Product Sample & Technical Tools & Support & Reference Folder Buy Documents Software Community Design TPS7A4001 SBVS162B–MARCH2011–REVISEDJULY2015 TPS7A4001 100-V Input Voltage, 50-mA, Very High Voltage Linear Regulator 1 Features 3 Description • VeryHighMaximumInputVoltage:100V The TPS7A4001 device is a very high voltage- 1 tolerant linear regulator that offers the benefits of a • WideInputVoltageRange:7to100V thermally-enhanced package (HVSSOP), and is able • Accuracy: to withstand continuous DC or transient input – Nominal:1% voltagesofupto100V. – OverLine,Load,andTemperature:2.5% The TPS7A4001 device is stable with any output • LowQuiescentCurrent:25 µA capacitance greater than 4.7 µF and any input capacitance greater than 1 µF (over temperature and • QuiescentCurrentatShutdown:4.1 µA tolerance). Therefore, implementations of this device • MaximumOutputCurrent:50mA require minimal board space because of its • CMOSLogic-Level-CompatibleEnablePin miniaturized packaging (HVSSOP) and a potentially small output capacitor. In addition, the TPS7A4001 • AdjustableOutputVoltagefromabout1.175to device offers an enable pin (EN) compatible with 90V standard CMOS logic to enable a low-current • StableWithCeramicCapacitors: shutdownmode. – InputCapacitance: ≥1 µF The TPS7A4001 device has an internal thermal – OutputCapacitance: ≥4.7 µF shutdown and current limiting to protect the system • DropoutVoltage:290mV during fault conditions. The HVSSOP packages has an operating temperature range of T = –40°C to • Built-InCurrentLimitandThermalShutdown J 125°C. Protection In addition, the TPS7A4001 device is ideal for • Package:HighThermalPerformanceHVSSOP generating a low-voltage supply from intermediate PowerPAD™ voltage rails in telecom and industrial applications; • OperatingTemperatureRange:–40°Cto125°C notonlycanitsupplyawell-regulatedvoltagerail,but it can also withstand and maintain regulation during 2 Applications very high and fast voltage transients. These features translate to simpler and more cost-effective electrical • Microprocessors,MicrocontrollersPoweredby surge-protection circuitry for a wide range of IndustrialBussesWithHighVoltageTransients applications, including PoE, bias supply, and LED • IndustrialAutomation lighting. • TelecomInfrastructure DeviceInformation(1) • Automotive • PoweroverEthernet(PoE) PARTNUMBER PACKAGE BODYSIZE(NOM) TPS7A4001 HVSSOP(8) 3.00mm×5.00mm • LEDLighting • BiasPowerSupplies (1) For all available packages, see the orderable addendum at theendofthedatasheet. TypicalApplicationSchematic 100 V V IN VIN IN OUT VOUT C IN TPS7A4001 CBYP R1 C OUT V EN FB EN GND R 2 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectualpropertymattersandotherimportantdisclaimers.PRODUCTIONDATA.

TPS7A4001 SBVS162B–MARCH2011–REVISEDJULY2015 www.ti.com Table of Contents 1 Features.................................................................. 1 7.4 DeviceFunctionalModes..........................................9 2 Applications........................................................... 1 8 ApplicationandImplementation........................ 10 3 Description............................................................. 1 8.1 ApplicationInformation............................................10 4 RevisionHistory..................................................... 2 8.2 TypicalApplication .................................................11 5 PinConfigurationandFunctions......................... 3 9 PowerSupplyRecommendations...................... 12 6 Specifications......................................................... 4 10 Layout................................................................... 13 6.1 AbsoluteMaximumRatings .....................................4 10.1 LayoutGuidelines.................................................13 6.2 ESDRatings..............................................................4 10.2 LayoutExample....................................................13 6.3 RecommendedOperatingConditions.......................4 10.3 ThermalConsiderations........................................13 6.4 ThermalInformation..................................................4 10.4 PowerDissipation.................................................14 6.5 ElectricalCharacteristics...........................................5 11 DeviceandDocumentationSupport................. 15 6.6 TypicalCharacteristics..............................................6 11.1 CommunityResources..........................................15 7 DetailedDescription.............................................. 8 11.2 Trademarks...........................................................15 7.1 Overview...................................................................8 11.3 ElectrostaticDischargeCaution............................15 7.2 FunctionalBlockDiagram.........................................8 11.4 Glossary................................................................15 7.3 FeatureDescription...................................................8 12 Mechanical,Packaging,andOrderable Information........................................................... 15 4 Revision History NOTE:Pagenumbersforpreviousrevisionsmaydifferfrompagenumbersinthecurrentversion. ChangesfromRevisionA(March2011)toRevisionB Page • AddedESDRatingstable,FeatureDescriptionsection,DeviceFunctionalModes,ApplicationandImplementation section,PowerSupplyRecommendationssection,Layoutsection,DeviceandDocumentationSupportsection,and Mechanical,Packaging,andOrderableInformationsection. ................................................................................................ 1 • ChangedPackagefromMSOP-8toHVSSOP. ..................................................................................................................... 1 • ChangedT valuefordisabledmodeoperatingmodefrom165to170°C............................................................................. 9 J • Changedvaluefrom35to45°C........................................................................................................................................... 14 ChangesfromOriginal(March2011)toRevisionA Page • Changedall105Vto100Vonpage1.................................................................................................................................. 1 2 SubmitDocumentationFeedback Copyright©2011–2015,TexasInstrumentsIncorporated ProductFolderLinks:TPS7A4001

TPS7A4001 www.ti.com SBVS162B–MARCH2011–REVISEDJULY2015 5 Pin Configuration and Functions DGNPackage 8-PinHVSSOP TopView OUT 1 8 IN FB 2 7 NC NC 3 6 NC GND 4 5 EN PinFunctions PIN I/O DESCRIPTION NAME NO. OUT 1 O Regulatoroutput.Acapacitor>4.7µFmustbetiedfromthispintogroundtoassurestability. FB 2 O Thispinistheinputtothecontrol-looperroramplifier.Itisusedtosettheoutputvoltageofthedevice. 3 NC 6 — Notinternallyconnected.ThispinmusteitherbeleftopenortiedtoGND. 7 GND 4 — Ground Thispinturnstheregulatoronoroff. IfV ≥V theregulatorisenabled. EN 5 I EN EN_HI IfV ≤V ,theregulatorisdisabled. EN EN_LO Ifnotused,theENpincanbeconnectedtoIN.MakesurethatV ≤V atalltimes. EN IN IN 8 I Inputsupply Soldertoprinted-circuit-board(PCB)toenhancethermalperformance. PowerPAD — — NOTE:ThePowerPADisinternallyconnectedtoGND. Althoughitcanbeleftfloating,TIhighlyrecommendsconnectingthePowerPADtotheGNDplane. Copyright©2011–2015,TexasInstrumentsIncorporated SubmitDocumentationFeedback 3 ProductFolderLinks:TPS7A4001

TPS7A4001 SBVS162B–MARCH2011–REVISEDJULY2015 www.ti.com 6 Specifications 6.1 Absolute Maximum Ratings overoperatingjunctiontemperaturerange(unlessotherwisenoted)(1) MIN MAX UNIT INpintoGNDpin –0.3 105 OUTpintoGNDpin –0.3 105 OUTpintoINpin –105 0.3 Voltage FBpintoGNDpin –0.3 2 V FBpintoINpin –105 0.3 ENpintoINpin –105 0.3 ENpintoGNDpin –0.3 105 Current Peakoutput Internallylimited Operatingvirtualjunction,T –40 125 J Temperature °C Storage,T –65 150 stg (1) StressesbeyondthoselistedunderAbsoluteMaximumRatingsmaycausepermanentdamagetothedevice.Thesearestressratings only,whichdonotimplyfunctionaloperationofthedeviceattheseoranyotherconditionsbeyondthoseindicatedunderRecommended OperatingConditions.Exposuretoabsolute-maximum-ratedconditionsforextendedperiodsmayaffectdevicereliability. 6.2 ESD Ratings VALUE UNIT Human-bodymodel(HBM),perANSI/ESDA/JEDECJS-001(1) ±2500 V(ESD) Electrostaticdischarge Charged-devicemodel(CDM),perJEDECspecificationJESD22- V C101(2) ±500 (1) JEDECdocumentJEP155statesthat500-VHBMallowssafemanufacturingwithastandardESDcontrolprocess. (2) JEDECdocumentJEP157statesthat250-VCDMallowssafemanufacturingwithastandardESDcontrolprocess. 6.3 Recommended Operating Conditions overoperatingjunctiontemperaturerange(unlessotherwisenoted) MIN NOM MAX UNIT VIN 7 100 V VOUT 1.161 90 V VEN 0 100 V IOUT 0 50 mA 6.4 Thermal Information TPS7A4001 THERMALMETRIC(1) DGN(HVVSOP) UNIT 8PINS R Junction-to-ambientthermalresistance 66.7 °C/W θJA R Junction-to-case(top)thermalresistance 54.1 °C/W θJC(top) R Junction-to-boardthermalresistance 38.1 °C/W θJB ψ Junction-to-topcharacterizationparameter 2 °C/W JT ψ Junction-to-boardcharacterizationparameter 37.8 °C/W JB R Junction-to-case(bottom)thermalresistance 15.5 °C/W θJC(bot) (1) Formoreinformationabouttraditionalandnewthermalmetrics,seetheSemiconductorandICPackageThermalMetricsapplication report,SPRA953. 4 SubmitDocumentationFeedback Copyright©2011–2015,TexasInstrumentsIncorporated ProductFolderLinks:TPS7A4001

TPS7A4001 www.ti.com SBVS162B–MARCH2011–REVISEDJULY2015 6.5 Electrical Characteristics AtT =–40°Cto125°C,V =V +2VorV =7V(whicheverisgreater),V =V ,I =100µA,C =1μF,C =4.7μF,and J IN OUT(NOM) IN EN IN OUT IN OUT FBtiedtoOUT,unlessotherwisenoted. PARAMETER TESTCONDITIONS MIN TYP MAX UNIT V Inputvoltage 7 100 V IN V Internalreference T =25°C,V =V ,V =9V,I =25mA 1.161 1.173 1.185 V REF J FB REF IN OUT Outputvoltagerange(1) V ≥V +2V V 90 V IN OUT(NOM) REF Nominalaccuracy T =25°C,V =9V,I =25mA –1 1 %V V J IN OUT OUT OUT V +2V≤V ≤24V(2) Overallaccuracy OUT(NOM) IN –2.5 2.5 %V 100µA≤I ≤50mA OUT OUT D%V OUT DV Lineregulation 7V≤VIN≤100V 0.03 %VOUT IN D%V OUT DI Loadregulation 100µA≤IOUT≤50mA 0.31 %VOUT OUT V =17V,V =18V,I =20mA 290 mV IN OUT(NOM) OUT V Dropoutvoltage DO V =17V,V =18V,I =50mA 0.78 1.3 V IN OUT(NOM) OUT V =90%V ,V =7V,T ≤85°C 51 117 200 mA OUT OUT(NOM) IN J I Currentlimit LIM V =90%V ,V =9V 51 128 200 mA OUT OUT(NOM) IN 7V≤V ≤100V,I =0mA 25 65 μA IN OUT I Groundcurrent GND I =50mA 25 μA OUT I Shutdownsupplycurrent V =0.4V 4.1 20 μA SHDN EN I Feedbackcurrent(3) –0.1 0.01 0.1 µA FB I Enablecurrent 7V≤V ≤100V,V =V 0.02 1 μA EN IN IN EN V Enablehigh-levelvoltage 1.5 V V EN_HI IN V Enablelow-levelvoltage 0 0.4 V EN_LO V =12V,V =V ,C =10μF, IN OUT(NOM) REF OUT 58 μV BW=10Hzto100kHz RMS V Outputnoisevoltage NOISE V =12V,V =5V,C =10μF, CIN (4)=10nOFU,T(BNWOM=) 10HztoOU1T00kHz 73 μVRMS BYP V =12V,V =5V,C =10μF, PSRR Power-supplyrejectionratio CIN (4)=10nOFU,T(ƒNO=M1)00Hz OUT 65 dB BYP Shutdown,temperatureincreasing 170 °C T Thermalshutdowntemperature SD Reset,temperaturedecreasing 150 °C T Operatingjunctiontemperature –40 125 °C J (1) Toensurestabilityatno-loadconditions,acurrentfromthefeedbackresistivenetworkgreaterthanorequalto10μAisrequired. (2) Maximuminputvoltageislimitedto24Vbecauseofthepackagepowerdissipationlimitationsatfullload(P≈(V –V )×I =(24 IN OUT OUT V–V )×50mA≈1.14W).Thedeviceiscapableofsourcingamaximumcurrentof50mAathigherinputvoltagesaslongasthe REF powerdissipatediswithinthethermallimitsofthepackageplusanyexternalheatsinking. (3) I >0flowsoutofthedevice. FB (4) C referstoabypasscapacitorconnectedtotheFBandOUTpins. BYP Copyright©2011–2015,TexasInstrumentsIncorporated SubmitDocumentationFeedback 5 ProductFolderLinks:TPS7A4001

TPS7A4001 SBVS162B–MARCH2011–REVISEDJULY2015 www.ti.com 6.6 Typical Characteristics AtT =–40°Cto125°C,V =V +2VorV =9V(whicheverisgreater),V =V ,I =100µA,C =1μF,C = J IN OUT(NOM) IN EN IN OUT IN OUT 4.7μF,andFBtiedtoOUT,unlessotherwisenoted. VOUT= 5V, IOUT= 28mA,COUT= 10mF VIN= 12V, VOUT= 5V VINSlew Rate = 220V/ms DIOUT= 1mA®29mA®1mA DVIN= 12V®55V COUT= 10mF, CBYP= 10nF 100mV/div CBYP= 0nF VOUT 50mV/div VOUT C = 10nF V BYP OUT 100mV/div VIN IOUT 10mA/div 50V/div Time (1ms/div) Time (100ms/div) Figure1.LineTransientResponsevsC Figure2.LoadTransientResponse BYP 10 1.275 − 40°C + 105°C − 40°C + 105°C 7.5 + 25°C + 125°C + 25°C + 125°C + 85°C + 85°C 5 1.225 %) 2.5 (()UTNOM 0 V (V)FB1.175 O−2.5 V −5 1.125 −7.5 −10 1.075 5 15 25 35 45 55 65 75 85 95 105 5 15 25 35 45 55 65 75 85 95 105 Input Voltage (V) Input Voltage (V) Figure3.LineRegulation Figure4.FeedbackVoltage 100 100 −40°C + 25°C 90 80 + 85°C 80 + 105°C + 125°C 70 D) N 60 60 G A) Isub( 40 I (nFB 4500 30 20 20 10 IOUT= 0mA 0 0 5 15 25 35 45 55 65 75 85 95 105 −40 −25 −10 5 20 35 50 65 80 95 110 125 Input Voltage (V) Temperature (°C) Figure5.GroundCurrentvsInputVoltage Figure6.FeedbackCurrent 6 SubmitDocumentationFeedback Copyright©2011–2015,TexasInstrumentsIncorporated ProductFolderLinks:TPS7A4001

TPS7A4001 www.ti.com SBVS162B–MARCH2011–REVISEDJULY2015 Typical Characteristics (continued) AtT =–40°Cto125°C,V =V +2VorV =9V(whicheverisgreater),V =V ,I =100µA,C =1μF,C = J IN OUT(NOM) IN EN IN OUT IN OUT 4.7μF,andFBtiedtoOUT,unlessotherwisenoted. 100 2 − 40°C − 40°C + 105°C 90 + 25°C 1.75 + 25°C + 125°C 80 + 85°C + 85°C + 105°C 1.5 70 + 125°C 1.25 A) 60 V) I (µGND 4500 V (DROP 0.751 30 0.5 20 0.25 10 0 0 0 10 20 30 40 50 0 10 20 30 40 50 Output Current (mA) Output Current (mA) Figure7.GroundCurrentvsOutputVoltage Figure8.DropoutVoltage 2.5 10 2 1 z) 1.5 H V(V)EN Vsub (EN_HI) me (V/ 0.1 1 s oi N 0.01 VIN = 12V 0.5 Vsub (EN_LO) VOUT = VREF COUT = 10m F IOUT = 100m A,VNOISE = 60m VRMS CBYP = 10nF IOUT = 50mA,VNOISE = 100m VRMS 0 0.001 −40 −25 −10 5 20 35 50 65 80 95 110 125 10 100 1k 10k 100k 1M 10M Temperature (°C) Frequency (Hz) Figure9.EnableThresholdVoltage Figure10.OutputSpectralNoiseDensity 200 100 90 160 80 70 A)120 dB) 60 (m R ( 50 L R IC 80 PS 40 −40°C 30 + 25°C VIN = 12V 40 + 85°C 20 VOUT = 5V ++ 110255°°CC 10 CCOBYUPT == 1100nm FF IIOOUUTT == 5100m0mAA 0 0 6 9 12 15 18 21 24 10 100 1k 10k 100k 1M 10M Input Voltage (V) Frequency (Hz) Figure11.CurrentLimit Figure12.Power-SupplyRejectionRatio Copyright©2011–2015,TexasInstrumentsIncorporated SubmitDocumentationFeedback 7 ProductFolderLinks:TPS7A4001

TPS7A4001 SBVS162B–MARCH2011–REVISEDJULY2015 www.ti.com 7 Detailed Description 7.1 Overview TheTPS7A4001devicebelongstoanewgenerationoflinearregulatorsthatuseaninnovativeBiCMOSprocess technologytoachieveveryhighmaximuminputandoutputvoltages. This process not only allows the TPS7A4001 device to maintain regulation during very fast high-voltage transients up to 105 V, but it also allows the TPS7A4001 device to regulate from a continuous high-voltage input rail. Unlike other regulators created using bipolar technology, the ground current of the TPS7A4001 device is alsoconstantoveritsoutputcurrentrange,resultinginincreasedefficiencyandlowerpowerconsumption. These features, combined with a high thermal performance HVSSOP PowerPAD package, make this device idealforindustrialandtelecomapplications. 7.2 Functional Block Diagram IN OUT UVLO Pass Device Thermal Shutdown Current Limit Error Enable Amp EN FB 7.3 Feature Description 7.3.1 InternalCurrentLimit The fixed internal current limit of the TPS7A4001 device helps protect the regulator during fault conditions. The maximum amount of current the device can source is the current limit (309 mA, typical), and is largely independent of output voltage. For reliable operation, the device does not operate in current limit for extended periodsoftime. 7.3.2 EnablePinOperation The TPS7A4001 device provides an enable pin (EN) feature that turns on the regulator when V > V , and EN EN_HI disablestheregulatorwhenV <V . EN EN_LO 7.3.3 ThermalProtection Thermal protection disables the output when the junction temperature rises to approximately 170°C, allowing the device to cool. When the junction temperature cools to approximately 150°C, the output circuitry is enabled. Depending on power dissipation, thermal resistance, and ambient temperature, the thermal protection circuit may cycle on and off. This cycling limits the dissipation of the regulator, protecting it from damage as a result of overheating. Any tendency to activate the thermal protection circuit indicates excessive power dissipation or an inadequate heatsink. For reliable operation, limit junction temperature to a maximum of 125°C. To estimate the margin of safety in a complete design (including heatsink), increase the ambient temperature until the thermal protection is triggered; use worst-case loads and signal conditions. For good reliability, trigger thermal protection at least 35°C above the maximum expected ambient condition of your particular application. This configuration produces a worst-casejunctiontemperatureof125°Catthehighestexpectedambienttemperatureandworst-caseload. 8 SubmitDocumentationFeedback Copyright©2011–2015,TexasInstrumentsIncorporated ProductFolderLinks:TPS7A4001

TPS7A4001 www.ti.com SBVS162B–MARCH2011–REVISEDJULY2015 Feature Description (continued) The internal protection circuitry of the TPS7A4001 device has been designed to protect against overload conditions. The protection circuitry was not intended to replace proper heatsinking. Continuously running the TPS7A4001deviceintothermalshutdowndegradesdevicereliability. 7.3.4 UndervoltageLockout(UVLO) The TPS7A4001 contains an Undervoltage Lockout comparator that ensures the error amplifier is disabled when the input voltage is below the required minimum operational voltage. The minimum recommended operational voltageis7V. 7.4 Device Functional Modes 7.4.1 NormalOperation Thedeviceregulatestothenominaloutputvoltageunderthefollowingconditions: • TheinputvoltageisatleastashighasV . IN(min) • Theinputvoltageisgreaterthanthenominaloutputvoltageaddedtothedropoutvoltage. • The enable voltage has previously exceeded the enable rising threshold voltage and has not decreased belowtheenablefallingthreshold. • Theoutputcurrentislessthanthecurrentlimit. • Thedevicejunctiontemperatureislessthanthemaximumspecifiedjunctiontemperature. 7.4.2 DropoutOperation If the input voltage is lower than the nominal output voltage plus the specified dropout voltage, but all other conditions are met for normal operation, the device operates in dropout mode. In this mode of operation, the output voltage is the same as the input voltage minus the dropout voltage. The transient performance of the device is significantly degraded because the pass device (as a bipolar junction transistor, or BJT) is in saturation and no longer controls the current through the LDO. Line or load transients in dropout can result in large output voltagedeviations. 7.4.3 Disabled Thedeviceisdisabledunderthefollowingconditions: • The enable voltage is less than the enable falling threshold voltage or has not yet exceeded the enable rising threshold. • Thedevicejunctiontemperatureisgreaterthanthethermalshutdowntemperature. Table1liststheconditionsthatleadtothedifferentmodesofoperation. Table1.DeviceFunctionalModeComparison PARAMETER OPERATINGMODE V V I T IN EN OUT J V >V +V and Normalmode IN OUT(nom) DO V >V I <I T <125°C V >V EN EN_HI OUT LIM J IN IN(min) Dropoutmode V <V <V +V V >V — T <125°C IN(min) IN OUT(nom) DO EN EN_HI J Disabledmode — V <V — T >170°C (anytrueconditiondisablesthedevice) EN EN_LO J Copyright©2011–2015,TexasInstrumentsIncorporated SubmitDocumentationFeedback 9 ProductFolderLinks:TPS7A4001

TPS7A4001 SBVS162B–MARCH2011–REVISEDJULY2015 www.ti.com 8 Application and Implementation NOTE Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes. Customers should validateandtesttheirdesignimplementationtoconfirmsystemfunctionality. 8.1 Application Information One of the primary applications of the TPS7A4001 device is to provide transient voltage protection to sensitive circuitrythatmaybedamagedinthepresenceofhigh-voltagespikes. This transient voltage protection can be more cost-effective and compact compared to topologies that use a transientvoltagesuppression(TVS)block. 8.1.1 AdjustableOperation The TPS7A4001 device has an output voltage range of about 1.175 to 90 V. The nominal output voltage of the deviceissetbytwoexternalresistors,asshowninFigure13. VIN VOUT IN OUT C IN 10 µF TPS7A4001 C10B YnPF R1 C OUT 10µF EN FB GND R 2 Figure13. AdjustableOperationforMaximumACPerformance Calculate R and R for any output voltage range using the formula shown in Equation 1. To ensure stability 1 2 underno-loadconditions,thisresistivenetworkmustprovideacurrent ≥10 μA. V V R = R OUT -1 , where OUT ³10mA 1 2 V R + R REF 1 2 (1) If greater voltage accuracy is required, consider the output voltage offset contributions because of the feedback pincurrentanduse0.1%toleranceresistors. 10 SubmitDocumentationFeedback Copyright©2011–2015,TexasInstrumentsIncorporated ProductFolderLinks:TPS7A4001

TPS7A4001 www.ti.com SBVS162B–MARCH2011–REVISEDJULY2015 8.2 Typical Application VIN IN OUT VOUT C 10IN µF TPS7A4001 C10B YnPF R1 C Where: RV1O+U RT2≥10 µA, and OUT VEN EN GND FB 10µF R1= R2 VVOUT –1 REF R 2 Figure14. ExampleCircuittoMaximizeTransientPerformance 8.2.1 DesignRequirements Forthisdesignexample,usethefollowingparameterslistedinTable2. Table2.DesignParameters PARAMETER VALUE V 12V,with55Vsurgetolerance IN V 5V(ideal),4.981(actual) OUT I 28mA OUT Accuracy 5% R1,R2 162kΩ,49.9kΩ 8.2.2 DetailedDesignProcedure The maximum value of total feedback resistance can be calculated to be 500 kΩ. Equation 1 was used to calculateR1andR2,andstandard1%resistorswereselectedtokeeptheaccuracywithinthe5%allocation.10- uF ceramic input and output capacitors were selected, along with a 10-nF bypass capacitor for optimal AC performance. 8.2.2.1 CapacitorRecommendations Low equivalent series resistance (ESR) capacitors should be used for the input, output, and bypass capacitors. Ceramic capacitors with X7R and X5R dielectrics are required. Ceramic X7R capacitors offer improved voltage and temperature coefficients, while ceramic X5R capacitors are the most cost-effective and are available in highervalues. NOTE HighESRcapacitorsmaydegradePSRR. 8.2.2.2 InputandOutputCapacitorRequirements The TPS7A4001 device high voltage linear regulator achieves stability with a minimum output capacitance of 4.7 µF and input capacitance of 1 µF; however, TI highly recommends to use 10-μF output and input capacitors to maximizeACperformance. 8.2.2.3 BypassCapacitorRequirements Although a bypass capacitor (C ) is not needed to achieve stability, TI highly recommends using a 10-nF BYP bypass capacitor to maximize AC performance (including line transient, noise, and PSRR). For additional informationregardingtheperformanceimprovementsofusingabypasscapacitor,see. 8.2.2.4 TransientResponse As with any regulator, increasing the size of the output capacitor reduces overshoot and undershoot magnitude butincreasesthedurationofthetransientresponse. The presence of the C capacitor may greatly improve the line transient response of the TPS7A4001 device, BYP asshowninFigure1. Copyright©2011–2015,TexasInstrumentsIncorporated SubmitDocumentationFeedback 11 ProductFolderLinks:TPS7A4001

TPS7A4001 SBVS162B–MARCH2011–REVISEDJULY2015 www.ti.com 8.2.3 ApplicationCurves VOUT= 5V, IOUT= 28mA,COUT= 10mF VIN= 12V, VOUT= 5V VINSlew Rate = 220V/ms DIOUT= 1mA®29mA®1mA DVIN= 12V®55V COUT= 10mF, CBYP= 10nF 100mV/div CBYP= 0nF VOUT 50mV/div VOUT C = 10nF V BYP OUT 100mV/div VIN IOUT 10mA/div 50V/div Time (1ms/div) Time (100ms/div) Figure15.LineTransientResponsevsC Figure16.LoadTransientResponse BYP 9 Power Supply Recommendations The input supply for the LDO should not exceed its recommended operating conditions (7 V to 100 V). The input voltage should provide adequate headroom for the device to have a regulated output. If the input supply is noisy, additional input capacitors with low ESR can help improve the output noise performance. The input and output supplies should also be bypassed with 10-µF capacitors located near the input and output pins. There should be noothercomponentslocatedbetweenthesecapacitorsandthepins. 12 SubmitDocumentationFeedback Copyright©2011–2015,TexasInstrumentsIncorporated ProductFolderLinks:TPS7A4001

TPS7A4001 www.ti.com SBVS162B–MARCH2011–REVISEDJULY2015 10 Layout 10.1 Layout Guidelines 10.1.1 BoardLayoutRecommendationstoImprovePSRRandNoisePerformance To improve AC performance such as PSRR, output noise, and transient response, TI recommends designing the board with separate ground planes for IN and OUT, with each ground plane connected only at the GND pin of the device. In addition, the ground connection for the output capacitor should connect directly to the GND pin of thedevice. Equivalent series inductance (ESL) and ESR must be minimized to maximize performance and ensure stability. Every capacitor (C , C , C ) must be placed as close as possible to the device and on the same side of the IN OUT BYP PCBastheregulatoritself. DonotplaceanyofthecapacitorsontheoppositesideofthePCBfromwheretheregulatorisinstalled.Theuse of vias and long traces is strongly discouraged because they may impact system performance negatively and evencauseinstability. If possible, and to ensure the maximum performance denoted in this product data sheet, use the same layout patternusedfortheTPS7A40evaluationboard,availableatwww.ti.com. 10.2 Layout Example Input GND Plane Vout Cin OUT 1 8 IN R1 Sense Line Cout FB 2 7 NC Vin Thermal Pad R2 NC 3 6 NC GND 4 5 EN Output GND Plane Figure17. RecommendedLayoutExample 10.3 Thermal Considerations Thermal protection disables the output when the junction temperature rises to approximately 170°C, allowing the device to cool. When the junction temperature cools to approximately 150°C, the output circuitry is enabled. Depending on power dissipation, thermal resistance, and ambient temperature, the thermal protection circuit may cycle ON and OFF. This cycling limits the dissipation of the regulator, protecting it from damage as a result of overheating. Copyright©2011–2015,TexasInstrumentsIncorporated SubmitDocumentationFeedback 13 ProductFolderLinks:TPS7A4001

TPS7A4001 SBVS162B–MARCH2011–REVISEDJULY2015 www.ti.com Thermal Considerations (continued) Any tendency to activate the thermal protection circuit indicates excessive power dissipation or an inadequate heatsink. For reliable operation, junction temperature should be limited to a maximum of 125°C. To estimate the margin of safety in a complete design (including heatsink), increase the ambient temperature until the thermal protection is triggered; use worst-case loads and signal conditions. For good reliability, thermal protection should trigger at least 45°C above the maximum expected ambient condition of the particular application. This configuration produces a worst-case junction temperature of 125°C at the highest expected ambient temperature andworst-caseload. The internal protection circuitry of the TPS7A4001 has been designed to protect against overload conditions. It was not intended to replace proper heatsinking. Continuously running the TPS7A4001 device into thermal shutdowndegradesdevicereliability. 10.4 Power Dissipation The ability to remove heat from the die is different for each package type, presenting different considerations in the PCB layout. The PCB area around the device that is free of other components moves the heat from the device to the ambient air. Using heavier copper increases the effectiveness in removing heat from the device. Theadditionofplatedthrough-holestoheatdissipatinglayersalsoimprovestheheatsinkeffectiveness. Powerdissipationdependsoninputvoltageandloadconditions.Powerdissipation(P )isequaltotheproductof D theoutputcurrenttimesthevoltagedropacrosstheoutputpasselement,asshowninEquation2: P = (V -V ) I D IN OUT OUT (2) 14 SubmitDocumentationFeedback Copyright©2011–2015,TexasInstrumentsIncorporated ProductFolderLinks:TPS7A4001

TPS7A4001 www.ti.com SBVS162B–MARCH2011–REVISEDJULY2015 11 Device and Documentation Support 11.1 Community Resources The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. TIE2E™OnlineCommunity TI'sEngineer-to-Engineer(E2E)Community.Createdtofostercollaboration amongengineers.Ate2e.ti.com,youcanaskquestions,shareknowledge,exploreideasandhelp solveproblemswithfellowengineers. DesignSupport TI'sDesignSupport QuicklyfindhelpfulE2Eforumsalongwithdesignsupporttoolsand contactinformationfortechnicalsupport. 11.2 Trademarks PowerPAD,E2EaretrademarksofTexasInstruments. Allothertrademarksarethepropertyoftheirrespectiveowners. 11.3 Electrostatic Discharge Caution Thesedeviceshavelimitedbuilt-inESDprotection.Theleadsshouldbeshortedtogetherorthedeviceplacedinconductivefoam duringstorageorhandlingtopreventelectrostaticdamagetotheMOSgates. 11.4 Glossary SLYZ022—TIGlossary. Thisglossarylistsandexplainsterms,acronyms,anddefinitions. 12 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of thisdocument.Forbrowser-basedversionsofthisdatasheet,refertotheleft-handnavigation. Copyright©2011–2015,TexasInstrumentsIncorporated SubmitDocumentationFeedback 15 ProductFolderLinks:TPS7A4001

PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2020 PACKAGING INFORMATION Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples (1) Drawing Qty (2) (6) (3) (4/5) TPS7A4001DGNR ACTIVE HVSSOP DGN 8 2500 Green (RoHS NIPDAU Level-2-260C-1 YEAR -40 to 125 QVQ & no Sb/Br) TPS7A4001DGNT ACTIVE HVSSOP DGN 8 250 Green (RoHS NIPDAU Level-2-260C-1 YEAR -40 to 125 QVQ & no Sb/Br) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement. (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1

PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2020 OTHER QUALIFIED VERSIONS OF TPS7A4001 : •Enhanced Product: TPS7A4001-EP NOTE: Qualified Version Definitions: •Enhanced Product - Supports Defense, Aerospace and Medical Applications Addendum-Page 2

PACKAGE MATERIALS INFORMATION www.ti.com 6-Sep-2019 TAPE AND REEL INFORMATION *Alldimensionsarenominal Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1 Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant (mm) W1(mm) TPS7A4001DGNR HVSSOP DGN 8 2500 330.0 12.4 5.3 3.3 1.3 8.0 12.0 Q1 TPS7A4001DGNT HVSSOP DGN 8 250 180.0 12.4 5.3 3.3 1.3 8.0 12.0 Q1 PackMaterials-Page1

PACKAGE MATERIALS INFORMATION www.ti.com 6-Sep-2019 *Alldimensionsarenominal Device PackageType PackageDrawing Pins SPQ Length(mm) Width(mm) Height(mm) TPS7A4001DGNR HVSSOP DGN 8 2500 370.0 355.0 55.0 TPS7A4001DGNT HVSSOP DGN 8 250 195.0 200.0 45.0 PackMaterials-Page2

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PACKAGE OUTLINE DGN0008B PowerPAD TM VSSOP - 1.1 mm max height SCALE 4.000 SMALL OUTLINE PACKAGE C 5.05 A 4.75 TYP 0.1 C PIN 1 INDEX AREA SEATING PLANE 6X 0.65 8 1 2X 3.1 1.95 2.9 NOTE 3 4 5 0.38 8X 0.25 B 3.1 0.13 C A B 2.9 NOTE 4 0.23 0.13 SEE DETAIL A EXPOSED THERMAL PAD 4 5 0.25 GAGE PLANE 1.98 1.78 9 1.1 MAX 8 1 0.7 0.15 0 -8 0.05 0.4 DETA 20AIL A 1.88 TYPICAL 1.62 4218837/A 11/2019 PowerPAD is a trademark of Texas Instruments. NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.15 mm per side. 4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm per side. 5. Reference JEDEC registration MO-187. www.ti.com

EXAMPLE BOARD LAYOUT DGN0008B PowerPAD TM VSSOP - 1.1 mm max height SMALL OUTLINE PACKAGE (2) NOTE 9 METAL COVERED BY SOLDER MASK (1.88) SYMM SOLDER MASK DEFINED PAD 8X (1.4) (R0.05) TYP 8 8X (0.45) 1 (3) 9 SYMM NOTE 9 (1.98) 6X (0.65) (1.22) 5 4 ( 0.2) TYP VIA (0.55) SEE DETAILS (4.4) LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE: 15X SOLDER MASK METAL METAL UNDER SOLDER MASK OPENING SOLDER MASK OPENING EXPOSED METAL EXPOSED METAL 0.05 MAX 0.05 MIN ALL AROUND ALL AROUND NON-SOLDER MASK SOLDER MASK DEFINED DEFINED (PREFERRED) SOLDE15.000R MASK DETAILS 4218837/A 11/2019 NOTES: (continued) 6. Publication IPC-7351 may have alternate designs. 7. Solder mask tolerances between and around signal pads can vary based on board fabrication site. 8. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown on this view. It is recommended that vias under paste be filled, plugged or tented. 9. Size of metal pad may vary due to creepage requirement. www.ti.com

EXAMPLE STENCIL DESIGN DGN0008B PowerPAD TM VSSOP - 1.1 mm max height SMALL OUTLINE PACKAGE (1.88) BASED ON 0.125 THICK STENCIL SYMM 8X (1.4) (R0.05) TYP 8 8X (0.45) 1 (1.98) SYMM BASED ON 0.125 THICK STENCIL 6X (0.65) 4 5 METAL COVERED SEE TABLE FOR BY SOLDER MASK DIFFERENT OPENINGS (4.4) FOR OTHER STENCIL THICKNESSES SOLDER PASTE EXAMPLE EXPOSED PAD 9: 100% PRINTED SOLDER COVERAGE BY AREA SCALE: 15X STENCIL SOLDER STENCIL THICKNESS OPENING 0.1 2.10 X 2.21 0.125 1.88 X 1.98 (SHOWN) 0.15 1.72 X 1.81 0.175 1.59 X 1.67 4218837/A 11/2019 NOTES: (continued) 10. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 11. Board assembly site may have different recommendations for stencil design. www.ti.com

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