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  • 型号: SMD291AX250T3
  • 制造商: Chipquik
  • 库位|库存: xxxx|xxxx
  • 要求:
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SMD291AX250T3产品简介:

ICGOO电子元器件商城为您提供SMD291AX250T3由Chipquik设计生产,在icgoo商城现货销售,并且可以通过原厂、代理商等渠道进行代购。 SMD291AX250T3价格参考。ChipquikSMD291AX250T3封装/规格:焊接, Leaded No-Clean Solder Paste Sn63Pb37 (63/37) Jar, 8.8 oz (250g)。您可以下载SMD291AX250T3参考资料、Datasheet数据手册功能说明书,资料中有SMD291AX250T3 详细功能的应用电路图电压和使用方法及教程。

产品参数 图文手册 常见问题
参数 数值
产品目录

焊接,拆焊,返修产品

描述

SOLDER PASTE SN63/PB37 250G焊料 SODR PASTE W/LD (T3) 63n/37b 250g JAR NC

产品分类

焊接

品牌

Chip Quik Inc

产品手册

产品图片

rohs

否含铅 / 不符合限制有害物质指令(RoHS)规范要求

产品系列

焊接,焊料,Chip Quik SMD291AX250T3CHIPQUIK®

mouser_ship_limit

该产品可能需要其他文件才能进口到中国。

MSDS材料安全数据表

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数据手册

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产品型号

SMD291AX250T3

产品

Flux

产品种类

焊料

发货信息

发货时随带冷包。 要确保客户满意和产品完好,建议采用空运发货方式。

商标

Chip Quik

工厂包装数量

3

工艺

有引线

形式

广口瓶装,250g(9 盎司)

成分

Sn63Pb37(63/37)

标准包装

1

核心尺寸

-

焊剂类型

免清洁

熔点

-

直径

-

类型

焊膏

线规

-

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PDF Datasheet 数据手册内容提取

SSMMDD229911AAXX225500TT33 Datasheet revision 1.4 www.chipquik.com Solder Paste No-Clean Sn63/Pb37 in Jar 250g T3 Mesh Product Highlights Printing speeds up to 100mm/sec Excellent wetting compatibility on most board finishes Long stencil life Print grade Wide process window Compatible with enclosed print heads Clear residue Passes BONO test Low voiding Specifications Alloy: Sn63/Pb37 Mesh Size: T3 Micron (µm) Range: 25-45 Flux Type: Synthetic No-Clean Flux Classification: REL0 Metal Load: 90.25% Metal by Weight Melting Point: 183°C (361°F) Packaging: Jar 250g Shelf Life: Refrigerated >12 months, Unrefrigerated >6 months *See notes below: *Shelf Life Notes: Chip Quik® solder paste is good past its quoted shelf life, regardless of refrigeration. Before use, visually inspect the solder paste to ensure it is not dried out or clumpy, or check stencil release. If stored in a jar, stir the product thoroughly for 2-3 minutes before inspection and use. Chip Quik® solder paste is manufactured using Made in USA high quality synthetic flux and precision atomized metal powder. Chip Quik® solder paste is guaranteed for 12 months from date of manufacture, regardless of refrigeration. If you have any issues with our solder paste, please contact Chip Quik® directly for no charge warranty replacement. Please retain original bill of sale, and solder paste in original container as we may request its return for internal R&D testing purposes. Printer Operation Print Speed: 25-100mm/sec Squeegee Pressure: 70-250g/cm of blade Under Stencil Wipe: Once every 10-25 prints, or as necessary Stencil Life >8 hours @ 20-50% RH 22-28°C (72-82°F) >4 hours @ 50-70% RH 22-28°C (72-82°F) Stencil Cleaning Automated stencil cleaning systems for both stencil and misprinted boards. Manual cleaning using isopropyl alcohol (IPA). Storage and Handling Refrigerate at 3-8°C (37-46°F). Do not freeze. Allow 4 hours for solder paste to reach an operating temperature of 20-25°C (68-77°F) before use. Transportation This product has no shipping restrictions. Shipping below 0°C (32°F) or above 25°C (77°F) for normal transit times by ground or air will not impact this product’s stated shelf life. 1 © 1994-2018 Chip Quik® Inc.

Recommended Profile Reflow profile for Sn63/Pb37 solder assembly, designed as a starting point for process optimization. 235°C (455°F) 183°C (361°F) 150°C (300°F) Temperature 100°C (200°F) 25°C (77°F) 0sec 30sec 120sec 150sec 210sec 240sec Time Test Results Test J-STD-004 or other Test Requirement Result requirements as stated Copper Mirror IPC-TM-650: 2.3.32 L: No breakthrough Corrosion IPC-TM-650: 2.6.15 L: No corrosion Quantitative Halides IPC-TM-650: 2.3.28.1 L: <0.5% Electrochemical Migration IPC-TM-650: 2.6.14.1 L: <1 decade drop (No-clean) Surface Insulation Resistance 85°C, IPC-TM-650: 2.6.3.7 L: ≥100MΩ (No-clean) 85% RH @ 168 Hours Tack Value IPC-TM-650: 2.4.44 44g Viscosity – Malcom @ 10 RPM/25°C IPC-TM-650: 2.4.34.4 Print: 210-300, Dispense: 100-140 (x103mPa/s) Visual IPC-TM-650: 3.4.2.5 Clear and free from precipitation Conflict Minerals Compliance Electronic Industry Citizenship Compliant Coalition (EICC) REACH Compliance Articles 33 and 67 of Regulation (EC) Contains Lead (Pb) CAS# 7439-92-1 No 1907/2006 No other SVHC present Conforms to the following Industry Standards: J-STD-004B, Amendment 1 (Solder Fluxes): Yes J-STD-005A (Solder Pastes): Yes J-STD-006C, Amendments 1 & 2 (Solder Alloys and Fluxed/Non-Fluxed Solders): Yes RoHS 2 Directive 2011/65/EU: No 2 © 1994-2018 Chip Quik® Inc.

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