SN74AUC1G240 SINGLE BUFFER/DRIVER WITH 3-STATE OUTPUT www.ti.com SCES384I–MARCH2002–REVISEDFEBRUARY2007 FEATURES • AvailableintheTexasInstruments • LowPowerConsumption,10-m AMaxI CC NanoFree™Package • – 8-mAOutputDriveat1.8V • Optimizedfor1.8-VOperationandIs3.6-VI/O • Latch-UpPerformanceExceeds100mAPer ToleranttoSupportMixed-ModeSignal JESD78,ClassII Operation • ESDProtectionExceedsJESD22 • I SupportsPartial-Power-DownMode off – 2000-VHuman-BodyModel(A114-A) Operation – 200-VMachineModel(A115-A) • Sub-1-VOperable – 1000-VCharged-DeviceModel(C101) • Maxt of2.5nsat1.8V pd DBV PACKAGE DCK PACKAGE YZPPACKAGE (TOPVIEW) (TOPVIEW) (BOTTOM VIEW) OE 1 5 VCC GND 34 Y OE 1 5 V CC A 2 A 2 OE 15 V CC A 2 GND 3 4 Y GND 3 4 Y See mechanical drawings for dimensions. DESCRIPTION/ORDERING INFORMATION This bus buffer gate is operational at 0.8-V to 2.7-V V , but is designed specifically for 1.65-V to 1.95-V V CC CC operation. The SN74AUC1G240 is a single line driver with a 3-state output. The output is disabled when the output-enable (OE)inputishigh. To ensure the high-impedance state during power up or power down, OE should be tied to V through a pullup CC resistor;theminimumvalueoftheresistorisdeterminedbythecurrent-sinkingcapabilityofthedriver. NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the package. This device is fully specified for partial-power-down applications using I . The I circuitry disables the outputs, off off preventingdamagingcurrentbackflowthroughthedevicewhenitispowereddown. ORDERINGINFORMATION T PACKAGE(1) ORDERABLEPARTNUMBER TOP-SIDEMARKING(2) A NanoFree™–WCSP(DSBGA) Reelof3000 SN74AUC1G240YZPR ___UK_ 0.23-mmLargeBump–YZP(Pb-free) –40(cid:176) Cto85(cid:176) C SOT(SOT-23)–DBV Reelof3000 SN74AUC1G240DBVR U40_ SOT(SC-70)–DCK Reelof3000 SN74AUC1G240DCKR UK_ (1) Packagedrawings,standardpackingquantities,thermaldata,symbolization,andPCBdesignguidelinesareavailableat www.ti.com/sc/package. (2) DBV/DCK:Theactualtop-sidemarkinghasoneadditionalcharacterthatdesignatestheassembly/testsite. YZP:Theactualtop-sidemarkinghasthreeprecedingcharacterstodenoteyear,month,andsequencecode,andonefollowing charactertodesignatetheassembly/testsite. Pleasebeawarethatanimportantnoticeconcerningavailability,standardwarranty,anduseincriticalapplicationsofTexas Instrumentssemiconductorproductsanddisclaimerstheretoappearsattheendofthisdatasheet. NanoFreeisatrademarkofTexasInstruments. PRODUCTIONDATAinformationiscurrentasofpublicationdate. Copyright©2002–2007,TexasInstrumentsIncorporated Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarilyincludetestingofallparameters.

SN74AUC1G240 SINGLE BUFFER/DRIVER WITH 3-STATE OUTPUT www.ti.com SCES384I–MARCH2002–REVISEDFEBRUARY2007 FUNCTIONTABLE INPUTS OUTPUT OE A Y L H L L L H H X Z LOGICDIAGRAM(POSITIVELOGIC) 1 OE 2 4 A Y Absolute Maximum Ratings(1) overoperatingfree-airtemperaturerange(unlessotherwisenoted) MIN MAX UNIT V Supplyvoltagerange –0.5 3.6 V CC V Inputvoltagerange(2) –0.5 3.6 V I V Voltagerangeappliedtoanyoutputinthehigh-impedanceorpower-offstate(2) –0.5 3.6 V O V Outputvoltagerange(2) –0.5 V +0.5 V O CC I Inputclampcurrent V <0 –50 mA IK I I Outputclampcurrent V <0 –50 mA OK O I Continuousoutputcurrent – 20 mA O ContinuouscurrentthroughV orGND – 100 mA CC DBVpackage 206 q Packagethermalimpedance(3) DCKpackage 252 (cid:176) C/W JA YZPpackage 132 T Storagetemperaturerange –65 150 (cid:176) C stg (1) Stressesbeyondthoselistedunder"absolutemaximumratings"maycausepermanentdamagetothedevice.Thesearestressratings only,andfunctionaloperationofthedeviceattheseoranyotherconditionsbeyondthoseindicatedunder"recommendedoperating conditions"isnotimplied.Exposuretoabsolute-maximum-ratedconditionsforextendedperiodsmayaffectdevicereliability. (2) Theinputnegative-voltageandoutputvoltageratingsmaybeexceedediftheinputandoutputcurrentratingsareobserved. (3) ThepackagethermalimpedanceiscalculatedinaccordancewithJESD51-7. 2 SubmitDocumentationFeedback

SN74AUC1G240 SINGLE BUFFER/DRIVER WITH 3-STATE OUTPUT www.ti.com SCES384I–MARCH2002–REVISEDFEBRUARY2007 Recommended Operating Conditions(1) MIN MAX UNIT V Supplyvoltage 0.8 2.7 V CC V =0.8V V CC CC V High-levelinputvoltage V =1.1Vto1.95V 0.65  V V IH CC CC V =2.3Vto2.7V 1.7 CC V =0.8V 0 CC V Low-levelinputvoltage V =1.1Vto1.95V 0.35  V V IL CC CC V =2.3Vto2.7V 0.7 CC V Inputvoltage 0 3.6 V I V Outputvoltage 0 V V O CC V =0.8V –0.7 CC V =1.1V –3 CC I High-leveloutputcurrent V =1.4V –5 mA OH CC V =1.65V –8 CC V =2.3V –9 CC V =0.8V 0.7 CC V =1.1V 3 CC I Low-leveloutputcurrent V =1.4V 5 mA OL CC V =1.65V 8 CC V =2.3V 9 CC V =0.8Vto1.6V 20 CC D t/D v Inputtransitionriseorfallrate V =1.65Vto1.95V 10 ns/V CC V =2.3Vto2.7V 3 CC T Operatingfree-airtemperature –40 85 (cid:176) C A (1) AllunusedinputsofthedevicemustbeheldatV orGNDtoensureproperdeviceoperation.RefertotheTIapplicationreport, CC ImplicationsofSloworFloatingCMOSInputs,literaturenumberSCBA004. SubmitDocumentationFeedback 3

SN74AUC1G240 SINGLE BUFFER/DRIVER WITH 3-STATE OUTPUT www.ti.com SCES384I–MARCH2002–REVISEDFEBRUARY2007 Electrical Characteristics overrecommendedoperatingfree-airtemperaturerange(unlessotherwisenoted) PARAMETER TESTCONDITIONS V MIN TYP(1) MAX UNIT CC I =–100m A 0.8Vto2.7V V –0.1 OH CC I =–0.7mA 0.8V 0.55 OH I =–3mA 1.1V 0.8 OH V V OH I =–5mA 1.4V 1 OH I =–8mA 1.65V 1.2 OH I =–9mA 2.3V 1.8 OH I =100m A 0.8Vto2.7V 0.2 OL I =0.7mA 0.8V 0.25 OL I =3mA 1.1V 0.3 OL V V OL I =5mA 1.4V 0.4 OL I =8mA 1.65V 0.45 OL I =9mA 2.3V 0.6 OL I AorOEinput V =V orGND 0to2.7V – 5 m A I I CC I V orV =2.7V 0 – 10 m A off I O I V =V orGND 2.7V – 10 m A OZ O CC I V =V orGND, I =0 0.8Vto2.7V 10 m A CC I CC O C V =V orGND 2.5V 2.5 pF I I CC C V =V orGND 2.5V 5.5 pF o O CC (1) AlltypicalvaluesareatT =25(cid:176) C. A Switching Characteristics overrecommendedoperatingfree-airtemperaturerange,C =15pF(unlessotherwisenoted)(seeFigure1) L V =1.2V V =1.5V V =1.8V V =2.5V PARAMETER FROM TO VCC=0.8V C–C0.1V C–C0.1V C– C0.15V C–C0.2V UNIT (INPUT) (OUTPUT) TYP MIN MAX MIN MAX MIN TYP MAX MIN MAX t A Y 4.5 0.6 3.3 0.7 2.2 0.6 1 1.7 0.4 1.4 ns pd t OE Y 5.5 0.7 4.1 0.5 2.6 0.5 1.2 1.9 0.5 1.6 ns en t OE Y 5 1.5 4.3 0.9 4.1 1.2 2.3 3.3 0.8 2.3 ns dis Switching Characteristics overrecommendedoperatingfree-airtemperaturerange,C =30pF(unlessotherwisenoted)(seeFigure1) L V =1.8V V =2.5V CC CC PARAMETER FROM TO – 0.15V – 0.2V UNIT (INPUT) (OUTPUT) MIN TYP MAX MIN MAX t A Y 0.5 1.5 2.5 0.8 1.7 ns pd t OE Y 0.7 1.6 2.6 0.6 1.9 ns en t OE Y 2 2.4 3.1 0.8 1.7 ns dis 4 SubmitDocumentationFeedback

SN74AUC1G240 SINGLE BUFFER/DRIVER WITH 3-STATE OUTPUT www.ti.com SCES384I–MARCH2002–REVISEDFEBRUARY2007 Operating Characteristics T =25(cid:176) C A TEST VCC=0.8V VCC=1.2V VCC=1.5V VCC=1.8V VCC=2.5V PARAMETER UNIT CONDITIONS TYP TYP TYP TYP TYP Outputs Power enabled 14 14 14 14 15 C dissipation f=10MHz pF pd capacitance Outputs 1 1 1 1 2 disabled SubmitDocumentationFeedback 5

SN74AUC1G240 SINGLE BUFFER/DRIVER WITH 3-STATE OUTPUT www.ti.com SCES384I–MARCH2002–REVISEDFEBRUARY2007 PARAMETER MEASUREMENT INFORMATION TEST S1 t /t Open PLH PHL 2 × VCC tPLZ/tPZL 2 × VCC R S1 Open tPHZ/tPZH GND From Output L Under Test GND (see NoteAC)L RL 0V.8C CV 15C pLF 2R kLW 0.V1D V 1.2 V±0.1 V 15 pF 2 kW 0.1 V 1.5 V±0.1 V 15 pF 2 kW 0.1 V LOAD CIRCUIT 1.8 V±0.15 V 15 pF 2 kW 0.15 V 2.5 V±0.2 V 15 pF 2 kW 0.15 V 1.8 V±0.15 V 30 pF 1 kW 0.15 V 2.5 V±0.2 V 30 pF 500W 0.15 V V CC Timing Input V /2 CC 0 V t W VCC tsu th V Input V /2 V /2 CC CC CC Data Input V /2 V /2 CC CC 0 V 0 V VOLTAGE WAVEFORMS VOLTAGE WAVEFORMS PULSE DURATION SETUPAND HOLD TIMES Input VCC/2 VCC/2 VCC COounttpruotl VCC/2 VCC/2 VCC 0 V 0 V t t t t PLH PHL PZL PLZ V Output V Output VCC/2 VCC/2 OH SW1a avte 2fo ×rm V 1 VCC/2 V + V CC VOL (see Note BCC) OL D VOL t t PHL PLH t t PZH PHZ Output VCC/2 VCC/2 VVOOHL (WseSae1v eNaOfoto utGretmpN Bu D2)t VCC/2 VOH–VD V»0OH V VOLTAGE WAVEFORMS VOLTAGE WAVEFORMS PROPAGATION DELAYTIMES ENABLEAND DISABLE TIMES INVERTINGAND NONINVERTING OUTPUTS LOW-AND HIGH-LEVELENABLING NOTES: A. C includes probe and jig capacitance. L B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR£10 MHz, Z = 50W, O slew rate³1 V/ns. D. The outputs are measured one at a time, with one transition per measurement. E. t and t are the same as t . PLZ PHZ dis F. t and t are the same as t . PZL PZH en G.t and t are the same as t . PLH PHL pd Figure1.LoadCircuitandVoltageWaveforms 6 SubmitDocumentationFeedback

PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2020 PACKAGING INFORMATION Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples (1) Drawing Qty (2) (6) (3) (4/5) 74AUC1G240DBVRG4 ACTIVE SOT-23 DBV 5 3000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 U40R & no Sb/Br) SN74AUC1G240DBVR ACTIVE SOT-23 DBV 5 3000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 U40R & no Sb/Br) SN74AUC1G240DCKR ACTIVE SC70 DCK 5 3000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 (UK5, UKR) & no Sb/Br) SN74AUC1G240YZPR ACTIVE DSBGA YZP 5 3000 Green (RoHS SNAGCU Level-1-260C-UNLIM -40 to 85 UKN & no Sb/Br) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement. (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and Addendum-Page 1

PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2020 continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2

PACKAGE MATERIALS INFORMATION www.ti.com 18-Jan-2020 TAPE AND REEL INFORMATION *Alldimensionsarenominal Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1 Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant (mm) W1(mm) SN74AUC1G240DBVR SOT-23 DBV 5 3000 180.0 8.4 3.23 3.17 1.37 4.0 8.0 Q3 SN74AUC1G240DCKR SC70 DCK 5 3000 178.0 9.2 2.4 2.4 1.22 4.0 8.0 Q3 SN74AUC1G240YZPR DSBGA YZP 5 3000 178.0 9.2 1.02 1.52 0.63 4.0 8.0 Q1 PackMaterials-Page1

PACKAGE MATERIALS INFORMATION www.ti.com 18-Jan-2020 *Alldimensionsarenominal Device PackageType PackageDrawing Pins SPQ Length(mm) Width(mm) Height(mm) SN74AUC1G240DBVR SOT-23 DBV 5 3000 202.0 201.0 28.0 SN74AUC1G240DCKR SC70 DCK 5 3000 180.0 180.0 18.0 SN74AUC1G240YZPR DSBGA YZP 5 3000 220.0 220.0 35.0 PackMaterials-Page2

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PACKAGE OUTLINE DBV0005A SOT-23 - 1.45 mm max height SCALE 4.000 SMALL OUTLINE TRANSISTOR C 3.0 2.6 0.1 C 1.75 1.45 1.45 B A 0.90 PIN 1 INDEX AREA 1 5 2X 0.95 3.05 2.75 1.9 1.9 2 4 3 0.5 5X 0.3 0.15 0.2 C A B (1.1) TYP 0.00 0.25 GAGE PLANE 0.22 TYP 0.08 8 TYP 0.6 0 0.3 TYP SEATING PLANE 4214839/E 09/2019 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. Refernce JEDEC MO-178. 4. Body dimensions do not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.15 mm per side. www.ti.com

EXAMPLE BOARD LAYOUT DBV0005A SOT-23 - 1.45 mm max height SMALL OUTLINE TRANSISTOR PKG 5X (1.1) 1 5 5X (0.6) SYMM (1.9) 2 2X (0.95) 3 4 (R0.05) TYP (2.6) LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE:15X SOLDER MASK SOLDER MASK METAL UNDER METAL OPENING OPENING SOLDER MASK EXPOSED METAL EXPOSED METAL 0.07 MAX 0.07 MIN ARROUND ARROUND NON SOLDER MASK SOLDER MASK DEFINED DEFINED (PREFERRED) SOLDER MASK DETAILS 4214839/E 09/2019 NOTES: (continued) 5. Publication IPC-7351 may have alternate designs. 6. Solder mask tolerances between and around signal pads can vary based on board fabrication site. www.ti.com

EXAMPLE STENCIL DESIGN DBV0005A SOT-23 - 1.45 mm max height SMALL OUTLINE TRANSISTOR PKG 5X (1.1) 1 5 5X (0.6) SYMM 2 (1.9) 2X(0.95) 3 4 (R0.05) TYP (2.6) SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL SCALE:15X 4214839/E 09/2019 NOTES: (continued) 7. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 8. Board assembly site may have different recommendations for stencil design. www.ti.com

PACKAGE OUTLINE YZP0005 DSBGA - 0.5 mm max height SCALE 8.000 DIE SIZE BALL GRID ARRAY B E A BALL A1 CORNER D C 0.5 MAX SEATING PLANE 0.19 0.05 C 0.15 BALL TYP 0.5 TYP C SYMM 1 B D: Max = 1.418 mm, Min =1 .358 mm TYP 0.5 TYP E: Max = 0.918 mm, Min =0 .858 mm A 0.25 5X 1 2 0.21 0.015 C A B SYMM 4219492/A 05/2017 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. www.ti.com

EXAMPLE BOARD LAYOUT YZP0005 DSBGA - 0.5 mm max height DIE SIZE BALL GRID ARRAY (0.5) TYP 5X ( 0.23) 1 2 A (0.5) TYP SYMM B C SYMM LAND PATTERN EXAMPLE SCALE:40X SOLDER MASK 0.05 MAX 0.05 MIN ( 0.23) OPENING SOLDER MASK OPENING ( 0.23) METAL METAL UNDER SOLDER MASK NON-SOLDER MASK SOLDER MASK DEFINED DEFINED (PREFERRED) SOLDER MASK DETAILS NOT TO SCALE 4219492/A 05/2017 NOTES: (continued) 3. Final dimensions may vary due to manufacturing tolerance considerations and also routing constraints. For more information, see Texas Instruments literature number SNVA009 (www.ti.com/lit/snva009). www.ti.com

EXAMPLE STENCIL DESIGN YZP0005 DSBGA - 0.5 mm max height DIE SIZE BALL GRID ARRAY (0.5) TYP 5X ( 0.25) (R0.05) TYP 1 2 A (0.5) TYP B SYMM C METAL SYMM TYP SOLDER PASTE EXAMPLE BASED ON 0.1 mm THICK STENCIL SCALE:40X 4219492/A 05/2017 NOTES: (continued) 4. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. www.ti.com

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