ICGOO在线商城 > 906-31-2-12-2-B-0
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906-31-2-12-2-B-0产品简介:
ICGOO电子元器件商城为您提供906-31-2-12-2-B-0由Wakefield设计生产,在icgoo商城现货销售,并且可以通过原厂、代理商等渠道进行代购。 提供906-31-2-12-2-B-0价格参考以及Wakefield906-31-2-12-2-B-0封装/规格参数等产品信息。 你可以下载906-31-2-12-2-B-0参考资料、Datasheet数据手册功能说明书, 资料中有906-31-2-12-2-B-0详细功能的应用电路图电压和使用方法及教程。
参数 | 数值 |
产品目录 | |
描述 | HEATSINK 31X31X12MM PIN散热片 CHIPSET H/S PIN FIN 31mm 11.6mm H B/A |
产品分类 | |
品牌 | Wakefield-Vette |
产品手册 | |
产品图片 | |
rohs | 符合RoHS无铅 / 符合限制有害物质指令(RoHS)规范要求 |
产品系列 | Wakefield 906-31-2-12-2-B-0906 |
mouser_ship_limit | 该产品可能需要其他文档才能发货到中国。 |
数据手册 | |
产品型号 | 906-31-2-12-2-B-0 |
不同强制气流时的热阻 | 3.4°C/W @ 200 LFM |
不同温升时功率耗散 | - |
产品 | Heat Sinks |
产品培训模块 | http://www.digikey.cn/PTM/IndividualPTM.page?site=cn&lang=zhs&ptm=30609 |
产品种类 | Heatsink |
其它名称 | 345-1152 |
冷却封装 | BGA |
商标 | Wakefield |
安装风格 | Spring Screw |
宽度 | 1.220"(30.99mm) |
形状 | 方形,鳍片 |
接合方法 | 夹 |
散热片材料 | Aluminium Alloy |
散热片样式 | Pin |
材料 | 铝 |
材料镀层 | 黑色阳极化处理 |
标准包装 | 50 |
热阻 | 10.71 C/W |
特色产品 | http://www.digikey.cn/product-highlights/zh/901910-series-clipchip-heat-sinks/52778 |
直径 | - |
离基底高度(鳍片高度) | 0.457"(11.60mm) |
类型 | 顶部安装 |
系列 | 906 |
自然条件下热阻 | 12°C/W |
设计目的 | 31 mm Components |
长度 | 1.220"(30.99mm) |
颜色 | Black |
高度 | 11.6 mm |
901-910 SERIES CHIPSET HEAT SINKS PIN FIN & ELLIPTICAL HEAT SINKS Wakefield-Vette’s 901-910 Series Heat Sinks for Chipset can match up to devices from Intel, Broadcom, Xilinx. TI, Motorola and many more! These heat sinks are designed for air flow applications. Enclosed pages Wakefield-Vette heat sink assembles onto chip set using the space that is between the have thermal performance data for natural PCB and the substrate of the solder balls. forced convection values. The solder balls provide a minimal gap of .5mm to .7mm. Attachment feature is below a .4mm thickness. The clipping system will not interfere or damage chip. Contact area 4 Springs at is the edge of chip. each corner Thermal Cooling Solutions from SMART to FINISH
901-910 SERIES CHIPSET HEAT SINKS Material: AL 6063 Finish: Black Anodize All dimensions in millimeters (mm) Part Numbering System * *Note: When selecting part number chip set thickness (CST) relates to spring selection! Thermal Cooling Solutions from SMART to FINISH
901-910 SERIES CHIPSET HEAT SINKS THERMAL PERFORMANCE Thermal Cooling Solutions from SMART to FINISH
901-910 SERIES CHIPSET HEAT SINKS THERMAL PERFORMANCE Thermal Cooling Solutions from SMART to FINISH
901-910 SERIES CHIPSET HEAT SINKS STEP 1: Center heat Sink onto BGA. Tilt and hook one side of SHOCK TEST SPECIFICATION: the clip under the Wave Form :Half sine wave BGA chip. Acceleration :50 g Duration Time :11 ms No. of Shock :Each axis 3 times Shock Direction :±X, ±Y, ±Z axis STEP 2: Press down Reliability & Communication Testing the other side of Instruments clip to snap it onto Random Vibration test the BGA chip. Frequency :5 Hz to 500 Hz Acceleration :3.13 grms P.S.D :0.01 g2/HZ (5 Hz) 0.02 g2/HZ (20 Hz to 500 Hz) Test Axis :X, Y, Z axis STEP :3 Make sure Test Time :10 mins (Each axis) the stop pin is not Total Test Time :30 mins on top of the chip set. Installation Done! Thermal Cooling Solutions from SMART to FINISH
901-910 SERIES CHIPSET HEAT SINKS Contact Us / Corporate Location Information Wakefield-Vetteis Global. Global presence means our engineering, design, salesand support are close to our customers, in the Americas, Europe, Middle East and Asia. Itmean multi-national manufacturing and delivery. And it means a global Wakefield-Vettesupply chain that can deliver, and provide support quickly, anywhere, with the highest quality solutions. Contact sales for a list of Distributors that carry stock. East Coast Operations New Hampshire 33 Bridge Street Pelham.NH03076 Phone: 603-635-2800 Fax: 603-635-1900 Info@wakefield-vette.com (Wakefield-VetteHeadquarters) 2013 Wakefield-Vette. All rights reserved. Information is subject to change without notice. Wakefield-Vetteassumes no liability for the errors that may appear in this document. Visit us on the web at:www.wakefield-vette.com Thermal Cooling Solutions from SMART to FINISH
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