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  • 型号: MMZ2012S601A
  • 制造商: TDK
  • 库位|库存: xxxx|xxxx
  • 要求:
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MMZ2012S601A产品简介:

ICGOO电子元器件商城为您提供MMZ2012S601A由TDK设计生产,在icgoo商城现货销售,并且可以通过原厂、代理商等渠道进行代购。 提供MMZ2012S601A价格参考¥0.11-¥0.12以及TDKMMZ2012S601A封装/规格参数等产品信息。 你可以下载MMZ2012S601A参考资料、Datasheet数据手册功能说明书, 资料中有MMZ2012S601A详细功能的应用电路图电压和使用方法及教程。

产品参数 图文手册 常见问题
参数 数值
产品目录

滤波器

DC电阻(DCR)

300 毫欧最大

描述

FERRITE CHIP 600 OHM 500MA 0805EMI滤波珠子、芯片与阵列 Ferrite Chip Beads

产品分类

铁氧体磁珠和芯片

品牌

TDK Corporation

产品手册

点击此处下载产品Datasheet

产品图片

rohs

符合RoHS无铅 / 符合限制有害物质指令(RoHS)规范要求

产品系列

EMI滤波珠子、芯片与阵列,TDK MMZ2012S601AMMZ

数据手册

点击此处下载产品Datasheet

产品型号

MMZ2012S601AT000

PCN零件编号

点击此处下载产品Datasheet

不同频率时的阻抗

600 欧姆 @ 100MHz

产品

Ferrite Chip Beads

产品培训模块

http://www.digikey.cn/PTM/IndividualPTM.page?site=cn&lang=zhs&ptm=7792

产品目录绘图

产品目录页面

点击此处下载产品Datasheet

产品种类

EMI滤波珠子、芯片与阵列

其它名称

445-1556-2
MMZ2012S601A

包装

带卷 (TR)

商标

TDK

外壳宽度

1.25 mm

外壳长度

2 mm

外壳高度

0.85 mm

大小/尺寸

0.079" 长 x 0.049" 宽(2.00mm x 1.25mm)

安装类型

表面贴装

容差

25 %

封装

Reel

封装/外壳

0805(2012 公制)

封装/箱体

0805 (2012 metric)

尺寸

1.25 mm W x 2 mm L x 0.85 mm H

工作温度范围

- 55 C to + 125 C

工厂包装数量

4000

最大直流电流

500 mA

最大直流电阻

300 mOhms

标准包装

4,000

测试频率

100 MHz

滤波器类型

差模 - 单线

电容

-

端接类型

SMD/SMT

系列

MMZ

阻抗

600 Ohms

额定电流

500mA

高度(最大值)

0.041"(1.05mm)

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PDF Datasheet 数据手册内容提取

Chip Beads For signal line MMZ series Type: MMZ0402 0402[01005 inch]* MMZ0603 0603[0201 inch] MMZ1005 1005[0402 inch] MMZ1608 1608[0603 inch] MMZ2012 2012[0805 inch] MMZ1005-E 1005[0402 inch] * Dimensions Code JIS[EIA] Issue date: November 2011 • All specifications are subject to change without notice. (cid:127) Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications.

(1/26) Chip Beads Conformity to RoHS Directive For Signal Line MMZ Series MMZ0402 FEATURES SHAPES AND DIMENSIONS/RECOMMENDED PC BOARD (cid:127) It is super small size(L0.4×W0.2×T0.2mm). PATTERN (cid:127) It prevents radiated noise from high-speed signal lines. 0.4±0.02 (cid:127) Maintain impedance to high frequency band. 2 (cid:127) Breescisatuasnec eit. adopts silver in internal electrode, it is low DC ±0.02 8 to 0. 2 1 (cid:127) Because it is not generate of cross talk with closed magnetic cir- 0. 0.2 0. cuit structural design, high density assembly is possible. 2 0.15 to 0.2 0.15 to 0.2 0 (cid:127) It is a product conforming to RoHS directive. 0. ± 2 0. Weight: 0.08mg APPLICATIONS Removal of signal line noises of cellular phones, portable audio 0.08 to 0.14 Dimensions in mm players, various modules, etc. TEMPERATURE RANGES Operating/storage –55 to +125°C PRODUCT IDENTIFICATION MMZ 0402 S 121 C T PACKAGING STYLE AND QUANTITIES (1) (2) (3) (4) (5) (6) (7) Packaging style Quantity Taping 20000 pieces/reel (1)Series name (2)Dimensions L×W RECOMMENDED SOLDERING CONDITION (3)Type name REFLOW SOLDERING (4)Impedance 121:120Ω at 100MHz (5)Characteristic type 10s max. (6)Packaging style 250 to 260˚C Natural T: Taping cooling 230˚C (7) TDK internal code 180˚C HANDLING AND PRECAUTIONS (cid:127) Before soldering, be sure to preheat components. The preheat- 150˚C ing temperature should be set so that the temperature difference Preheating Soldering between the solder temperature and product temperature does 60 to 120s 30 to 60s not exceed 150°C. Time(s) (cid:127) After mounting components onto the printed circuit board, do not apply stress through board bending or mishandling. ELECTRICAL CHARACTERISTICS (cid:127) Do not expose the inductors to stray magnetic fields. Impedance DC resistance Rated current (cid:127) Avoid static electricity discharge during handling. Part No. (Ω)[100MHz]∗ (Ω)max. (mA)max. MMZ0402S100C 10±5Ω 0.10 500 MMZ0402S700C 70±25% 0.45 260 MMZ0402S121C 120±25% 0.70 210 ∗ Test equipment: E4991A or equivalent Test tool: 16197 or equivalent Test temperature: 25±10°C (cid:127) Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications. (cid:127) Please contact our Sales office when your application is considered the following: The device’s failure or malfunction may directly endanger human life (e.g. application for automobile/aircraft/medical/nuclear power devices, etc.) (cid:127) All specifications are subject to change without notice. 001-05 / 20111129 / e9412_mmz

(2/26) TYPICAL ELECTRICAL CHARACTERISTICS Z FREQUENCY CHARACTERISTICS(DIFFERS ACCORDING TO SERIES) MMZ0402S SERIES 250 MMZ0402S121C 200 Ω) MMZ0402S700C (e150 nc MMZ0402S100C a d e100 p m I 50 0 1 10 100 1000 10000 Frequency(MHz) Z, X, R vs. FREQUENCY CHARACTERISTICS MMZ0402S100C MMZ0402S700C MMZ0402S121C 20 160 250 140 200 15 120 Ω()e Z Ω()e100 Z Ω()e150 Z c R c c an10 an 80 an R d d R d pe X pe 60 pe100 m m m X I 5 I 40 I X 50 20 0 0 0 1 10 100 1000 10000 1 10 100 1000 10000 1 10 100 1000 10000 Frequency(MHz) Frequency(MHz) Frequency(MHz) PACKAGING STYLES REEL DIMENSIONS TAPE DIMENSIONS 1 5 1.0 Sprocket hole 1.5+–00..01 Cavity ±1.750.±3.50.0 min. ±0.2 60 8.0 ø 4 0.4max. 0.26±0.04 4.0±0.1 0.0 ± 2.0±0.05 2.0±0.05 46 0. 2.0±0.5 8.4+–02..00 160min. Taping 200min. ø13±0.2 14.4max. ø21±0.8 ø180±2.0 Dimensions in mm Drawing direction 300min. Dimensions in mm (cid:127) All specifications are subject to change without notice. 001-05 / 20111129 / e9412_mmz

(3/26) Chip Beads Conformity to RoHS Directive For Signal Line MMZ Series MMZ0603 FEATURES MATERIAL CHARACTERISTICS (cid:127) This is a multilayered chip bead product with dimensions of S material: Standard type that features impedance characteristics L0.6×W0.3×T0.3mm. similar to those of a typical ferrite core. (cid:127) The product is magnetically shielded, allowing high density For signal line applications in which the blocking region mounting. is near 100MHz. Impedance values selected for effec- (cid:127) We refined the rules for internal conductor design to reduce tiveness at 40 to 300MHz. floating capacity between conductors, which in turn has Y material: High frequency range type intended for the 100MHz contributed to a dramatic improvement in high frequency region and above. characteristics. We have also been able to expand and reinforce For signal line applications in which the signal fre- the EMI suppression in the GHz range. quency is far from the cutoff frequency. Impedance val- (cid:127) It is a product conforming to RoHS directive. ues selected for effectiveness at 80 to 400MHz. D material: For applications calling for low insertion loss at low fre- APPLICATIONS quencies and sharply increasing impedance at high Removal of signal line noises of cellular phones, portable audio frequencies. Designed for high impedance at high fre- players, various modules, DSCs, portable game machines, etc. quencies (300MHz to 1GHz) for signal line applica- tions. PRODUCT IDENTIFICATION F material: This new product inherits the characteristic of our D- MMZ 0603 S 121 C T material, namely its sharp impedance rise time, and its (1) (2) (3) (4) (5) (6) (7) impedance peak frequency has been shifted higher into range. The product offers excellent noise suppres- (1) Series name sion from 600MHz to as high as in the GHz range. (2) Dimensions L×W (3) Type name TYPICAL MATERIAL CHARACTERISTICS (4) Impedance 121:120Ω at 100MHz 2000 1800 (5) Characteristic type D 1600 (6) Packaging style Y 1400 T:Taping Ω) (e 1200 (7) TDK internal code anc 1000 ped 800 S F HANDLING AND PRECAUTIONS Im 600 (cid:127) Before soldering, be sure to preheat components. The preheat- 400 ing temperature should be set so that the temperature difference 200 between the solder temperature and product temperature does 0 10 100 1000 not exceed 150°C. Frequency(MHz) (cid:127) After mounting components onto the printed circuit board, do not apply stress through board bending or mishandling. (cid:127) Do not expose the inductors to stray magnetic fields. (cid:127) Avoid static electricity discharge during handling. (cid:127) When hand soldering, apply the soldering iron to the printed cir- cuit board only. Temperature of the iron tip should not exceed 350°C. Soldering time should not exceed 3 seconds. (cid:127) Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications. (cid:127) Please contact our Sales office when your application is considered the following: The device’s failure or malfunction may directly endanger human life (e.g. application for automobile/aircraft/medical/nuclear power devices, etc.) (cid:127) All specifications are subject to change without notice. 001-05 / 20111129 / e9412_mmz

(4/26) SHAPES AND DIMENSIONS/RECOMMENDED PC BOARD ELECTRICAL CHARACTERISTICS PATTERN Impedance DC resistance Rated current Part No. (Ω)[100MHz]∗ (Ω)max. (mA)max. 0.6±0.03 MMZ0603S100C 10±5Ω 0.09 500 ±0.03 0.30 MMMMZZ00660033SS182010CC 18200±±2255%% 00..4350 220000 0.3 0.25 0.30 0.25 MMZ0603S241C 240±25% 0.57 200 MMZ0603S471C 470±25% 1.30 100 0.1min. MMZ0603S601C 600±25% 1.45 100 03 MMZ0603Y121C 120±25% 0.39 200 ±0. Weight: 0.3mg MMZ0603Y241C 240±25% 0.80 200 3 0. MMZ0603Y471C 470±25% 1.40 200 Dimensions in mm MMZ0603Y601C 600±25% 1.50 200 MMZ0603D330C 33±25% 0.70 100 TEMPERATURE RANGES MMZ0603D560C 56±25% 0.95 100 MMZ0603D800C 80±25% 1.25 100 Operating/storage –55 to +125°C MMZ0603F100C 10±5Ω 0.50 200 MMZ0603F220C 22±25% 1.00 200 PACKAGING STYLE AND QUANTITIES MMZ0603F330C 33±25% 1.30 150 Packaging style Quantity ∗ Test equipment: E4991A or equivalent Taping 15000 pieces/reel Test tool: 16197 or equivalent Test temperature: 25±10°C RECOMMENDED SOLDERING CONDITION REFLOW SOLDERING 10s max. 250 to 260˚C Natural cooling 230˚C 180˚C 150˚C Preheating Soldering 60 to 120s 30 to 60s Time(s) TYPICAL ELECTRICAL CHARACTERISTICS Z FREQUENCY CHARACTERISTICS(DIFFERS ACCORDING TO SERIES) MMZ0603S SERIES MMZ0603Y SERIES MMZ0603D SERIES 1000 1000 900 MMZ0603S601C MMZ0603Y601C 890000 MMMMZZ00660033SS427411CC 890000 MMZ0603Y471C 780000 MMZ0603D800C Ω()dance567000000 MMMMMMZZZ000666000333SSS181200100CCC Ω()dance567000000 MMMMZZ00660033YY214211CC Ω()dance456000000 MMMMZZ00660033DD353600CC Impe340000 Impe340000 Impe300 200 200 200 100 100 100 0 0 0 1 10 100 1000 10000 1 10 100 1000 10000 1 10 100 1000 10000 Frequency(MHz) Frequency(MHz) Frequency(MHz) MMZ0603F SERIES 1200 1000 MMZ0603F330C Ω) 800 (e c MMZ0603F220C an600 d mpe400 MMZ0603F100C I 200 0 1 10 100 1000 10000 Frequency(MHz) (cid:127) All specifications are subject to change without notice. 001-05 / 20111129 / e9412_mmz

(5/26) TYPICAL ELECTRICAL CHARACTERISTICS Z, X, R vs. FREQUENCY CHARACTERISTICS MMZ0603S100C MMZ0603S800C MMZ0603S121C 18 160 250 16 140 14 Z 120 200 Ω)12 Ω) Z Ω) Z (Impedance14680 RX (Impedance 146800000 XR (Impedance 11505000 RX 2 20 0 0 0 1 10 100 1000 10000 1 10 100 1000 10000 1 10 100 1000 10000 Frequency(MHz) Frequency(MHz) Frequency(MHz) MMZ0603S241C MMZ0603S471C MMZ0603S601C 450 800 1000 400 800 350 600 Ω) 300 Ω) Z Ω) (mpedance 221505000 Z R (mpedance 400 R (mpedance 640000 Z R I 100 X I 200 X I 200 X 50 01 10 100 1000 10000 01 10 100 1000 10000 01 10 100 1000 10000 Frequency(MHz) Frequency(MHz) Frequency(MHz) MMZ0603Y121C MMZ0603Y241C MMZ0603Y471C 250 600 900 800 500 200 700 Ω()e150 Z Ω()e400 Z Ω()e600 Z c c c500 dan R dan300 R dan400 R e100 e e mp mp200 mp300 I X I I X 50 X 200 100 100 0 0 0 1 10 100 1000 10000 1 10 100 1000 10000 1 10 100 1000 10000 Frequency(MHz) Frequency(MHz) Frequency(MHz) MMZ0603Y601C 1000 800 Ω) (e600 c Z R n a d e400 p m I X 200 0 1 10 100 1000 10000 Frequency(MHz) (cid:127) All specifications are subject to change without notice. 001-05 / 20111129 / e9412_mmz

(6/26) TYPICAL ELECTRICAL CHARACTERISTICS Z, X, R vs. FREQUENCY CHARACTERISTICS MMZ0603D330C MMZ0603D560C MMZ0603D800C 500 700 900 600 800 400 700 Ω) Ω)500 Ω)600 (ce300 (ce400 Z (ce500 Z an Z R an R an R ed200 ed300 ed400 p p p m m m300 I I200 I 100 200 100 X X X 100 0 0 0 1 10 100 1000 10000 1 10 100 1000 10000 1 10 100 1000 10000 Frequency(MHz) Frequency(MHz) Frequency(MHz) MMZ0603F100C MMZ0603F220C MMZ0603F330C 300 700 1200 250 600 1000 Ω)200 Ω)500 Ω)800 (mpedance110500 Z R (mpedance340000 Z (mpedance460000 Z I X I200 R I 50 100 200 X X R 0 0 0 1 10 100 1000 10000 1 10 100 1000 10000 1 10 100 1000 10000 Frequency(MHz) Frequency(MHz) Frequency(MHz) PACKAGING STYLES REEL DIMENSIONS TAPE DIMENSIONS 1 5 Sprocket hole 1.5+–00..01 Cavity ±750.±50.0 1.0 1. 3. 3 min. ±00. 60 8. ø 5 0.5max. 0.38±0.05 4.0±0.1 0.0 ± 2.0±0.05 2.0±0.05 68 0. 2.0±0.5 8.4+–02..00 160min. Taping 200min. ø13±0.2 14.4max. ø21±0.8 ø180±2.0 Dimensions in mm Drawing direction 300min. Dimensions in mm (cid:127) All specifications are subject to change without notice. 001-05 / 20111129 / e9412_mmz

(7/26) Chip Beads Conformity to RoHS Directive For Signal Line MMZ Series MMZ1005 FEATURES MATERIAL CHARACTERISTICS (cid:127) Size standardized for use by automatic assembly equipment. B material:This type is perfectly suited for fast digital signals. By No preferred orientation. equalizing R components and X components that (cid:127) Electroplated terminal electrodes accommodate reflow beads possess at a frequency of 5MHz, it is able to soldering. suppress overshooting, undershooting and ringing of (cid:127) High reliability due to an entirely monolithic structure. fast digital signals. (cid:127) Closed magnetic circuit structure allows high-density installation S material: Standard type that features impedance characteristics while preventing crosstalk between circuits. similar to those of a typical ferrite core. (cid:127) Low DC resistance structure of electrode prevents wasteful For signal line applications in which the blocking region electric power consumption. is near 100MHz. Impedance values selected for effec- (cid:127) It is a product conforming to RoHS directive. tiveness at 40 to 300MHz. Y material: High frequency range type intended for the 100MHz APPLICATIONS region and above. Removal of signal line noises of cellular phones, PCs, note PCs, For signal line applications in which the signal fre- TVs, TV tuners, STBs, audio players, DVDs, DSCs, DVCs, game quency is far from the cutoff frequency. Impedance val- machines, digital photo frames, car navigation system, PNDs, etc. ues selected for effectiveness at 80 to 400MHz. D material: For applications calling for low insertion loss at low fre- PRODUCT IDENTIFICATION quencies and sharply increasing impedance at high MMZ 1005 S 121 C T frequencies. Designed for high impedance at high fre- (1) (2) (3) (4) (5) (6) (7) quencies (300MHz to 1GHz) for signal line applica- tions. (1) Series name F material: This new product inherits the characteristic of our D- (2) Dimensions L×W material, namely its sharp impedance rise time, and its (3) Type name impedance peak frequency has been shifted higher (4) Impedance into range. The product offers excellent noise suppres- 121:120Ω at 100MHz sion from 600MHz to as high as in the GHz range. (5) Characteristic type (6) Packaging style TYPICAL MATERIAL CHARACTERISTICS T:Taping 2000 (7) TDK internal code D 1800 1600 HANDLING AND PRECAUTIONS 1400 Y Ω) (cid:127) Before soldering, be sure to preheat components. The preheat- (e 1200 c ing temperature should be set so that the temperature difference an 1000 d S F between the solder temperature and product temperature does pe 800 m not exceed 150°C. I 600 400 (cid:127) After mounting components onto the printed circuit board, do not B 200 apply stress through board bending or mishandling. 0 (cid:127) Do not expose the inductors to stray magnetic fields. 10 100 1000 (cid:127) Avoid static electricity discharge during handling. Frequency(MHz) (cid:127) When hand soldering, apply the soldering iron to the printed cir- cuit board only. Temperature of the iron tip should not exceed 350°C. Soldering time should not exceed 3 seconds. (cid:127) Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications. (cid:127) Please contact our Sales office when your application is considered the following: The device’s failure or malfunction may directly endanger human life (e.g. application for automobile/aircraft/medical/nuclear power devices, etc.) (cid:127) All specifications are subject to change without notice. 001-05 / 20111129 / e9412_mmz

(8/26) SHAPES AND DIMENSIONS/RECOMMENDED PC BOARD ELECTRICAL CHARCTERISTICS PATTERN Impedance DC resistance Rated current Part No. (Ω)[100MHz]∗ (Ω)max. (mA)max. 1±0.05 MMZ1005B800C 80±25% 0.19 450 5 MMZ1005B121C 120±25% 0.25 400 0 ±0.50. 0.5 MMMMZZ11000055BS680010CC 68000±±2255%% 00..8152 250000 0.1min. 0.5 0.4 0.5 MMZ1005S121C 120±25% 0.22 500 5 MMZ1005S241C 240±25% 0.28 400 0 Weight: 1mg 0. MMZ1005S601C 600±25% 0.52 300 ± 5 Dimensions in mm MMZ1005S102C 1000±25% 0.75 200 0. MMZ1005Y400C 40±25% 0.10 550 MMZ1005Y800C 80±25% 0.17 450 TEMPERATURE RANGES MMZ1005Y121C 120±25% 0.18 400 Operating/storage –55 to +125°C MMZ1005Y241C 240±25% 0.26 300 MMZ1005Y301C 300±25% 0.38 250 MMZ1005Y471C 470±25% 0.47 250 PACKAGING STYLE AND QUANTITIES MMZ1005Y601C 600±25% 0.54 250 Packaging style Quantity MMZ1005Y102C 1000±25% 0.70 200 Taping 10000 pieces/reel MMZ1005Y152C 1500±25% 1.00 100 MMZ1005D100C 10±5Ω 0.10 500 RECOMMENDED SOLDERING CONDITION MMZ1005D220C 22±25% 0.17 400 REFLOW SOLDERING MMZ1005D330C 33±25% 0.24 400 MMZ1005D680C 68±25% 0.38 400 MMZ1005D121C 120±25% 0.60 350 10s max. MMZ1005D241C 240±25% 0.90 200 MMZ1005F330C 33±25% 0.50 200 250 to 260˚C Natural MMZ1005F470C 47±25% 0.60 100 230˚C cooling MMZ1005F560C 56±25% 0.70 100 ∗ Test equipment: E4991A or equivalent Test tool: 16192A or equivalent 180˚C Test temperature: 25±10°C 150˚C Preheating Soldering 60 to 120s 30 to 60s Time(s) TYPICAL ELECTRICAL CHARACTERISTICS Z FREQUENCY CHARACTERISTICS(DIFFERS ACCORDING TO SERIES) MMZ1005B SERIES MMZ1005S SERIES MMZ1005Y SERIES 800 MMZ1005B601C 1400 MMZ1005S102C 1800 MMZ1005Y152C 700 MMZ1005B121C 1200 MMZ1005S601C 1600 MMMMZZ11000055YY610012CC 600 MMZ1005S241C 1400 MMZ1005Y471C Ω) MMZ1005B800C Ω)1000 MMZ1005S121C Ω)1200 MMZ1005Y301C (mpedance345000000 (mpedance 680000 MMZ1005S800C (mpedance1680000000 MMMMMMMMZZZZ1111000000005555YYYY481200240011CCCC I200 I 400 I 400 100 200 200 0 0 0 1 10 100 1000 10000 1 10 100 1000 10000 1 10 100 1000 10000 Frequency(MHz) Frequency(MHz) Frequency(MHz) MMZ1005D SERIES MMZ1005F SERIES 3000 1200 MMZ1005D241C MMZ1005F560C 2500 1000 Ω)2000 Ω) 800 (e MMZ1005D121C (e MMZ1005F470C anc1500 MMZ1005D680C anc600 ed MMZ1005D330C ed MMZ1005F330C mp1000 MMZ1005D220C mp400 I MMZ1005D100C I 500 200 0 0 1 10 100 1000 10000 1 10 100 1000 10000 Frequency(MHz) Frequency(MHz) (cid:127) All specifications are subject to change without notice. 001-05 / 20111129 / e9412_mmz

(9/26) TYPICAL ELECTRICAL CHARACTERISTICS Z, X, R vs. FREQUENCY CHARACTERISTICS MMZ1005B800C MMZ1005B121C MMZ1005B601C 120 180 800 160 700 100 Z 140 600 Ω) 80 Ω)120 Ω) (ance 60 R (ance100 Z R (ance 540000 Z mped 40 mped 6800 mped 300 R I X I 40 X I 200 X 20 20 100 0 0 0 1 10 100 1000 10000 1 10 100 1000 10000 1 10 100 1000 10000 Frequency(MHz) Frequency(MHz) Frequency(MHz) MMZ1005S800C MMZ1005S121C MMZ1005S241C 160 250 400 140 350 200 120 300 Ω) Z Ω) Ω) (e100 (e150 (e 250 c c c pedan 6800 R pedan100 Z R pedan 210500 Z R m m m I 40 I X I 100 X 50 X 20 50 0 0 0 1 10 100 1000 10000 1 10 100 1000 10000 1 10 100 1000 10000 Frequency(MHz) Frequency(MHz) Frequency(MHz) MMZ1005S601C MMZ1005S102C 900 1400 800 1200 700 Ω()mpedance345600000000 Z R Ω()mpedance1680000000 Z R I I 400 200 X X 200 100 0 0 1 10 100 1000 10000 1 10 100 1000 10000 Frequency(MHz) Frequency(MHz) MMZ1005Y400C MMZ1005Y800C MMZ1005Y121C 80 160 250 70 140 200 60 120 Ω) Z Ω) Ω) Z (ance 4500 R (ance18000 Z (ance150 R ped 30 ped 60 R ped100 m m m I 20 I 40 I X X X 50 10 20 0 0 0 1 10 100 1000 10000 1 10 100 1000 10000 1 10 100 1000 10000 Frequency(MHz) Frequency(MHz) Frequency(MHz) (cid:127) All specifications are subject to change without notice. 001-05 / 20111129 / e9412_mmz

(10/26) TYPICAL ELECTRICAL CHARACTERISTICS Z, X, R vs. FREQUENCY CHARACTERISTICS MMZ1005Y241C MMZ1005Y301C MMZ1005Y471C 500 600 800 700 500 400 600 Ω()e300 Z Ω()e400 Z Ω()e 500 Z pedanc200 R pedanc300 R pedanc 430000 R m m200 m I X I X I 200 100 100 X 100 0 0 0 1 10 100 1000 10000 1 10 100 1000 10000 1 10 100 1000 10000 Frequency(MHz) Frequency(MHz) Frequency(MHz) MMZ1005Y601C MMZ1005Y102C MMZ1005Y152C 1200 1400 1800 1600 1000 1200 1400 Ω)800 Ω)1000 Ω)1200 Z (mpedance460000 ZR (mpedance 680000 Z R (mpedance1086000000 R I I 400 I X X 400 200 200 X 200 01 10 100 1000 10000 01 10 100 1000 10000 01 10 100 1000 10000 Frequency(MHz) Frequency(MHz) Frequency(MHz) MMZ1005D100C MMZ1005D220C MMZ1005D330C 70 200 300 60 Z 250 150 Ω) 50 Ω) Ω)200 (Impedance 432000 RX (Impedance15000 Z RX (Impedance110500 Z RX 50 10 0 0 0 1 10 100 1000 10000 1 10 100 1000 10000 1 10 100 1000 10000 Frequency(MHz) Frequency(MHz) Frequency(MHz) MMZ1005D680C MMZ1005D121C MMZ1005D241C 600 1000 3000 500 2500 800 Z Ω)400 Ω) 2000 (dance300 Z R (dance600 R Ω()X, R1500 Z R mpe200 mpe400 Z, 1000 I I 200 100 500 X X X 0 0 0 1 10 100 1000 10000 1 10 100 1000 10000 1 10 100 1000 10000 Frequency(MHz) Frequency(MHz) Frequency(MHz) (cid:127) All specifications are subject to change without notice. 001-05 / 20111129 / e9412_mmz

(11/26) TYPICAL ELECTRICAL CHARACTERISTICS Z, X, R vs. FREQUENCY CHARACTERISTICS MMZ1005F330C MMZ1005F470C MMZ1005F560C 700 1000 1200 900 600 1000 800 Ω)500 Ω) 700 Z Ω) 800 (Impedance234000000 Z (Impedance 654300000000 R (Impedance 640000 Z 200 100 200 R R X 100 X X 0 0 0 1 10 100 1000 10000 1 10 100 1000 10000 1 10 100 1000 10000 Frequency(MHz) Frequency(MHz) Frequency(MHz) PACKAGING STYLES REEL DIMENSIONS TAPE DIMENSIONS 1 5 Sprocket hole 1.5+–00..01 Cavity ±750.±50.0 1.0 1. 3. 3 n. 0. mi ±0 60 8. ø 0.8max. 0.65±0.1 4.0±0.1 0.1 ± 2.0±0.05 2.0±0.05 15 1. 2.0±0.5 8.4+–02..00 ø13±0.2 14.4max. 160min. Taping 200min. ø21±0.8 ø180±2.0 Dimensions in mm Drawing direction 300min. Dimensions in mm (cid:127) All specifications are subject to change without notice. 001-05 / 20111129 / e9412_mmz

(12/26) Chip Beads Conformity to RoHS Directive For Signal Line MMZ Series MMZ1608 FEATURES SHAPES AND DIMENSIONS/RECOMMENDED PC BOARD (cid:127) Chip bead(impeder), MMZ series offers 8 construction materials. PATTERN (cid:127) Size standardized for use by automatic assembly equipment. 1.6±0.15 No preferred orientation. 5 (cid:127) Either flow or reflow soldering methods can be used due to 0.1 8 ± 0. electroplating of the terminal electrodes. 8 0. (cid:127) High reliability due to an entirely monolithic structure. 0.3±0.2 0.6 0.8 0.6 (cid:127) Closed magnetic circuit structure allows high-density installation Thickness(T) Weight while preventing crosstalk between circuits. T 0.6±0.15mm 3mg (cid:127) Low DC resistance structure of electrode prevents wasteful 0.8±0.15mm 4mg Dimensions in mm electric power consumption. (cid:127) The products contain no lead and also support lead-free TEMPERATURE RANGES soldering. Operating/storage –55 to +125°C (cid:127) It is a product conforming to RoHS directive. PACKAGING STYLE AND QUANTITIES Packaging style Quantity APPLICATIONS Taping 4000 pieces/reel Removal of signal line noises of cellular phones, PCs, note PCs, TVs, TV tuners, STBs, audio players, DVDs, DSCs, DVCs, game RECOMMENDED SOLDERING CONDITION machines, digital photo frames, car navigation system, PNDs, etc. REFLOW SOLDERING PRODUCT IDENTIFICATION MMZ 1608 R 121 A T 10s max. (1) (2) (3) (4) (5) (6) (7) 250 to 260˚C Natural cooling 230˚C (1)Series name (2)Dimensions L×W 180˚C (3)Type name 150˚C (4)Impedance 121:120Ω at 100MHz Preheating Soldering 60 to 120s 30 to 60s (5)Characteristic type (6)Packaging style Time(s) T:Taping (7) TDK internal code HANDLING AND PRECAUTIONS (cid:127) Before soldering, be sure to preheat components. The preheat- ing temperature should be set so that the temperature difference between the solder temperature and product temperature does not exceed 150°C. (cid:127) After mounting components onto the printed circuit board, do not apply stress through board bending or mishandling. (cid:127) Do not expose the inductors to stray magnetic fields. (cid:127) Avoid static electricity discharge during handling. (cid:127) When hand soldering, apply the soldering iron to the printed cir- cuit board only. Temperature of the iron tip should not exceed 350°C. Soldering time should not exceed 3 seconds. (cid:127) Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications. (cid:127) Please contact our Sales office when your application is considered the following: The device’s failure or malfunction may directly endanger human life (e.g. application for automobile/aircraft/medical/nuclear power devices, etc.) (cid:127) All specifications are subject to change without notice. 001-05 / 20111129 / e9412_mmz

(13/26) MATERIAL CHARACTERISTICS ELECTRICAL CHARACTERISTICS B material:This type is perfectly suited for fast digital signals. Impedance Rated Product’s DC resistance By equalizing R components and X components that Part No. (Ω) (Ω)max. current thickness [100MHz]∗ (mA)max. T(mm) beads possess at a frequency of 5MHz, it is able to MMZ1608B121C 120±25% 0.15 600 0.6 suppress overshooting, undershooting and ringing of MMZ1608B221C 220±25% 0.25 500 0.6 fast digital signals. MMZ1608B301C 300±25% 0.25 500 0.6 R material:For wide frequency applications calling for broad MMZ1608B471C 470±25% 0.30 500 0.6 MMZ1608B601C 600±25% 0.40 500 0.6 impedance characteristics. MMZ1608B102C 1000±25% 0.60 300 0.8 For digital signal line applications calling requiring MMZ1608R150A 15±25% 0.05 1500 0.8 good waveform integrity. Impedance values selected MMZ1608R300A 30±25% 0.05 1500 0.8 for effectiveness at 10 to 200MHz. MMZ1608R600A 60±25% 0.10 800 0.8 MMZ1608R121A 120±25% 0.18 500 0.8 S material:Standard type that features impedance characteristics MMZ1608R301A 300±25% 0.25 500 0.8 similar to those of a typical ferrite core. MMZ1608R471A 470±25% 0.30 500 0.8 For signal line applications in which the blocking region MMZ1608R601A 600±25% 0.40 500 0.8 is near 100MHz. Impedance values selected for MMZ1608R102A 1000±25% 0.50 400 0.8 effectiveness at 40 to 300MHz. MMZ1608S400A 40±25% 0.10 600 0.8 MMZ1608S800A 80±25% 0.15 500 0.8 Y material:High frequency range type intended for the 100MHz MMZ1608S121A 120±25% 0.15 500 0.8 region and above. MMZ1608S181A 180±25% 0.20 500 0.8 For signal line applications in which the signal MMZ1608S221A 220±25% 0.20 500 0.8 frequency is far from the cutoff frequency. Impedance MMZ1608S301A 300±25% 0.30 500 0.8 MMZ1608S471A 470±25% 0.30 500 0.8 values selected for effectiveness at 80 to 400MHz. MMZ1608S601A 600±25% 0.35 500 0.8 A material:This high-impedance product is based on the MMZ1608S102A 1000±25% 0.50 400 0.8 impedance frequency characteristics of our Y-material. MMZ1608S202A 2000±25% 0.90 200 0.8 The product offers excellent impedance MMZ1608Y150B 15±25% 0.05 1500 0.8 characteristics, which is greater than 2500Ω, in the MMZ1608Y300B 30±25% 0.05 1500 0.8 MMZ1608Y600B 60±25% 0.15 500 0.8 vicinity of 100MHz range (MMZ1608A252B). MMZ1608Y121B 120±25% 0.20 500 0.8 Q material:For high-band applications designed for 100MHz and MMZ1608Y221B 220±25% 0.30 500 0.8 above. Impedance values selected for effectiveness at MMZ1608Y301B 300±25% 0.30 500 0.8 100 to 800MHz. MMZ1608Y471B 470±25% 0.35 500 0.8 MMZ1608Y601B 600±25% 0.40 500 0.8 D material:For applications calling for low insertion loss at low MMZ1608Y751B 750±25% 0.45 500 0.8 frequencies and sharply increasing impedance at high MMZ1608Y102B 1000±25% 0.50 400 0.8 frequencies. Designed for high impedance at high MMZ1608Y152B 1500±25% 0.60 300 0.8 frequencies (300MHz to 1GHz) for signal line MMZ1608A182B 1800±25% 0.80 200 0.8 applications. MMZ1608A222B 2200±25% 0.80 200 0.8 MMZ1608A252B 2500±25% 0.80 200 0.8 F material:This new product inherits the characteristic of our MMZ1608Q121B 120±25% 0.30 500 0.8 D-material, namely its sharp impedance rise time, and MMZ1608Q221B 220±25% 0.40 500 0.8 its impedance peak frequency has been shifted higher MMZ1608Q331B 330±25% 0.50 400 0.8 into range. MMZ1608Q471B 470±25% 0.70 300 0.8 MMZ1608Q601B 600±25% 0.80 200 0.8 The product offers excellent noise suppression from MMZ1608Q102B 1000±25% 1.00 200 0.8 600MHz to as high as in the GHz range. MMZ1608D050C 5±2Ω 0.05 700 0.8 MMZ1608D100C 10±5Ω 0.10 500 0.6 TYPICAL MATERIAL CHARACTERISTICS MMZ1608D220C 22±25% 0.20 500 0.6 MMZ1608D500C 50±25% 0.25 500 0.6 2500 MMZ1608D800C 80±25% 0.30 500 0.6 A D MMZ1608D800B 80±25% 0.30 500 0.8 F 2000 MMZ1608D121C 120±25% 0.30 400 0.6 Y MMZ1608D121B 120±25% 0.30 400 0.8 Ω()e 1500 Q MMZ1608D241C 240±25% 0.60 300 0.8 nc MMZ1608D301B 300±25% 0.70 300 0.8 a ped 1000 MMZ1608F030B 3typ. 0.05 700 0.8 m MMZ1608F470B 47±25% 0.40 500 0.8 I S R MMZ1608F750B 75±25% 0.55 300 0.8 500 MMZ1608F121B 120±25% 0.75 200 0.8 B ∗ Test equipment: E4991A or equivalent 0 Test tool: 16192A or equivalent 10 100 1000 Test temperature: 25±10°C Frequency(MHz) (cid:127) All specifications are subject to change without notice. 001-05 / 20111129 / e9412_mmz

(14/26) TYPICAL ELECTRICAL CHARACTERISTICS Z, X, R vs. FREQUENCY CHARACTERISTICS MMZ1608B121C MMZ1608B221C MMZ1608B301C 160 300 350 140 250 300 Ω) 120 Z Ω) 200 Ω) 250 Z (mpedance 1680000 R (mpedance 110500 ZR (mpedance 125000 R I 40 I I 100 20 X 50 X 50 X 0 0 0 1 10 100 1000 10000 1 10 100 1000 10000 1 10 100 1000 10000 Frequency(MHz) Frequency(MHz) Frequency(MHz) MMZ1608B471C MMZ1608B601C MMZ1608B102C 600 700 1200 500 600 1000 Ω) 400 Ω) 500 Z Ω) 800 Z (ance 300 Z (ance 400 R (ance 600 mped 200 R mped 300 mped 400 R I I 200 I X X 100 100 200 X 0 0 0 10 100 1000 10000 1 10 100 1000 10000 10 100 1000 10000 Frequency(MHz) Frequency(MHz) Frequency(MHz) MMZ1608R150A MMZ1608R300A MMZ1608R600A 20 40 90 35 80 15 30 70 Ω) Ω) Ω) 60 (ance 10 Z R (ance 2205 Z R (ance 50 Z R d d d 40 pe pe 15 pe m m m 30 I 5 I 10 I X 20 X X 5 10 0 0 0 1 10 100 1000 10000 1 10 100 1000 10000 1 10 100 1000 10000 Frequency(MHz) Frequency(MHz) Frequency(MHz) MMZ1608R121A MMZ1608R301A MMZ1608R471A 140 350 600 120 300 500 Ω) 100 Ω) 250 Ω) 400 (mpedance 6800 Z R (mpedance 125000 Z R (mpedance 230000 Z R I 40 I 100 I X X X 20 50 100 0 0 0 1 10 100 1000 10000 1 10 100 1000 10000 10 100 1000 10000 Frequency(MHz) Frequency(MHz) Frequency(MHz) (cid:127) All specifications are subject to change without notice. 001-05 / 20111129 / e9412_mmz

(15/26) TYPICAL ELECTRICAL CHARACTERISTICS Z, X, R vs. FREQUENCY CHARACTERISTICS MMZ1608R601A MMZ1608R102A MMZ1608S400A 700 1200 60 600 1000 50 Z Ω) 500 Ω) 800 Ω) 40 (mpedance 340000 Z R (mpedance 640000 ZR (mpedance 2300 R I 200 X I X I X 100 200 10 0 0 0 1 10 100 1000 10000 1 10 100 1000 10000 11 10 100 1000 10000 Frequency(MHz) Frequency(MHz) Frequency(MHz) MMZ1608S800A MMZ1608S121A MMZ1608S181A 120 180 300 160 100 250 Z 140 Ω) 80 Ω) 120 Ω) 200 (e R (e R (e anc 60 anc 100 Z anc 150 Z R d d 80 d e e e mp 40 mp 60 mp 100 I X I X I X 40 20 50 20 0 0 0 1 10 100 1000 10000 1 10 100 1000 10000 10 100 1000 10000 Frequency(MHz) Frequency(MHz) Frequency(MHz) MMZ1608S221A MMZ1608S301A MMZ1608S471A 300 450 600 400 250 500 350 Ω)200 Ω) 300 Ω)400 (mpedance110500 Z R (mpedance 122505000 Z R (mpedance230000 ZR I X I I 100 X 50 X 100 50 0 0 0 1 10 100 1000 10000 1 10 100 1000 10000 1 10 100 1000 10000 Frequency(MHz) Frequency(MHz) Frequency(MHz) MMZ1608S601A MMZ1608S102A MMZ1608S202A 700 1400 3000 600 1200 2500 Ω) 500 Ω)1000 Ω)2000 (mpedance 340000 Z R (mpedance 680000 Z R (mpedance11050000 Z R I 200 I 400 I X X 500 X 100 200 01 10 100 1000 10000 01 10 100 1000 10000 01 10 100 1000 10000 Frequency(MHz) Frequency(MHz) Frequency(MHz) (cid:127) All specifications are subject to change without notice. 001-05 / 20111129 / e9412_mmz

(16/26) TYPICAL ELECTRICAL CHARACTERISTICS Z, X, R vs. FREQUENCY CHARACTERISTICS MMZ1608Y150B MMZ1608Y300B MMZ1608Y600B 25 60 120 50 100 20 Ω) Z Ω) 40 Ω) 80 (mpedance 1105 R (mpedance 2300 ZR (mpedance 4600 Z R I X I I 5 10 X 20 X 0 0 0 1 10 100 1000 10000 1 10 100 1000 10000 1 10 100 1000 10000 Frequency(MHz) Frequency(MHz) Frequency(MHz) MMZ1608Y121B MMZ1608Y221B MMZ1608Y301B 250 400 600 350 500 200 300 Ω()e 150 Z Ω()e250 Z Ω()e 400 pedanc 100 R pedanc125000 R pedanc 300 Z R m m m 200 I I100 I 50 X X 100 X 50 0 0 0 1 10 100 1000 10000 1 10 100 1000 10000 1 10 100 1000 10000 Frequency(MHz) Frequency(MHz) Frequency(MHz) MMZ1608Y471B MMZ1608Y601B MMZ1608Y751B 700 900 1000 800 600 700 800 Ω) 500 Ω) 600 Ω) Z R (ance400 Z R (ance 500 Z R (ance600 ed300 ed 400 ed400 mp mp 300 mp I200 I X I X X 200 200 100 100 0 0 0 1 10 100 1000 10000 1 10 100 1000 10000 1 10 100 1000 10000 Frequency(MHz) Frequency(MHz) Frequency(MHz) MMZ1608Y102B MMZ1608Y152B 1400 1800 1600 1200 1400 Ω)1000 Ω)1200 (ance 800 Z R (ance1000 Z R ed 600 ed 800 p p m m 600 I 400 I X 400 X 200 200 0 0 1 10 100 1000 10000 1 10 100 1000 10000 Frequency(MHz) Frequency(MHz) (cid:127) All specifications are subject to change without notice. 001-05 / 20111129 / e9412_mmz

(17/26) TYPICAL ELECTRICAL CHARACTERISTICS Z, X, R vs. FREQUENCY CHARACTERISTICS MMZ1608A182B MMZ1608A222B MMZ1608A252B 2000 2500 3000 2500 Z 2000 1500 Ω()e R Ω()e1500 Z R Ω()e2000 danc1000 danc danc1500 Z Impe 500 X Impe1000 X Impe1000 X 500 500 R 0 0 0 1 10 100 1000 10000 1 10 100 1000 10000 1 10 100 1000 10000 Frequency(MHz) Frequency(MHz) Frequency(MHz) MMZ1608Q121B MMZ1608Q221B MMZ1608Q331B 350 600 800 700 300 500 Z 600 Ω()mpedance 122505000 Z R Ω()mpedance 234000000 Z R Ω()mpedance345000000 RX I 100 I I200 X 100 X 50 100 0 0 0 1 10 100 1000 10000 1 10 100 1000 10000 1 10 100 1000 10000 Frequency(MHz) Frequency(MHz) Frequency(MHz) MMZ1608Q471B MMZ1608Q601B MMZ1608Q102B 1200 1400 2000 1000 1200 Z 1500 Ω) 800 Ω)1000 Ω) Z (mpedance 460000 R (mpedance 680000 Z R (mpedance1000 R I I 400 I 500 200 X X 200 X 01 10 100 1000 10000 01 10 100 1000 10000 01 10 100 1000 10000 Frequency(MHz) Frequency(MHz) Frequency(MHz) MMZ1608D050C MMZ1608D100C MMZ1608D220C 30 80 160 70 140 25 60 120 Ω) 20 Ω) Ω) (ance 15 Z R (ance 4500 Z R (ance18000 Z R mped 10 X mped 30 X mped 60 I I 20 I 40 5 X 10 20 0 0 0 1 10 100 1000 10000 1 10 100 1000 10000 1 10 100 1000 10000 Frequency(MHz) Frequency(MHz) Frequency(MHz) (cid:127) All specifications are subject to change without notice. 001-05 / 20111129 / e9412_mmz

(18/26) TYPICAL ELECTRICAL CHARACTERISTICS Z, X, R vs. FREQUENCY CHARACTERISTICS MMZ1608D500C MMZ1608D800C MMZ1608D800B 400 600 600 500 500 300 Ω) Z Ω) 400 Z Ω) 400 (mpedance 200 R (mpedance 230000 R (mpedance 230000 Z R I 100 X I X I 100 100 X 01 10 100 1000 10000 01 10 100 1000 10000 01 10 100 1000 10000 Frequency(MHz) Frequency(MHz) Frequency(MHz) MMZ1608D121C MMZ1608D121B MMZ1608D241C 800 800 1200 700 700 1000 600 600 Ω) Z Ω) Z Ω) 800 (mpedance 543000000 R (mpedance 543000000 R (mpedance 640000 Z R I 200 I 200 I X X 200 100 100 X 0 0 0 1 10 100 1000 10000 1 10 100 1000 10000 1 10 100 1000 10000 Frequency(MHz) Frequency(MHz) Frequency(MHz) MMZ1608D301B MMZ1608F030B MMZ1608F470B 3000 35 900 30 800 2500 Z 700 Ω)2000 Ω) 25 R Ω) 600 (mpedance11500000 (mpedance1250 X (mpedance345000000 I Z R I10 I200 Z 500 5 100 R X X 0 0 0 1 10 100 1000 10000 1 10 100 1000 10000 1 10 100 1000 10000 Frequency(MHz) Frequency(MHz) Frequency(MHz) MMZ1608F750B MMZ1608F121B 2000 6000 5000 1500 Ω) Ω)4000 (mpedance1000 (mpedance23000000 I 500 I R Z 1000 X Z R X 0 0 1 10 100 1000 10000 1 10 100 1000 10000 Frequency(MHz) Frequency(MHz) (cid:127) All specifications are subject to change without notice. 001-05 / 20111129 / e9412_mmz

(19/26) PACKAGING STYLES REEL DIMENSIONS TAPE DIMENSIONS 1 5 Sprocket hole 1.5+–00..01 Cavity ±750.±50.0 1.0 1. 3. 3 min. ±00. 0 8. 6 ø 2 1.1max. 1.1±0.2 4.0±0.1 4.0±0.1 0. ± 9 2.0±0.05 1. 2.0±0.5 8.4+–02..00 ø13±0.2 14.4max. 160min. Taping 200min. ø21±0.8 ø180±2.0 Dimensions in mm Drawing direction 300min. Dimensions in mm (cid:127) All specifications are subject to change without notice. 001-05 / 20111129 / e9412_mmz

(20/26) Chip Beads Conformity to RoHS Directive For Signal Line MMZ Series MMZ2012 FEATURES MATERIAL CHARACTERISTICS (cid:127) Chip bead(impeder), MMZ series offers 4 construction materials. R material: For wide frequency applications calling for broad (cid:127) Size standardized for use by automatic assembly equipment. impedance characteristics. No preferred orientation. For digital signal line applications calling requiring (cid:127) Either flow or reflow soldering methods can be used due to good waveform integrity. Impedance values selected electroplating of the terminal electrodes. for effectiveness at 10 to 200MHz. (cid:127) High reliability due to an entirely monolithic structure. S material: Standard type that features impedance characteristics (cid:127) Closed magnetic circuit structure allows high-density installation similar to those of a typical ferrite core. while preventing crosstalk between circuits. For signal line applications in which the blocking region (cid:127) Low DC resistance structure of electrode prevents wasteful is near 100MHz. Impedance values selected for effec- electric power consumption. tiveness at 40 to 300MHz. (cid:127) The products contain no lead and also support lead-free Y material: High frequency range type intended for the 100MHz soldering. region and above. (cid:127) It is a product conforming to RoHS directive. For signal line applications in which the signal fre- quency is far from the cutoff frequency. Impedance val- APPLICATIONS ues selected for effectiveness at 80 to 400MHz. Removal of signal line noises of cellular phones, PCs, note PCs, D material: For applications calling for low insertion loss at low fre- TVs, TV tuners, STBs, audio players, DVDs, DSCs, DVCs, game quencies and sharply increasing impedance at high machines, digital photo frames, car navigation system, PNDs, etc. frequencies. Designed for high impedance at high fre- quencies (200 to 500MHz) for signal line applications. PRODUCT IDENTIFICATION MMZ 2012 R 121 A T TYPICAL MATERIAL CHARACTERISTICS (1) (2) (3) (4) (5) (6) (7) 2500 (1) Series name 2000 (2) Dimensions L×W Ω) Y (3) Type name (e 1500 c (4)Impedance an d 121:120Ω at 100MHz mpe 1000 S D (5) Characteristic type I R (6) Packaging style 500 T:Taping (7) TDK internal code 0 10 100 1000 Frequency(MHz) HANDLING AND PRECAUTIONS (cid:127) Before soldering, be sure to preheat components. The preheat- ing temperature should be set so that the temperature difference between the solder temperature and product temperature does not exceed 150°C. (cid:127) After mounting components onto the printed circuit board, do not apply stress through board bending or mishandling. (cid:127) Do not expose the inductors to stray magnetic fields. (cid:127) Avoid static electricity discharge during handling. (cid:127) When hand soldering, apply the soldering iron to the printed cir- cuit board only. Temperature of the iron tip should not exceed 350°C. Soldering time should not exceed 3 seconds. (cid:127) Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications. (cid:127) Please contact our Sales office when your application is considered the following: The device’s failure or malfunction may directly endanger human life (e.g. application for automobile/aircraft/medical/nuclear power devices, etc.) (cid:127) All specifications are subject to change without notice. 001-05 / 20111129 / e9412_mmz

(21/26) SHAPES AND DIMENSIONS/RECOMMENDED PC BOARD ELECTRICAL CHARACTERISTICS PATTERN Impedance DC resistance Rated current Part No. (Ω)[100MHz]∗ (Ω)max. (mA)max. 2±0.2 MMZ2012R150A 15±25% 0.05 1500 2 MMZ2012R300A 30±25% 0.05 1500 0. ± 2 MMZ2012R600A 60±25% 0.10 1000 1.25 1. MMZ2012R121A 120±25% 0.12 800 0.5±0.3 0.8 1 0.8 MMZ2012R301A 300±25% 0.15 600 MMZ2012R601A 600±25% 0.20 500 2 0. Weight: 8mg MMZ2012R102A 1000±25% 0.30 500 ± 0.85 Dimensions in mm MMMMZZ22001122SS480000AA 4800±±2255%% 00..1100 1800000 MMZ2012S121A 120±25% 0.15 800 TEMPERATURE RANGES MMZ2012S181A 180±25% 0.15 600 Operating/storage –55 to +125°C MMZ2012S301A 300±25% 0.20 600 MMZ2012S601A 600±25% 0.30 500 PACKAGING STYLE AND QUANTITIES MMZ2012S102A 1000±25% 0.35 500 Packaging style Quantity MMZ2012Y150B 15±25% 0.05 1500 Taping 4000 pieces/reel MMZ2012Y300B 30±25% 0.05 1500 MMZ2012Y600B 60±25% 0.10 1000 RECOMMENDED SOLDERING CONDITION MMZ2012Y121B 120±25% 0.12 800 MMZ2012Y301B 300±25% 0.15 600 REFLOW SOLDERING MMZ2012Y601B 600±25% 0.20 500 MMZ2012Y102B 1000±25% 0.30 500 MMZ2012Y152B 1500±25% 0.40 500 10s max. MMZ2012Y202B 2000±25% 0.50 400 250 to 260˚C MMZ2012D800B 80±25% 0.30 500 Natural cooling MMZ2012D121B 120±25% 0.30 500 230˚C MMZ2012D301B 300±25% 0.50 400 ∗ Test equipment: E4991A or equivalent 180˚C Test tool: 16192A or equivalent Test temperature: 25±10°C 150˚C Preheating Soldering 60 to 120s 30 to 60s Time(s) TYPICAL ELECTRICAL CHARACTERISTICS Z, X, R vs. FREQUENCY CHARACTERISTICS MMZ2012R150A MMZ2012R300A MMZ2012R600A 25 40 90 35 80 20 70 30 Ω) Ω) Ω) 60 (mpedance1105 Z R (mpedance122505 Z R (mpedance345000 Z R I 5 X I10 X I20 X 5 10 0 0 0 1 10 100 1000 10000 1 10 100 1000 10000 1 10 100 1000 10000 Frequency(MHz) Frequency(MHz) Frequency(MHz) MMZ2012R121A MMZ2012R301A MMZ2012R601A 140 350 700 120 300 600 Ω)100 Ω) 250 Ω) 500 (ce80 Z (ce200 Z (ce400 Z an R an R an R ed60 ed150 ed300 p p p m m m I40 X I100 I200 20 50 100 X X 0 0 0 1 10 100 1000 10000 1 10 100 1000 10000 1 10 100 1000 10000 Frequency(MHz) Frequency(MHz) Frequency(MHz) (cid:127) All specifications are subject to change without notice. 001-05 / 20111129 / e9412_mmz

(22/26) TYPICAL ELECTRICAL CHARACTERISTICS Z, X, R vs. FREQUENCY CHARACTERISTICS MMZ2012R102A MMZ2012S400A MMZ2012S800A 1200 60 140 1000 50 120 Ω()ance680000 Z R Ω()ance3400 Z Ω()ance18000 Z R ed ed R ed 60 p p p m400 m20 m I I I 40 X 200 10 20 X X 0 0 0 1 10 100 1000 10000 1 10 100 1000 10000 1 10 100 1000 10000 Frequency(MHz) Frequency(MHz) Frequency(MHz) MMZ2012S121A MMZ2012S181A MMZ2012S301A 180 300 450 160 400 250 140 350 Ω) 120 Ω) 200 Ω) 300 (e (e (e anc100 Z R anc150 R anc250 Z d 80 d Z d200 pe pe pe R m 60 m100 m150 I 40 X I X I100 50 X 20 50 0 0 0 1 10 100 1000 10000 1 10 100 1000 10000 1 10 100 1000 10000 Frequency(MHz) Frequency(MHz) Frequency(MHz) MMZ2012S601A MMZ2012S102A MMZ2012Y150B 700 1200 30 600 1000 25 Ω) 500 Ω) 800 Ω) 20 Z (mpedance340000 Z R (mpedance460000 Z R (mpedance1105 R I200 X I I X 100 200 X 5 0 0 0 1 10 100 1000 10000 1 10 100 1000 10000 1 10 100 1000 10000 Frequency(MHz) Frequency(MHz) Frequency(MHz) MMZ2012Y300B MMZ2012Y600B MMZ2012Y121B 50 120 200 100 40 150 Ω) Z Ω) 80 Ω) (ce30 (ce Z (ce Z R dan R dan 60 R dan100 e20 e e p p p Im X Im 40 X Im 50 X 10 20 0 0 0 1 10 100 1000 10000 1 10 100 1000 10000 1 10 100 1000 10000 Frequency(MHz) Frequency(MHz) Frequency(MHz) (cid:127) All specifications are subject to change without notice. 001-05 / 20111129 / e9412_mmz

(23/26) TYPICAL ELECTRICAL CHARACTERISTICS Z, X, R vs. FREQUENCY CHARACTERISTICS MMZ2012Y301B MMZ2012Y601B MMZ2012Y102B 600 800 1200 700 500 1000 600 Ω()mpedance234000000 Z R Ω()mpedance 543000000 Z R Ω()mpedance468000000 Z R I X I 200 X I X 100 200 100 0 0 0 1 10 100 1000 10000 1 10 100 1000 10000 1 10 100 1000 10000 Frequency(MHz) Frequency(MHz) Frequency(MHz) MMZ2012Y152B MMZ2012Y202B MMZ2012D800B 1800 2500 700 1600 600 1400 2000 Ω)1200 Ω) R Ω) 500 (ce1000 (ce1500 Z (ce400 an Z R an an ed 800 ed1000 ed300 p p p m 600 m X m I X I I200 400 500 Z 100 200 R X 0 0 0 1 10 100 1000 10000 1 10 100 1000 10000 1 10 100 1000 10000 Frequency(MHz) Frequency(MHz) Frequency(MHz) MMZ2012D121B MMZ2012D301B 1200 4500 4000 1000 3500 Ω) 800 Ω)3000 (e (e c c2500 an600 an d d2000 e e p p m400 m1500 I Z I 1000 200 R Z R X 500 X 0 0 1 10 100 1000 10000 1 10 100 1000 10000 Frequency(MHz) Frequency(MHz) PACKAGING STYLES REEL DIMENSIONS TAPE DIMENSIONS 1 5 1.0 Sprocket hole 1.5+–00..01 Cavity ±1.750.±3.50.0 3 n. 0. mi ±0 60 8. ø 2 1.1max. 1.5±0.2 4.0±0.1 4.0±0.1 0. ± 2.0±0.05 2.3 2.0±0.5 8.4+–02..00 ø13±0.2 14.4max. 160min. Taping 200min. ø21±0.8 ø180±2.0 Dimensions in mm Drawing direction 300min. Dimensions in mm (cid:127) All specifications are subject to change without notice. 001-05 / 20111129 / e9412_mmz

(24/26) Chip Beads Conformity to RoHS Directive For Signal Line MMZ Series MMZ1005-E FEATURES PRODUCT IDENTIFICATION (cid:127) Compared with the existing MMZ1005 type, this new product MMZ 1005 S 601 E T has broad-band impedance values for higher frequency ranges. (1) (2) (3) (4) (5) (6) (7) (cid:127) Size standardized for use by automatic assembly equipment. No preferred orientation. (1) Series name (cid:127) Electroplated terminal electrodes accommodate reflow (2) Dimensions L×W soldering. (cid:127) High reliability due to an entirely monolithic structure. (3) Type name (cid:127) Closed magnetic circuit structure allows high-density installation (4) Impedance while preventing crosstalk between circuits. 601:600Ω at 100MHz (cid:127) Low DC resistance structure of electrode prevents wasteful (5) Characteristic type electric power consumption. (6) Packaging style (cid:127) It is a product conforming to RoHS directive. T:Taping (7) TDK internal code APPLICATIONS Removal of signal line noises of cellular phones, PCs, note PCs, PACKAGING STYLE AND QUANTITIES TVs, TV tuners, STBs, audio players, DVDs, DSCs, DVCs, game Packaging style Quantity machines, digital photo frames, car navigation system, PNDs, etc. Taping 10000 pieces/reel TEMPERATURE RANGES Operating/storage –55 to +125°C HANDLING AND PRECAUTIONS (cid:127) Before soldering, be sure to preheat components. The preheat- SHAPES AND DIMENSIONS/RECOMMENDED PC BOARD ing temperature should be set so that the temperature difference PATTERN between the solder temperature and product temperature does 1±0.05 not exceed 150°C. (cid:127) After mounting components onto the printed circuit board, do not 5 0.0 5 apply stress through board bending or mishandling. ±5 0. (cid:127) Do not expose the inductors to stray magnetic fields. 0. 0.1min. 0.5 0.4 0.5 (cid:127) Avoid static electricity discharge during handling. 5 (cid:127) When hand soldering, apply the soldering iron to the printed cir- 0 Weight: 1mg ±0. cuit board only. Temperature of the iron tip should not exceed 5 Dimensions in mm 0. 350°C. Soldering time should not exceed 3 seconds. ELECTRICAL CHARACTERISTICS RECOMMENDED SOLDERING CONDITION Impedance(Ω)∗ DC Rated REFLOW SOLDERING Part No. resistance current [100MHz] [1GHz] (Ω)max. (mA)max. MMZ1005S601E 600±25% 1000±40% 0.65 300 10s max. MMZ1005S102E 1000±25% 1400±40% 1.00 250 250 to 260˚C MMZ1005S182E 1800±25% 1800±40% 1.50 200 Natural cooling MMZ1005A601E 600±25% 1400±40% 0.80 300 230˚C MMZ1005A102E 1000±25% 2000±40% 1.20 250 MMZ1005A152E 1500±25% 2300±40% 1.60 230 180˚C MMZ1005A182E 1800±25% 2700±40% 2.10 200 MMZ1005A222E 2200±25% 3000±40% 2.20 150 150˚C MMZ1005D121E 120±25% 1000±40% 0.70 300 Preheating Soldering MMZ1005D221E 220±25% 1700±40% 1.00 250 60 to 120s 30 to 60s MMZ1005F470E 47±25% 800±40% 0.70 300 MMZ1005F750E 75±25% 1500±40% 1.00 250 Time(s) MMZ1005F121E 120±25% 2300±40% 1.50 200 ∗ Test equipment: E4991A or equivalent Test tool: 16192A or equivalent Test temperature: 25±10°C (cid:127) Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications. (cid:127) Please contact our Sales office when your application is considered the following: The device’s failure or malfunction may directly endanger human life (e.g. application for automobile/aircraft/medical/nuclear power devices, etc.) (cid:127) All specifications are subject to change without notice. 001-05 / 20111129 / e9412_mmz

(25/26) TYPICAL ELECTRICAL CHARACTERISTICS Z FREQUENCY CHARACTERISTICS(DIFFERS ACCORDING TO SERIES) MMZ1005S-E SERIES MMZ1005A-E SERIES MMZ1005D-E SERIES 3000 5000 MMZ1005A222E 2000 MMZ1005S182E 4500 MMZ1005A182E 1800 MMZ1005D221E 2500 MMZ1005S102E 4000 MMZ1005A152E 1600 Ω)2000 Ω) 3500 MMZ1005A102E Ω)1400 MMZ1005D121E (Impedance11050000 MMZ1005S601E (Impedance1223505000000000 MMZ1005A601E (Impedance11680200000000 500 1000 400 500 200 0 0 0 1 10 100 1000 10000 1 10 100 1000 10000 1 10 100 1000 10000 Frequency(MHz) Frequency(MHz) Frequency(MHz) MMZ1005F-E SERIES 3000 MMZ1005F121E 2500 MMZ1005F750E Ω)2000 (e c MMZ1005F470E an1500 d e p m1000 I 500 0 1 10 100 1000 10000 Frequency(MHz) Z, X, R vs. FREQUENCY CHARACTERISTICS MMZ1005S601E MMZ1005S102E MMZ1005S182E 1000 1600 3000 1400 2500 800 Z 1200 Ω) Ω) Z Ω)2000 (e 600 (e1000 (e danc R danc 800 R danc1500 Z R pe 400 pe 600 pe m m X m1000 I 200 X I 400 I X 500 200 0 0 0 1 10 100 1000 10000 1 10 100 1000 10000 1 10 100 1000 10000 Frequency(MHz) Frequency(MHz) Frequency(MHz) MMZ1005A601E MMZ1005A102E MMZ1005A152E 1600 2500 3000 1400 2500 2000 1200 Z Ω) Z Ω) Z Ω)2000 (e1000 (e1500 (e R c c c dan 800 R dan R dan1500 pe 600 pe1000 pe m m m1000 I 400 I I X 500 X X 500 200 0 0 0 1 10 100 1000 10000 1 10 100 1000 10000 1 10 100 1000 10000 Frequency(MHz) Frequency(MHz) Frequency(MHz) (cid:127) All specifications are subject to change without notice. 001-05 / 20111129 / e9412_mmz

(26/26) TYPICAL ELECTRICAL CHARACTERISTICS Z, X, R vs. FREQUENCY CHARACTERISTICS MMZ1005A182E MMZ1005A222E 3500 4500 4000 3000 3500 Ω)2500 Z Ω)3000 Z (ce2000 (ce2500 an R an R ed1500 ed2000 p p m m1500 I1000 I X 1000 500 X 500 0 0 1 10 100 1000 10000 1 10 100 1000 10000 Frequency(MHz) Frequency(MHz) MMZ1005D121E MMZ1005D221E 1200 2000 1000 1500 Ω) 800 Ω) Z (ce Z R (ce R an 600 an1000 d d e e mp 400 mp I I 500 200 X X 0 0 1 10 100 1000 10000 1 10 100 1000 10000 Frequency(MHz) Frequency(MHz) MMZ1005F470E MMZ1005F750E MMZ1005F121E 1200 1800 3000 1600 1000 2500 1400 Ω) 800 Ω)1200 Ω)2000 (ance 600 Z R (ance1000 Z R (ance1500 Z R d d 800 d e e e mp 400 mp 600 mp1000 I I I 400 200 500 X 200 X X 0 0 0 1 10 100 1000 10000 1 10 100 1000 10000 1 10 100 1000 10000 Frequency(MHz) Frequency(MHz) Frequency(MHz) PACKAGING STYLES REEL DIMENSIONS TAPE DIMENSIONS 1 5 Sprocket hole 1.5+–00..01 Cavity ±750.±50.0 1.0 1. 3. 3 min. ±00. 0 8. 6 ø 0.8max. 0.65±0.1 4.0±0.1 0.1 ± 2.0±0.05 2.0±0.05 15 1. 2.0±0.5 8.4+–02..00 160min. Taping 200min. ø13±0.2 14.4max. ø21±0.8 ø180±2.0 Dimensions in mm Drawing direction 300min. Dimensions in mm (cid:127) All specifications are subject to change without notice. 001-05 / 20111129 / e9412_mmz