GaAs INTEGRATED CIRCUIT PG2406TK D 6 0.01 to 3.0 GHz SPDT SWITCH E M 6 DESCRIPTION U The PG2406TK is a GaAs MMIC for L, S-band SPDT (Single Pole Double Throw) switch 0which were designed for mobile phone and another L, S-band application. 4 This device can operate 2 control switching by control voltage 1.8 to 5.3 V. This device can operate frequency N from 0.01 to 3.0 GHz, having the low insertion loss and high isolation. 2 This device is housed in a 6-pin lead-less minimold package. And this package is able to high-density surface mounting. G FEATURES I C • Switch control voltage : Vcont (H) = 1.8 to 5T.3 V (2.7 V TYP.) : Vcont (L) = 0.2 to +0.2 V (0 V TYP.) : • Low insertion loss : Lins = 0.40 dB TYP. @ f = 1.0 GHzt, Vcont (H) = 2.7 V, Vcont (L) = 0 V : Lins = 0.47 dB TYP. @ f = 2.5 GHnz, Vcont (H) = 2.7 V, Vcont (L) = 0 V N • High isolation : ISL = 27 dB TYP. @ f = 1.0 GHz, Vcont (H) = 2.7 V, Vcont (L) = 0 V : ISL = 17 dB TYP. @ f = 2.5 eGHz, Vcont (H) = 2.7 V, Vcont (L) = 0 V • Handling power : Pin (0.1 dB) = +29.0 dBm TYmP. @ f = 2.0/2.5 GHz, Vcont (H) = 2.7 V, Vcont (L) = 0 V : Pin (1 dB) = +30.5 dBm TYP. @ f = 0.5 to 3.0 GHz, Vcont (H) = 2.7 V, Vcont (L) = 0 V O • High-density surface mounting : 6-pin lead-less minimold package (1.5  1.1  0.55 mm) e APPLICATIONS c • L, S-band digital cellular or cordless telephone a • W-LAN, WLL and BlCuetoothTM etc. l ORDERING INFORMATION p e Part Number Order Number Package Marking Supplying Form S PG2406TK-E2 PG2406TK-E2-A R6-pin lead-less minimold G5K  Embossed tape 8 mm wide (1511 PKG) (Pb-Free)  Pin 1, 6 face the perforation side of the tape  Qty 5 kpcs/reel n I Remark To order evaIluation samples, contact your nearby sales office. D Part numb-er for sample order: PG2406TK-A p o r CDaution Although this device is designed to be as robust as possible, ESD (Electrostatic Discharge) can damage this device. This device must be protected at all times from ESD. Static charges may easily produce potentials of several kilovolts on the human body or equipment, which can discharge without detection. Industry-standard ESD precautions must be employed at all times. Document No. PG10746EJ01V0DS (1st edition) Date Published January 2009 NS

PG2406TK PIN CONNECTIONS AND INTERNAL BLOCK DIAGRAM D Pin No. Pin Name 6 1 RF1 E 2 GMND 3 RF2 4 6Vcont2 U 5 RFC 0 6 Vcont1 4 SW TRUTH TABLE N 2 ON Path Vcont1 Vcont2 G RFC-RF1 High Low RFC-RF2 Low High I C T ABSOLUTE MAXIMUM RATINGS (TA = +25C, unless otherwise specified) : t Parameter Symbol Ratings Unit n N Switch Control Voltage Vcont +6.0 Note V e Input Power f = 0.01 to 0.5 GHz Pin1 +24.0 dBm m f = 0.5 to 3.0 GHz Pin2 +31.0 O Operating Ambient Temperature TA 45 to +85 C e Storage Temperature Tstg 55 to +150 C c Note Vcont1  Vcont2  6.0 V a C RECOMMENDED OPERATING RANGlE (TA = +25C, unless otherwise specified) p Parameter Symbol MIN. TYP. MAX. Unit e Switch ControlS Voltage (H) Vcont (H) 1.8 2.7 5.3 V R Switch Control Voltage (L) Vcont (L) 0.2 0 0.2 V n I I D - p o r D 2 Data Sheet PG10746EJ01V0DS

PG2406TK ELECTRICAL CHARACTERISTICS D (TA = +25C, Vcont (H) = 2.7 V, Vcont (L) = 0 V, DC blocking capacitors = 56 pF, unless otherwise specified) 6 Parameter Symbol Test Conditions MINE. TYP. MAX. Unit Insertion Loss 1 Lins1 f = 0.01 to 0.05 GHz Note 1  0.40  M dB Insertion Loss 2 Lins2 f = 0.05 to 0.5 GHz Note 2  0.40 0.45 dB 6 Insertion Loss 3 Lins3 f = 0.5 to 1.0 GHz U 0.40 0.45 dB Insertion Loss 4 Lins4 f = 1.0 to 2.0 GHz  0.450 0.50 dB Insertion Loss 5 Lins5 f = 2.0 to 2.5 GHz  0.47 0.55 dB 4 Insertion Loss 6 Lins6 f = 2.5 to 3.0 GHz  0.53 0.60 dB N Isolation 1 ISL1 f = 0.01 to 0.05 GHz Note 1  227  dB Isolation 2 ISL2 f = 0.05 to 0.5 GHz Note 2 23 27  dB G Isolation 3 ISL3 f = 0.5 to 1.0 GHz 23 27  dB Isolation 4 ISL4 f = 1.0 to 2.0I GHz C16 19  dB Isolation 5 ISL5 f = 2.0 toT 2.5 GHz 14 17  dB Isolation 6 ISL6 f = 2.5 to 3.0 GHz 14 17  dB : Input Return Loss 1 RLin1 f = 0.01 to 0.05 GHz Note 1 t  20  dB n Input Return Loss 2 RLin2 Nf = 0.05 to 0.5 GHz Note 2 15 20  dB Input Return Loss 3 RLin3 f = 0.5 to 3.0 GHz e 15 20  dB Output Return Loss 1 RLout1 f = 0.01 to 0.05 GmHz Note 1  20  dB Output Return Loss 2 ORLout2 f = 0.05 to 0.5 GHz Note 2 15 20  dB Output Return Loss 3 RLout3 f = 0.5 to 3e.0 GHz 15 20  dB 0.1 dB Loss Compression Pin (0.1 dB) f = 2.0c/2.5 GHz +26.0 +29.0  dBm Input Power Note 3 f = 0.5 to 3.0 GHz  +29.0  dBm a C 1 dB Loss Compression Pin (1 dB) f = 0.5 to 3.0 GHz  +30.5  dBm l Input Power Note 4 p 2nd Harmonics 2f0 f = 2.0/2.5 GHz, Pin = +20 dBm 65 75  dBc e 3rd HarmonicsS 3f0 f = 2.0/2.5 GHz, Pin = +20 dBm 65 75  dBc R Intermodulation Intercept Point IIP3 f = 0.5 to 3.0 GHz, 2 tone,  +60  dBm 5 MHz spicing Switch Control Current n Icont No RF input  0.2 20 A I Switch Control Speed I tSW 50% CTL to 90/10% RF  50 500 ns D - Notes 1. DC blockping capacitors = 10 000 pF at f = 0.01 to 0.05 GHz 2. DC blocking capacitors = 1 000 pF at f = 0.05 to 0.5 GHz 3. Pin (0o.1 dB) is measured the input power level when the insertion loss increases more 0.1 dB than that of linear range. r 4. Pin (1 dB) is measured the input power level when the insertion loss increases more 1 dB than that of D linear range. Caution This device is used it is necessary to use DC blocking capacitors. The value of DC blocking capacitors should be chosen to accommodate the frequency of operation, bandwidth, switching speed and the condition with actual board of your system. The range of recommended DC blocking capacitor value is less than 56 pF. 3 Data Sheet PG10746EJ01V0DS

PG2406TK ELECTRICAL CHARACTERISTICS D (TA = +25C, Vcont (H) = 1.8 V, Vcont (L) = 0 V, DC blocking capacitors = 56 pF, unless otherwise specified) 6 Parameter Symbol Test Conditions MINE. TYP. MAX. Unit Insertion Loss 7 Lins7 f = 0.01 to 0.05 GHz Note 1  0.40  M dB Insertion Loss 8 Lins8 f = 0.05 to 0.5 GHz Note 2  0.40 0.46 dB 6 Insertion Loss 9 Lins9 f = 0.5 to 1.0 GHz U 0.40 0.47 dB Insertion Loss 10 Lins10 f = 1.0 to 2.0 GHz  0.460 0.52 dB Insertion Loss 11 Lins11 f = 2.0 to 2.5 GHz  0.48 0.57 dB 4 Insertion Loss 12 Lins12 f = 2.5 to 3.0 GHz  0.54 0.62 dB N Isolation 7 ISL7 f = 0.01 to 0.05 GHz Note 1  227  dB Isolation 8 ISL8 f = 0.05 to 0.5 GHz Note 2 23 27  dB G Isolation 9 ISL9 f = 0.5 to 1.0 GHz 23 27  dB Isolation 10 ISL10 f = 1.0 to 2.0I GHz C16 19  dB Isolation 11 ISL11 f = 2.0 toT 2.5 GHz 14 17  dB Isolation 12 ISL12 f = 2.5 to 3.0 GHz 14 17  dB : Input Return Loss 4 RLin4 f = 0.01 to 0.05 GHz Note 1 t  20  dB n Input Return Loss 5 RLin5 Nf = 0.05 to 0.5 GHz Note 2 15 20  dB Input Return Loss 6 RLin6 f = 0.5 to 3.0 GHz e 15 20  dB Output Return Loss 4 RLout4 f = 0.01 to 0.05 GmHz Note 1  20  dB Output Return Loss 5 ORLout5 f = 0.05 to 0.5 GHz Note 2 15 20  dB Output Return Loss 6 RLout6 f = 0.5 to 3e.0 GHz 15 20  dB 0.1 dB Loss Compression Pin (0.1 dB) f = 2.0c/2.5 GHz +19.0 +22.0  dBm Input Power Note 3 f = 0.5 to 3.0 GHz  +22.0  dBm a C 1 dB Loss Compression Pin (1 dB) f = 0.5 to 3.0 GHz  +25.0  dBm l Input Power Note 4 p Switch Control Current Icont No RF input  0.2 20 A e Switch ControlS Speed tSW 50% CTL to 90/10% RF  50 500 ns R Notes 1. DC blocking capacitors = 10 000 pF at f = 0.01 to 0.05 GHz 2. DC blocking capnacitors = 1 000 pF at f = 0.05 to 0.5 GHz I 3. Pin (0.1 dB) is measured the input power level when the insertion loss increases more 0.1 dB than that of I D linear rang-e. 4. Pin (1 dB) ips measured the input power level when the insertion loss increases more 1 dB than that of linear range. o Caution This device is used it is necessary to use DC blocking capacitors. r The value of DC blocking capacitors should be chosen to accommodate the frequency of D operation, bandwidth, switching speed and the condition with actual board of your system. The range of recommended DC blocking capacitor value is less than 56 pF. 4 Data Sheet PG10746EJ01V0DS

PG2406TK EVALUATION CIRCUIT D 6 E M 6 U 0 4 N 2 G Note C1 : 0.01 to 0.05 GHz 10 000 pF : 0.05 to 0.5 GHz 1 000 pF I C : 0.5 to 3.0 GHz 56 pF T C2 : 1 000 pF The application circuits and their parameters are for reference only a:nd are not intended for use in actual design-ins. t N n APPLICATION INFORMATION e m O e c a C • LESD provides a means to increase the ESD protection on a specific RF port, typically the port attached to the l antenna. p • The value may be tailored to provide specific electrical responses. • The RF ground connections shoueld be kept as short as possible and connected to directly to a good RF ground S for best performance. R n I I D - p o r D 5 Data Sheet PG10746EJ01V0DS

PG2406TK ILLUSTRATION OF THE TEST CIRCUIT ASSEMBLED ON EVALUATION BOADRD 6 E M 6 U 0 4 N 2 G I C T : t n N e m O e c a C l p e USING THE EVALUATION BOARD S R Symbol Test Conditions Values C1 f = 0.01 to 0.05 GH z 10 000 pF n If = 0.05 to 0.5 GHz 1 000 pF I D f = 0.5 to 3-.0 GHz 56 pF C2 p 1 000 pF o r D 6 Data Sheet PG10746EJ01V0DS

PG2406TK TYPICAL CHARACTERISTICS (TA = +25C, DC blocking capacitors = 56 pF, unless othDerwise specified) 6 E M 6 U 0 4 N 2 G I C T : t n N e m O e c a C l p e S R n I I D - p o r D Remark The graphs indicate nominal characteristics. 7 Data Sheet PG10746EJ01V0DS

PG2406TK D 6 E M 6 U 0 4 N 2 G I C T : t n N e m O e c a C l p e S R n I I D - p o r D Remark The graphs indicate nominal characteristics. 8 Data Sheet PG10746EJ01V0DS

PG2406TK MOUNTING PAD LAYOUT DIMENSIONS D 6-PIN LEAD-LESS MINIMOLD (1511 PKG) (UNIT: mm) 6 E M 6 U 0 4 N 2 G I C Remark The mounting pad layout in this document is for reference only. T : t n N e m O e c a C l p e S R n I I D - p o r D 9 Data Sheet PG10746EJ01V0DS

PG2406TK PACKAGE DIMENSIONS D 6-PIN LEAD-LESS MINIMOLD (1511 PKG) (UNIT: mm) 6 E M 6 U 0 4 N 2 G I C T : t n N e m O e c a C l p e S R n I I D - p o r D 10 Data Sheet PG10746EJ01V0DS

PG2406TK RECOMMENDED SOLDERING CONDITIONS D This product should be soldered and mounted under the following recommended conditions. For soldering methods and conditions other than those recommended below, contact your nearby sales office. 6 Soldering Method Soldering Conditions E Condition Symbol M Infrared Reflow Peak temperature (package surface temperature) : 260C or below IR260 Time at peak temperature : 10 seconds or less Time at temperature of 220C or higher : 60 seconds or less 6 Preheating time at 120 to 180C :U 12030 seconds Maximum number of reflow processes : 3 times 0 Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below Wave Soldering Peak temperature (molten solder temperature) : 260C or below 4 WS260 Time at peak temperature N: 10 seconds or less Preheating temperature (package surface temperature) : 120C or belo2w Maximum number of flow processes : 1 time G Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below Partial Heating Peak temperature (terminal temperature) : 350C or below HS350 I C Soldering time (per side of device) : 3 seconds or less Maximum chlorine content of rosTin flux (% mass) : 0.2%(Wt.) or below : Caution Do not use different soldering methods together (except for partial heating). t n N e m O e c a C l p e S R n I I D - p o r D 11 Data Sheet PG10746EJ01V0DS

PG2406TK This product uses gallium arsenide (GaAs). D Caution GaAs Products GaAs vapor and powder are hazardous to human health if inhaled or ingested, so please observe the following points. • Follow related laws and ordinances when disposing of the product. If there are no applicable laws 6 and/or ordinances, dispose of the product as recommended below. E 1. Commission a disposal company able to (with a license to) collect, transport and dispose of M materials that contain arsenic and other such industrial waste materials. 2. Exclude the product from general industrial waste and household garbage, and ensure that the product is controlled (as industrial waste subject to special control) up until final d6isposal. U • Do not burn, destroy, cut, crush, or chemically dissolve the product. 0 • Do not lick the product or in any way allow it to enter the mouth. 4 N 2 G I C T : t n N e m O e c a C l p e S R n I I D - p o r D 12 Data Sheet PG10746EJ01V0DS

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