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  • 型号: IXTH450P2
  • 制造商: IXYS
  • 库位|库存: xxxx|xxxx
  • 要求:
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IXTH450P2产品简介:

ICGOO电子元器件商城为您提供IXTH450P2由IXYS设计生产,在icgoo商城现货销售,并且可以通过原厂、代理商等渠道进行代购。 IXTH450P2价格参考。IXYSIXTH450P2封装/规格:晶体管 - FET,MOSFET - 单, N-Channel 500V 16A (Tc) 300W (Tc) Through Hole TO-247 (IXTH)。您可以下载IXTH450P2参考资料、Datasheet数据手册功能说明书,资料中有IXTH450P2 详细功能的应用电路图电压和使用方法及教程。

IXYS品牌的IXTH450P2是一款高压功率MOSFET(单N沟道),具有高电压、大电流和优异的开关性能,广泛应用于高功率电力电子系统中。其主要应用场景包括:

1. 电源系统:常用于工业级开关电源(SMPS)、不间断电源(UPS)和DC-DC转换器中,作为主开关器件,适用于高输入电压环境(耐压达2000V),可有效提升转换效率与系统稳定性。

2. 脉冲功率应用:因其具备快速开关能力和高脉冲电流承受能力,适用于激光驱动器、医疗设备中的电容放电电路以及雷达脉冲调制器等需要瞬时大功率输出的场合。

3. 感应加热与焊接设备:在高频感应加热电源中用作逆变桥臂开关管,支持高频工作,有助于提高加热效率;也可用于电阻焊机、电弧焊电源等工业焊接设备中。

4. 高压直流输电与能源系统:在HVDC模块或太阳能逆变器中作为关键开关元件,尤其适用于需要耐受恶劣电气环境的高可靠性系统。

5. 电机驱动:可用于高压交流或直流电机控制装置中,特别适合要求高耐用性和过载能力的工业驱动场景。

6. 测试与测量设备:在高压脉冲发生器、电子负载及功率放大器中发挥重要作用。

该器件采用TO-268(SOT-227B)封装,便于散热与模块集成,适合在高温、高应力环境下长期运行。综合来看,IXTH450P2适用于对可靠性、耐压能力和功率密度要求较高的工业与电力电子领域。
产品参数 图文手册 常见问题
参数 数值
产品目录

分立半导体产品

描述

MOSFET N-CH 500V 16A TO247

产品分类

FET - 单

FET功能

标准

FET类型

MOSFET N 通道,金属氧化物

品牌

IXYS

数据手册

点击此处下载产品Datasheet

产品图片

产品型号

IXTH450P2

rohs

无铅 / 符合限制有害物质指令(RoHS)规范要求

产品系列

PolarP2™

不同Id时的Vgs(th)(最大值)

4.5V @ 250µA

不同Vds时的输入电容(Ciss)

2530pF @ 25V

不同Vgs时的栅极电荷(Qg)

43nC @ 10V

不同 Id、Vgs时的 RdsOn(最大值)

330 毫欧 @ 8A,10V

供应商器件封装

TO-247 (IXTH)

功率-最大值

300W

包装

管件

安装类型

通孔

封装/外壳

TO-247-3

标准包装

30

漏源极电压(Vdss)

500V

电流-连续漏极(Id)(25°C时)

16A (Tc)

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PDF Datasheet 数据手册内容提取

Polar2TM IXTP450P2 V = 500V DSS Power MOSFETs IXTQ450P2 I = 16A D25 R ≤≤≤≤≤ 330mΩΩΩΩΩ IXTH450P2 DS(on) t = 400ns N-Channel Enhancement Mode rr(typ) Avalanche Rated Fast Intrinsic Diode TO-220AB (IXTP) G DS Tab Symbol Test Conditions Maximum Ratings TO-3P (IXTQ) V T = 25°C to 150°C 500 V DSS J V T = 25°C to 150°C, R = 1MΩ 500 V DGR J GS V Continuous ± 30 V G GSS D V Transient ± 40 V GSM S Tab I T = 25°C 16 A D25 C I T = 25°C, Pulse Width Limited by T 48 A TO-247(IXTH) DM C JM I T = 25°C 16 A A C E T = 25°C 750 mJ AS C dv/dt I ≤ I , V ≤ V ,T ≤ 150°C 10 V/ns S DM DD DSS J P T = 25°C 300 W G D C D Tab S T -55 ... +150 °C J T 150 °C JM G = Gate D = Drain T -55 ... +150 °C stg S = Source Tab = Drain T Maximum Lead Temperature for Soldering 300 °C L T Plastic Body for 10s 260 °C SOLD Features M Mounting Torque 1.13/10 Nm/lb.in. d (cid:122) Avalanche Rated Weight TO-220 3.0 g (cid:122) Fast Intrinsic Diode TO-3P 5.5 g (cid:122) Dynamic dv/dt Rated TO-247 6.0 g (cid:122) Low Package Inductance Advantages Symbol Test Conditions Characteristic Values (cid:122) High Power Density (T = 25°C, Unless Otherwise Specified) Min. Typ. Max. (cid:122) Easy to Mount J (cid:122) Space Savings BV V = 0V, I = 250μA 500 V DSS GS D V V = V , I = 250μA 2.5 4.5 V GS(th) DS GS D Applications I V = ± 30V, V = 0V ± 100 nA GSS GS DS (cid:122) Switch-Mode and Resonant-Mode I V = V , V = 0V 5 μA DSS DS DSS GS Power Supplies TJ = 125°C 25 μA (cid:122) DC-DC Converters R V = 10V, I = 0.5 • I , Note 1 330 mΩ (cid:122) Laser Drivers DS(on) GS D D25 (cid:122) AC and DC Motor Drives (cid:122) Robotics and Servo Controls © 2011 IXYS CORPORATION, All Rights Reserved DS100241A(10/11)

IXTP450P2 IXTQ450P2 IXTH450P2 Symbol Test Conditions Characteristic Values TO-3P Outline (T = 25°C Unless Otherwise Specified) Min. Typ. Max. J g V = 20V, I = 0.5 • I , Note 1 12 20 S fs DS D D25 C 2280 pF iss C V = 0V, V = 25V, f = 1MHz 257 pF oss GS DS C 30 pF rss t 16 ns d(on) Resistive Switching Times t 10 ns r V = 10V, V = 0.5 • V , I = 0.5 • I t GS DS DSS D D 2 5 50 ns d(off) R = 10Ω (External) t G 18 ns f Q 43 nC g(on) Q V = 10V, V = 0.5 • V , I = 0.5 • I 18 nC gs GS DS DSS D D25 Q 11 nC gd R 0.42 °C/W thJC R TO-220 0.50 °C/W thCS R TO-3P & TO-247 0.25 °C/W thCS Source-Drain Diode Symbol Test Conditions Characteristic Values (T = 25°C Unless Otherwise Specified) Min. Typ. Max. J I V = 0V 16 A S GS TO-247 Outline I Repetitive, Pulse Width Limited by T 64 A SM JM V I = I , V = 0V, Note 1 1.3 V SD F S GS t I = 16A, -di/dt = 100A/μs 400 ns rr VF = 100V, V = 0V ∅ P R GS 1 2 3 Note 1. Pulse test, t ≤ 300μs, duty cycle, d ≤ 2%. e Terminals: 1 - Gate 2 - Drain TO-220 Outline 3 - Source Dim. Millimeter Inches Min. Max. Min. Max. A 4.7 5.3 .185 .209 A 2.2 2.54 .087 .102 1 A 2.2 2.6 .059 .098 2 b 1.0 1.4 .040 .055 b 1.65 2.13 .065 .084 1 b 2.87 3.12 .113 .123 2 C .4 .8 .016 .031 D 20.80 21.46 .819 .845 E 15.75 16.26 .610 .640 e 5.20 5.72 0.205 0.225 L 19.81 20.32 .780 .800 1 - Gate 2 - Drain L1 4.50 .177 3 - Source ∅P 3.55 3.65 .140 .144 Q 5.89 6.40 0.232 0.252 R 4.32 5.49 .170 .216 S 6.15 BSC 242 BSC IXYS Reserves the Right to Change Limits, Test Conditions, and Dimensions. IXYS MOSFETs and IGBTs are covered 4,835,592 4,931,844 5,049,961 5,237,481 6,162,665 6,404,065 B1 6,683,344 6,727,585 7,005,734 B2 7,157,338B2 by one or more of the following U.S. patents:4,850,072 5,017,508 5,063,307 5,381,025 6,259,123 B1 6,534,343 6,710,405 B2 6,759,692 7,063,975 B2 4,881,106 5,034,796 5,187,117 5,486,715 6,306,728 B1 6,583,505 6,710,463 6,771,478 B27,071,537

IXTP450P2 IXTQ450P2 IXTH450P2 Fig. 1. Output Characteristics @ T = 25ºC Fig. 2. Extended Output Characteristics @ T = 25ºC J J 16 50 14 V G S = 170VV 45 V G S = 170VV 40 12 35 6V mperes 108 mperes 2350 I - AD 6 I - AD 20 6V 15 4 10 2 5V 5 5V 0 0 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 0 5 10 15 20 25 30 VDS - Volts VDS - Volts Fig. 4. R Normalized to I = 8A Value vs. DS(on) D Fig. 3. Output Characteristics @ TJ = 125ºC Junction Temperature 16 3.2 VGS = 10V 14 6V VGS = 10V 2.8 12 d 2.4 e z peres 10 ormali 2.0 I D = 16A I - AmD 68 - NS(on) 1.6 I D = 8A D 5V R 1.2 4 2 0.8 4V 0 0.4 0 1 2 3 4 5 6 7 8 9 10 11 12 -50 -25 0 25 50 75 100 125 150 VDS - Volts TJ - Degrees Centigrade Fig. 5. RDS(on) Normalized to ID = 8A Value vs. Fig. 6. Maximum Drain Current vs. Drain Current Case Temperature 3.6 18 VGS = 10V 16 3.2 TJ = 125ºC 14 d 2.8 ze 12 ali es orm 2.4 per 10 N m - on) 2.0 TJ = 25ºC - AD 8 DS( I 6 R 1.6 4 1.2 2 0.8 0 0 5 10 15 20 25 30 35 40 45 50 -50 -25 0 25 50 75 100 125 150 ID - Amperes TC - Degrees Centigrade © 2011 IXYS CORPORATION, All Rights Reserved

IXTP450P2 IXTQ450P2 IXTH450P2 Fig. 7. Input Admittance Fig. 8. Transconductance 40 50 35 TJ = - 40ºC 40 30 eres 25 T J = 1- 242505ºººCCC mens 30 25ºC p e m 20 Si I - AD 15 g - f s 20 125ºC 10 10 5 0 0 3.0 3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0 0 5 10 15 20 25 30 35 40 VGS - Volts ID - Amperes Fig. 9. Forward Voltage Drop of Intrinsic Diode Fig. 10. Gate Charge 50 10 45 9 VDS = 250V I D = 8A 40 8 I G = 10mA 35 7 eres 30 olts 6 p V Am 25 - S 5 - S 20 VG 4 I TJ = 125ºC 15 3 TJ = 25ºC 10 2 5 1 0 0 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 0 5 10 15 20 25 30 35 40 45 VSD - Volts QG - NanoCoulombs Fig. 11. Capacitance Fig. 12. Forward-Bias Safe Operating Area 10,000 100 RDS(on) Limit Ciss 25µs s 100µs d a ar1,000 10 F o s c e Pi er e - Coss mp c A acitan 100 I - D 1 p a C Crss TJ = 150ºC 1ms TC = 25ºC f = 1 MHz Single Pulse 10 0.1 0 5 10 15 20 25 30 35 40 10 100 1,000 VDS - Volts VDS - Volts IXYS Reserves the Right to Change Limits, Test Conditions, and Dimensions.

IXTP450P2 IXTQ450P2 IXTH450P2 Fig. 13. Maximum Transient Thermal Impedance 1 W / C - º 0.1 C J h) (t Z 0.01 0.0001 0.001 0.01 0.1 1 10 Pulse Width - Seconds © 2011 IXYS CORPORATION, All Rights Reserved IXYS REF: T_450P2(5J-N45) 10-17-11

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