Vishay Siliconix Fig. 5 - Typical Capacitance vs. Drain-to-Source Voltage Fig. 7 - Typical Source-Drain Diode Forward Voltage Fig. 6 - Typical Gate Charge vs. Gate-to-Source Voltage Fig. 8 - Maximum Safe Operating Area S13-0166-Rev. E, 04-Feb-13 4 Document Number: 91283 For technical questions, contact: hvm@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

IRFR9220, IRFU9220, SiHFR9220, SiHFU9220 www.vishay.com Vishay Siliconix R D V DS V GS D.U.T. R g - +VDD - 10 V Pulse width ≤ 1 µs Duty factor ≤ 0.1 % Fig. 10a - Switching Time Test Circuit t t t t d(on) r d(off) f V GS 10 % Fig. 9 - Maximum Drain Current vs. Case Temperature 90 % V DS Fig. 10b - Switching Time Waveforms Fig. 11 - Maximum Effective Transient Thermal Impedance, Junction-to-Case S13-0166-Rev. E, 04-Feb-13 5 Document Number: 91283 For technical questions, contact: hvm@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

IRFR9220, IRFU9220, SiHFR9220, SiHFU9220 www.vishay.com Vishay Siliconix L V DS I AS R D.U.T. g - VA + DD I AS - 20 V Driver tp 0.01 Ω t p 15 V V DS Fig. 12a - Unclamped Inductive Test Circuit Fig. 12b - Unclamped Inductive Waveforms Fig. 12c - Maximum Avalanche Energy vs. Drain Current Current regulator Same type as D.U.T. Q 50 kΩ G - 10 V 12 V 0.2 µF 0.3 µF QGS QGD - V D.U.T. + DS V G V GS - 3 mA Charge I I G D Current sampling resistors Fig. 13a - Basic Gate Charge Waveform Fig. 13b - Gate Charge Test Circuit S13-0166-Rev. E, 04-Feb-13 6 Document Number: 91283 For technical questions, contact: hvm@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

IRFR9220, IRFU9220, SiHFR9220, SiHFU9220 www.vishay.com Vishay Siliconix Peak Diode Recovery dV/dt Test Circuit D.U.T. + Circuit layout considerations • Low stray inductance • Ground plane • Low leakage inductance current transformer - + - + - Rg • dV/dt controlled by Rg + •• DIS.UD c.To.n -t rdoellveidc eb uy ndduetry tfeascttor “D” - VDD Note • Compliment N-Channel of D.U.T. for driver Driver gate drive P.W. Period D = P.W. Period V = - 10 Va GS D.U.T. l waveform SD Reverse recovery Body diode forward current current dI/dt D.U.T. V waveform DS Diode recovery dV/dt V DD Re-applied voltage Body diode forward drop Inductor current Ripple ≤ 5 % ISD Note a. V = - 5 V for logic level and - 3 V drive devices GS Fig. 14 - For P-Channel Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and reliability data, see www.vishay.com/ppg?91283. S13-0166-Rev. E, 04-Feb-13 7 Document Number: 91283 For technical questions, contact: hvm@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

Package Information www.vishay.com Vishay Siliconix TO-252AA Case Outline E A MILLIMETERS INCHES C2 b3 DIM. MIN. MAX. MIN. MAX. 3 A 2.18 2.38 0.086 0.094 L A1 - 0.127 - 0.005 b 0.64 0.88 0.025 0.035 b2 0.76 1.14 0.030 0.045 D b3 4.95 5.46 0.195 0.215 H C 0.46 0.61 0.018 0.024 C2 0.46 0.89 0.018 0.035 L4 5 D 5.97 6.22 0.235 0.245 L L m) D1 4.10 - 0.161 - m 5 E 6.35 6.73 0.250 0.265 0. b b2 ght ( C E1 4.32 - 0.170 - e ei H 9.40 10.41 0.370 0.410 h A1 e1 ne e 2.28 BSC 0.090 BSC a pl e1 4.56 BSC 0.180 BSC e g a L 1.40 1.78 0.055 0.070 g L3 0.89 1.27 0.035 0.050 1 D L4 - 1.02 - 0.040 L5 1.01 1.52 0.040 0.060 ECN: T16-0236-Rev. P, 16-May-16 DWG: 5347 E1 Notes • Dimension L3 is for reference only. Revision: 16-May-16 1 Document Number: 71197 For technical questions, contact: pmostechsupport@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

Package Information Vishay Siliconix TO-251AA (HIGH VOLTAGE) 4 3 A E1 Thermal PAD E A 4 b4 0.0100.25 M C A B c2 L2 4 A θ2 θ1 D1 4 B D 3 C Seating 5 plane L1 L3 C C (Datum A) L B B A A1 3 x b2 c 3 x b View A - A 2 x e 0.0100.25 M C A B Base 5 metal Plating b1, b3 Lead tip (c) c1 5 (b, b2) Section B - B and C - C MILLIMETERS INCHES MILLIMETERS INCHES DIM. MIN. MAX. MIN. MAX. DIM. MIN. MAX. MIN. MAX. A 2.18 2.39 0.086 0.094 D1 5.21 - 0.205 - A1 0.89 1.14 0.035 0.045 E 6.35 6.73 0.250 0.265 b 0.64 0.89 0.025 0.035 E1 4.32 - 0.170 - b1 0.65 0.79 0.026 0.031 e 2.29 BSC 2.29 BSC b2 0.76 1.14 0.030 0.045 L 8.89 9.65 0.350 0.380 b3 0.76 1.04 0.030 0.041 L1 1.91 2.29 0.075 0.090 b4 4.95 5.46 0.195 0.215 L2 0.89 1.27 0.035 0.050 c 0.46 0.61 0.018 0.024 L3 1.14 1.52 0.045 0.060 c1 0.41 0.56 0.016 0.022 θ1 0' 15' 0' 15' c2 0.46 0.86 0.018 0.034 θ2 25' 35' 25' 35' D 5.97 6.22 0.235 0.245 ECN: S-82111-Rev. A, 15-Sep-08 DWG: 5968 Notes 1. Dimensioning and tolerancing per ASME Y14.5M-1994. 2. Dimension are shown in inches and millimeters. 3. Dimension D and E do not include mold flash. Mold flash shall not exceed 0.13 mm (0.005") per side. These dimensions are measured at the outermost extremes of the plastic body. 4. Thermal pad contour optional with dimensions b4, L2, E1 and D1. 5. Lead dimension uncontrolled in L3. 6. Dimension b1, b3 and c1 apply to base metal only. 7. Outline conforms to JEDEC outline TO-251AA. Document Number: 91362 www.vishay.com Revision: 15-Sep-08 1

Application Note 826 Vishay Siliconix RECOMMENDED MINIMUM PADS FOR DPAK (TO-252) 0.224 (5.690) 3 0) 4 8 2 1 0. 6. ( 0.420 10.668) ( 7 2) 8 0 0 2 0. 2. ( 0 6) 9 8 0 2 0. 2. ( 0.180 0.055 (4.572) (1.397) Recommended Minimum Pads Dimensions in Inches/(mm) Return to Index Return to Index A P P L I C A T I O N N O T E Document Number: 72594 www.vishay.com Revision: 21-Jan-08 3

Legal Disclaimer Notice www.vishay.com Vishay Disclaimer ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROV E RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE. Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other disclosure relating to any product. Vishay makes no warranty, representation or guarantee regarding the suitability of the products for any particular purpose o r the continuing production of any product. To the maximum extent permitted by applicable law, Vishay disclaims (i) any and all liability arising out of the application or use of any product, (ii) any and all liability, including without limitation special, consequential or incidental damages, and (iii) any and all implied warranties, including warranties of fitness for particular purpose, non-infringement and merchantability. Statements regarding the suitability of products for certain types of applications are based on Vishay’s knowledge of typical requirements that are often placed on Vishay products in generic applications. Such statements are not binding statements about the suitability of products for a particular application. It is the customer’s responsibility to validate that a particular product with the properties described in the product specification is suitable for use in a particular application. Parameters provided in datasheets and / or specifications may vary in different applications and performance may vary over time. All operating parameters, including typical parameters, must be validated for each customer application by the customer’s technical experts. Product specifications do not expand or otherwise modify Vishay’s terms and conditions of purchase, including but not limited to the warranty expressed therein. Except as expressly indicated in writing, Vishay products are not designed for use in medical, life-saving, or life-sustainin g applications or for any other application in which the failure of the Vishay product could result in personal injury or death. Customers using or selling Vishay products not expressly indicated for use in such applications do so at their own risk . Please contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for such applications. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this documen t or by any conduct of Vishay. Product names and markings noted herein may be trademarks of their respective owners. © 2019 VISHAY INTERTECHNOLOGY, INC. ALL RIGHTS RESERVED Revision: 01-Jan-2019 1 Document Number: 91000

Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: V ishay: IRFR9220TRRPBF IRFR9220TRLPBF IRFR9220PBF IRFR9220TRPBF IRFR9220 IRFR9220TR IRFR9220TRL IRFR9220TRR IRFU9220 IRFU9220PBF SIHFU9220-GE3