Product Sample & Technical Tools & Support & Folder Buy Documents Software Community SN74AHC08,SN54AHC08 SCLS236J–MARCH1996–REVISEDDECEMBER2015 SNx4AHC08 Quadruple 2-Input Positive-AND Gates 1 Features 3 Description • 2-Vto5.5-VOperatingRange The SNx4AHC08 devices are quadruple 2-input 1 positive-AND gates. These devices perform the • Latch-UpPerformanceExceeds250mAPer Boolean function Y = A • B or Y = A + B in positive JESD17 logic. • ESDProtectionExceedsJESD22 – 2000-VHuman-BodyModel(A114-A) DeviceInformation(1) – 200-VMachineModel(A115-A) PARTNUMBER PACKAGE BODYSIZE(NOM) SOIC(14) 8.65mm×3.90mm – 1000-VCharged-DeviceModel(C101) SSOP(14) 6.20mm×5.30mm 2 Applications TVSOP(14) 3.60mm×4.40mm SN74AHC08 PDIP(14) 19.30mm×6.35mm • Servers SO(14) 10.30mm×5.30mm • NetworkSwitches TSSOP(14) 5.00mm×4.40mm • PCsandNotebooks VQFN(14) 3.50mm×3.50mm • ElectronicPointsofSale SN54AHC08 LCCC(20) 8.89mm×8.89mm (1) For all available packages, see the orderable addendum at theendofthedatasheet. SimplifiedSchematic A Y B 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectualpropertymattersandotherimportantdisclaimers.PRODUCTIONDATA.

SN74AHC08,SN54AHC08 SCLS236J–MARCH1996–REVISEDDECEMBER2015 www.ti.com Table of Contents 1 Features.................................................................. 1 8 ParameterMeasurementInformation..................8 2 Applications........................................................... 1 9 DetailedDescription.............................................. 9 3 Description............................................................. 1 9.1 Overview...................................................................9 4 RevisionHistory..................................................... 2 9.2 FunctionalBlockDiagram.........................................9 5 DeviceComparisonTable..................................... 3 9.3 FeatureDescription...................................................9 9.4 DeviceFunctionalModes..........................................9 6 PinConfigurationandFunctions......................... 3 10 ApplicationandImplementation........................ 10 7 Specifications......................................................... 4 10.1 ApplicationInformation..........................................10 7.1 AbsoluteMaximumRatings......................................4 10.2 TypicalApplication ...............................................10 7.2 ESDRatings..............................................................4 11 PowerSupplyRecommendations..................... 11 7.3 RecommendedOperatingConditions.......................5 7.4 ThermalInformation..................................................5 12 Layout................................................................... 11 7.5 ElectricalCharacteristics,T =25°C........................5 12.1 LayoutGuidelines.................................................11 A 7.6 ElectricalCharacteristics,T =–55°Cto125°C, 12.2 LayoutExample....................................................12 A SN54AHC08...............................................................6 13 DeviceandDocumentationSupport................. 13 7.7 ElectricalCharacteristics,TA=–40°Cto125°C, 13.1 RelatedLinks........................................................13 SN74AHC08...............................................................6 13.2 CommunityResources..........................................13 7.8 SwitchingCharacteristics,V =3.3V±0.3V........6 CC 13.3 Trademarks...........................................................13 7.9 SwitchingCharacteristics,V =5V±0.5V...........7 CC 13.4 ElectrostaticDischargeCaution............................13 7.10 NoiseCharacteristics,SN74AHC08.......................7 13.5 Glossary................................................................13 7.11 OperatingCharacteristics........................................7 14 Mechanical,Packaging,andOrderable 7.12 TypicalCharacteristics............................................7 Information........................................................... 13 4 Revision History NOTE:Pagenumbersforpreviousrevisionsmaydifferfrompagenumbersinthecurrentversion. ChangesfromRevisionI(May2013)toRevisionJ Page • AddedESDRatingstable,FeatureDescriptionsection,DeviceFunctionalModes,ApplicationandImplementation section,PowerSupplyRecommendationssection,Layoutsection,DeviceandDocumentationSupportsection,and Mechanical,Packaging,andOrderableInformationsection.................................................................................................. 1 ChangesfromRevisionH(March1996)toRevisionI Page • Changeddocumentformat .................................................................................................................................................... 1 • Extendedoperatingtemperaturerangeto125°C................................................................................................................... 5 2 SubmitDocumentationFeedback Copyright©1996–2015,TexasInstrumentsIncorporated ProductFolderLinks:SN74AHC08 SN54AHC08

SN74AHC08,SN54AHC08 www.ti.com SCLS236J–MARCH1996–REVISEDDECEMBER2015 5 Device Comparison Table PARTNUMBER PACKAGE BODYSIZE(NOM) SN74AHC08D SOIC(14) 8.65mm×3.90mm SN74AHC08DB SSOP(14) 6.20mm×5.30mm SN74AHC08DGV TVSOP(14) 3.60mm×4.40mm SN74AHC08N PDIP(14) 19.30mm×6.35mm SN74AHC08NS SO(14) 10.30mm×5.30mm SN74AHC08PW TSSOP(14) 5.00mm×4.40mm SN74AHC08RGY VQFN(14) 3.50mm×3.50mm SN54AHC08FK LCCC(20) 8.89mm×8.89mm 6 Pin Configuration and Functions D,DB,DGV,N,NS,PW,orWPackage RGYPackage 14-PinSOIC,SSOP,TVSOP,PDIP,SO,orTSSOP 14-PinVQFN TopView TopView C 1A 1 14 VCC 1A VC 1B 2 13 4B 1 14 1B 2 13 4B 1Y 3 12 4A 1Y 3 12 4A 2A 4 11 4Y 2A 4 11 4Y 2B 5 10 3B 2B 5 10 3B 2Y 6 9 3A 2Y 6 9 3A 7 8 GND 7 8 3Y D Y N 3 G FKPackage 20-PinLCCC TopView C B A C CB 1 1 N V 4 3 2 1 2019 1Y 4 18 4A NC 5 17 NC 2A 6 16 4Y NC 7 15 NC 2B 8 14 3B 9 10 11 12 13 YD CY A 2N N3 3 G NC–Nointernalconnection Copyright©1996–2015,TexasInstrumentsIncorporated SubmitDocumentationFeedback 3 ProductFolderLinks:SN74AHC08 SN54AHC08

SN74AHC08,SN54AHC08 SCLS236J–MARCH1996–REVISEDDECEMBER2015 www.ti.com PinFunctions PIN SOIC,SSOP, I/O DESCRIPTION NAME TVSOP,PDIP, VQFN LCCC SO,TSSOP 1A 1 1 2 I 1AInput 1B 2 2 3 I 1BInput 1Y 3 3 4 O 1YOutput 2A 4 4 6 I 2AInput 2B 5 5 8 I 2BInput 2Y 6 6 9 O 2YOutput 3Y 8 8 12 O 3YOutput 3A 9 9 13 I 3AInput 3B 10 10 14 I 3BInput 4Y 11 11 16 O 4YOutput 4A 12 12 18 I 4AInput 4B 13 13 19 I 4BInput GND 7 7 10 — GroundPin NC — — 1,5,7,11,15,17 — NoConnection VCC 14 14 20 — PowerPin 7 Specifications 7.1 Absolute Maximum Ratings overoperatingfree-airtemperaturerange(unlessotherwisenoted)(1) MIN MAX UNIT V Supplyvoltage –0.5 7 V CC V Inputvoltage(2) –0.5 7 V I V Outputvoltage,V (2) –0.5 V +0.5 V O O CC I Inputclampcurrent V <0 -20 mA IK I I Outputclampcurrent V <0orV >V ±20 mA OK O O CC I Continuousoutputcurrent V =0toV ±25 mA O O CC ContinuouscurrentthroughV orGND ±50 mA CC T Junctiontemperature 150 °C J T Storagetemperature –65 150 °C stg (1) StressesbeyondthoselistedunderAbsoluteMaximumRatingsmaycausepermanentdamagetothedevice.Thesearestressratings only,whichdonotimplyfunctionaloperationofthedeviceattheseoranyotherconditionsbeyondthoseindicatedunderRecommended OperatingConditions.Exposuretoabsolute-maximum-ratedconditionsforextendedperiodsmayaffectdevicereliability. (2) Theinputandoutputvoltageratingsmaybeexceedediftheinputandoutputcurrentratingsareobserved. 7.2 ESD Ratings VALUE UNIT Electrostatic Human-bodymodel(HBM),perANSI/ESDA/JEDECJS-001(1) ±2000 V V (ESD) discharge Charged-devicemodel(CDM),perJEDECspecificationJESD22-C101(2) ±1000 (1) JEDECdocumentJEP155statesthat500-VHBMallowssafemanufacturingwithastandardESDcontrolprocess.Manufacturingwith lessthan500-VHBMispossiblewiththenecessaryprecautions. (2) JEDECdocumentJEP157statesthat250-VCDMallowssafemanufacturingwithastandardESDcontrolprocess.Manufacturingwith lessthan250-VCDMispossiblewiththenecessaryprecautions. 4 SubmitDocumentationFeedback Copyright©1996–2015,TexasInstrumentsIncorporated ProductFolderLinks:SN74AHC08 SN54AHC08

SN74AHC08,SN54AHC08 www.ti.com SCLS236J–MARCH1996–REVISEDDECEMBER2015 7.3 Recommended Operating Conditions See (1) MIN MAX UNIT VCC Supplyvoltage 2 5.5 V VCC=2V 1.5 VIH High-levelinputvoltage VCC=3V 2.1 V VCC=5.5V 3.85 VCC=2V 0.5 VIL Low-levelInputvoltage VCC=3V 0.9 V VCC=5.5V 1.65 VI Inputvoltage 0 5.5 V VO Outputvoltage 0 VCC V VCC=2V –50 IOH High-leveloutputcurrent VCC=3.3V±0.3V –4 mA VCC=5V±0.5V –8 VCC=2V 50 IOL Low-leveloutputcurrent VCC=3.3V±0.3V 4 mA VCC=5V±0.5V 8 VCC=3.3V±0.3V 100 Δt/Δv InputTransitionriseorfallrate ns/V VCC=5V±0.5V 20 SN54AHC08 –55 125 TA Operatingfree-airtemperature °C SN74AHC08 –40 125 (1) AllunusedinputsofthedevicemustbeheldatV orGNDtoensureproperdeviceoperation.RefertotheTIapplicationreport, CC ImplicationsofSloworFloatingCMOSInputs,SCBA004. 7.4 Thermal Information SN74AHC08 THERMALMETRIC(1) D(SOIC) DB DGV N(PDIP) NS(SO) PW(TSSOP) RGY UNIT (SSOP) (TVSOP) (VQFN) 14PINS 14PINS 14PINS 14PINS 14PINS 14PINS 14PINS Junction-to-ambientthermal R 86 96 127 80 76 113 47 °C/W θJA resistance (1) Formoreinformationabouttraditionalandnewthermalmetrics,seetheSemiconductorandICPackageThermalMetricsapplication report,SPRA953. 7.5 Electrical Characteristics, T = 25°C A overoperatingfree-airtemperaturerange(unlessotherwisenoted) PARAMETER TESTCONDITIONS VCC MIN TYP MAX UNIT 2V 1.9 2 IOH=–50µA 3V 2.9 3 VOH 4.5V 4.4 4.5 V IOH=–4mA 3V 2.58 IOH=–8mA 4.5V 3.94 2V 0.1 IOL=50µA 3V 0.1 VOL 4.5V 0.1 V IOH=4mA 3V 0.36 IOH=8mA 4.5V 0.36 II VI=5.5VorGND 0Vto5.5V ±0.1 µA ICC VI=VCCorGND, IO=0 5.5V 2 µA Ci VI=VCCorGND 5V 4 10 pF Copyright©1996–2015,TexasInstrumentsIncorporated SubmitDocumentationFeedback 5 ProductFolderLinks:SN74AHC08 SN54AHC08

SN74AHC08,SN54AHC08 SCLS236J–MARCH1996–REVISEDDECEMBER2015 www.ti.com 7.6 Electrical Characteristics, T = –55°C to 125°C, SN54AHC08 A overoperatingfree-airtemperaturerange(unlessotherwisenoted) PARAMETER TESTCONDITIONS VCC MIN MAX UNIT 2V 1.9 IOH=–50µA 3V 2.9 VOH 4.5V 4.4 V IOH=–4mA 3V 2.48 IOH=–8mA 4.5V 3.8 2V 0.1 IOL=50µA 3V 0.1 VOL 4.5V 0.1 V IOH=4mA 3V 0.5 IOH=8mA 4.5V 0.5 II VI=5.5VorGND 0Vto5.5V ±1(1) µA ICC VI=VCCorGND, IO=0 5.5V 20 µA Ci VI=VCCorGND 5V pF (1) OnproductscomplianttoMIL-PRF-38535,thisparameterisnotproductiontestedatVCC=0V. 7.7 Electrical Characteristics, T = –40°C to 125°C, SN74AHC08 A overoperatingfree-airtemperaturerange(unlessotherwisenoted) PARAMETER TESTCONDITIONS VCC TA MIN MAX UNIT 2V 1.9 IOH=–50µA 3V 2.9 VOH 4.5V 4.4 V IOH=–4mA 3V 2.48 IOH=–8mA 4.5V 3.8 2V 0.1 IOL=50µA 3V 0.1 4.5V 0.1 TA=–40°Cto85°C 0.44 VOL IOH=4mA 3V TA=–40°Cto125°C 0.5 V Recommended TA=–40°Cto85°C 0.44 IOH=8mA 4.5V TA=–40°Cto125°C 0.5 Recommended II VI=5.5VorGND 0Vto5.5V ±1 µA ICC VI=VCCorGND,IO=0 5.5V 20 µA Ci VI=VCCorGND 5V TA=–40°Cto85°C 10 pF 7.8 Switching Characteristics, V = 3.3 V ± 0.3 V CC overrecommendedoperatingfree-airtemperaturerange(unlessotherwisenoted)(seeFigure2) FROM TO LOAD PARAMETER (INPUT) (OUTPUT) CAPACITANCE TA MIN TYP MAX UNIT TA=25°C 6.2(1) 8.8(1) TA=–55°Cto125°C,SN54AHC08 1(1) 10.5(1) tPLH,tPHL AorB Y CL=15pF TA=–40°Cto85°C,SN74AHC08 1 10.5 ns TA=–40°Cto125°CRecommended, 1 10.5 SN74AHC08 TA=25°C 8.7 12.3 TA=–55°Cto125°C,SN54AHC08 1 14 tPLH,tPHL AorB Y CL=50pF TA=–40°Cto85°C,SN74AHC08 1 14 ns TA=–40°Cto125°CRecommended, 1 14 SN74AHC08 (1) OnproductscomplianttoMIL-PRF-38535,thisparameterisnotproductiontested. 6 SubmitDocumentationFeedback Copyright©1996–2015,TexasInstrumentsIncorporated ProductFolderLinks:SN74AHC08 SN54AHC08

SN74AHC08,SN54AHC08 www.ti.com SCLS236J–MARCH1996–REVISEDDECEMBER2015 7.9 Switching Characteristics, V = 5 V ± 0.5 V CC overrecommendedoperatingfree-airtemperaturerange(unlessotherwisenoted)(seeFigure2) FROM TO LOAD PARAMETER (INPUT) (OUTPUT) CAPACITANCE TA MIN TYP MAX UNIT TA=25°C 4.3(1) 5.9(1) TA=–55°Cto125°C,SN54AHC08 1(1) 7(1) tPLH,tPHL AorB Y CL=15pF TA=–40°Cto85°C,SN74AHC08 1 7 ns TA=–40°Cto125°CRecommended, 1 7 SN74AHC08 TA=25°C 5.8 7.9 TA=–55°Cto125°C,SN54AHC08 1 9 tPLH,tPHL AorB Y CL=50pF TA=–40°Cto85°C,SN74AHC08 1 9 ns TA=–40°Cto125°CRecommended, 1 9 SN74AHC08 (1) OnproductscomplianttoMIL-PRF-38535,thisparameterisnotproductiontested. 7.10 Noise Characteristics, SN74AHC08 V =5V,C =50pF,T =25°C(1) CC L A MIN MAX UNIT V Quietoutput,maximumdynamicV 0.8 V OL(P) OL V Quietoutput,minimumdynamicV –0.8 V OL(V) OL V Quietoutput,minimumdynamicV 4.4 V OH(V) OH V High-leveldynamicinputvoltage 3.5 V IH(D) V Low-leveldynamicinputvoltage 1.5 V IL(D) (1) Characteristicsareforsurface-mountpackagesonly. 7.11 Operating Characteristics V =5V,T =25°C CC A PARAMETER TESTCONDITIONS TYP UNIT C Powerdissipationcapacitance Noload,f=1MHz 18 pF pd 7.12 Typical Characteristics V =5.5V CC Figure1.AHCFamilyV vsI OL OL Copyright©1996–2015,TexasInstrumentsIncorporated SubmitDocumentationFeedback 7 ProductFolderLinks:SN74AHC08 SN54AHC08

SN74AHC08,SN54AHC08 SCLS236J–MARCH1996–REVISEDDECEMBER2015 www.ti.com 8 Parameter Measurement Information VCC From Output Test From Output RL= 1 kΩ S1 Open TEST S1 UnderTest Point UnderTest GND tPLH/tPHL Open CL CL tPLZ/tPZL VCC (see NoteA) (see NoteA) tPHZ/tPZH GND Open Drain VCC LOAD CIRCUIT FOR LOAD CIRCUIT FOR TOTEM-POLE OUTPUTS 3-STATEAND OPEN-DRAIN OUTPUTS VCC Timing Input 50% VCC tw th 0 V VCC tsu VCC Input 50% VCC 50% VCC Data Input 50% VCC 50% VCC 0 V 0 V VOLTAGEWAVEFORMS VOLTAGEWAVEFORMS PULSEDURATION SETUPAND HOLD TIMES VCC Output VCC Input 50% VCC 50% VCC Control 50% VCC 50% VCC 0 V 0 V tPLH tPHL tPZL tPLZ Output VOH Waveform 1 ≈VCC InO-Puhtapsuet 50%VCC 50% VCC S1 at VCC 50% VCC VOL+0.3V VOL (see Note B) VOL tPHL tPLH tPZH tPHZ Output Out-ofO-Puhtapsuet 50% VCC 50% VCVVCOOHL (WseSae1v eNaftoo GtremN BD2) 50% VCC VOH−0.3V V≈0O HV VOLTAGEWAVEFORMS VOLTAGEWAVEFORMS PROPAGATIONDELAYTIMES ENABLEAND DISABLE TIMES INVERTINGAND NONINVERTING OUTPUTS LOW-AND HIGH-LEVELENABLING A. C includesprobeandjigcapacitance. L B. Waveform1 is for an outputwith internalconditions such that theoutputis lowexceptwhendisabledby theoutput control. Waveform2isforanoutputwithinternalconditionssuchthattheoutputishighexceptwhendisabledbytheoutput control. C. Allinputpulsesaresuppliedbygeneratorshavingthefollowingcharacteristics:PRR≤1MHz,Z =50Ω,t ≤3ns,t O r f ≤3ns. D. Theoutputsaremeasuredoneatatimewithoneinputtransitionpermeasurement. E. Allparametersandwaveformsarenotapplicabletoalldevices. Figure2. LoadCircuitandVoltageWaveforms 8 SubmitDocumentationFeedback Copyright©1996–2015,TexasInstrumentsIncorporated ProductFolderLinks:SN74AHC08 SN54AHC08

SN74AHC08,SN54AHC08 www.ti.com SCLS236J–MARCH1996–REVISEDDECEMBER2015 9 Detailed Description 9.1 Overview The SNx4AHC08 devices are quadruple 2-input positive-AND gates with low drive that will produce slow rise and falltimes.Thisslowtransitionreducesringingontheoutputsignal.Theinputsarehighimpedancewhen V =0V. CC 9.2 Functional Block Diagram A Y B 9.3 Feature Description Slowriseandfalltimeonoutputsallowforlow-noiseoutputs. 9.4 Device Functional Modes Table1isthefunctiontablefortheSNx4AHC08. Table1.FunctionTable (EachGate) INPUTS OUTPUT A B Y H H H L X L X L L Copyright©1996–2015,TexasInstrumentsIncorporated SubmitDocumentationFeedback 9 ProductFolderLinks:SN74AHC08 SN54AHC08

SN74AHC08,SN54AHC08 SCLS236J–MARCH1996–REVISEDDECEMBER2015 www.ti.com 10 Application and Implementation NOTE Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes. Customers should validateandtesttheirdesignimplementationtoconfirmsystemfunctionality. 10.1 Application Information A common application for AND gates is the use in power sequencing. Power sequencing is often employed in applications that require a processor or other delicate device with specific voltage timing requirements in order to protect the device from malfunctioning. Using the SN74AHC08 to verify that the processor has turned on can protectitfromharmfulsignals. 10.2 Typical Application VCC = 5 V A Temp. Y EN Sensor B MCU (MSP43x) VO Figure3. TypicalApplicationDiagram 10.2.1 DesignRequirements ThisdeviceusesCMOStechnologyandhasbalancedoutputdrive.Takecaretoavoidbuscontentionbecauseit can drive currents that would exceed maximum limits. The high drive will also create fast edges into light loads, soroutingandloadconditionsmustbeconsideredtopreventringing. 10.2.2 DetailedDesignProcedure 1. Recommendedinputconditions – Risetimeandfalltimespecs:See(Δt/Δv)intheRecommendedOperatingConditionstable. – SpecifiedHighandlowlevels:See(V andV )intheRecommendedOperatingConditions table. IH IL – Inputsareovervoltagetolerantallowingthemtogoashighas5.5VatanyvalidV CC 2. Recommendoutputconditions – Loadcurrentsshouldnotexceed25mAperoutputand50mAtotalforthepart – OutputsshouldnotbepulledaboveV CC 10 SubmitDocumentationFeedback Copyright©1996–2015,TexasInstrumentsIncorporated ProductFolderLinks:SN74AHC08 SN54AHC08

SN74AHC08,SN54AHC08 www.ti.com SCLS236J–MARCH1996–REVISEDDECEMBER2015 Typical Application (continued) 10.2.3 ApplicationCurve V =5.5V CC Figure4. AHCFamilyV vsI OH OH 11 Power Supply Recommendations The power supply can be any voltage between the minimum and maximum supply voltage rating located in the AbsoluteMaximumRatingstable. Each V pin should have a good bypass capacitor to prevent power disturbance. For devices with a single CC supply, 0.1 μF is recommended. If there are multiple V pins, 0.01 μF or 0.022 μF is recommended for each CC powerpin.Itisacceptabletoparallelmultiplebypasscapstorejectdifferentfrequenciesofnoise.A0.1 μFand1 μF are commonly used in parallel. The bypass capacitor should be installed as close to the power pin as possibleforbestresults. 12 Layout 12.1 Layout Guidelines Whenusingmultiplebitlogicdevicesinputsshouldnoteverfloat. In many cases, functions or parts of functions of digital logic devices are unused, for example, when only two inputs of a triple-input AND gate are used or only 3 of the 4 buffer gates are used. Such input pins should not be left unconnected because the undefined voltages at the outside connections result in undefined operational states. Specified in Figure 5 are the rules that must be observed under all circumstances. All unused inputs of digital logic devices must be connected to a high or low bias to prevent them from floating. The logic level that must be applied to any particular unused input depends on the function of the device. Generally they will be tied to GND or V ; whichever makes more sense or is more convenient. It is generally acceptable to float outputs CC unless the part is a transceiver. If the transceiver has an output enable pin, it will disable the outputs section of thepartwhenasserted.ThiswillnotdisabletheinputsectionoftheIOs,sotheycannotfloatwhendisabled. Copyright©1996–2015,TexasInstrumentsIncorporated SubmitDocumentationFeedback 11 ProductFolderLinks:SN74AHC08 SN54AHC08

SN74AHC08,SN54AHC08 SCLS236J–MARCH1996–REVISEDDECEMBER2015 www.ti.com 12.2 Layout Example V cc Input Unused Input Output Unused Input Output Input Figure5. LayoutDiagram 12 SubmitDocumentationFeedback Copyright©1996–2015,TexasInstrumentsIncorporated ProductFolderLinks:SN74AHC08 SN54AHC08

SN74AHC08,SN54AHC08 www.ti.com SCLS236J–MARCH1996–REVISEDDECEMBER2015 13 Device and Documentation Support 13.1 Related Links The table below lists quick access links. Categories include technical documents, support and community resources,toolsandsoftware,andquickaccesstosampleorbuy. Table2.RelatedLinks TECHNICAL TOOLS& SUPPORT& PARTS PRODUCTFOLDER SAMPLE&BUY DOCUMENTS SOFTWARE COMMUNITY SN54AHC08 Clickhere Clickhere Clickhere Clickhere Clickhere SN74AHC08 Clickhere Clickhere Clickhere Clickhere Clickhere 13.2 Community Resources The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. TIE2E™OnlineCommunity TI'sEngineer-to-Engineer(E2E)Community.Createdtofostercollaboration amongengineers.Ate2e.ti.com,youcanaskquestions,shareknowledge,exploreideasandhelp solveproblemswithfellowengineers. DesignSupport TI'sDesignSupport QuicklyfindhelpfulE2Eforumsalongwithdesignsupporttoolsand contactinformationfortechnicalsupport. 13.3 Trademarks E2EisatrademarkofTexasInstruments. Allothertrademarksarethepropertyoftheirrespectiveowners. 13.4 Electrostatic Discharge Caution Thesedeviceshavelimitedbuilt-inESDprotection.Theleadsshouldbeshortedtogetherorthedeviceplacedinconductivefoam duringstorageorhandlingtopreventelectrostaticdamagetotheMOSgates. 13.5 Glossary SLYZ022—TIGlossary. Thisglossarylistsandexplainsterms,acronyms,anddefinitions. 14 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of thisdocument.Forbrowser-basedversionsofthisdatasheet,refertotheleft-handnavigation. Copyright©1996–2015,TexasInstrumentsIncorporated SubmitDocumentationFeedback 13 ProductFolderLinks:SN74AHC08 SN54AHC08

PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2020 PACKAGING INFORMATION Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples (1) Drawing Qty (2) (6) (3) (4/5) 5962-9682001Q2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 5962- 9682001Q2A SNJ54AHC 08FK SN74AHC08D ACTIVE SOIC D 14 50 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 AHC08 & no Sb/Br) SN74AHC08DBR ACTIVE SSOP DB 14 2000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 HA08 & no Sb/Br) SN74AHC08DG4 ACTIVE SOIC D 14 50 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 AHC08 & no Sb/Br) SN74AHC08DGVR ACTIVE TVSOP DGV 14 2000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 HA08 & no Sb/Br) SN74AHC08DR ACTIVE SOIC D 14 2500 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 AHC08 & no Sb/Br) SN74AHC08DRG4 ACTIVE SOIC D 14 2500 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 AHC08 & no Sb/Br) SN74AHC08N ACTIVE PDIP N 14 25 Green (RoHS NIPDAU N / A for Pkg Type -40 to 125 SN74AHC08N & no Sb/Br) SN74AHC08NSR ACTIVE SO NS 14 2000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 AHC08 & no Sb/Br) SN74AHC08PW ACTIVE TSSOP PW 14 90 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 HA08 & no Sb/Br) SN74AHC08PWG4 ACTIVE TSSOP PW 14 90 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 HA08 & no Sb/Br) SN74AHC08PWR ACTIVE TSSOP PW 14 2000 Green (RoHS NIPDAU | SN Level-1-260C-UNLIM -40 to 125 HA08 & no Sb/Br) SN74AHC08PWRE4 ACTIVE TSSOP PW 14 2000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 HA08 & no Sb/Br) SN74AHC08PWRG4 ACTIVE TSSOP PW 14 2000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 HA08 & no Sb/Br) SN74AHC08RGYR ACTIVE VQFN RGY 14 3000 Green (RoHS NIPDAU Level-2-260C-1 YEAR -40 to 125 HA08 & no Sb/Br) SNJ54AHC08FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 5962- 9682001Q2A SNJ54AHC Addendum-Page 1

PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2020 Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples (1) Drawing Qty (2) (6) (3) (4/5) 08FK (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement. (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF SN54AHC08, SN74AHC08 : •Catalog: SN74AHC08 Addendum-Page 2

PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2020 •Enhanced Product: SN74AHC08-EP, SN74AHC08-EP •Military: SN54AHC08 NOTE: Qualified Version Definitions: •Catalog - TI's standard catalog product •Enhanced Product - Supports Defense, Aerospace and Medical Applications •Military - QML certified for Military and Defense Applications Addendum-Page 3

PACKAGE MATERIALS INFORMATION www.ti.com 17-Apr-2020 TAPE AND REEL INFORMATION *Alldimensionsarenominal Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1 Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant (mm) W1(mm) SN74AHC08DGVR TVSOP DGV 14 2000 330.0 12.4 6.8 4.0 1.6 8.0 12.0 Q1 SN74AHC08DR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 SN74AHC08NSR SO NS 14 2000 330.0 16.4 8.1 10.4 2.5 12.0 16.0 Q1 SN74AHC08PWR TSSOP PW 14 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1 SN74AHC08PWR TSSOP PW 14 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1 SN74AHC08PWRG4 TSSOP PW 14 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1 SN74AHC08RGYR VQFN RGY 14 3000 330.0 12.4 3.75 3.75 1.15 8.0 12.0 Q1 PackMaterials-Page1

PACKAGE MATERIALS INFORMATION www.ti.com 17-Apr-2020 *Alldimensionsarenominal Device PackageType PackageDrawing Pins SPQ Length(mm) Width(mm) Height(mm) SN74AHC08DGVR TVSOP DGV 14 2000 367.0 367.0 35.0 SN74AHC08DR SOIC D 14 2500 367.0 367.0 38.0 SN74AHC08NSR SO NS 14 2000 367.0 367.0 38.0 SN74AHC08PWR TSSOP PW 14 2000 364.0 364.0 27.0 SN74AHC08PWR TSSOP PW 14 2000 367.0 367.0 35.0 SN74AHC08PWRG4 TSSOP PW 14 2000 367.0 367.0 35.0 SN74AHC08RGYR VQFN RGY 14 3000 367.0 367.0 35.0 PackMaterials-Page2

None

None

None

None

None

MECHANICAL DATA MPDS006C – FEBRUARY 1996 – REVISED AUGUST 2000 DGV (R-PDSO-G**) PLASTIC SMALL-OUTLINE 24 PINS SHOWN 0,23 0,40 0,07 M 0,13 24 13 0,16 NOM 4,50 6,60 4,30 6,20 Gage Plane 0,25 0°–(cid:1)8° 0,75 1 12 0,50 A Seating Plane 0,15 1,20 MAX 0,08 0,05 PINS ** 14 16 20 24 38 48 56 DIM A MAX 3,70 3,70 5,10 5,10 7,90 9,80 11,40 A MIN 3,50 3,50 4,90 4,90 7,70 9,60 11,20 4073251/E 08/00 NOTES: A. All linear dimensions are in millimeters. B. This drawing is subject to change without notice. C. Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side. D. Falls within JEDEC: 24/48 Pins – MO-153 14/16/20/56 Pins – MO-194 • POST OFFICE BOX 655303 DALLAS, TEXAS 75265

None

None

None

None

None

MECHANICAL DATA MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001 DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE 28 PINS SHOWN 0,38 0,65 0,15 M 0,22 28 15 0,25 0,09 5,60 8,20 5,00 7,40 Gage Plane 1 14 0,25 A 0°–(cid:1)8° 0,95 0,55 Seating Plane 2,00 MAX 0,05 MIN 0,10 PINS ** 14 16 20 24 28 30 38 DIM A MAX 6,50 6,50 7,50 8,50 10,50 10,50 12,90 A MIN 5,90 5,90 6,90 7,90 9,90 9,90 12,30 4040065/E 12/01 NOTES: A. All linear dimensions are in millimeters. B. This drawing is subject to change without notice. C. Body dimensions do not include mold flash or protrusion not to exceed 0,15. D. Falls within JEDEC MO-150 • POST OFFICE BOX 655303 DALLAS, TEXAS 75265

IMPORTANTNOTICEANDDISCLAIMER TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATASHEETS), DESIGN RESOURCES (INCLUDING REFERENCE DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS” AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS. These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable standards, and any other safety, security, or other requirements. These resources are subject to change without notice. TI grants you permission to use these resources only for development of an application that uses the TI products described in the resource. Other reproduction and display of these resources is prohibited. No license is granted to any other TI intellectual property right or to any third party intellectual property right. TI disclaims responsibility for, and you will fully indemnify TI and its representatives against, any claims, damages, costs, losses, and liabilities arising out of your use of these resources. TI’s products are provided subject to TI’s Terms of Sale (www.ti.com/legal/termsofsale.html) or other applicable terms available either on ti.com or provided in conjunction with such TI products. TI’s provision of these resources does not expand or otherwise alter TI’s applicable warranties or warranty disclaimers for TI products. Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2020, Texas Instruments Incorporated