ULN2803,04APG/AFWG TOSHIBA Bipolar Digital Integrated Circuit Silicon Monolithic ULN2803APG, ULN2803AFWG, ULN2804APG, ULN2804AFWG 8ch Darlington Sink Driver ULN2803APG The ULN2803APG / AFWG Series are high−voltage, ULN2804APG high−current darlington drivers comprised of eight NPN darlington pairs. All units feature integral clamp diodes for switching inductive loads. Applications include relay, hammer, lamp and display (LED) drivers. Features • Output current (single output) ULN2803AFWG 500 mA (max) ULN2804AFWG • High sustaining voltage output 50 V (min) • Output clamp diodes • Inputs compatible with various types of logic. • Package Type−APG : DIP−18pin • Package Type−AFWG : SOP−18pin Weight P-DIP18-300-2.54-001: 1.478 g (Typ.) P-SOP18-0812-1.27-001: 0.48 g (Typ.) Pin Connection (top view) Input Base Type Designation Resistor ULN2803APG / AFWG 2.7 kΩ TTL, 5 V CMOS ULN2804APG / AFWG 10.5 kΩ 6~15 V PMOS, CMOS 1 2012-11-26

ULN2803,04APG/AFWG Schematics (each driver) ULN2803APG / AFWG ULN2804APG / AFWG Note: The input and output parasitic diodes cannot be used as clamp diodes. Absolute Maximum Ratings (Ta = 25°C) Characteristic Symbol Rating Unit Output sustaining voltage VCE (SUS) −0.5 to 50 V Output current IOUT 500 mA / ch Input voltage VIN −0.5 to 30 V Clamp diode reverse voltage VR 50 V Clamp diode forward current IF 500 mA APG 1.47 Power dissipation PD W AFWG 0.92 / 1.31 (Note) Operating temperature Topr −40 to 85 °C Storage temperature Tstg −55 to 150 °C Note: On Glass Epoxy PCB (75 × 114 × 1.6 mm Cu 20%) 2 2012-11-26

ULN2803,04APG/AFWG Recommended Operating Conditions (Ta = −40~85°C) Characteristic Symbol Test Condition Min Typ. Max Unit Output sustaining voltage VCE (SUS) ― 0 ― 50 V tpw = 25 ms, Duty = 10%, 0 ― 347 8 Circuits APG tpw = 25 ms, Duty = 50%, 0 ― 123 8 Circuits mA / Output current IOUT ch tpw = 25 ms, Duty = 10%, 0 ― 268 8 Circuits AFWG tpw = 25 ms, Duty = 50%, 0 ― 90 8 Circuits Input voltage VIN ― 0 ― 30 V Input voltage ULN2803A ― 2.5 ― 30 (Output on) VIN (ON) V ULN2804A ― 8 ― 30 Clamp diode reverse voltage VR ― ― ― 50 V Clamp diode forward current IF ― ― ― 400 mA APG Ta = 85°C ― ― 0.76 Power dissipation PD W AFWG Ta = 85°C (Note) ― ― 0.48 Note: On Glass Epoxy PCB (75 × 114 × 1.6 mm Cu 20%) 3 2012-11-26

ULN2803,04APG/AFWG Electrical Characteristics (Ta = 25°C) Test Characteristic Symbol Cir− Test Condition Min Typ. Max Unit Cuit VCE = 50 V Ta = 25°C ― ― 50 Output leakage current ICEX 1 VCE = 50 V Ta = 85°C ― ― 100 μA ULN2804A VCE = 50 V VIN = 1 V ― ― 500 IOUT = 350 mA, IIN = 500 μA ― 1.3 1.6 Collector−emitter saturation voltage VCE (sat) 2 IOUT = 200 mA, IIN = 350 μA ― 1.1 1.3 V IOUT = 100 mA, IIN = 250 μA ― 0.9 1.1 ULN2803A VIN = 3.85 V ― 0.93 1.35 IIN (ON) 2 VIN = 5 V ― 0.35 0.5 mA Input current ULN2804A VIN = 12 V ― 1.0 1.45 IIN (OFF) 4 IOUT = 500 μA, Ta = 85°C 50 65 ― μA VCE = 2 V, IOUT = 200 mA ― ― 2.4 ULN2803A VCE = 2 V, IOUT = 250 mA ― ― 2.7 VCE = 2 V, IOUT = 300 mA ― ― 3.0 Input voltage (Output on) VIN (ON) 5 VCE = 2 V, IOUT = 125 mA ― ― 5.0 V VCE = 2 V, IOUT = 200 mA ― ― 6.0 ULN2804A VCE = 2 V, IOUT = 275 mA ― ― 7.0 VCE = 2 V, IOUT = 350 mA ― ― 8.0 DC current transfer ratio hFE 2 VCE = 2 V, IOUT = 350 mA 1000 ― ― ― Ta = 25°C (Note) ― ― 50 Clamp diode reverse current IR 6 μA Ta = 85°C (Note) ― ― 100 Clamp diode forward voltage VF 7 IF = 350 mA ― ― 2.0 V Input capacitance CIN ― ― ― 15 ― pF Turn−on delay tON RL = 125 Ω, VOUT = 50 V ― 0.1 ― 8 μs Turn−off delay tOFF RL = 125 Ω, VOUT = 50 V ― 0.2 ― Note: VR = VR (max) 4 2012-11-26

ULN2803,04APG/AFWG Test Circuit 1. I 2. V h 3. I CEX CE (sat), FE IN (ON) 4. I 5. V 6. I IN (OFF) IN (ON) R 7. V F 5 2012-11-26

ULN2803,04APG/AFWG 8. t , t ON OFF Note 1: Pulse Width 50 μs, Duty Cycle 10% Output Impedance 50 Ω, tr ≤ 5 ns, tf ≤ 10 ns Note 2: See below. Input Condition Type Number R1 VIH ULN2803A 0Ω 3 V ULN2804A 0Ω 8 V Note 3: CL includes probe and jig capacitance Precautions for Using This IC does not integrate protection circuits such as overcurrent and overvoltage protectors. Thus, if excess current or voltage is applied to the IC, the IC may be damaged. Please design the IC so that excess current or voltage will not be applied to the IC. Utmost care is necessary in the design of the output line, COMMON and GND line since IC may be destroyed due to short−circuit between outputs, air contamination fault, or fault by improper grounding. 6 2012-11-26

ULN2803,04APG/AFWG 7 2012-11-26

ULN2803,04APG/AFWG 8 2012-11-26

ULN2803,04APG/AFWG Package Dimensions P-DIP18-300-2.54-001 “Unit : mm” Weight: 1.478 g (typ.) This drawing is an object for explanation. 9 2012-11-26

ULN2803,04APG/AFWG Package Dimensions P-SOP18-0812-1.27-001 “Unit : mm” Weight: 0.48 g (typ.) This drawing is an object for explanation. 10 2012-11-26

ULN2803,04APG/AFWG Notes on Contents 1. Equivalent Circuits The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory purposes. 2. Test Circuits Components in the test circuits are used only to obtain and confirm the device characteristics. These components and circuits are not guaranteed to prevent malfunction or failure from occurring in the application equipment. IC Usage Considerations Notes on Handling of ICs (1) The absolute maximum ratings of a semiconductor device are a set of ratings that must not be exceeded, even for a moment. Do not exceed any of these ratings. Exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result injury by explosion or combustion. (2) Use an appropriate power supply fuse to ensure that a large current does not continuously flow in case of over current and/or IC failure. The IC will fully break down when used under conditions that exceed its absolute maximum ratings, when the wiring is routed improperly or when an abnormal pulse noise occurs from the wiring or load, causing a large current to continuously flow and the breakdown can lead smoke or ignition. To minimize the effects of the flow of a large current in case of breakdown, appropriate settings, such as fuse capacity, fusing time and insertion circuit location, are required. (3) If your design includes an inductive load such as a motor coil, incorporate a protection circuit into the design to prevent device malfunction or breakdown caused by the current resulting from the inrush current at power ON or the negative current resulting from the back electromotive force at power OFF. IC breakdown may cause injury, smoke or ignition. Use a stable power supply with ICs with built-in protection functions. If the power supply is unstable, the protection function may not operate, causing IC breakdown. IC breakdown may cause injury, smoke or ignition. (4) Do not insert devices in the wrong orientation or incorrectly. Make sure that the positive and negative terminals of power supplies are connected properly. Otherwise, the current or power consumption may exceed the absolute maximum rating, and exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result injury by explosion or combustion. In addition, do not use any device that is applied the current with inserting in the wrong orientation or incorrectly even just one time. (5) Carefully select external components (such as inputs and negative feedback capacitors) and load components (such as speakers), for example, power amp and regulator. If there is a large amount of leakage current such as input or negative feedback condenser, the IC output DC voltage will increase. If this output voltage is connected to a speaker with low input withstand voltage, overcurrent or IC failure can cause smoke or ignition. (The over current can cause smoke or ignition from the IC itself.) In particular, please pay attention when using a Bridge Tied Load (BTL) connection type IC that inputs output DC voltage to a speaker directly. 11 2012-11-26

ULN2803,04APG/AFWG Points to Remember on Handling of ICs (1) Heat Radiation Design In using an IC with large current flow such as power amp, regulator or driver, please design the device so that heat is appropriately radiated, not to exceed the specified junction temperature (Tj) at any time and condition. These ICs generate heat even during normal use. An inadequate IC heat radiation design can lead to decrease in IC life, deterioration of IC characteristics or IC breakdown. In addition, please design the device taking into considerate the effect of IC heat radiation with peripheral components. (2) Back-EMF When a motor rotates in the reverse direction, stops or slows down abruptly, a current flow back to the motor’s power supply due to the effect of back-EMF. If the current sink capability of the power supply is small, the device’s motor power supply and output pins might be exposed to conditions beyond absolute maximum ratings. To avoid this problem, take the effect of back-EMF into consideration in system design. About solderability, following conditions were confirmed • Solderability (1) Use of Sn-37Pb solder Bath · solder bath temperature = 230°C · dipping time = 5 seconds · the number of times = once · use of R-type flux (2) Use of Sn-3.0Ag-0.5Cu solder Bath · solder bath temperature = 245°C · dipping time = 5 seconds · the number of times = once · use of R-type flux 12 2012-11-26

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Customers are solely responsible for all aspects of their own product design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such design or applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts, diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating parameters for such designs and applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR APPLICATIONS. • PRODUCT IS NEITHER INTENDED NOR WARRANTED FOR USE IN EQUIPMENTS OR SYSTEMS THAT REQUIRE EXTRAORDINARILY HIGH LEVELS OF QUALITY AND/OR RELIABILITY, AND/OR A MALFUNCTION OR FAILURE OF WHICH MAY CAUSE LOSS OF HUMAN LIFE, BODILY INJURY, SERIOUS PROPERTY DAMAGE AND/OR SERIOUS PUBLIC IMPACT ("UNINTENDED USE"). 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