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  • 型号: UPG2009TB-E3-A
  • 制造商: CEL
  • 库位|库存: xxxx|xxxx
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UPG2009TB-E3-A产品简介:

ICGOO电子元器件商城为您提供UPG2009TB-E3-A由CEL设计生产,在icgoo商城现货销售,并且可以通过原厂、代理商等渠道进行代购。 UPG2009TB-E3-A价格参考¥询价-¥询价。CELUPG2009TB-E3-A封装/规格:RF 开关, RF Switch IC Bluetooth, WLAN SPDT 2.5GHz 50Ohm 6-SuperMiniMold。您可以下载UPG2009TB-E3-A参考资料、Datasheet数据手册功能说明书,资料中有UPG2009TB-E3-A 详细功能的应用电路图电压和使用方法及教程。

产品参数 图文手册 常见问题
参数 数值
产品目录

射频/IF 和 RFID

描述

IC SWITCH SPDT 6-SMINIRF 开关 IC L S Band SPDT Switch

产品分类

RF 开关

IIP3

-

品牌

CEL

产品手册

点击此处下载产品Datasheet

产品图片

rohs

符合RoHS无铅 / 符合限制有害物质指令(RoHS)规范要求

产品系列

RF集成电路,RF 开关 IC,CEL UPG2009TB-E3-A-

数据手册

点击此处下载产品Datasheet

P1dB

-

产品型号

UPG2009TB-E3-A

RF类型

Bluetooth,WLAN

产品目录页面

点击此处下载产品Datasheet

产品种类

RF 开关 IC

介入损耗

0.45 dB

供应商器件封装

6-SuperMiniMold

关闭隔离—典型值

28 dB

其它名称

UPG2009TB-ATR
UPG2009TB-ATR-ND
UPG2009TB-E3-A-ND
UPG2009TB-E3-ATR
UPG2009TBE3A

包装

带卷 (TR)

商标

CEL

安装风格

SMD/SMT

封装

Reel

封装/外壳

6-TSSOP,SC-88,SOT-363

封装/箱体

MiniMold-6

工作温度

-45°C ~ 85°C

工厂包装数量

3000

带宽

500 MHz to 2500 MHz

开关数量

Single

开关配置

SPDT

拓扑

反射

插损@频率

0.4dB @ 2.5GHz

最大功率耗散

0.15 W

最大工作温度

+ 85 C

最小工作温度

- 45 C

标准包装

3,000

特性

-

电压-电源

2.7 V ~ 3 V

电源电压-最大

3 V

电源电压-最小

2.7 V

电路

SPDT

阻抗

50 欧姆

隔离@频率

25dB @ 2.5GHz (标准)

频率

500 MHz to 2.5 GHz

频率 -上

2.5GHz

频率 -下

500MHz

高控制电压

3 V

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PDF Datasheet 数据手册内容提取

DATA SHEET GaAs INTEGRATED CIRCUIT μ PG2009TB T L-BAND HIGH POWER SPDT SWITCH U DESCRIPTION The μPG2009TB is an L-band SPDT (Single Pole Double Throw) GaAs FET switch which was developed for digital O cellular or cordless telephone application. The device can operate from 500 MHz to 2.5 GHz, having the low insertion loss and high isolation by 2.8 V control voltage. FEATURES g • Low insertion loss : LINS = 0.25 dB TYP. @ Vcont1/2- = 2.8 V/0 V, f = 1.0 GHz n LINS = 0.30 dB TYP. @ Vcont1/2 = 2.8 V/0 V, f = 2.0 GHz i • High isolation : ISL = 28 dB TYP. @ VconEt1/2 = 2.8 V/0 V, f = 2.0 GHz p • High power : Pin (0.1dB) = 34 dBm TYP. @ Vcont1/2 = 2.8 V/0 V, f = 1.0 GHz : p t • 6-pin super minimold package (2.0 × 1.25 × 0.9 mm) n a e M APPLICATION S m • L-band digital cellular or cordless telephone n • BuletoothTM, W-LAN and WLL applications e i c P A ORDERING INFORMATION a h l p Part Number Package Marking Suppltying Form e i μPG2009TB-E3 6-pin super minimold G2U •Embossed tape 8 mm wide w H •Pin 1, 2, 3R face the perforation side of the tape •Qty 3 k pcs/reel 2 n M I Remark To order evaluation samples, contact your nearby sales office. - Part number for sample order: μPG2009TBp-A 9 P o 0 r 4 D 2 G C Caution Observe precautions when handling because these devices are sensitive to electrostatic discharge. The information in this document is subject to change without notice. Before using this document, please confirm that this is the latestversion. Document No. PG10191EJ02V0DS (2nd edition) The mark shows major revised points. Date Published July 2004 CP(K)

μPG2009TB PIN CONNECTIONS Pin No. Pin Name (Top View) (Bottom View) 1 OUT1 T 3 U 4 4 3 2 GND 2 3 OUT2 2 5 5 2 G 4 Vcont2 U 1 6 6 1 5 IN g 6 Vcont1 n ABSOLUTE MAXIMUM RATINGS (TA = +25°C, unless otOherwise specified) i p Parameter Symbol Ratings Unit p Control Voltage 1, 2 Vcont1, 2 −6.0 to +6.0 Note V : t Input Power Pin -+36 dBm n a Total Power Dissipation Ptot 0.15 W M e Operating Ambient Temperature TA E−45 to +85 °C Storage Temperature Tstg −55 to +150 °C m n Note ⏐Vcont1-Vcont2⏐ ≤ 6.0 V e i S P c RECOMMENDED OPERATING RENGE (TA = +25°C) a h Parameter Symbol MIN. TYP. lMAX. Unit t A p Control Voltage (High) Vcont(H) +2.7 +2.8 +3.0 V i w Control Voltage (Low) Vcont(L) −0.2 e0 +0.2 V R 2 H n M I - 9 P p 0 o 4 r 2 D G C 2 Data Sheet PG10191EJ02V0DS

μPG2009TB ELECTRICAL CHARACTERISTICS (TA = +25°C, Vcont1 = 2.8 V, Vcont2 = 0 V or Vcont1 = 0 V, Vcont2 = 2.8 V, ZO = 50 Ω, Off chip DC blocking capacitors value; 56 pF, unless otherwise specified) T Parameter Symbol Test Conditions MIN. TYP. MAX. Unit Insertion Loss LINS f = 0.5 to 1.0 GHz − 0.25 0.45 dB f = 2.0 GHz − 0.30 0.50 dB U f = 2.5 GHz − 0.40 − dB g Isolation ISL f = 0.5 to 2.0 GHz 24 28 − dB n f = 2.5 GHz − 25 − dB Input Return Loss RLin f = 0.5 to 2.5 GHz O 15 20 − dBi p Output Return Loss RLout f = 0.5 to 2.5 GHz 15 20 − dB Input Power at 0.1 dB Pin(0.1 dB) f = 1.0 GHz, 32.5 : 34 − pdBm Compression Point Note Vcont = 2.8 V/0 V t a n 2nd Harmonics 2f0 f = 1.0 GHz-, Vcont = 2.8 V/0 V, 65 75 M− dBc Pin = 30.5 dBm e E 3rd Harmonics 3f0 f = 1.0 GHz, Vcont = 2.8 V/0 V, m 65 75 − dBc n Pin = 30.5 dBm Switching Speed tSW e − i150 − ns P Control Current IconSt Vcont = 2.8 V/0 V, RF Nonc − 1 50 μA a h Note Pin(0.1 dB) are measured the input power level when thle insertion loss intcrease more 0.1 than that of linear range. All other characteristics are measured in linpear range. A i w e Caution When the μPG2009TB is used it is necessary to use DC blocking capacitors for No.1 (OUT1), No.3 (OUT2) and No.5 (IN). The value of DRC blocking capac itors should be chosen to accommodate the 2 frequency of operation, bandwidth, switching speed and the condition with actual board of your H system. n M The range of recommended DC blocking capacitor value is less than 100 pF. I - 9 p P 0 o 4 r 2 D G C Data Sheet PG10191EJ02V0DS 3

μPG2009TB EVALUATION CIRCUIT Vcont1 = 2.8 V, Vcont2 = 0 V or Vcont2 = 0 V, Vcont1 = 2.8 V, off chip DC blocking capacitors value C1 = 56 pF, C2 = 1 000 pF (Bypass), using the standard evaluation board. T C2 C1 Vcont1 6 G 1 U OUT1 2 IN 5 2 C1 U O Vcont2 4 3 OUT2 C1 C2 EVALUATION BOARD - Vcont1 E 6pin SMM SPDT SW S OUT1 A C2 C1 G IN 2U C1 C1 H C2 OUT2 P Vcont2 TRUTH TABLE Vcont1 Vcont2 IN−OUT1 IN−OUT2 Low High OFF ON High Low ON OFF 4 Data Sheet PG10191EJ02V0DS

μPG2009TB TYPICAL CHARACTERISTICS (TA = +25°C, Vcont1/2 = 2.8 V/0 V, Pin = 0 dBm, OUT2 side is 50 Ω termination, unless otherwise specified) INPUT RETURN LOSS vs. FREQUENCY ISOLATION vs. FEQUENCY CH1S11 log MAG 10 dB/ REF 0 dB CH1S21 log MAG T10 dB/ REF 0 dB 1: –25.43 dB 1: –28.787 dB 1.0 GHz 1.0 GHz 2: –30.339 dB 2: –28.871 dB B) 1.5 GHz 1.5 GHz d 3: –30.025 dB 3: –27.75 dB RL (in 4: –232.8.01 2G dHBz dB) U 4: –242.9.00 2G dHBz ss 5: –172.8.55 G dHBz SL ( 5: –212.5.58 2G dHBz n Lo 0 3.0 GHz on I 0 3.0 GHz ut Retur–20 1 5 IsolatiO–20 1 p 5 n 4 4 I 2 3 2 3 –40 –40 START 0.500 000 000 GHz STOP 3.000 000 000 GHz START 0.500 000 000 GHz STOP 3.000 000 000 GHz Frequency f (GHz) - Frequency f (GHz) INSERTION LOSS vs. FREQUENCYE OUTPUT RETERN LOSS vs. FREQUENCY CH1S21 log MAG 1 dB/ REF 0 dB CH1S22 log MAG 10 dB/ REF 0 dB 1: –0.620 dB 1: –25.992 dB 1.0 GHz 1.0 GHz 2: –0.744 dB B) 2: –31.882 dB 1.5 GHz d 1.5 GHz (dB)S 34::S ––012..80.085 17G ddHBBz RL (out 34:: ––32252..40.068 7G ddHBBz LIN 2.5 GHz s 2.5 GHz Loss 0 1 5: –13.3.00 2G dHBz n Los 0 5: –183.1.04 5G dHBz n ur nsertio–2.0 2 A3 4 5 put Ret–20 1 5 I ut 4 O –4.0 –40 2 3 START 0.500 000 H000 GHz STOP 3.000 000 000 GHz START 0.500 000 000 GHz STOP 3.000 000 000 GHz Frequency f (GHz) Frequency f (GHz) Caution These characteristics values include the losses of the evaluation board. P Remark The graphs indicate nominal characteristics. Data Sheet PG10191EJ02V0DS 5

μPG2009TB TYPICAL CHARACTERISTICS (f = 2 GHz, OUT2 side is 50 Ω termination, unless otherwise specified) RELATION BETWEEN CONTROL VOLTAGE OF INSERSION LOSS T 0 0.1 dB) 0.2 U (S 0.3 N LI s 0.4 s o L n 0.5 o ersi 0.6 O s In 0.7 Vcont = 2.4 V 0.8 Vcont = 2.8 V Vcont = 3.2 V 0.9 25 26 27 28 29 30 31 32 33 34 35 36 37 - Input Power Pin (dBm) RELATION BETWEEN CONTROLE RELATION BETWEEN CONTROL VOLTAGE OF 2nd HARMONICS VOLTAGE OF 3rd HARMONICS 0 0 Vcont = 2.4 V Vcont = 2.4 V 10 Vcont = 2.8 V 10 Vcont = 2.8 V Bc) 20 SVcont = 3.2 V Bc) 20 Vcont = 3.2 V d d 0 ( 30 0 ( 30 2f 3f nics 40 nics 40 mo 50 A mo 50 Har 60 Har 60 d d 2n 70 3r 70 80 80 90 H 90 25 26 27 28 29 30 31 32 33 34 35 36 37 25 26 27 28 29 30 31 32 33 34 35 36 37 Input Power Pin (dBm) Input Power Pin (dBm) Remark The graphs indicate nominal characteristics. P 6 Data Sheet PG10191EJ02V0DS

μPG2009TB PACKAGE DIMENSIONS 6-PIN SUPER MINIMOLD (UNIT: mm) T 2.1±0.1 1.25±0.1 U+0.1 2–0.05 5 0. 2 6 0. 0. ± 3 0 1. 2. 65 0. O 0.1 MIN. 0.1 - 0.9± 0.7 E +0.1 5–0.05 1 1 0. 0. o 0 t S A H P Data Sheet PG10191EJ02V0DS 7

μPG2009TB RECOMMENDED SOLDERING CONDITIONS This product should be soldered and mounted under the following recommended conditions. For soldering methods and conditions other than those recommended below, contact your nearby sales office. T Soldering Method Soldering Conditions Condition Symbol Infrared Reflow Peak temperature (package surface temperature) : 260°C or below IR260 Time at peak temperature : 10 seconds or less Time at temperature of 220°C or higher : 60 seconds or less U Preheating time at 120 to 180°C : 120±30 seconds Maximum number of reflow processes : 3 times Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below VPS Peak temperature (package surface temperature) : 215°C or below VP215 Time at temperature of 200°C or higher O: 25 to 40 seconds Preheating time at 120 to 150°C : 30 to 60 seconds Maximum number of reflow processes : 3 times Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below Wave Soldering Peak temperature (molten solder temperature) : 260°C or below WS260 - Time at peak temperature : 10 seconds or less Preheating temperature (package surface temperature) : 120°C or below Maximum number of flow prEocesses : 1 time Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below Partial Heating Peak temperature (pin temperature) : 350°C or below HS350 Soldering time (per side of device) : 3 seconds or less Maximum chlorinSe content of rosin flux (% mass) : 0.2%(Wt.) or below Caution Do not use different soldering methods together (except for partial heating). A H P 8 Data Sheet PG10191EJ02V0DS

μPG2009TB SAFETY INFORMATION ON THIS PRODUCT The product contains gallium arsenide, GaAs. Caution GaAs Products GaAs vapor and powder are hazardous to human health if inhaled or ingested. • Do not destroy or burn the product. • Do not cut or cleave off any part of the product. T • Do not crush or chemically dissolve the product. • Do not put the product in the mouth. Follow related laws and ordinances for disposal. The product should be excluded from general industrial waste or household garbage. U O - E S A H P

NOTICE 1. Descriptions of circuits, software and other related information in this document are provided only to illustrate the operation of semiconductor products and application examples. You are fully responsible for the incorporation of these circuits, software, and information in the design of your equipment. California Eastern Laboratories and Renesas Electronics assumes no responsibility for any losses incurred by you or third parties arising from the use of these circuits, software, or information. T 2. California Eastern Laboratories has used reasonable care in preparing the information included in this document, but California Eastern Laboratories does not warrant that such information is error free. California Eastern Laboratories and Renesas Electronics assumes no liability whatsoever for any damages incurred by you resulting from errors in or omissions from the information included herein. 3. California Eastern Laboratories and Renesas Electronics do not assume any liability for infringement of patents, copyrights, or other intellectual property rights of third parties by or arising from the use of Renesas Electronics products or technical information described in this document. No license, express, U implied or otherwise, is granted hereby under any patents, copyrights or other intellectual property rights of California Eastern Laboratories or Renesas Electronics or others. 4. You should not alter, modify, copy, or otherwise misappropriate any Renesas Electronics product, whether in whole or in part. California Eastern Laboratories and Renesas Electronics assume no responsibility for any losses incurred by you or third parties arising from such alteration, modification, copy or otherwise misappropriation of Renesas Electronics product. 5. Renesas Electronics products are classified according to the following two quality grades: “Standard” and “High Quality”. The recommended applications O for each Renesas Electronics product depends on the product’s quality grade, as indicated below. “Standard”: Computers; office equipment; communications equipment; test and measurement equipment; audio and visual equipment; home electronic appliances; machine tools; personal electronic equipment; and industrial robots etc. “High Quality”: Transportation equipment (automobiles, trains, ships, etc.); traffic control systems; anti-disaster systems; anti-crime systems; and safety equipment etc. Renesas Electronics products are neither intended nor authorized for use in products or systems that may pose a direct threat to human life or bodily injury (artificial life support devices or systems, surgical implantations etc.), or may cause serious property damages (nuclear reactor control systems, military equipment etc.). You must check the quality grade of each Renesas Electronics product before using it in a particular application. You may not use any Renesas Electronics product for any a-pplication for which it is not intended. California Eastern Laboratories and Renesas Electronics shall not be in any way liable for any damages or losses incurred by you or third parties arising from the use of any Renesas Electronics product for which the product is not intended by California Eastern Laboratories or Renesas Electronics. 6. You should use the Renesas Electronics products described in thisE document within the range specified by California Eastern Laboratories, especially with respect to the maximum rating, operating supply voltage range, movement power voltage range, heat radiation characteristics, installation and other product characteristics. California Eastern Laboratories shall have no liability for malfunctions or damages arising out of the use of Renesas Electronics products beyond such specified ranges. 7. 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Please contact a California Eastern Laboratories sales office for details as to environmental matters such as the environmental compatibility of each Renesas Electronics product. Please use Renesas Electronics products in compliance with all applicable laws and regulations that regulate the inclusion or use of A controlled substances, including without limitation, the EU RoHS Directive. California Eastern Laboratories and Renesas Electronics assume no liability for damages or losses occurring as a result of your noncompliance with applicable laws and regulations. 9. Renesas Electronics products and technology may not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable domestic or foreign laws or regulations. You should not use Renesas Electronics products or technology described in this document for any purpose relating to military applications or use by the military, including but not limited to the development of weapons of mass destruction. When exporting the Renesas Electronics products or technology described in this document, you should comply with the applicable export control laws and H regulations and follow the procedures required by such laws and regulations. 10. It is the responsibility of the buyer or distributor of California Eastern Laboratories, who distributes, disposes of, or otherwise places the Renesas Electronics product with a third party, to notify such third party in advance of the contents and conditions set forth in this document, California Eastern Laboratories and Renesas Electronics assume no responsibility for any losses incurred by you or third parties as a result of unauthorized use of Renesas Electronics products. 11. 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