图片仅供参考

详细数据请看参考数据手册

Datasheet下载
  • 型号: STD25NF10LA
  • 制造商: STMicroelectronics
  • 库位|库存: xxxx|xxxx
  • 要求:
数量阶梯 香港交货 国内含税
+xxxx $xxxx ¥xxxx

查看当月历史价格

查看今年历史价格

STD25NF10LA产品简介:

ICGOO电子元器件商城为您提供STD25NF10LA由STMicroelectronics设计生产,在icgoo商城现货销售,并且可以通过原厂、代理商等渠道进行代购。 STD25NF10LA价格参考。STMicroelectronicsSTD25NF10LA封装/规格:晶体管 - FET,MOSFET - 单, 表面贴装 N 沟道 100V 25A(Tc) 100W(Tc) DPAK。您可以下载STD25NF10LA参考资料、Datasheet数据手册功能说明书,资料中有STD25NF10LA 详细功能的应用电路图电压和使用方法及教程。

产品参数 图文手册 常见问题
参数 数值
产品目录

分立半导体产品

描述

MOSFET N-CH 100V 25A DPAK

产品分类

FET - 单

FET功能

逻辑电平门

FET类型

MOSFET N 通道,金属氧化物

品牌

STMicroelectronics

数据手册

点击此处下载产品Datasheet点击此处下载产品Datasheet

产品图片

产品型号

STD25NF10LA

rohs

无铅 / 符合限制有害物质指令(RoHS)规范要求

产品系列

STripFET™ II

不同Id时的Vgs(th)(最大值)

2.5V @ 250µA

不同Vds时的输入电容(Ciss)

1710pF @ 25V

不同Vgs时的栅极电荷(Qg)

52nC @ 5V

不同 Id、Vgs时的 RdsOn(最大值)

35 毫欧 @ 12.5A,10V

产品培训模块

http://www.digikey.cn/PTM/IndividualPTM.page?site=cn&lang=zhs&ptm=26067

供应商器件封装

D-Pak

其它名称

497-12552-1

其它有关文件

http://www.st.com/web/catalog/sense_power/FM100/CL824/SC1165/PF243566?referrer=70071840

功率-最大值

100W

包装

剪切带 (CT)

安装类型

表面贴装

封装/外壳

TO-252-3,DPak(2 引线+接片),SC-63

标准包装

1

漏源极电压(Vdss)

100V

电流-连续漏极(Id)(25°C时)

25A (Tc)

推荐商品

型号:STW78N65M5

品牌:STMicroelectronics

产品名称:分立半导体产品

获取报价

型号:IRFZ48NSTRLPBF

品牌:Infineon Technologies

产品名称:分立半导体产品

获取报价

型号:IXFX32N50Q

品牌:IXYS

产品名称:分立半导体产品

获取报价

型号:VP2206N3-G-P003

品牌:Microchip Technology

产品名称:分立半导体产品

获取报价

型号:IRF5803D2TR

品牌:Infineon Technologies

产品名称:分立半导体产品

获取报价

型号:BSC252N10NSFGATMA1

品牌:Infineon Technologies

产品名称:分立半导体产品

获取报价

型号:STB5NK52ZD-1

品牌:STMicroelectronics

产品名称:分立半导体产品

获取报价

型号:IRF3315SPBF

品牌:Infineon Technologies

产品名称:分立半导体产品

获取报价

样品试用

万种样品免费试用

去申请
STD25NF10LA 相关产品

NTR4503NT1G

品牌:ON Semiconductor

价格:¥1.00-¥1.33

RJK1053DPB-00#J5

品牌:Renesas Electronics America

价格:

FDP20N50

品牌:ON Semiconductor

价格:¥15.77-¥15.77

BSP149H6327XTSA1

品牌:Infineon Technologies

价格:¥5.03-¥5.03

IRFR220NPBF

品牌:Infineon Technologies

价格:

NDT451N

品牌:ON Semiconductor

价格:

TK12A60W,S4VX

品牌:Toshiba Semiconductor and Storage

价格:¥14.06-¥27.83

PSMN2R5-30YL,115

品牌:Nexperia USA Inc.

价格:

PDF Datasheet 数据手册内容提取

STD25NF10LA Ω N-channel 100 V, 0.030 , 25 A DPAK STripFET™ II Power MOSFET Features Order code V R max I DSS DS(on) D STD25NF10LA 100 V < 0.035 Ω 25 A TAB ■ Exceptional dv/dt capability ■ 100% avalanche tested 3 1 ■ Logic level device DPAK Applications ■ Switching application ■ Automotive Description Figure 1. Internal schematic diagram This Power MOSFET has been developed using D(TAB) STMicroelectronics’ unique STripFET process, which is specifically designed to minimize input capacitance and gate charge. This renders the device suitable for use as primary switch in advanced high-efficiency isolated DC-DC converters for telecom and computer applications, and applications with low gate charge driving G(1) requirements. S(3) AM09016v1 Table 1. Device summary Order code Marking Package Packaging STD25NF10LA D25NF10LA DPAK Tape and reel October 2011 Doc ID 022319 Rev 1 1/15 www.st.com 15

Contents STD25NF10LA Contents 1 Electrical ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 2 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 2.1 Electrical characteristics (curves) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 3 Test circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 4 Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 5 Packing mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 6 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 2/15 Doc ID 022319 Rev 1

STD25NF10LA Electrical ratings 1 Electrical ratings Table 2. Absolute maximum ratings Symbol Parameter Value Unit V Drain-source voltage 100 V DS V Gate- source voltage ± 16 V GS I (1) Drain current (continuous) at T = 25 °C 25 A D C I Drain current (continuous) at T = 100 °C 21 A D C I (2) Drain current (pulsed) 100 A DM P Total dissipation at T = 25 °C 100 W tot C Derating Factor 0.67 W/°C dv/dt(3) Peak diode recovery avalanche energy 20 V/ns E (4) Single pulse avalanche energy 450 mJ AS T Storage temperature stg -55 to 175 °C T Max. operating junction temperature j 1. Current limited by package 2. Pulse width limited by safe operating area. 3. I ≤ 25 A, di/dt ≤ 300 A/µs, V =V , T ≤ T SD DD (BR)DSS J JMAX 4. Starting T = 25 °C, I = 12.5 A V = 50 V j D DD Table 3. Thermal data Symbol Parameter Value Unit Rthj-case Thermal resistance junction-case max 1.5 °C/W Rthj-pcb Thermal resistance junction-pcb max (1) 50 °C/W 1. When Mounted on 1 inch2 FR-4 board, 2 oz. of Cu. Doc ID 022319 Rev 1 3/15

Electrical characteristics STD25NF10LA 2 Electrical characteristics (T =25°C unless otherwise specified) CASE Table 4. On/off states Symbol Parameter Test conditions Min. Typ. Max. Unit Drain-source V I = 250 µA, V =0 100 V (BR)DSS breakdown voltage D GS V = 100 V Zero gate voltage DS 1 µA IDSS drain current VDS= 100 V, TC = 125 °C 10 µA V =0 GS Gate-body leakage I V = ± 16 V, V = 0 ±100 nA GSS current GS DS V Gate threshold voltage V = V , I = 250 µA 1 2.5 V GS(th) DS GS D R Static drain-source on VGS = 10 V, ID = 12.5 A 0.030 0.035 Ω DS(on) resistance V = 4.5 V, I = 12.5 A 0.035 0.040 Ω GS D Table 5. Dynamic Symbol Parameter Test conditions Min. Typ. Max. Unit Input capacitance C 1710 pF Ciss Output capacitance VDS = 25 V, f = 1 MHz, - 250 pF Coss Reverse transfer VGS = 0 110 pF rss capacitance t Turn-on delay time 20 ns d(on) V = 50 V, I = 12.5 A t Rise time DD D 40 ns r R =4.7 Ω V = 5 V - t Turn-off delay time G GS 58 ns d(off) (see Figure13) t Fall time 20 ns f Q Total gate charge V = 80 V, I = 25 A, 38 52 nC g DD D Q Gate-source charge V = 5 V, R =4.7 Ω - 8.5 nC gs GS G Q Gate-drain charge (see Figure14) 21 nC gd 4/15 Doc ID 022319 Rev 1

STD25NF10LA Electrical characteristics Table 6. Source drain diode Symbol Parameter Test conditions Min. Typ. Max. Unit I Source-drain current 25 A SD - ISDM (1) Source-drain current (pulsed) 100 A V (2) Forward on voltage I = 25 A, V = 0 - 1.5 V SD SD GS t Reverse recovery time I = 25 A, di/dt = 100 A/µs, 88 ns rr SD Q Reverse recovery charge V = 50 V, T = 150 °C - 317 nC rr DD j I Reverse recovery current (see Figure15) 7.2 A RRM 1. Pulse width limited by safe operating area. 2. Pulsed: pulse duration = 300 µs, duty cycle 1.5% Doc ID 022319 Rev 1 5/15

Electrical characteristics STD25NF10LA 2.1 Electrical characteristics (curves) Figure 2. Safe operating area Figure 3. Thermal impedance Figure 4. Output characteristics Figure 5. Transfer characteristics Figure 6. Normalized breakdown voltage vs. Figure 7. Static drain-source on resistance temperature 6/15 Doc ID 022319 Rev 1

STD25NF10LA Electrical characteristics Figure 8. Gate charge vs. gate-source voltage Figure 9. Capacitance variations Figure 10. Normalized gate threshold voltage Figure 11. Normalized on resistance vs. vs. temperature temperature Figure 12. Source-drain diode forward characteristics Doc ID 022319 Rev 1 7/15

Test circuit STD25NF10LA 3 Test circuit Figure 13. Switching times test circuit for Figure 14. Gate charge test circuit resistive load VDD 12V 47kΩ 1kΩ 100nF RL 2μ20F0 3μ.F3 VDD IG=CONST VD Vi=20V=VGMAX 100Ω D.U.T. VGS 2200 RG D.U.T. μF 2.7kΩ VG PW 47kΩ 1kΩ PW AM01468v1 AM01469v1 Figure 15. Test circuit for inductive load Figure 16. Unclamped Inductive load test switching and diode recovery times circuit L A A A D FAST L=100μH VD G D.U.T. DIODE 2200 3.3 μF μF VDD S B 3.3 1000 B B μF μF 25Ω D VDD ID G RG S Vi D.U.T. Pw AM01470v1 AM01471v1 Figure 17. Unclamped inductive waveform Figure 18. Switching time waveform V(BR)DSS ton toff VD tdon tr tdoff tf 90% 90% IDM 10% ID 0 10% VDS VDD VDD 90% VGS AM01472v1 0 10% AM01473v1 8/15 Doc ID 022319 Rev 1

STD25NF10LA Package mechanical data 4 Package mechanical data In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. Doc ID 022319 Rev 1 9/15

Package mechanical data STD25NF10LA Table 7. DPAK (TO-252) mechanical data mm Dim. Min. Typ. Max. A 2.20 2.40 A1 0.90 1.10 A2 0.03 0.23 b 0.64 0.90 b4 5.20 5.40 c 0.45 0.60 c2 0.48 0.60 D 6.00 6.20 D1 5.10 E 6.40 6.60 E1 4.70 e 2.28 e1 4.40 4.60 H 9.35 10.10 L 1 1.50 L1 2.80 L2 0.80 L4 0.60 1 R 0.20 V2 0° 8° 10/15 Doc ID 022319 Rev 1

STD25NF10LA Package mechanical data Figure 19. DPAK (TO-252) drawing 0068772_H Figure 20. DPAK footprint(a) 6.7 1.8 3 1.6 2.3 6.7 2.3 1.6 AM08850v1 a. All dimensions are in millimeters Doc ID 022319 Rev 1 11/15

Packing mechanical data STD25NF10LA 5 Packing mechanical data Table 8. DPAK (TO-252) tape and reel mechanical data Tape Reel mm mm Dim. Dim. Min. Max. Min. Max. A0 6.8 7 A 330 B0 10.4 10.6 B 1.5 B1 12.1 C 12.8 13.2 D 1.5 1.6 D 20.2 D1 1.5 G 16.4 18.4 E 1.65 1.85 N 50 F 7.4 7.6 T 22.4 K0 2.55 2.75 P0 3.9 4.1 Base qty. 2500 P1 7.9 8.1 Bulk qty. 2500 P2 1.9 2.1 R 40 T 0.25 0.35 W 15.7 16.3 12/15 Doc ID 022319 Rev 1

STD25NF10LA Packing mechanical data Figure 21. Tape for DPAK (TO-252) 10 pitches cumulative tolerance on tape +/- 0.2 mm Top cover P0 D P2 T tape E F K0 W B1 B0 For machine ref. only A0 P1 D1 including draft and radii concentric around B0 User direction of feed R Bending radius User direction of feed AM08852v1 Figure 22. Reel for DPAK (TO-252) T REEL DIMENSIONS 40mm min. Access hole At sl ot location B D C N A Full radius Tape slot G measured at hub in core for tape start 25 mm min. width AM08851v2 Doc ID 022319 Rev 1 13/15

Revision history STD25NF10LA 6 Revision history T able 9. Revision history Date Revision Changes 05-Oct-2011 1 First release. 14/15 Doc ID 022319 Rev 1

STD25NF10LA Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS EXPRESSLY APPROVED IN WRITING BY TWO AUTHORIZED ST REPRESENTATIVES, ST PRODUCTS ARE NOT RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. © 2011 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco - Philippines - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com Doc ID 022319 Rev 1 15/15