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  • 型号: STD5N52U
  • 制造商: STMicroelectronics
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STD5N52U产品简介:

ICGOO电子元器件商城为您提供STD5N52U由STMicroelectronics设计生产,在icgoo商城现货销售,并且可以通过原厂、代理商等渠道进行代购。 STD5N52U价格参考。STMicroelectronicsSTD5N52U封装/规格:晶体管 - FET,MOSFET - 单, 表面贴装 N 沟道 525V 4.4A(Tc) 70W(Tc) DPAK。您可以下载STD5N52U参考资料、Datasheet数据手册功能说明书,资料中有STD5N52U 详细功能的应用电路图电压和使用方法及教程。

产品参数 图文手册 常见问题
参数 数值
产品目录

分立半导体产品

描述

MOSFET N-CH 525V 4.4A DPAKMOSFET N-channel 525 V 4.4 A DPAK TO-220F

产品分类

FET - 单分离式半导体

FET功能

标准

FET类型

MOSFET N 通道,金属氧化物

Id-ContinuousDrainCurrent

4.4 A

Id-连续漏极电流

4.4 A

品牌

STMicroelectronics

产品手册

点击此处下载产品Datasheet

产品图片

rohs

符合RoHS无铅 / 符合限制有害物质指令(RoHS)规范要求

产品系列

晶体管,MOSFET,STMicroelectronics STD5N52UUltraFASTmesh™

数据手册

点击此处下载产品Datasheet

产品型号

STD5N52U

Pd-PowerDissipation

70 W

Pd-功率耗散

70 W

RdsOn-Drain-SourceResistance

1.28 Ohms

RdsOn-漏源导通电阻

1.28 Ohms

Vds-Drain-SourceBreakdownVoltage

525 V

Vds-漏源极击穿电压

525 V

上升时间

13.6 ns

下降时间

15 ns

不同Id时的Vgs(th)(最大值)

4.5V @ 50µA

不同Vds时的输入电容(Ciss)

529pF @ 25V

不同Vgs时的栅极电荷(Qg)

16.9nC @ 10V

不同 Id、Vgs时的 RdsOn(最大值)

1.5 欧姆 @ 2.2A,10V

产品目录页面

点击此处下载产品Datasheet

产品种类

MOSFET

供应商器件封装

D-Pak

其它名称

497-10017-1

其它有关文件

http://www.st.com/web/catalog/sense_power/FM100/CL824/SC1167/PF224224?referrer=70071840

典型关闭延迟时间

23.1 ns

功率-最大值

70W

包装

剪切带 (CT)

商标

STMicroelectronics

安装类型

表面贴装

安装风格

SMD/SMT

封装

Reel

封装/外壳

TO-252-3,DPak(2 引线+接片),SC-63

封装/箱体

DPAK-2

工厂包装数量

2500

晶体管极性

N-Channel

最大工作温度

+ 150 C

最小工作温度

- 55 C

标准包装

1

漏源极电压(Vdss)

525V

电流-连续漏极(Id)(25°C时)

4.4A (Tc)

系列

STD5N52U

配用

/product-detail/zh/STEVAL-IHM021V2/497-10543-ND/2287332

配置

Single

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PDF Datasheet 数据手册内容提取

STD5N52U, STF5N52U N-channel 525 V, 1.25 Ω typ., 4.4 A UltraFASTmesh™ Power MOSFETs in DPAK and TO-220FP packages - Datasheet production data Features Order codes V R max I P DS DS(on) D TOT STD5N52U 70 W 525 V 1.5 Ω 4.4 A TAB STF5N52U 25 W 3 • Outstanding dv/dt capability 1 3 2 • Gate charge minimized DPAK 1 TO-220FP • Very low intrinsic capacitances • Very low R DS(on) • Extremely low t rr Applications Figure 1. Internal schematic diagram D(2, TAB) • Switching applications Description These devices are N-channel Power MOSFETs developed using UltraFASTmesh™ technology, G(1) which combines the advantages of reduced on- resistance, Zener gate protection and very high dv/dt capability with an enhanced fast body-drain recovery diode. S(3) AM01476v1 Table 1. Device summary Order codes Marking Package Packaging STD5N52U DPAK Tape and reel 5N52U STF5N52U TO-220FP Tube April 2014 DocID15684 Rev 3 1/19 This is information on a product in full production. www.st.com

Contents STD5N52U, STF5N52U Contents 1 Electrical ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 2 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 2.1 Electrical characteristics (curves) . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 3 Test circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 4 Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 4.1 DPAK, STD5N52U . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11 4.2 TO-220FP, STF5N52U . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 5 Packaging mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 6 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 2/19 DocID15684 Rev 3

STD5N52U, STF5N52U Electrical ratings 1 Electrical ratings Table 2. Absolute maximum ratings Value Symbol Parameter Unit DPAK TO-220FP V Gate- source voltage ± 30 V GS I Drain current (continuous) at T = 25 °C 4.4 A D C I Drain current (continuous) at T = 100 °C 2.8 A D C I (1) Drain current (pulsed) 17.6 A DM P Total dissipation at T = 25 °C 70 25 W TOT C Avalanche current, repetitive or not-repetitive I 4.4 A AR (pulse width limited by T max) J Single pulse avalanche energy E 170 mJ AS (starting T = 25 °C, I = I , V = 50 V) J D AR DD dv/dt(2) Peak diode recovery voltage slope 20 V/ns Gate-source human body model (R = 1.5 kΩ, ESD 2.8 kV C = 100 pF) Insulation withstand voltage (RMS) from all V three leads to external heat sink 2500 V ISO (t=1 s;T =25 °C) C T Operating junction temperature °C J -55 to 150 T Storage temperature °C stg 1. Pulse width limited by safe operating area. 2. I ≤ 4.4 A, di/dt ≤ 400 A/μs, peak V ≤ V SD DS (BR)DSS Table 3. Thermal data Value Symbol Parameter Unit DPAK TO-220FP R Thermal resistance junction-case max 1.79 5 °C/W thj-case R Thermal resistance junction-ambient max 62.5 °C/W thj-amb R (1) Thermal resistance junction-pcb 50 °C/W thj-pcb 1. When mounted on 1 inch² FR-4 board, 2oz Cu DocID15684 Rev 3 3/19 19

Electrical characteristics STD5N52U, STF5N52U 2 Electrical characteristics (Tcase =25 °C unless otherwise specified). Table 4. On /off states Symbol Parameter Test conditions Min. Typ. Max. Unit Drain-source V breakdown voltage I = 1 mA 525 V (BR)DSS D (V = 0) GS Zero gate voltage VDS = 525 V 10 μA I DSS drain current (VGS = 0) VDS = 525 V, TC=125 °C 500 μA Gate-body leakage I V = 20 V ±10 μA GSS current (V = 0) GS DS V Gate threshold voltage V = V , I = 50 μA 3 3.75 4.5 V GS(th) DS GS D Static drain-source on- R V = 10 V, I = 2.2 A 1.25 1.5 Ω DS(on) resistance GS D Table 5. Dynamic Symbol Parameter Test conditions Min. Typ. Max. Unit C Input capacitance - 529 - pF iss C Output capacitance V = 25 V, f = 1 MHz, - 71 - pF oss DS V = 0 Reverse transfer GS C - 13.4 - pF rss capacitance Equivalent C (1) capacitance time V = 0 to 420 V, V = 0 - 11 - pF o(tr) DS GS related R Gate input resistance f=1 MHz open drain - 6 - Ω g Q Total gate charge - 16.9 - nC g V = 416 V, I = 4.4 A, DD D Q Gate-source charge V = 10 V - 4.2 - nC gs GS (see Figure 17) Q Gate-drain charge - 8.4 - nC gd 1. C time related is defined as a constant equivalent capacitance giving the same charging time as C oss eq. oss when V increases from 0 to 80% V DS DSS 4/19 DocID15684 Rev 3

STD5N52U, STF5N52U Electrical characteristics Table 6. Switching times Symbol Parameter Test conditions Min. Typ. Max. Unit t Turn-on delay time - 11.4 - ns d(on) V = 260 V, I = 2.2 A, t Rise time DD D - 13.6 - ns r R = 4.7 Ω, V = 10 V G GS t Turn-off-delay time - 23.1 - ns d(off) (see Figure 16) t Fall time - 15 - ns f Table 7. Source drain diode Symbol Parameter Test conditions Min. Typ. Max. Unit I Source-drain current - 4.4 A SD I (1) Source-drain current (pulsed) - 17.6 A SDM V (2) Forward on voltage I = 4.4 A, V = 0 - 1.6 V SD SD GS t Reverse recovery time - 55 ns rr I = 4.4 A, di/dt = 100 A/μs SD Q Reverse recovery charge V = 60 V - 95 nC rr DD (see Figure 18) I Reverse recovery current - 3.5 A RRM t Reverse recovery time - 120 ns rr I = 4.4 A, di/dt = 100 A/μs SD Q Reverse recovery charge V = 60 V T = 150 °C - 266 nC rr DD J (see Figure 18) I Reverse recovery current - 4.5 A RRM 1. Pulse width limited by safe operating area 2. Pulsed: pulse duration = 300 μs, duty cycle 1.5% Table 8. Gate-source Zener diode Symbol Parameter Test conditions Min Typ. Max. Unit V Gate-source breakdown voltage I = ± 1mA, I =0 30 - - V (BR)GSO GS D The built-in back-to-back Zener diodes have specifically been designed to enhance the device's ESD capability. In this respect the Zener voltage is appropriate to achieve an efficient and cost-effective intervention to protect the device's integrity. These integrated Zener diodes thus avoid the usage of external components. DocID15684 Rev 3 5/19 19

Electrical characteristics STD5N52U, STF5N52U 2.1 Electrical characteristics (curves) Figure 2. Safe operating area for DPAK Figure 3. Thermal impedance for DPAK Figure 4. Safe operating area for TO-220FP Figure 5. Thermal impedance for TO-220FP Figure 6. Output characteristics Figure 7. Transfer characteristics 6/19 DocID15684 Rev 3

STD5N52U, STF5N52U Electrical characteristics Figure 8. Normalized V vs temperature Figure 9. Static drain-source on-resistance (BR)DSS ((BBRR)) Figure 10. Gate charge vs gate-source voltage Figure 11. Capacitance variations Figure 12. Normalized gate threshold voltage vs Figure 13. Normalized on-resistance vs temperature temperature DocID15684 Rev 3 7/19 19

Electrical characteristics STD5N52U, STF5N52U Figure 14. Source-drain diode forward Figure 15. Maximum avalanche energy vs characteristics temperature 8/19 DocID15684 Rev 3

STD5N52U, STF5N52U Test circuits 3 Test circuits Figure 16. Switching times test circuit for Figure 17. Gate charge test circuit resistive load VDD 12V 47kΩ 1kΩ 100nF RL 2μ20F0 3μ.F3 VDD IG=CONST VD Vi=20V=VGMAX 100Ω D.U.T. VGS 2200 RG D.U.T. μF 2.7kΩ VG PW 47kΩ 1kΩ PW AM01468v1 AM01469v1 Figure 18. Test circuit for inductive load Figure 19. Unclamped inductive load test circuit switching and diode recovery times L A A A D FAST L=100μH VD G D.U.T. DIODE 2200 3.3 μF μF VDD S B 3.3 1000 B B μF μF 25Ω D VDD ID G RG S Vi D.U.T. Pw AM01470v1 AM01471v1 Figure 20. Unclamped inductive waveform Figure 21. Switching time waveform V(BR)DSS ton toff VD tdon tr tdoff tf 90% 90% IDM 10% ID 0 10% VDS VDD VDD 90% VGS AM01472v1 0 10% AM01473v1 DocID15684 Rev 3 9/19 19

Package mechanical data STD5N52U, STF5N52U 4 Package mechanical data In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. 10/19 DocID15684 Rev 3

STD5N52U, STF5N52U Package mechanical data 4.1 DPAK, STD5N52U Figure 22. DPAK (TO-252) type A drawing (cid:19)(cid:19)(cid:25)(cid:27)(cid:26)(cid:26)(cid:21)(cid:66)(cid:49) DocID15684 Rev 3 11/19 19

Package mechanical data STD5N52U, STF5N52U Table 9. DPAK (TO-252) type A mechanical data mm Dim. Min. Typ. Max. A 2.20 2.40 A1 0.90 1.10 A2 0.03 0.23 b 0.64 0.90 b4 5.20 5.40 c 0.45 0.60 c2 0.48 0.60 D 6.00 6.20 D1 5.10 E 6.40 6.60 E1 4.70 e 2.28 e1 4.40 4.60 H 9.35 10.10 L 1.00 1.50 (L1) 2.80 L2 0.80 L4 0.60 1.00 R 0.20 V2 0° 8° 12/19 DocID15684 Rev 3

STD5N52U, STF5N52U Package mechanical data Figure 23. DPAK (TO-252) type A footprint (a) (cid:41)(cid:51)(cid:19)(cid:19)(cid:25)(cid:27)(cid:26)(cid:26)(cid:21)(cid:66)(cid:49) a. All dimensions are in millimeters DocID15684 Rev 3 13/19 19

Package mechanical data STD5N52U, STF5N52U 4.2 TO-220FP, STF5N52U Figure 24. TO-220FP drawing 7012510_Rev_K_B 14/19 DocID15684 Rev 3

STD5N52U, STF5N52U Package mechanical data Table 10. TO-220FP mechanical data mm Dim. Min. Typ. Max. A 4.4 4.6 B 2.5 2.7 D 2.5 2.75 E 0.45 0.7 F 0.75 1 F1 1.15 1.70 F2 1.15 1.70 G 4.95 5.2 G1 2.4 2.7 H 10 10.4 L2 16 L3 28.6 30.6 L4 9.8 10.6 L5 2.9 3.6 L6 15.9 16.4 L7 9 9.3 Ø 3 3.2 DocID15684 Rev 3 15/19 19

Packaging mechanical data STD5N52U, STF5N52U 5 Packaging mechanical data Figure 25. Tape for DPAK (TO-252) 10 pitches cumulative tolerance on tape +/- 0.2 mm Top cover P0 D P2 T tape E F K0 W B1 B0 For machine ref. only A0 P1 D1 including draft and radii concentric around B0 User direction of feed R Bending radius User direction of feed AM08852v1 16/19 DocID15684 Rev 3

STD5N52U, STF5N52U Packaging mechanical data Figure 26. Reel for DPAK (TO-252) T REEL DIMENSIONS 40mm min. Access hole At sl ot location B D C N A Full radius Tape slot G measured at hub in core for tape start 25 mm min. width AM08851v2 Table 11. DPAK (TO-252) tape and reel mechanical data Tape Reel mm mm Dim. Dim. Min. Max. Min. Max. A0 6.8 7 A 330 B0 10.4 10.6 B 1.5 B1 12.1 C 12.8 13.2 D 1.5 1.6 D 20.2 D1 1.5 G 16.4 18.4 E 1.65 1.85 N 50 F 7.4 7.6 T 22.4 K0 2.55 2.75 P0 3.9 4.1 Base qty. 2500 P1 7.9 8.1 Bulk qty. 2500 P2 1.9 2.1 R 40 T 0.25 0.35 W 15.7 16.3 DocID15684 Rev 3 17/19 19

Revision history STD5N52U, STF5N52U 6 Revision history Table 12. Document revision history Date Revision Changes 06-May-2009 1 First release. – Inserted new device in I2PAK. – Updated tables 1, 2 and 3 with the new package. 28-Sep-2011 2 – Updated Section4: Package mechanical data with the new package and Section5: Packaging mechanical data. – Minor text changes. – Updated Section4.1: DPAK, STD5N52U – Modified: Q unit in Table7 rr 24-Apr-2014 3 – Modified: Figure8 and 11 – The part number STI5N52U has been moved to a separate datasheet 18/19 DocID15684 Rev 3

STD5N52U, STF5N52U Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. ST PRODUCTS ARE NOT DESIGNED OR AUTHORIZED FOR USE IN: (A) SAFETY CRITICAL APPLICATIONS SUCH AS LIFE SUPPORTING, ACTIVE IMPLANTED DEVICES OR SYSTEMS WITH PRODUCT FUNCTIONAL SAFETY REQUIREMENTS; (B) AERONAUTIC APPLICATIONS; (C) AUTOMOTIVE APPLICATIONS OR ENVIRONMENTS, AND/OR (D) AEROSPACE APPLICATIONS OR ENVIRONMENTS. WHERE ST PRODUCTS ARE NOT DESIGNED FOR SUCH USE, THE PURCHASER SHALL USE PRODUCTS AT PURCHASER’S SOLE RISK, EVEN IF ST HAS BEEN INFORMED IN WRITING OF SUCH USAGE, UNLESS A PRODUCT IS EXPRESSLY DESIGNATED BY ST AS BEING INTENDED FOR “AUTOMOTIVE, AUTOMOTIVE SAFETY OR MEDICAL” INDUSTRY DOMAINS ACCORDING TO ST PRODUCT DESIGN SPECIFICATIONS. PRODUCTS FORMALLY ESCC, QML OR JAN QUALIFIED ARE DEEMED SUITABLE FOR USE IN AEROSPACE BY THE CORRESPONDING GOVERNMENTAL AGENCY. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. © 2014 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco - Philippines - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com DocID15684 Rev 3 19/19 19

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