BIPOLAR ANALOG INTEGRATED CIRCUIT UPC2771TB T 3 V, SUPER MINIMOLD MEDIUM POWER SI MMIC AMPLIFIER U FEATURES GAIN vs. FREQUENCY AND TEMPERATURE • HIGH GAIN: 21 dB at 900 to 1500 MHz Typical 24 • HIGH OUTPUT POWER: PSAT = +12.5 dBm at 900 MHz TA = -40˚ C +11 dBm at 1500 MHz 22 • LOW BIAS VOLTAGE: 3.0 V Typical, 2.7 V Minimum • SUPER SMALL PACKAGE: SOT-363 B) O d 20 +85˚ C • TAPE AND REEL PACKAGING OPTION AVAILABLE (S TA = +25˚ C TA = +85˚ C G n, DESCRIPTION ai 18 G The UPC2771TB is a Silicon Monolithic integrated circuit +25˚ C which is manufactured using the NESAT™ III process. The -16 -40˚ C NESAT III process produces transistors with fT approaching 20 VCC = 3.0 V GHz. The UPC2771TB is pin compatible and has comparable 14 performance as the larger UPC2771T, so it is suitable for use E 0.1 0.3 1.0 3.0 as a replacement to help reduce system size. The IC is housed Frequency, f (GHz) in a 6 pin super minimold or SOT-363 package. Operating on a 3 volt supply, this IC is ideally suited for hand-held, portable designs. NEC's stringent quality assurance and test procedures ensure S the highest reliability and performance. ELECTRICAL CHARACTERISTICS (TA = 25(cid:176) C, ZL = ZS = 50 W , VCC = 3.0 V) PART NUMBER UPC2771TB PACAKAGE OUTLINE S06 SYMBOLS PARAMETERS AND CONDITIONS UNITS MIN TYP MAX ICC Circuit Current (no signal) mA 36 45 GS Small Signal Gain, f = 900 MHz dB 19 21 24 f = 1500 MHz dB 18 21 24 fU Upper Limit Operating Frequency (The gain at fU is 3 dB down from the gain at 100 MHz) GHz 1.8 2.2 H P1dB 1 dB Compressed Output Power, f = 900 MHz dBm +9 +11.5 f = 1500 MHz dBm +7 +9.5 PSAT Saturated Output Power, f = 900 MHz dBm +12.5 f = 1500 MHz dBm +11 NF Noise Figure, f = 900 MHz dB 6 7.5 f = 1500 MHz dB 6 7.5 P RLIN Input Return Loss, f = 900 MHz dB 10 14 f = 1500 MHz dB 10 14 RLOUT Output Return Loss, f = 900 MHz dB 6.5 9.0 f = 1500 MHz dB 5.5 8.5 ISOL Isolation, f = 900 MHz dB 25 30 f = 1500 MHz dB 25 30 OIP3 SSB OutputThird Order Intercept Point f = 900, 902 MHz, POUT = +4 dBm dBm +13 f = 1500, 1502 MHz, POUT = +4 dBm dBm +10 PADJ1 Adjacent Channel Power 1, f = 900 mHz, p /4 QPSK wave1, POUT = +7 dBm D f = – 50 kHz dBc -61 D f = – 100 kHz dBc -72 PADJ2 Adjacent Channel Power 2, f = 1.5 GHz, p /4 QPSK wave1, POUT = +7 dBm D f = – 50 kHz dBc -59 D f = – 100 kHz dBc -71 Note: 1.p /4 QPSK modulated wave input, data rate 42 kbps, Filter roll off a = 0.5

UPC2771TB ABSOLUTE MAXIMUM RATINGS1 (TA = 25(cid:176) C) TEST CIRCUIT SYMBOLS PARAMETERS UNITS RATINGS VCC VCC Supply Voltage V 3.6 1000 pF ICC Total Supply Current mA 77.7 PIN Input Power dBm +13 T PT Total Power Dissipation2 mW 270 L=1000 nH TOP Operating Temperature (cid:176) C -40 to +85 6 TSTG Storage Temperature (cid:176) C -55 to +150 50 W 1 4 50 W IN OUT Notes: 1000 pF U1000 pF 1. Operation in excess of any one of these parameters may result in permanent damage. 2. Mounted on a 50 X 50 X 1.6 mm epoxy glass PWB (TA = 85(cid:176) C). 2, 3, 5 RECOMMENDED OPERATING CONDITIONS O SYMBOLS PARAMETERS UNITS MIN TYP MAX VCC Supply Voltage V 2.7 3 3.3 TOP Operating Temperature (cid:176)C -40 +25 +85 - TYPICAL PERFORMANCE CURVES (TA = 25(cid:176) C) E CIRCUIT CURRENT vs. VOLTAGE CIRCUIT CURRENT vs. TEMPERATURE 50 50 A) 40 S A) 40 m m nt, I (CC 30 nt, I (CC 30 e e Curr 20 Curr20 uit A uit Circ 10 Circ10 0 0 0 1 2 3 4 -60 -40 -20 0 20 40 60 80 100 Supply VoHltage, VCC (V) Temperature ((cid:176) C) GAIN AND NOISE FIGURE INPUT RETURN LOSS AND vs. FREQUENCY AND VOLTAGE OUTPUT RETURN LOSS vs. FREQUENCY 24 P 0 VCC = 2.7V VCC = 3.0V VCC = 3.3V VCC = 3.0V 22 20 GS -10 RLout VCC = 3.3V VCC = 3.0 V 18 B) B) d Gain, G (dS 111642 VCC = 3.3 V VCC = 3.0V VCC = 2.7 V 7 e, NF (dB) Return Loss (-20 RLin ur -30 10 5 g Fi NF e 8 VCC = 2.7 V s oi 6 3 N -40 0.1 0.3 1.0 3.0 0.1 0.3 1.0 3.0 Frequency, f (GHz) Frequency, f (GHz)

UPC2771TB TYPICAL PERFORMANCE CURVES (TA = 25(cid:176) ) OUTPUT POWER vs. ISOLATION vs. FREQUENCY INPUT POWER AND VOLTAGE 0 15 VCC = 3.0V VCC = 3.3 V f = 900 MHz T -10 m) 10 B) dB L (d-20 (UT VCC = 2.7 V ation, ISO-30 Power, PO 5 UVCC = 3.0 V Isol put 0 -40 ut O O -50 -5 0.1 0.3 1.0 3.0 -25 -20 -15 -10 -5 0 Frequency, f (GHz) Input Power, PIN (dBm) SATURATED OUTPUT POWER vs. -SATURATED OUTPUT POWER vs. FREQUENCY AND VOLTAGE FREQUENCY AND TEMPERATURE m) 17 Em) 17 B Pin = -3 dBm B Pin = -3 dBm d d (T), 15 VCC = 3.3 V (T), 15 SA SA TA = +85˚C PO( 13 PO( 13 er, er, TA = +25˚C w VCC = 3.0 V S w ut Po 11 VCC = 2.7 V ut Po 11 TA = -40˚C p p ut 9 ut 9 O O d d e e at 7 at 7 ur A ur at at S 5 S 5 0.1 0.3 1.0 3.0 0.1 0.3 1.0 3.0 Frequency, f (GHz) Frequency, f (GHz) H P

UPC2771TB OUTLINE DIMENSIONS (Units in mm) LEAD CONNECTIONS UPC2771TB PACKAGE OUTLINE S06 (Top View) (Bottom View) 2.1– 0.1 T 1.25– 0.1 3 4 4 3 H 2.0– 0.2 0 . 2 +0.1(cid:13) 2 -0 2 5 5 2 0.65 3 4 C U 1.3 0.65 2 5 1 6 6 1 1 6 DOT ON(cid:13) 1. INPUT O BACK SIDE 2. GND 0.9 – 0.1 3. GND 4. OUTPUT 0.7 5. GND 6. VCC +0.1(cid:13) 0(cid:17)~0.1 0.15 -0.5 - E PIN DESCRIPTION Pin Pin Applied Description Internal No. Name Voltage Equivalent (V) S Circuit 1 Input — Signal input pin. An internal matching circuit, configured 6 with resistors, enables 50 W connection over a wide bandwidth. A multi-feedback circuit is designed to cancel the deviations of hFE and resistance. This pin must be coupled to the signal source with a blocking capacitor. 4 A 4 Output Signal output pin. Connect an inductor between this pin and VCC to supply current to the internal output transistors. 6 VCC 2.7 to 3.3 Power supply pin. This pin should be externally equipped 1 with a bypass capacitor to minimize ground impedance. 2 GND 0 Ground pins. These pins should be connected to system ground with minimum inductance. Ground pattern on the H board should be formed as wide as possible. All the ground pins must be connected together with wide ground pattern to minimize impedance difference. 3 2 5 P ORDERING INFORMATION PART NUMBER QTY UPC2771TB-E3-A 3K/Reel Note: Embossed Tape, 8 mm wide. Pins 1, 2 and 3 face perforated side of tape.

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