TC913A/TC913B Dual Auto-Zeroed Operational Amplifiers Features: Package Type • First Monolithic Dual Auto-Zeroed PDIP Operational Amplifier TC913ACPA TC913BCPA • Chopper Amplifier Performance Without External Capacitors: OUT A 1 A B 8 VDD -IN A 2 7 OUT B - V : 15 V Max. - + OS +IN A 3 6 -IN B - VOS: Drift; 0.15 V/°C Max. V 4 + - 5 +IN B - Saves Cost of External Capacitors SS • SOIC Packages Available SOIC • High DC Gain; 120dB TC913ACOA TC913BCOA • Low Supply Current; 650 A • Low Input Voltage Noise: OUT A 1 A B 8 VDD -IN A 2 7 OUT B - 0.65 V (0.1 Hz to 10 Hz) - + P-P +IN A 3 6 -IN B • Wide Common Mode Voltage Range: + - VSS 4 5 +IN B - V to V - 2V SS DD • High Common Mode Rejection; 116dB General Description: • Dual or Single Supply Operation: The TC913 is the world’s first complete monolithic, dual - ±3.3V to ±8.3V auto-zeroed operational amplifier. The TC913 sets a - +6.5V to +16V new standard for low-power, precision dual-operational • Excellent AC Operating Characteristics: amplifiers. Chopper-stabilized or auto-zeroed amplifi- - Slew Rate; 2.5V/sec ers offer low offset voltage errors by periodically sam- pling offset error, and storing correction voltages on - Unity-Gain Bandwidth; 1.5 MHz capacitors. Previous single amplifier designs required • Pin Compatible with LM358, OP-14, MC1458, two user-supplied, external 0.1F error storage correc- ICL7621, TL082, TLC322 tion capacitors — much too large for on-chip integra- tion. The unique TC913 architecture requires smaller Applications: capacitors, making on-chip integration possible. Microvolt offset levels are achieved and external • Instrumentation capacitors are not required. • Medical Instrumentation The TC913 system benefits are apparent when con- • Embedded Control trasted with a TC7650 chopper amplifier circuit imple- • Temperature Sensor Amplifier mentation. A single TC913 replaces two TC7650’s and • Strain Gage Amplifier four capacitors. Five components and assembly steps are eliminated. Device Selection Table The TC913 pinout matches many popular dual-opera- Temp. Offset tional amplifiers: OP-04, TLC322, LM358, and ICL7621 Part Number Package Range Voltage are typical examples. In many applications, operating from dual 5V power supplies or single supplies, the TC913ACOA 8-Pin SOIC 0°C to 15 V TC913 offers superior electrical performance, and can +70°C be a functional drop-in replacement; printed circuit TC913ACPA 8-Pin PDIP 0°C to 15 V board rework is not necessary. The TC913’s low offset +70°C voltage error eliminates offset voltage trim TC913BCOA 8-Pin SOIC 0°C to 30 V potentiometers often needed with bipolar and low +70°C accuracy CMOS operational amplifiers. TC913BCPA 8-Pin PDIP 0°C to 30 V The TC913 takes full advantage of Microchip’s +70°C proprietary CMOS technology. Unity gain bandwidth is 1.5 MHz and slew rate is 2.5V/sec.  2001-2012 Microchip Technology Inc. DS21482D-page 1

TC913A/TC913B Functional Block Diagram VSS VDD 4 8 TC913 VOS Correction Amplifier + A A Internal – Oscillator * B B (fOSC 200 Hz) * Low-Impedance -Input A 2 - Output Buffer -Input B 6 + +Input A 5 + 1 Output A +Input B 3 Main Amplifier - 7 Output B 1 of 2 Amplifier Shown *NOTE: Internal capacitors. No external capacitors required. DS21482D-page 2  2001-2012 Microchip Technology Inc.

TC913A/TC913B 1.0 ELECTRICAL CHARACTERISTICS *Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to Absolute Maximum Ratings* the device. These are stress ratings only and functional operation of the device at these or any other conditions Total Supply Voltage (V to V ).......................+18V above those indicated in the operation sections of the DD SS Input Voltage......................(V +0.3V) to (V -0.3V) specifications is not implied. Exposure to Absolute DD SS Maximum Rating conditions for extended periods may Current Into Any Pin...........................................10 mA affect device reliability. While Operating.........................................100 A Package Power Dissipation (T – 70°C) A Plastic DIP...............................................730 mW Plastic SOIC............................................470 mW Operating Temperature Range C Device..........................................0°C to +70°C Storage Temperature Range..............-65°C to +150°C TC913A AND TC913B ELECTRICAL SPECIFICATIONS Electrical Characteristics: V = ±5V, T = +25°C, unless otherwise indicated. S A TC913A TC913B Symbol Parameter Min Typ Max Min Typ Max Unit Test Conditions V Input Offset — 5 15 — 15 30 V T = +25°C OS A Voltage TCV Average Temp. — 0.05 0.15 — 0.1 0.25 V/°C 0°C  T  +70°C OS A Coefficient of — 0.05 0.15 — 0.1 0.25 V/°C -25°C  T  +85°C A Input Offset (Note 1) Voltage I Average Input — — 90 — — 120 pA T = +25°C B A Bias Current — — 3 — — 4 nA 0°C  T  +70°C A — — 4 — — 6 nA -25°C  T  +85° A I Average Input — 5 20 — 10 40 pA T = +25°C OS A Offset Current — — 1 — — 1 nA T = +85°C A e Input Voltage — 0.6 — — 0.6 — V 0.1 to 1Hz, R  100 N P-P S Noise — 11 — — 11 — V 0.1 to 10Hz, R  100 P-P S CMRR Common Mode 110 116 — 100 110 — dB V  V  V - 2.2 SS CM DD Rejection Ratio CMVR Common Mode V V 2 V V 2 V SS — DD - SS — DD - Voltage Range A Open-Loop 115 120 — 110 120 — dB R = 10k, V = ±4V OL L OUT Voltage Gain V Output Voltage V + 0.3 — V - 0.9 V + 0.3 — V -0.9 V R = 10k OUT SS DD SS DD L Swing BW Closed Loop — 1.5 — — 1.5 — MHz Closed Loop Gain = +1 Bandwidth SR Slew Rate — 2.5 — — 2.5 — V/sec R = 10k, C = 50pF L L PSRR Power Supply 110 — — 100 — — dB ±3.3V to ±5.5V Rejection Ratio V Operating ±3.5 — ±8.3 ±3.5 — ±8.3 V Split Supply S Supply Voltage 7.0 — 16 7.0 — 16 V Single Supply Range I Quiescent — 0.65 0.85 — — 1.1 mA V = ±5V S S Supply Current Note 1: Characterized; not 100% tested.  2001-2012 Microchip Technology Inc. DS21482D-page 3

TC913A/TC913B 2.0 PIN DESCRIPTIONS The descriptions of the pins are listed in Table2-1. TABLE 2-1: PIN FUNCTION TABLE Pin No. (8-Pin PDIP) Symbol Description (8-Pin SOIC) 1 OUT A Output 2 -IN A Inverting Input 3 +IN A Non-inverting Input 4 V Negative Power Supply SS 5 +IN B Non-inverting Input 6 -IN B Inverting Input 7 OUT B Output 8 V Positive Power Supply DD DS21482D-page 4  2001-2012 Microchip Technology Inc.

TC913A/TC913B 3.0 DETAILED DESCRIPTION 3.3 Overload Recovery The TC913 recovers quickly from output saturation. 3.1 Theory of Operation Typical recovery time from positive output saturation is 20msec. Negative output saturation recovery time is Each of the TC913’s two Op Amps actually consists of typically 5msec. two amplifiers. A main amplifier is always connected from the input to the output. A separate nulling amplifier 3.4 Avoiding Latch-up alternately nulls its own offset and then the offset of the amplifier. Since each amplifier is continuously being Junction-isolated CMOS circuits inherently contain a nulled, offset voltage drift with time, temperature and parasitic p-n-p-n transistor circuit. Voltages exceeding power supply variations is greatly reduced. the supplies by 0.3V should not be applied to the All nulling circuitry is internal and the nulling operation device pins. Larger voltages can turn the p-n-p-n is transparent to the user. Offset nulling voltages are device on, causing excessive device power supply stored on two internal capacitors. An internal oscillator current and power dissipation. The TC913’s power and control logic, shared by the TC913’s two amplifiers, supplies should be established at the same time or control the nulling process. before input signals are applied. If this is not possible, input current should be limited to 0.1 mA to avoid 3.2 Pin Compatibility triggering the p-n-p-n structure. The TC913 pinout is compatible with OP-14, LM358, MC1458, LT1013, TLC322, and similar dual Op Amps. In many circuits operating from single or ±5V supplies, the TC913 is a drop-in replacement offering DC performance rivaling that of the best single Op Amps. The TC913’s amplifiers include a low-impedance class AB output buffer. Some previous CMOS chopper amplifiers used a high-impedance output stage which made open-loop gain dependent on load resistance. The TC913’s open-loop gain is not dependent on load resistance.  2001-2012 Microchip Technology Inc. DS21482D-page 5

TC913A/TC913B 4.0 TYPICAL CHARACTERISTICS Note: The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. Input Offset Voltage vs. Supply Current vs. ± Supply Voltage Common Mode Voltage Gain and Phase vs. Frequency 1200 35 50 225 SUPPLY CURRENT (µA)1086400000000 TA = +25°C T OFFSET VOLTAGE (µV)3221105050 VTAA == +±255V°C OSED-LOOP GAIN (dB) -43211000000 GAIN PHASE VTRASL === +1±025 5VkW°C 11940-48305505 PHASE (deg) 200 PU CL -20 -90 IN 5 -30 -135 0 0 -40 -180 2 3 4 5 6 7 8 -6 -5 -4 -3 -2 -1 0 1 2 3 4 10k 100k 1M 10M ± SUPPLY VOLTAGE (V) INPUT COMMON MODE VOLTAGE (V) FREQUENCY (Hz) Output Voltage Swing vs. Load Resistance Negative Overload Recovery Time Positive Overload Recovery Time 5.0 VTAS == +±255V°C -SWING RTLA == 1+02 5kW°C OUTPUT = V) 2 V/DIV GE ( 4.2 TA +SWING INPUT 0V L VO 3.4 0V T U P T 2.6 U O ± 1.8 O= U2 TVP/DUITV INPUT INPUT Gain = –20 GAIN = –20 1.0 100 1k 10k 100k 1M HORIZONTAL SCALE = 20 msec/DIV HORIZONTAL SCALE = 20 msec/DIV LOAD RESISTANCE (W) DS21482D-page 6  2001-2012 Microchip Technology Inc.

TC913A/TC913B 5.0 PACKAGING INFORMATION 5.1 Package Marking Information Package marking data not available at this time. 5.2 Taping Form Component Taping Orientation for 8-Pin SOIC (Narrow) Devices User Direction of Feed Pin 1 W P Standard Reel Component Orientation for 713 Suffix Device Carrier Tape, Number of Components Per Reel and Reel Size Package Carrier Width (W) Pitch (P) Part Per Full Reel Reel Size 8-Pin SOIC (N) 12 mm 8 mm 2500 13 in  2001-2012 Microchip Technology Inc. DS21482D-page 7

TC913A/TC913B 5.3 Package Dimensions Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 8-Pin SOIC Pin 1 .157 (3.99) .244 (6.20) .150 (3.81) .228 (5.79) .050 (1.27) Typ. .197 (5.00) .189 (4.80) .069 (1.75) .053 (1.35) 8° Max. .010 (0.25) .007 (0.18) .020 (0.51) .010 (0.25) .013 (0.33) .004 (0.10) .050 (1.27) .016 (0.40) Dimensions: inches (mm) Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 8-Pin Plastic DIP Pin1 .260 (6.60) .240 (6.10) .045 (1.14) .070 (1.78) .030 (0.76) .040 (1.02) .310 (7.87) .400 (10.16) .290 (7.37) .348 (8.84) .200 (5.08) .140 (3.56) .040 (1.02) .020 (0.51) .015 (0.38) 3° Min. .150 (3.81) .008 (0.20) .115 (2.92) .400 (10.16) .310 (7.87) .110 (2.79) .022 (0.56) .090 (2.29) .015 (0.38) Dimensions: inches (mm) DS21482D-page 8  2001-2012 Microchip Technology Inc.

TC913A/TC913B 6.0 REVISION HISTORY Revision D (December 2012) Added a note to each package outline drawing.  2001-2012 Microchip Technology Inc. DS21482D-page 9

TC913A/TC913B NOTES: DS21482D-page 10  2001-2012 Microchip Technology Inc.

TC913A/TC913B THE MICROCHIP WEB SITE CUSTOMER SUPPORT Microchip provides online support via our WWW site at Users of Microchip products can receive assistance www.microchip.com. This web site is used as a means through several channels: to make files and information easily available to • Distributor or Representative customers. Accessible by using your favorite Internet • Local Sales Office browser, the web site contains the following • Field Application Engineer (FAE) information: • Technical Support • Product Support – Data sheets and errata, application notes and sample programs, design Customers should contact their distributor, resources, user’s guides and hardware support representative or field application engineer (FAE) for documents, latest software releases and archived support. Local sales offices are also available to help software customers. A listing of sales offices and locations is included in the back of this document. • General Technical Support – Frequently Asked Questions (FAQ), technical support requests, Technical support is available through the web site online discussion groups, Microchip consultant at: http://microchip.com/support program member listing • Business of Microchip – Product selector and ordering guides, latest Microchip press releases, listing of seminars and events, listings of Microchip sales offices, distributors and factory representatives CUSTOMER CHANGE NOTIFICATION SERVICE Microchip’s customer notification service helps keep customers current on Microchip products. Subscribers will receive e-mail notification whenever there are changes, updates, revisions or errata related to a specified product family or development tool of interest. To register, access the Microchip web site at www.microchip.com. Under “Support”, click on “Customer Change Notification” and follow the registration instructions.  2001-2012 Microchip Technology Inc. DS21482D-page 11

TC913A/TC913B READER RESPONSE It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip product. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our documentation can better serve you, please FAX your comments to the Technical Publications Manager at (480)792-4150. Please list the following information, and use this outline to provide us with your comments about this document. TO: Technical Publications Manager Total Pages Sent ________ RE: Reader Response From: Name Company Address City / State / ZIP / Country Telephone: (_______) _________ - _________ FAX: (______) _________ - _________ Application (optional): Would you like a reply? Y N Device: TC913A/TC913B Literature Number: DS21482D Questions: 1. What are the best features of this document? 2. How does this document meet your hardware and software development needs? 3. Do you find the organization of this document easy to follow? If not, why? 4. What additions to the document do you think would enhance the structure and subject? 5. What deletions from the document could be made without affecting the overall usefulness? 6. Is there any incorrect or misleading information (what and where)? 7. How would you improve this document? DS21482D-page 12  2001-2012 Microchip Technology Inc.

Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. • Microchip is willing to work with the customer who is concerned about the integrity of their code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device Trademarks applications and the like is provided only for your convenience The Microchip name and logo, the Microchip logo, dsPIC, and may be superseded by updates. It is your responsibility to FlashFlex, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, ensure that your application meets with your specifications. PICSTART, PIC32 logo, rfPIC, SST, SST Logo, SuperFlash MICROCHIP MAKES NO REPRESENTATIONS OR and UNI/O are registered trademarks of Microchip Technology WARRANTIES OF ANY KIND WHETHER EXPRESS OR Incorporated in the U.S.A. and other countries. IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor, INCLUDING BUT NOT LIMITED TO ITS CONDITION, MTP, SEEVAL and The Embedded Control Solutions QUALITY, PERFORMANCE, MERCHANTABILITY OR Company are registered trademarks of Microchip Technology FITNESS FOR PURPOSE. Microchip disclaims all liability Incorporated in the U.S.A. arising from this information and its use. Use of Microchip Silicon Storage Technology is a registered trademark of devices in life support and/or safety applications is entirely at Microchip Technology Inc. in other countries. the buyer’s risk, and the buyer agrees to defend, indemnify and Analog-for-the-Digital Age, Application Maestro, BodyCom, hold harmless Microchip from any and all damages, claims, chipKIT, chipKIT logo, CodeGuard, dsPICDEM, suits, or expenses resulting from such use. No licenses are dsPICDEM.net, dsPICworks, dsSPEAK, ECAN, conveyed, implicitly or otherwise, under any Microchip ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial intellectual property rights. Programming, ICSP, Mindi, MiWi, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, mTouch, Omniscient Code Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit, PICtail, REAL ICE, rfLAB, Select Mode, SQI, Serial Quad I/O, Total Endurance, TSHARC, UniWinDriver, WiperLock, ZENA and Z-Scale are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. GestIC and ULPP are registered trademarks of Microchip Technology Germany II GmbH & Co. & KG, a subsidiary of Microchip Technology Inc., in other countries. All other trademarks mentioned herein are property of their respective companies. © 2001-2012, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. ISBN: 9781620768440 QUALITY MANAGEMENT SYSTEM Microchip received ISO/TS-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and CERTIFIED BY DNV Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures == ISO/TS 16949 == are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified.  2001-2012 Microchip Technology Inc. DS21482D-page 13

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