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PACKAGE OPTION ADDENDUM www.ti.com 6-May-2009 PACKAGING INFORMATION OrderableDevice Status(1) Package Package Pins Package EcoPlan(2) Lead/BallFinish MSLPeakTemp(3) Type Drawing Qty 5962-9203101M2A OBSOLETE LCCC FK 20 TBD CallTI CallTI 5962-9203101MEA OBSOLETE CDIP J 16 TBD CallTI CallTI 5962-9203102MEA OBSOLETE CDIP J 16 TBD CallTI CallTI 5962-9203103Q2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N/AforPkgType 5962-9203103QEA ACTIVE CDIP J 16 1 TBD A42SNPB N/AforPkgType UC1861J OBSOLETE CDIP J 16 TBD CallTI CallTI UC1861J883B OBSOLETE CDIP J 16 TBD CallTI CallTI UC1863J ACTIVE CDIP J 16 1 TBD A42SNPB N/AforPkgType UC1863J883B ACTIVE CDIP J 16 1 TBD A42SNPB N/AforPkgType UC1863L ACTIVE LCCC FK 20 1 TBD POST-PLATE N/AforPkgType UC1863L883B ACTIVE LCCC FK 20 1 TBD POST-PLATE N/AforPkgType UC1864J OBSOLETE CDIP J 16 TBD CallTI CallTI UC1864J883B OBSOLETE CDIP J 16 TBD CallTI CallTI UC1864L OBSOLETE LCCC FK 20 TBD CallTI CallTI UC1864L883B OBSOLETE LCCC FK 20 TBD CallTI CallTI UC1865J OBSOLETE CDIP J 16 TBD CallTI CallTI UC1865J883B OBSOLETE CDIP J 16 TBD CallTI CallTI UC1867J OBSOLETE CDIP J 16 TBD CallTI CallTI UC1867L OBSOLETE LCCC FK 20 TBD CallTI CallTI UC2861DW ACTIVE SOIC DW 16 40 Green(RoHS& CUNIPDAU Level-2-260C-1YEAR noSb/Br) UC2861DWG4 ACTIVE SOIC DW 16 40 Green(RoHS& CUNIPDAU Level-2-260C-1YEAR noSb/Br) UC2861N ACTIVE PDIP N 16 25 Green(RoHS& CUNIPDAU N/AforPkgType noSb/Br) UC2861NG4 ACTIVE PDIP N 16 25 Green(RoHS& CUNIPDAU N/AforPkgType noSb/Br) UC2861Q ACTIVE PLCC FN 20 46 Green(RoHS& CUSN Level-2-260C-1YEAR noSb/Br) UC2861QG3 ACTIVE PLCC FN 20 46 Green(RoHS& CUSN Level-2-260C-1YEAR noSb/Br) UC2863DW ACTIVE SOIC DW 16 40 Green(RoHS& CUNIPDAU Level-2-260C-1YEAR noSb/Br) UC2863DWG4 ACTIVE SOIC DW 16 40 Green(RoHS& CUNIPDAU Level-2-260C-1YEAR noSb/Br) UC2863N ACTIVE PDIP N 16 25 Green(RoHS& CUNIPDAU N/AforPkgType noSb/Br) UC2863NG4 ACTIVE PDIP N 16 25 Green(RoHS& CUNIPDAU N/AforPkgType noSb/Br) UC2864DW ACTIVE SOIC DW 16 40 Green(RoHS& CUNIPDAU Level-2-260C-1YEAR noSb/Br) UC2864DWG4 ACTIVE SOIC DW 16 40 Green(RoHS& CUNIPDAU Level-2-260C-1YEAR noSb/Br) UC2865N ACTIVE PDIP N 16 25 Green(RoHS& CUNIPDAU N/AforPkgType noSb/Br) UC2865NG4 ACTIVE PDIP N 16 25 Green(RoHS& CUNIPDAU N/AforPkgType Addendum-Page1

PACKAGE OPTION ADDENDUM www.ti.com 6-May-2009 OrderableDevice Status(1) Package Package Pins Package EcoPlan(2) Lead/BallFinish MSLPeakTemp(3) Type Drawing Qty noSb/Br) UC2866N ACTIVE PDIP N 16 25 Green(RoHS& CUNIPDAU N/AforPkgType noSb/Br) UC2866NG4 ACTIVE PDIP N 16 25 Green(RoHS& CUNIPDAU N/AforPkgType noSb/Br) UC3861DW ACTIVE SOIC DW 16 40 Green(RoHS& CUNIPDAU Level-2-260C-1YEAR noSb/Br) UC3861DWG4 ACTIVE SOIC DW 16 40 Green(RoHS& CUNIPDAU Level-2-260C-1YEAR noSb/Br) UC3861N ACTIVE PDIP N 16 25 Green(RoHS& CUNIPDAU N/AforPkgType noSb/Br) UC3861NG4 ACTIVE PDIP N 16 25 Green(RoHS& CUNIPDAU N/AforPkgType noSb/Br) UC3862N ACTIVE PDIP N 16 25 Green(RoHS& CUNIPDAU N/AforPkgType noSb/Br) UC3862NG4 ACTIVE PDIP N 16 25 Green(RoHS& CUNIPDAU N/AforPkgType noSb/Br) UC3863DW ACTIVE SOIC DW 16 40 Green(RoHS& CUNIPDAU Level-2-260C-1YEAR noSb/Br) UC3863DWG4 ACTIVE SOIC DW 16 40 Green(RoHS& CUNIPDAU Level-2-260C-1YEAR noSb/Br) UC3863DWTR ACTIVE SOIC DW 16 2000 Green(RoHS& CUNIPDAU Level-2-260C-1YEAR noSb/Br) UC3863DWTRG4 ACTIVE SOIC DW 16 2000 Green(RoHS& CUNIPDAU Level-2-260C-1YEAR noSb/Br) UC3863N ACTIVE PDIP N 16 25 Green(RoHS& CUNIPDAU N/AforPkgType noSb/Br) UC3863NG4 ACTIVE PDIP N 16 25 Green(RoHS& CUNIPDAU N/AforPkgType noSb/Br) UC3864N ACTIVE PDIP N 16 25 Green(RoHS& CUNIPDAU N/AforPkgType noSb/Br) UC3864NG4 ACTIVE PDIP N 16 25 Green(RoHS& CUNIPDAU N/AforPkgType noSb/Br) UC3865DW ACTIVE SOIC DW 16 40 Green(RoHS& CUNIPDAU Level-2-260C-1YEAR noSb/Br) UC3865DWG4 ACTIVE SOIC DW 16 40 Green(RoHS& CUNIPDAU Level-2-260C-1YEAR noSb/Br) UC3865DWTR ACTIVE SOIC DW 16 2000 Green(RoHS& CUNIPDAU Level-2-260C-1YEAR noSb/Br) UC3865DWTRG4 ACTIVE SOIC DW 16 2000 Green(RoHS& CUNIPDAU Level-2-260C-1YEAR noSb/Br) UC3865N ACTIVE PDIP N 16 25 Green(RoHS& CUNIPDAU N/AforPkgType noSb/Br) UC3865NG4 ACTIVE PDIP N 16 25 Green(RoHS& CUNIPDAU N/AforPkgType noSb/Br) UC3865Q ACTIVE PLCC FN 20 46 Green(RoHS& CUSN Level-2-260C-1YEAR noSb/Br) UC3865QG3 ACTIVE PLCC FN 20 46 Green(RoHS& CUSN Level-2-260C-1YEAR noSb/Br) UC3867DW ACTIVE SOIC DW 16 40 Green(RoHS& CUNIPDAU Level-2-260C-1YEAR noSb/Br) Addendum-Page2

PACKAGE OPTION ADDENDUM www.ti.com 6-May-2009 OrderableDevice Status(1) Package Package Pins Package EcoPlan(2) Lead/BallFinish MSLPeakTemp(3) Type Drawing Qty UC3867DWG4 ACTIVE SOIC DW 16 40 Green(RoHS& CUNIPDAU Level-2-260C-1YEAR noSb/Br) UC3867DWTR ACTIVE SOIC DW 16 2000 Green(RoHS& CUNIPDAU Level-2-260C-1YEAR noSb/Br) UC3867DWTRG4 ACTIVE SOIC DW 16 2000 Green(RoHS& CUNIPDAU Level-2-260C-1YEAR noSb/Br) UC3867N ACTIVE PDIP N 16 25 Green(RoHS& CUNIPDAU N/AforPkgType noSb/Br) UC3867NG4 ACTIVE PDIP N 16 25 Green(RoHS& CUNIPDAU N/AforPkgType noSb/Br) UC3868N ACTIVE PDIP N 16 25 Green(RoHS& CUNIPDAU N/AforPkgType noSb/Br) UC3868NG4 ACTIVE PDIP N 16 25 Green(RoHS& CUNIPDAU N/AforPkgType noSb/Br) (1)Themarketingstatusvaluesaredefinedasfollows: ACTIVE:Productdevicerecommendedfornewdesigns. LIFEBUY:TIhasannouncedthatthedevicewillbediscontinued,andalifetime-buyperiodisineffect. NRND:Notrecommendedfornewdesigns.Deviceisinproductiontosupportexistingcustomers,butTIdoesnotrecommendusingthispartin anewdesign. PREVIEW:Devicehasbeenannouncedbutisnotinproduction.Samplesmayormaynotbeavailable. OBSOLETE:TIhasdiscontinuedtheproductionofthedevice. (2)EcoPlan-Theplannedeco-friendlyclassification:Pb-Free(RoHS),Pb-Free(RoHSExempt),orGreen(RoHS&noSb/Br)-pleasecheck http://www.ti.com/productcontentforthelatestavailabilityinformationandadditionalproductcontentdetails. TBD:ThePb-Free/Greenconversionplanhasnotbeendefined. Pb-Free(RoHS):TI'sterms"Lead-Free"or"Pb-Free"meansemiconductorproductsthatarecompatiblewiththecurrentRoHSrequirements forall6substances,includingtherequirementthatleadnotexceed0.1%byweightinhomogeneousmaterials.Wheredesignedtobesoldered athightemperatures,TIPb-Freeproductsaresuitableforuseinspecifiedlead-freeprocesses. Pb-Free(RoHSExempt):ThiscomponenthasaRoHSexemptionforeither1)lead-basedflip-chipsolderbumpsusedbetweenthedieand package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible)asdefinedabove. Green(RoHS&noSb/Br):TIdefines"Green"tomeanPb-Free(RoHScompatible),andfreeofBromine(Br)andAntimony(Sb)basedflame retardants(BrorSbdonotexceed0.1%byweightinhomogeneousmaterial) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incomingmaterialsandchemicals.TIandTIsuppliersconsidercertaininformationtobeproprietary,andthusCASnumbersandotherlimited informationmaynotbeavailableforrelease. InnoeventshallTI'sliabilityarisingoutofsuchinformationexceedthetotalpurchasepriceoftheTIpart(s)atissueinthisdocumentsoldbyTI toCustomeronanannualbasis. OTHERQUALIFIEDVERSIONSOFUC1861,UC1863,UC1864,UC1865,UC1867,UC3861,UC3863,UC3864,UC3865,UC3867: •Space:UC1863-SP NOTE:QualifiedVersionDefinitions: •Space-Radiationtolerant,ceramicpackagingandqualifiedforuseinSpace-basedapplication Addendum-Page3

PACKAGE MATERIALS INFORMATION www.ti.com 29-Jul-2008 TAPE AND REEL INFORMATION *Alldimensionsarenominal Device Package Package Pins SPQ Reel Reel A0(mm) B0(mm) K0(mm) P1 W Pin1 Type Drawing Diameter Width (mm) (mm) Quadrant (mm) W1(mm) UC3863DWTR SOIC DW 16 2000 330.0 16.4 10.85 10.8 2.7 12.0 16.0 Q1 UC3865DWTR SOIC DW 16 2000 330.0 16.4 10.85 10.8 2.7 12.0 16.0 Q1 UC3867DWTR SOIC DW 16 2000 330.0 16.4 10.85 10.8 2.7 12.0 16.0 Q1 PackMaterials-Page1

PACKAGE MATERIALS INFORMATION www.ti.com 29-Jul-2008 *Alldimensionsarenominal Device PackageType PackageDrawing Pins SPQ Length(mm) Width(mm) Height(mm) UC3863DWTR SOIC DW 16 2000 346.0 346.0 33.0 UC3865DWTR SOIC DW 16 2000 346.0 346.0 33.0 UC3867DWTR SOIC DW 16 2000 346.0 346.0 33.0 PackMaterials-Page2

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