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DMP2069UFY4-7产品简介:
ICGOO电子元器件商城为您提供DMP2069UFY4-7由Diodes Inc.设计生产,在icgoo商城现货销售,并且可以通过原厂、代理商等渠道进行代购。 DMP2069UFY4-7价格参考¥1.09-¥3.65。Diodes Inc.DMP2069UFY4-7封装/规格:晶体管 - FET,MOSFET - 单, 表面贴装 P 沟道 20V 2.5A(Ta) 530mW(Ta) DFN2015H4-3。您可以下载DMP2069UFY4-7参考资料、Datasheet数据手册功能说明书,资料中有DMP2069UFY4-7 详细功能的应用电路图电压和使用方法及教程。
DMP2069UFY4-7是由Diodes Incorporated生产的MOSFET(金属氧化物半导体场效应晶体管),属于单通道增强型N沟道MOSFET。该器件具有低导通电阻、高开关速度和出色的热性能,适用于多种应用场景。 主要应用场景: 1. 电源管理: - DC-DC转换器:DMP2069UFY4-7可以用于高效能的降压或升压DC-DC转换器中,作为主开关管或同步整流管,提供低损耗的电流路径,提高转换效率。 - 线性稳压器:在低压差线性稳压器(LDO)中,该MOSFET可以用作负载开关或旁路开关,以实现更高效的电源管理。 2. 电机驱动: - 无刷直流电机(BLDC):在小型电机驱动电路中,如无人机、电动工具等,DMP2069UFY4-7可以用作H桥电路中的开关元件,控制电机的正反转和速度调节。 - 步进电机驱动:在需要精确控制的步进电机应用中,该MOSFET可以用于电流控制和方向切换,确保电机平稳运行。 3. 负载开关: - 便携式电子设备:在智能手机、平板电脑、笔记本电脑等便携式设备中,DMP2069UFY4-7可以用作负载开关,实现快速的电源接通和断开,减少待机功耗。 - USB接口保护:在USB充电器或USB集线器中,该MOSFET可以用作过流保护开关,防止过载损坏设备。 4. 信号调理: - 模拟开关:在音频设备、传感器信号处理等应用中,DMP2069UFY4-7可以用作低噪声、低失真的模拟开关,实现信号的快速切换。 - 电平转换:在不同电压域之间的信号传输中,该MOSFET可以用作电平转换器,确保信号的准确传递。 5. 电池管理系统(BMS): - 电池充放电控制:在锂电池、铅酸电池等电池管理系统中,DMP2069UFY4-7可以用作充放电路径的控制开关,确保电池的安全和长寿命。 总之,DMP2069UFY4-7凭借其优异的电气特性和紧凑的封装形式,广泛应用于消费电子、工业控制、通信设备等多个领域,特别适合对效率、可靠性和空间有严格要求的应用场景。
参数 | 数值 |
产品目录 | |
描述 | MOSFET P-CH 20V 2.5A 3-DFNMOSFET MOSFET P-CHAN. |
产品分类 | FET - 单分离式半导体 |
FET功能 | 逻辑电平门 |
FET类型 | MOSFET P 通道,金属氧化物 |
Id-ContinuousDrainCurrent | - 2.5 A |
Id-连续漏极电流 | 2.5 A |
品牌 | Diodes Incorporated |
产品手册 | |
产品图片 | |
rohs | 符合RoHS无铅 / 符合限制有害物质指令(RoHS)规范要求 |
产品系列 | 晶体管,MOSFET,Diodes Incorporated DMP2069UFY4-7- |
数据手册 | |
产品型号 | DMP2069UFY4-7 |
Pd-PowerDissipation | 0.53 W |
Pd-功率耗散 | 530 mW |
Qg-GateCharge | 9.1 nC |
Qg-栅极电荷 | 9.1 nC |
RdsOn-漏源导通电阻 | 90 mOhms |
RoHS指令信息 | http://diodes.com/download/4349 |
Vds-Drain-SourceBreakdownVoltage | - 20 V |
Vds-漏源极击穿电压 | 20 V |
上升时间 | 155.1 ns |
下降时间 | 423.8 ns |
不同Id时的Vgs(th)(最大值) | 1V @ 250µA |
不同Vds时的输入电容(Ciss) | 214pF @ 10V |
不同Vgs时的栅极电荷(Qg) | 9.1nC @ 4.5V |
不同 Id、Vgs时的 RdsOn(最大值) | 54 毫欧 @ 2.5A,4.5V |
产品目录页面 | |
产品种类 | MOSFET |
供应商器件封装 | DFN2015H4-3 |
其它名称 | DMP2069UFY4-7DICT |
典型关闭延迟时间 | 688.1 ns |
功率-最大值 | 530mW |
包装 | 剪切带 (CT) |
商标 | Diodes Incorporated |
安装类型 | 表面贴装 |
安装风格 | SMD/SMT |
封装 | Reel |
封装/外壳 | 3-XFDFN |
封装/箱体 | X2-DFN2015-3 |
晶体管极性 | P-Channel |
最大工作温度 | + 150 C |
最小工作温度 | - 55 C |
标准包装 | 1 |
漏源极电压(Vdss) | 20V |
电流-连续漏极(Id)(25°C时) | 2.5A (Ta) |
系列 | DMP2069 |
配置 | Single |
DMP2069UFY4 P-CHANNEL ENHANCEMENT MODE MOSFET Product Summary Features and Benefits • Low On-Resistance • Low Input Capacitance V(BR)DSS RDS(ON) max ID max • Fast Switching Speed TA = 25°C • Low Input/Output Leakage T 54mΩ @ VGS = -4.5V -2.5A • ESD Protected Up To 3kV • Lead Free By Design/RoHS Compliant (Note 1) C -20V • "Green" Device, Halogen and Antimony Free (Note 2) U 90mΩ @ VGS = -1.8V -1.8A • Qualified to AEC-Q101 Standards for High Reliability D O R Description and Applications Mechanical Data P W This MOSFET has been designed to minimize the on-state resistance • Case: X2-DFN2015-3 E (RDS(on)) and yet maintain superior switching performance, making it • Case Material: Molded Plastic, “Green” Molding Compound. N ideal for high efficiency power management applications. UL Flammability Classification Rating 94V-0 • Moisture Sensitivity: Level 1 per J-STD-020 • Backlighting • Terminals: Finish ⎯ NiPdAu over Copper leadframe. Solderable • Power Management Functions per MIL-STD-202, Method 208 • DC-DC Converters • Terminals Connections: See Diagram Below • • Weight: 0.008 grams (approximate) X2-DFN2015-3 S D G ESD PROTECTED TO 3kV Top View Bottom View Internal Schematic Ordering Information (Note 3) Part Number Case Packaging DMP2069UFY4-7 X2-DFN2015-3 3000/Tape & Reel Notes: 1. No purposefully added lead. 2. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com. 3. For packaging details, go to our website at http://www.diodes.com. Marking Information 29P = Marking Code 29P YM = Date Code Marking Y = Year (ex: W = 2009) YM M = Month (ex: 9 = September) Date Code Key Year 2009 2010 2011 2012 2013 2014 2015 Code W X Y Z A B C Month Jan Feb Mar Apr May Jun Jul Aug Sep Oct Nov Dec Code 1 2 3 4 5 6 7 8 9 O N D DMP2069UFY4 1 of 6 January 2012 Document number: DS31949 Rev. 5 - 2 www.diodes.com © Diodes Incorporated
DMP2069UFY4 Maximum Ratings @TA = 25°C unless otherwise specified Characteristic Symbol Value Units Drain-Source Voltage VDSS -20 V Gate-Source Voltage VGSS ±8 V T Continuous Drain Current (Note 4) SStetaatdey TTAA == 2750°°CC ID --22..52 A C Pulsed Drain Current (Note 5) IDM -12 A U D O R P Thermal Characteristics W E Characteristic Symbol Value Unit N Power Dissipation (Note 4) PD 0.53 W Thermal Resistance, Junction to Ambient @TA = 25°C RθJA 231 °C/W Operating and Storage Temperature Range TJ, TSTG -55 to +150 °C Electrical Characteristics @TA = 25°C unless otherwise specified Characteristic Symbol Min Typ Max Unit Test Condition OFF CHARACTERISTICS (Note 6) Drain-Source Breakdown Voltage BVDSS -20 ⎯ ⎯ V VGS = 0V, ID = -250μA Zero Gate Voltage Drain Current TJ = 25°C IDSS ⎯ ⎯ -1.0 μA VDS = -20V, VGS = 0V Gate-Source Leakage IGSS ⎯ ⎯ ±10 μA VGS = ±8V, VDS = 0V ON CHARACTERISTICS (Note 6) Gate Threshold Voltage VGS(th) -0.3 -0.55 -1.0 V VDS = VGS, ID = -250μA 36 54 VGS = -4.5V, ID = -2.5A Static Drain-Source On-Resistance RDS (ON) ⎯ 46 69 mΩ VGS = -2.5V, ID = -2.2A 60 90 VGS = -1.8V, ID = -2.0A Forward Transfer Admittance |Yfs| ⎯ 8 ⎯ S VDS = -5V, ID = -2.5A DYNAMIC CHARACTERISTICS (Note 7) Input Capacitance Ciss ⎯ 214 ⎯ pF Output Capacitance Coss ⎯ 104 ⎯ pF Vf =D S1 .=0 M-1H0Vz , VGS = 0V Reverse Transfer Capacitance Crss ⎯ 25 ⎯ pF Gate Resistnace Rg ⎯ 250 ⎯ Ω VDS = 0V, VGS = 0V, f = 1.0MHz SWITCHING CHARACTERISTICS (Note 7) Total Gate Charge Qg ⎯ 9.1 ⎯ nC Gate-Source Charge Qgs ⎯ 1.5 ⎯ nC VGS = -4.5V, VDS = -10V, ID = -4A Gate-Drain Charge Qgd ⎯ 1.7 ⎯ nC Turn-On Delay Time tD(on) ⎯ 80.4 160 ns Turn-On Rise Time tr ⎯ 155.1 210 ns VDS = -10V, VGS = -4.5V, Turn-Off Delay Time tD(off) ⎯ 688.1 1376 ns RD = 2.5Ω, RG = 3.0Ω Turn-Off Fall Time tf ⎯ 423.8 848 ns Notes: 4. Device mounted on FR-4 PCB with minimum recommended pad layout. 5. Repetitive rating, pulse width limited by junction temperature. 6. Short duration pulse test used to minimize self-heating effect. 7. Guaranteed by design. Not subject to production testing. DMP2069UFY4 2 of 6 January 2012 Document number: DS31949 Rev. 5 - 2 www.diodes.com © Diodes Incorporated
DMP2069UFY4 20 20 VGVSG S= =3 .45.V5V VDS = 5V VGS = 3.0V UCT N CURRENT (A) 1105 VGS = 2.5V VVGGSS == 2 1..08VV N CURRENT (A) 1105 ROD I, DRAID 5 VGS = 1.5V I, DRAID 5 P TA = 150°C W TA = 125°C TA = 85°C E VGS = 1.2V TA = 25°C 0 0 TA = -55°C N 0 1 2 3 4 5 0 0.5 1 1.5 2 2.5 3 3.5 4 V , DRAIN-SOURCE VOLTAGE (V) V , GATE-SOURCE VOLTAGE (V) DS GS Fig. 1 Typical Output Characteristic Fig. 2 Typical Transfer Characteristic 0.16 0.08 )Ω )Ω CE ( 0.14 CE ( VGS = 4.5V N N A A SIST 0.12 SIST 0.06 TA = 150°C E E N-R 0.10 VGS = 1.5V N-R TA = 125°C CE O 0.08 CE O 0.04 TA = 85°C UR VGS = 1.8V UR TA = 25°C O 0.06 O S S RAIN- 0.04 VGS = 2.5V RAIN- 0.02 TA = -55°C D VGS = 4.5V D , ON) 0.02 , N) DS( S(O R 0 RD 0 0 5 10 15 20 0 5 10 15 20 ID, DRAIN-SOURCE CURRENT (A) ID, DRAIN CURRENT (A) Fig. 3 Typical On-Resistance Fig. 4 Typical On-Resistance vs. Drain Current and Gate Voltage vs. Drain Current and Temperature 1.7 0.10 )Ω E ( D) 1.5 NC 0.08 E A R, DRAIN-SOURCE DSONRESISTANCE (NORMALIZ 011...913 VIGDS = = 1 40.A5V AIN-SOURCE ON-RESIST 00..0046 VGIDS == 52A.5VVIGDS = = 1 40.A5V ON- 0.7 VGIDS == 52A.5V , DRN0.02 O S D 0.5 R 0 -50 -25 0 25 50 75 100 125 150 -50 -25 0 25 50 75 100 125 150 T , AMBIENT TEMPERATURE (°C) T , AMBIENT TEMPERATURE (°C) A A Fig. 5 On-Resistance Variation with Temperature Fig. 6 On-Resistance Variation with Temperature DMP2069UFY4 3 of 6 January 2012 Document number: DS31949 Rev. 5 - 2 www.diodes.com © Diodes Incorporated
DMP2069UFY4 1.0 20 V) 18 E ( G 0.8 16 A LT A) VO NT ( 14 D E T OL 0.6 ID = 1mA RR 12 DUC THRESH 0.4 ID = 250µA RCE CU 108 TA = 25°C O TE OU R A S 6 P , GH) 0.2 I, S 4 T W S( E VG 2 N 0 0 -50 -25 0 25 50 75 100 125 150 0.2 0.4 0.6 0.8 1.0 1.2 1.4 T , AMBIENT TEMPERATURE (°C) V , SOURCE-DRAIN VOLTAGE (V) A SD Fig. 7 Gate Threshold Variation vs. Ambient Temperature Fig. 8 Diode Forward Voltage vs. Current 10,000 100,000 f = 1MHz nA) 10,000 TA = 150°C F) T ( p N NCE ( 1,000 RRE 1,000 TA = 125°C A U T C CI E A G AP Ciss KA 100 TA = 85°C C A C, 100 Coss , LES S D 10 I Crss TA = 25°C 10 1 0 5 10 15 20 0 5 10 15 20 V , DRAIN-SOURCE VOLTAGE (V) V , DRAIN-SOURCE VOLTAGE (V) DS DS Fig. 9 Typical Capacitance Fig. 10 Typical Leakage Current vs. Drain-Source Voltage 1 CE D = 0.7 N D = 0.5 A T S D = 0.3 SI E R 0.1 AL D = 0.1 M D = 0.9 ER D = 0.05 H NT T D = 0.02 RRθJθAJ(At )= = 2r3(t5) °*C R/WθJA E NSI 0.01 D = 0.01 P(pk) A t1 R r(t), T D = 0.005 DTJu t-y T CAy t=c2 lPe, *D R =θ JtA1(/tt2) D = Single Pulse 0.001 0.00001 0.0001 0.001 0.01 0.1 1 10 100 1,000 t , PULSE DURATION TIME (s) 1 Fig. 11 Transient Thermal Response DMP2069UFY4 4 of 6 January 2012 Document number: DS31949 Rev. 5 - 2 www.diodes.com © Diodes Incorporated
DMP2069UFY4 Package Outline Dimensions A3 T X2-DFN2015-3 A C SEATING PLANE Dim Min Max Typ U A − 0.40 − D A1 D A1 0 0.05 0.02 O z A3 − − 0.13 b 0.20 0.30 0.25 R L d − − 0.30 P e d D 1.45 1.575 1.50 W D2 1.00 1.20 1.10 E e − − 0.50 N E E2 E 1.95 2.075 2.00 D2 E2 0.70 0.90 0.80 f − − 0.60 L 0.25 0.35 0.30 f z − − 0.125 b All Dimensions in mm Suggested Pad Layout X Y2 Dimensions Value (in mm) C 1.00 G 0.15 X1 X 0.31 Y1 X1 1.30 Y 0.50 Y1 1.00 G Y2 0.65 X Y C DMP2069UFY4 5 of 6 January 2012 Document number: DS31949 Rev. 5 - 2 www.diodes.com © Diodes Incorporated
DMP2069UFY4 IMPORTANT NOTICE DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDING TO THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE T (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION). C Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes U without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the D application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or O trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume R all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated P website, harmless against all damages. W Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel. E Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and N hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized application. Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings noted herein may also be covered by one or more United States, international or foreign trademarks. LIFE SUPPORT Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express written approval of the Chief Executive Officer of Diodes Incorporated. As used herein: A. Life support devices or systems are devices or systems which: 1. are intended to implant into the body, or 2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the labeling can be reasonably expected to result in significant injury to the user. B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or to affect its safety or effectiveness. Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems. Copyright © 2012, Diodes Incorporated www.diodes.com DMP2069UFY4 6 of 6 January 2012 Document number: DS31949 Rev. 5 - 2 www.diodes.com © Diodes Incorporated