Effective February 2016 Technical Data 10515 Supersedes March 2007 0603ESDA-MLP ESD suppressor Applications Pb • ESD port protection for mobile/smart phones • Game console ESD port protection • High speed ESD data port protection • Set-top-boxes • Tablets, notebooks, netbooks, laptops • High definition television (HDTV) • Media players • Digital cameras • Medical equipment • Computers and peripherals ESD port protection • Consumer electronics Product description Ordering • Ultra-low capacitance (0.05 pF) ideal for high • Specify part number and packaging suffix speed data applications (e.g. 0603ESDA-MLP7) 0603ESDA-MLP = part number, 7 = packaging suffix) • Provides Electro Static Discharge (ESD) protection with fast response time (<1 ns) allowing equipment to pass IEC 61000-4-2 Packaging suffixes Level 4 test • Single–line, bi-directional device • 7 (Tape and reel, 5 000 parts per 7” diameter reel) • 0603 (1608 metric) compact design utilizes less board space • Lead free, RoHS compliant

Technical Data 10515 0603ESDA-MLP Effective February 2016 ESD suppressor Product specifications ESD ESD capability capability Rated Attenuation Leakage IEC61000-4- IEC61000-4- voltage Clamping Trigger Capacitance Capacitance change (0–6 current @ 2 Direct 2 Air ESD pulse (V ) voltage1 voltage2 @ 1 MHz (pF) @ 1 MHz (pF) GHz) (dB) 12 V (nA) discharge discharge withstand3 Part number4 maDCximum (V) typical (V) typical typical maximum typical typicDaCl (kV) typical (kV) typical typical 0603ESDA-MLP 30 35 300 0.05 0.15 -0.2 <0.1 8 15 >1000 1. Clamping voltage: Per IEC61000-4-2, Level 4 waveform (8 kV direct 30 A) measured 30 ns after initial 3. Minor shifting in characteristics may be observed over multiple ESD pulses at very rapid rate. pulse. 4. Part Number Definition: 0603ESDA-MLP 2. Trigger voltage: Trigger measurement made using Transmission Line Pulse (TLP) method. 0603ESDA= Product code and size -MLP= Form designation Dimensions—mm [in] Design considerations The location in the circuit for the 0603ESDA-MLP has to be carefully determined. For better performance, the device should be placed as close to the signal input as possible and ahead of any other component. Due to the high current associated with an ESD event, it is recommended to use a “0-stub” pad design (pad directly on the signal/data line and second pad directly on common ground). Environmental data Operating temperature: - 55 °C to +125 °C Storage temperature (component): - 55 °C to +125 °C Load humidity: 12 VDC per EIA/IS- 722 +85 °C, 85% relative humidity for 1 000 hours Thermal shock: 10 cycles, - 55 °C to +125 °C, 30 minute dwell time Moisture resistance: MIL-STD-202G, method 106G, 10 cycles Mechanical shock: EIA/IS- 722 paragraph 4.9 Mechanical vibration: EIA/IS- 722 paragraph 4.10 Resistance to solvent: EIA/IS- 722 paragraph 4.11 2 www.eaton.com/elx

0603ESDA-MLP Technical Data 10515 ESD suppressor Effective February 2016 Wave solder profile Reflow soldering not recommended t p Tp First Wave Second Wave e ur atTsmax erTstyp p m e TTsmin Preheat area Cool down area Time Reference EN 61760-1:2006 Profile Feature Standard SnPb Solder Lead (Pb) Free Solder Preheat • Temperature min. (Tsmin) 100°C 100°C • Temperature typ. (Tstyp) 120°C 120°C • Temperature max. (Tsmax) 130°C 130°C • Time (Tsmin to Tsmax) (ts) 70 seconds 70 seconds D preheat to max Temperature 150°C max. 150°C max. Peak temperature (TP)* 235°C – 260°C 250°C – 260°C Time at peak temperature (tp) 10 seconds max 10 seconds max 5 seconds max each wave 5 seconds max each wave Ramp-down rate ~ 2 K/s min ~ 2 K/s min ~3.5 K/s typ ~3.5 K/s typ ~5 K/s max ~5 K/s max Time 25°C to 25°C 4 minutes 4 minutes Manual solder 350°C, 4-5 seconds (by soldering iron), generally manual hand soldering is not recommended. www.eaton.com/elx 3

Technical Data 10515 0603ESDA-MLP Effective February 2016 ESD suppressor Solder reflow profile TP Table 1 - Standard SnPb Solder (Tc) TC -5°C Max. Ramp Up Rate = 3°C/s tP Volume Volume Package mm3 mm3 Max. Ramp Down Rate = 6°C/s Thickness <350 ≥350 TL <2.5mm) 235°C 220°C Preheat t ≥2.5mm 220°C 220°C A e Tsmax atur Table 2 - Lead (Pb) Free Solder (Tc) per Volume Volume Volume Tem Tsmin ts PThacickkangees s m<3m503 m35m03 - 2000 m>2m003 0 <1.6mm 260°C 260°C 260°C 1.6 – 2.5mm 260°C 250°C 245°C >2.5mm 250°C 245°C 245°C 25°C Time 25°C to Peak Time Reference JDEC J-STD-020D Profile Feature Standard SnPb Solder Lead (Pb) Free Solder Preheat and Soak • Temperature min. (Tsmin) 100°C 150°C • Temperature max. (Tsmax) 150°C 200°C • Time (Tsmin to Tsmax) (ts) 60-120 Seconds 60-120 Seconds Average ramp up rate Tsmax to Tp 3°C/ Second Max. 3°C/ Second Max. Liquidous temperature (Tl) 183°C 217°C Time at liquidous (tL) 60-150 Seconds 60-150 Seconds Peak package body temperature (TP)* Table 1 Table 2 Time (tp)** within 5 °C of the specified classification temperature (Tc) 20 Seconds** 30 Seconds** Average ramp-down rate (Tp to Tsmax) 6°C/ Second Max. 6°C/ Second Max. Time 25°C to Peak Temperature 6 Minutes Max. 8 Minutes Max. * Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum. ** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum. Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also reserves the right to change or update, without notice, any technical information contained in this bulletin. Eaton Electronics Division 1000 Eaton Boulevard Cleveland, OH 44122 United States www.eaton.com/elx © 2016 Eaton All Rights Reserved Eaton is a registered trademark. Printed in USA Publication No. 10515 All other trademarks are property February 2016 of their respective owners.