Product Sample & Technical Tools & Support & Folder Buy Documents Software Community SN65220,SN65240,SN75240 SLLS266H–FEBRUARY1997–REVISEDMAY2015 SNx52x0 USB Port Transient Suppressors 1 Features 3 Description • DesigntoProtectSubmicron3-Vor5-V The SN65220 device is a dual, and the SN65240 and 1 SN75240 devices are quadruple, unidirectional CircuitsfromNoiseTransients transient voltage suppressors (TVS). These devices • PortESDProtectionCapabilityExceeds: provide electrical noise transient protection to – 15-kVHumanBodyModel Universal Serial Bus (USB) low and full-speed ports. – 2-kVMachineModel The input capacitance of 35 pF makes it unsuitable forhigh-speedUSB2.0applications. • AvailableinaWCSPChip-ScalePackage Any cabled I/O can be subjected to electrical noise • Stand-OffVoltage:6V(Min) transients from various sources. These noise • LowCurrentLeakage:1-µAMaxat6V transients can cause damage to the USB transceiver • LowCapacitance:35-pF(Typ) and/or the USB ASIC if they are of sufficient magnitudeandduration. 2 Applications The ESD performance of the SN65220, SN65240, • USBFull-SpeedHost,HUB,orPeripheral and SN75240 devices is measured at the system level, according to IEC61000-4-2. However, system • Ports design impacts the results of these tests. To accomplish a high compliance level requires careful boarddesignandlayouttechniques. DeviceInformation(1) PARTNUMBER PACKAGE BODYSIZE(NOM) SOT-23(6) 2.90mm×1.60mm SN65220 DSBGA(4) 0.925mm×0.925mm SN65240 PDIP(8) 9.09mm×6.35mm SN75240 TSSOP(8) 3.00mm×4.40mm (1) For all available packages, see the orderable addendum at theendofthedatasheet. TVSCurrentvsVoltage 4 Simplified Schematic 7.5 USB 5 Transceiver A 2.5 – 27O nt 0 D+ e A urr -2.5 C 15kO -5 GND SN65220or ½SNx5240 -7.5 15kO -10 B D- -10 -5 0 5 10 15 27O Voltage–V 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectualpropertymattersandotherimportantdisclaimers.PRODUCTIONDATA.

SN65220,SN65240,SN75240 SLLS266H–FEBRUARY1997–REVISEDMAY2015 www.ti.com Table of Contents 1 Features.................................................................. 1 10.2 FunctionalBlockDiagram.......................................6 2 Applications........................................................... 1 10.3 FeatureDescription.................................................7 3 Description............................................................. 1 10.4 DeviceFunctionalModes........................................7 4 SimplifiedSchematic............................................. 1 11 ApplicationandImplementation.......................... 8 11.1 ApplicationInformation............................................8 5 RevisionHistory..................................................... 2 11.2 TypicalApplication .................................................8 6 DeviceComparisonTable..................................... 3 12 PowerSupplyRecommendations..................... 10 7 PinConfigurationandFunctions......................... 3 13 Layout................................................................... 10 8 Specifications......................................................... 4 13.1 LayoutGuidelines.................................................10 8.1 AbsoluteMaximumRatings......................................4 13.2 LayoutExample....................................................10 8.2 ESDRatings..............................................................4 14 DeviceandDocumentationSupport................. 11 8.3 RecommendedOperatingConditions.......................4 14.1 RelatedLinks........................................................11 8.4 ThermalInformation..................................................4 14.2 CommunityResources..........................................11 8.5 ElectricalCharacteristics...........................................4 14.3 Trademarks...........................................................11 8.6 TypicalCharacteristics..............................................5 14.4 ElectrostaticDischargeCaution............................11 9 ParameterMeasurementInformation..................5 14.5 Glossary................................................................11 10 DetailedDescription............................................. 6 15 Mechanical,Packaging,andOrderable 10.1 Overview.................................................................6 Information........................................................... 11 5 Revision History ChangesfromRevisionG(August2008)toRevisionH Page • AddedPinConfigurationandFunctionssection,ESDtable,ThermalInformationtable,FeatureDescriptionsection, DeviceFunctionalModes,ApplicationandImplementationsection,PowerSupplyRecommendationssection, Layoutsection,DeviceandDocumentationSupportsection,andMechanical,Packaging,andOrderableInformation section ................................................................................................................................................................................... 1 2 SubmitDocumentationFeedback Copyright©1997–2015,TexasInstrumentsIncorporated ProductFolderLinks:SN65220 SN65240 SN75240

SN65220,SN65240,SN75240 www.ti.com SLLS266H–FEBRUARY1997–REVISEDMAY2015 6 Device Comparison Table PRODUCT SUPPRESSORS T -RANGE PACKAGE A WCSP-4 SN65220 1 –40°Cto85°C SOT23-6 DIP-8 SN65240 2 –40°Cto85°C TSSOP-8 DIP-8 SN75240 2 0°Cto70°C TSSOP-8 7 Pin Configuration and Functions DBVPackage 6-PinSOT-23 TopView NC 1 6 A S GND 2 A5 GND D I NC 3 4 B YZBPackage 4-PinDSBGA TopView A A1 A2 GND B B1 B2 GND P,PWPackages 8-PinPDIP,TSSOP TopView GND 1 8 A C 2 7 GND GND 3 6 B D 4 5 GND PinFunctions PIN TYPE DESCRIPTION NAME DBV YZB P,PW A 6 A1 8 Analoginput Transientsuppressorinput-Line1 B 4 B2 6 Analoginput Transientsuppressorinput-Line2 C — — 2 Analoginput Transientsuppressorinput-Line3 D — — 4 Analoginput Transientsuppressorinput-Line4 GND 2,5 A2,B2 1,3,5,7 Power Localdeviceground NC 1,3 — — — Internallynotconnected Copyright©1997–2015,TexasInstrumentsIncorporated SubmitDocumentationFeedback 3 ProductFolderLinks:SN65220 SN65240 SN75240

SN65220,SN65240,SN75240 SLLS266H–FEBRUARY1997–REVISEDMAY2015 www.ti.com 8 Specifications 8.1 Absolute Maximum Ratings overoperatingfree-airtemperaturerange(unlessotherwisenoted)(1) MIN MAX UNIT P Peakpowerdissipation 60 W D(peak) I Peakforwardsurgecurrent 3 A FSM I Peakreversesurgecurrent –9 A RSM T Storagetemperature –65 150 °C stg (1) StressesbeyondthoselistedunderAbsoluteMaximumRatingsmaycausepermanentdamagetothedevice.Thesearestressratings only,andfunctionaloperationofthedeviceattheseoranyotherconditionsbeyondthoseindicatedunderRecommendedOperating Conditionsisnotimplied.Exposuretoabsolute-maximum-ratedconditionsforextendedperiodsmayaffectdevicereliability. 8.2 ESD Ratings VALUE UNIT Humanbodymodel(HBM),perANSI/ESDA/JEDECJS-001,allpins(1) ±15000 V(ESD) Electrostaticdischarge Chargeddevicemodel(CDM),perJEDECspecificationJESD22-C101,all V pins(2) ±2000 (1) JEDECdocumentJEP155statesthat500-VHBMallowssafemanufacturingwithastandardESDcontrolprocess. (2) JEDECdocumentJEP157statesthat250-VCDMallowssafemanufacturingwithastandardESDcontrolprocess. 8.3 Recommended Operating Conditions MIN MAX UNIT SN75240 0 70 T Ambienttemperature °C A SN65220,SN65240 –40 85 8.4 Thermal Information SN65220 SN65240,SN75240 DBV YZB P PW THERMALMETRIC(1) UNIT (SOT-23) (DSBGA) (PDIP) (TSSOP) 6PINS 4BALLS 8PINS R Junction-to-ambientthermalresistance 199.5 170 67.5 185.3 °C/W θJA R Junction-to-case(top)thermalresistance 159.7 1.8 57.9 68.8 °C/W θJC(top) R Junction-to-boardthermalresistance 51.1 43.5 44.5 114.0 °C/W θJB ψ Junction-to-topcharacterizationparameter 41 9.2 36.2 9.9 °C/W JT ψ Junction-to-boardcharacterizationparameter 50.5 43.5 44.5 112.3 °C/W JB (1) Formoreinformationabouttraditionalandnewthermalmetrics,seetheSemiconductorandICPackageThermalMetricsapplication report,SPRA953. 8.5 Electrical Characteristics overrecommendedoperatingconditions(unlessotherwisenoted) PARAMETER TESTCONDITIONS MIN TYP MAX UNIT I Leakagecurrent V =6VatA,B,C,orDterminals 1 µA lkg I V Breakdownvoltage V =1mAatA,B,C,orDterminals 6.5 7 8 V (BR) I C Inputcapacitancetoground V =0.4sin(4E6πt)+0.5V 35 pF IN I 4 SubmitDocumentationFeedback Copyright©1997–2015,TexasInstrumentsIncorporated ProductFolderLinks:SN65220 SN65240 SN75240

SN65220,SN65240,SN75240 www.ti.com SLLS266H–FEBRUARY1997–REVISEDMAY2015 8.6 Typical Characteristics T =25°Cunlessotherwisenoted. A 7.5 5 2.5 A – nt 0 e r r u C -2.5 S V T -5 -7.5 -10 -10 -5 0 5 10 15 TVSVoltage–V Figure1.Transient-Voltage-SuppressorCurrentvsVoltage 9 Parameter Measurement Information ILK VI DUT Figure2. MeasurementofLeakageCurrent II VBR DUT Figure3. MeasurementofBreakdownVoltage Copyright©1997–2015,TexasInstrumentsIncorporated SubmitDocumentationFeedback 5 ProductFolderLinks:SN65220 SN65240 SN75240

SN65220,SN65240,SN75240 SLLS266H–FEBRUARY1997–REVISEDMAY2015 www.ti.com 10 Detailed Description 10.1 Overview The SN65220, SN65240, and SN75240 devices integrate multiple unidirectional transient voltage suppressors (TVS).Figure4showstheequivalentcircuitdiagramofasingleTVSdiode. For positive transient voltages, only the Q1 transistor determines the switching characteristic. When the input voltagereachestheZenervoltage,V ,ZenerdiodeD1conducts;therefore,allowingforthebase-emittervoltage, Z V , to increase. At V = V + V , the transistor starts conducting. From then on, its on-resistance decreases BE IN Z BE linearlywithincreasinginputvoltage. For negative transient voltages, only diode D2 determines the switching characteristic. Here, switching occurs whentheinputvoltageexceedsthediodeforwardvoltage,V . FW 7.5 5 A,B,CorD D1 A 2.5 VFW VZ VBE – 0 Q1 D2 nt re -2.5 R1 ur C -5 Measured GND fromA,B,C -7.5 orDtoGND -10 -10 -5 0 5 10 15 Voltage–V Figure4. TVSStructureandCurrent —VoltageCharacteristic 10.2 Functional Block Diagram SN65240 SN65220 SN75240 A A C GND GND GND GND GND GND B B D 6 SubmitDocumentationFeedback Copyright©1997–2015,TexasInstrumentsIncorporated ProductFolderLinks:SN65220 SN65240 SN75240

SN65220,SN65240,SN75240 www.ti.com SLLS266H–FEBRUARY1997–REVISEDMAY2015 10.3 Feature Description The SN65220, SN65240, and SN75240 family of unidirectional transient voltage suppressors provide transient protection to Universal Serial Bus low and full−speed ports. These TVS diodes provide a minimum breakdown voltage of 6.5V to protect USB transceivers and USB ASICs typically implemented in 3-V or 5-V digital CMOS technology. 10.4 Device Functional Modes TVSdiodespossesstwofunctionalmodes,ahigh-impedanceandaconductingmode. During normal operating conditions, that is in the absence of high voltage transients, the breakdown voltage of TVSdiodesisnotexceededandthedevicesremainhigh-impedance. Inthepresenceofhigh-voltagetransientsthebreakdownvoltageisexceeded.TheTVSdiodesthenconductand become low-impedance. In this mode excessive transient energy is shunted directly to local circuit ground, preventingUSBtransceiversfromelectricaldamage. Copyright©1997–2015,TexasInstrumentsIncorporated SubmitDocumentationFeedback 7 ProductFolderLinks:SN65220 SN65240 SN75240

SN65220,SN65240,SN75240 SLLS266H–FEBRUARY1997–REVISEDMAY2015 www.ti.com 11 Application and Implementation NOTE Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes. Customers should validateandtesttheirdesignimplementationtoconfirmsystemfunctionality. 11.1 Application Information The universal serial bus (USB) has become a popular solution to connect PC peripherals. USB allows devices to be hot-plugged in and out of the existing PC system without rebooting or turning off the PC. Because frequent human interaction with the USB system occurs as a result of its attractive hot-plugging ability, there is the possibility for large ESD strikes and damage to crucial system elements. The ESD protection included on the existing hardware is typically in the 2-kV to 4-kV range for the human body model (HBD) and 200-V to 300-V for the machine model (MM). The ESD voltage levels found in a normal USB operating environment can exceed these levels. The SN75240, SN65240, and SN65220 devices will increase the robustness of the existing USB hardwaretoESDstrikescommontotheenvironmentinwhichUSBislikelytobeused. 11.2 Typical Application Figure 5 illustrates a typical USB system and application of the SN75240, SN65240, and SN65220 devices. Connections to pin A from the D+ data line, pin B from the D– data line, and the device grounds from the GND linethatalreadyexistsarenecessarytoincreasetheamountofESDprotectionprovidedtotheUSBport. The design of the suppressor gives it very low maximum current leakage of 1 μA, a very low typical capacitance of 35 pF, and a standoff voltage minimum of 6 V. Because of these levels, the SN75240, SN65240, and SN65220 devices will provide added protection to the USB system hardware during ESD events without introducingthehighcapacitanceandcurrentleakagelevelstypicalofexternaltransientvoltagesuppressors.The addition of an SN75240, SN65240, or SN65220 device is beneficial to both full-speed and low-speed USB 1.1 bandwidthstandards. USB USB HubPort DownStream Transceiver Transceiver 27O 1.5kO(1) 27O D+ D+ A A 15kO GND SN65220or SN65220or GND ½SNx5240 ½SNx5240 15kO 1.5kO(2) B D- D- B 27O 1)Full-speedonly 27O 2)Low-speedonly Figure5. TypicalApplicationSchematicforESDProtectionofUSBTransceivers 11.2.1 DesignRequirements Forthisdesignexample,usetheparameterslistedinTable1asdesignparameters. Table1.DesignParameters DESIGNPARAMETER EXAMPLEVALUE Minimumbreakdownvoltage(TVS) 6.5V Maximumsupplyvoltage(USBtransceiver) 5.5V Typicaljunctioncapacitance(TVS) 35pF Maximumdatarate(USBtransceiver) 12Mbps 8 SubmitDocumentationFeedback Copyright©1997–2015,TexasInstrumentsIncorporated ProductFolderLinks:SN65220 SN65240 SN75240

SN65220,SN65240,SN75240 www.ti.com SLLS266H–FEBRUARY1997–REVISEDMAY2015 11.2.2 DetailedDesignProcedure To effectively protect USB transceivers, use TVS diodes with breakdown voltages close to 6 V, such as the SN65220,SN65240,orSN75220devices. Because of the TVS junction capacitance of 35 pF, apply these TVS diodes only to USB transceivers with full- speedcapabilitythatis12Mbpsmaximum. Place the TVS diodes as close to the board connector as possible to prevent transient energies from entering furtherboardspace. ConnecttheTVSdiodebetweenthedatalines(D+,D–)andlocalcircuitground(GND). Because noise transient represents high-speed frequencies, ensure low-inductance return paths for the transient currentsbyprovidingasolidgroundplaneandusingtwoVIAsconnectingtheTVSterminalstoground. 11.2.3 ApplicationCurve I pk 90% I pk ) A ( I 10% I pk t r Time Figure6. HBMCurve Copyright©1997–2015,TexasInstrumentsIncorporated SubmitDocumentationFeedback 9 ProductFolderLinks:SN65220 SN65240 SN75240

SN65220,SN65240,SN75240 SLLS266H–FEBRUARY1997–REVISEDMAY2015 www.ti.com 12 Power Supply Recommendations Unlike other semiconductor components that require a supply voltage to operate, the SN65220, SN65240, and SN75240 transient suppressors are combinations of multiple p-n diodes, activated by transient voltages. Therefore,thesetransientsuppressorsdonotrequireexternalvoltagesupplies. 13 Layout 13.1 Layout Guidelines The multiple ground pins provided lower the connection resistance to ground. In order to improve circuit operation, a connection to all ground pins must be provided on the system printed circuit board. Without proper deviceconnectiontoground,thespeedandprotectioncapabilityofthedevicewillbedegraded. • The ground termination pads should be connected directly to a ground plane on the board for optimum performance. A single trace ground conductor will not provide an effective path for fast rise-time transient eventsincludingESDduetoparasiticinductance. • Nominal inductive values of a PCB trace are approximately 20 nH/cm. This value may seem small, but an apparent “short length” of trace may be sufficient to produce significant L(di/dt) effects with fast rise-time ESD spikes. • Mount the TVS as close as possible to the I/O socket to reduce radiation originating from the transient as it is routedtoground. NOTE Direct connective paths of the traces are taken to the suppressor mounting pads to minimize parasitic inductance in the surge-current conductive path, thus minimizing L(di/dt)effects. 13.2 Layout Example VIAtoPowerGroundPlane USB VIAtoPowerSupplyPlane Connector GND USB Transceiver 15kO 27O NC SN65220 A D+ GND GND 27O D- NC B 15kO VBUS Figure7. LayoutExampleofa4-LayerBoardWithSN65220 10 SubmitDocumentationFeedback Copyright©1997–2015,TexasInstrumentsIncorporated ProductFolderLinks:SN65220 SN65240 SN75240

SN65220,SN65240,SN75240 www.ti.com SLLS266H–FEBRUARY1997–REVISEDMAY2015 14 Device and Documentation Support 14.1 Related Links The table below lists quick access links. Categories include technical documents, support and community resources,toolsandsoftware,andquickaccesstosampleorbuy. Table2.RelatedLinks TECHNICAL TOOLS& SUPPORT& PARTS PRODUCTFOLDER SAMPLE&BUY DOCUMENTS SOFTWARE COMMUNITY SN65220 Clickhere Clickhere Clickhere Clickhere Clickhere SN65240 Clickhere Clickhere Clickhere Clickhere Clickhere SN75240 Clickhere Clickhere Clickhere Clickhere Clickhere 14.2 Community Resources The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. TIE2E™OnlineCommunity TI'sEngineer-to-Engineer(E2E)Community.Createdtofostercollaboration amongengineers.Ate2e.ti.com,youcanaskquestions,shareknowledge,exploreideasandhelp solveproblemswithfellowengineers. DesignSupport TI'sDesignSupport QuicklyfindhelpfulE2Eforumsalongwithdesignsupporttoolsand contactinformationfortechnicalsupport. 14.3 Trademarks E2EisatrademarkofTexasInstruments. Allothertrademarksarethepropertyoftheirrespectiveowners. 14.4 Electrostatic Discharge Caution Thesedeviceshavelimitedbuilt-inESDprotection.Theleadsshouldbeshortedtogetherorthedeviceplacedinconductivefoam duringstorageorhandlingtopreventelectrostaticdamagetotheMOSgates. 14.5 Glossary SLYZ022—TIGlossary. Thisglossarylistsandexplainsterms,acronyms,anddefinitions. 15 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of thisdocument.Forbrowser-basedversionsofthisdatasheet,refertotheleft-handnavigation. Copyright©1997–2015,TexasInstrumentsIncorporated SubmitDocumentationFeedback 11 ProductFolderLinks:SN65220 SN65240 SN75240

PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2020 PACKAGING INFORMATION Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples (1) Drawing Qty (2) (6) (3) (4/5) SN65220DBVR ACTIVE SOT-23 DBV 6 3000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 SADI & no Sb/Br) SN65220DBVRG4 ACTIVE SOT-23 DBV 6 3000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 SADI & no Sb/Br) SN65220DBVT ACTIVE SOT-23 DBV 6 250 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 SADI & no Sb/Br) SN65220DBVTG4 ACTIVE SOT-23 DBV 6 250 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 SADI & no Sb/Br) SN65240P ACTIVE PDIP P 8 50 Green (RoHS NIPDAU N / A for Pkg Type -40 to 85 SN65240P & no Sb/Br) SN65240PE4 ACTIVE PDIP P 8 50 Green (RoHS NIPDAU N / A for Pkg Type -40 to 85 SN65240P & no Sb/Br) SN65240PW ACTIVE TSSOP PW 8 150 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 A65240 & no Sb/Br) SN65240PWG4 ACTIVE TSSOP PW 8 150 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 A65240 & no Sb/Br) SN65240PWR ACTIVE TSSOP PW 8 2000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 A65240 & no Sb/Br) SN65240PWRG4 ACTIVE TSSOP PW 8 2000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 A65240 & no Sb/Br) SN75240P ACTIVE PDIP P 8 50 Green (RoHS NIPDAU N / A for Pkg Type 0 to 70 SN75240P & no Sb/Br) SN75240PW ACTIVE TSSOP PW 8 150 Green (RoHS NIPDAU Level-1-260C-UNLIM 0 to 70 A75240 & no Sb/Br) SN75240PWG4 ACTIVE TSSOP PW 8 150 Green (RoHS NIPDAU Level-1-260C-UNLIM 0 to 70 A75240 & no Sb/Br) SN75240PWR ACTIVE TSSOP PW 8 2000 Green (RoHS NIPDAU Level-1-260C-UNLIM 0 to 70 A75240 & no Sb/Br) SN75240PWRG4 ACTIVE TSSOP PW 8 2000 Green (RoHS NIPDAU Level-1-260C-UNLIM 0 to 70 A75240 & no Sb/Br) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. Addendum-Page 1

PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2020 PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement. (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF SN65220 : •Automotive: SN65220-Q1 NOTE: Qualified Version Definitions: •Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects Addendum-Page 2

PACKAGE MATERIALS INFORMATION www.ti.com 24-Apr-2020 TAPE AND REEL INFORMATION *Alldimensionsarenominal Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1 Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant (mm) W1(mm) SN65220DBVR SOT-23 DBV 6 3000 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3 SN65220DBVT SOT-23 DBV 6 250 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3 SN65240PWR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1 SN75240PWR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1 PackMaterials-Page1

PACKAGE MATERIALS INFORMATION www.ti.com 24-Apr-2020 *Alldimensionsarenominal Device PackageType PackageDrawing Pins SPQ Length(mm) Width(mm) Height(mm) SN65220DBVR SOT-23 DBV 6 3000 180.0 180.0 18.0 SN65220DBVT SOT-23 DBV 6 250 180.0 180.0 18.0 SN65240PWR TSSOP PW 8 2000 367.0 367.0 35.0 SN75240PWR TSSOP PW 8 2000 367.0 367.0 35.0 PackMaterials-Page2

PACKAGE OUTLINE DBV0006A SOT-23 - 1.45 mm max height SCALE 4.000 SMALL OUTLINE TRANSISTOR C 3.0 2.6 0.1 C 1.75 1.45 B A 1.45 MAX PIN 1 INDEX AREA 1 6 2X 0.95 3.05 2.75 1.9 5 2 4 3 0.50 6X 0.25 0.15 0.2 C A B (1.1) TYP 0.00 0.25 GAGE PLANE 0.22 TYP 0.08 8 TYP 0.6 0 0.3 TYP SEATING PLANE 4214840/B 03/2018 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. Body dimensions do not include mold flash or protrusion. Mold flash and protrusion shall not exceed 0.15 per side. 4. Leads 1,2,3 may be wider than leads 4,5,6 for package orientation. 5. Refernce JEDEC MO-178. www.ti.com

EXAMPLE BOARD LAYOUT DBV0006A SOT-23 - 1.45 mm max height SMALL OUTLINE TRANSISTOR PKG 6X (1.1) 1 6X (0.6) 6 SYMM 2 5 2X (0.95) 3 4 (R0.05) TYP (2.6) LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE:15X SOLDER MASK SOLDER MASK METAL UNDER METAL OPENING OPENING SOLDER MASK EXPOSED METAL EXPOSED METAL 0.07 MAX 0.07 MIN ARROUND ARROUND NON SOLDER MASK SOLDER MASK DEFINED DEFINED (PREFERRED) SOLDER MASK DETAILS 4214840/B 03/2018 NOTES: (continued) 6. Publication IPC-7351 may have alternate designs. 7. Solder mask tolerances between and around signal pads can vary based on board fabrication site. www.ti.com

EXAMPLE STENCIL DESIGN DBV0006A SOT-23 - 1.45 mm max height SMALL OUTLINE TRANSISTOR PKG 6X (1.1) 1 6X (0.6) 6 SYMM 2 5 2X(0.95) 3 4 (R0.05) TYP (2.6) SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL SCALE:15X 4214840/B 03/2018 NOTES: (continued) 8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 9. Board assembly site may have different recommendations for stencil design. www.ti.com

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PACKAGE OUTLINE PW0008A TSSOP - 1.2 mm max height SCALE 2.800 SMALL OUTLINE PACKAGE C 6.6 TYP SEATING PLANE 6.2 PIN 1 ID A 0.1 C AREA 6X 0.65 8 1 3.1 2X 2.9 NOTE 3 1.95 4 5 0.30 8X 0.19 4.5 1.2 MAX B 0.1 C A B 4.3 NOTE 4 (0.15) TYP SEE DETAIL A 0.25 GAGE PLANE 0.15 0.75 0 - 8 0.05 0.50 DETAIL A TYPICAL 4221848/A 02/2015 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.15 mm per side. 4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm per side. 5. Reference JEDEC registration MO-153, variation AA. www.ti.com

EXAMPLE BOARD LAYOUT PW0008A TSSOP - 1.2 mm max height SMALL OUTLINE PACKAGE 8X (1.5) 8X (0.45) SYMM (R0.05) 1 TYP 8 SYMM 6X (0.65) 5 4 (5.8) LAND PATTERN EXAMPLE SCALE:10X SOOPLEDNEINRG MASK METAL MSOELTDAEL RU NMDAESRK SOOPLEDNEINRG MASK 0.05 MAX 0.05 MIN ALL AROUND ALL AROUND NON SOLDER MASK SOLDER MASK DEFINED DEFINED SOLDER MASK DETAILS NOT TO SCALE 4221848/A 02/2015 NOTES: (continued) 6. Publication IPC-7351 may have alternate designs. 7. Solder mask tolerances between and around signal pads can vary based on board fabrication site. www.ti.com

EXAMPLE STENCIL DESIGN PW0008A TSSOP - 1.2 mm max height SMALL OUTLINE PACKAGE 8X (1.5) SYMM (R0.05) TYP 8X (0.45) 1 8 SYMM 6X (0.65) 5 4 (5.8) SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL SCALE:10X 4221848/A 02/2015 NOTES: (continued) 8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 9. Board assembly site may have different recommendations for stencil design. www.ti.com

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