SM15TxxA, SM15TxxCA Datasheet 1500 W TVS in SMC Features • Peak pulse power: – 1500 W (10/1000 μs) – up to 10 kW (8/20 μs) • Stand-off voltage range from 5 V to 188 V • Unidirectional and bidirectional types • Low leakage current: 0.2 µA at 25 °C • Operating T max: 150 °C j • High power capability at T max.: up to 1250 W (10/1000 µs) j • Lead finishing: matte tin plating Complies with the following standards • UL94, V0 • J-STD-020 MSL level 1 • J-STD-002, JESD 22-B102 E3 and MIL-STD-750, method 2026 • JESD-201 class 2 whisker test • IPC7531 footprint and JEDEC registered package outline • UL 497B file number: QVGQ2.E136224 • IEC 61000-4-4 level 4: – 4 k V Product status link • IEC 61000-4-2, C = 150 pF, R = 330 Ω exceeds level 4: – 30 kV (air discharge) SM15T6V8A , SM15T6V8CA , SM15T7V5A , SM15T7V5CA , – 30 kV (contact discharge) SM15T10A , SM15T10CA , SM15T12A , SM15T12CA , SM15T15A , SM15T15CA , Description SM15T18A , SM15T18CA , SM15T22A , SM15T22CA , The SM15T TVS series are designed to protect sensitive equipment against SM15T24A , SM15T24CA , electrostatic discharges according to IEC 61000-4-2, MIL STD 883 Method 3015, and SM15T27A , SM15T27CA , electrical overstress such as IEC 61000-4-4 and 5. They are used for surges below SM15T SM15T30A , SM15T30CA , 1500 W 10/1000 μs. SM15T33A , SM15T33CA , SM15T36A , SM15T36CA , This planar technology makes it compatible with high-end equipment and SMPS SM15T39A , SM15T39CA , where low leakage current and high junction temperature are required to provide SM15T68A , SM15T68CA , reliability and stability over time. SM15T75A , SM15T75CA , SM15T100A , SM15T100CA , SM15T150A , SM15T150CA , SM15T200A , SM15T200CA , SM15T220A , SM15T220CA DS0683 - Rev 7 - April 2020 www.st.com For further information contact your local STMicroelectronics sales office.

SM15TxxA, SM15TxxCA Characteristics 1 Characteristics Table 1. Absolute maximum ratings (T = 25 °C) amb Symbol Parameter Value Unit IEC 61000-4-2 (C = 150 pF, R = 330 Ω) VPP Peak pulse voltage Contact discharge 30 kV Air discharge 30 PPP Peak pulse power dissipation Tj initial = Tamb 1500 W Tstg Storage temperature range -65 to +150 °C Tj Operating junction temperature range -55 to +150 °C TL Maximum lead temperature for soldering during 10 s 260 °C Figure 1. Electrical characteristics - parameter definitions Figure 2. Pulse definition for electrical characteristics DS0683 - Rev 7 page 2/12

SM15TxxA, SM15TxxCA Characteristics Table 2. Electrical characteristics - parameter values (T = 25 °C, unless otherwise specified) amb 10 / 1000 µs 8 / 20µs IRM max at VRM VBR at IBR (1) αT VCL(2)(3) IPP(4) RD VCL(2)(3) IPP(4) RD Type 25 °C 85 °C Min. Typ. Max. Max. Max. Max. Max. Max. µA µA V V mA V A Ω V A Ω 10-4/°C SM15T6V8A/CA 500 2000 5.8 6.45 6.8 7.14 10 10.5 143 0.023 13.4 746 0.008 5.7 SM15T7V5A/CA 250 1000 6.4 7.13 7.5 7.88 10 11.3 132 0.026 14.5 690 0.010 6.1 SM15T10A/CA 10 50 8.55 9.5 10 10.5 1 14.5 103 0.039 18.6 538 0.015 7.3 SM15T12A/CA 0.2 1 10.2 11.4 12 12.6 1 16.7 90 0.046 21.7 461 0.020 7.8 SM15T15A/CA 0.2 1 12.8 14.3 15 15.8 1 21.2 71 0.076 27.2 368 0.031 8.4 SM15T18A/CA 0.2 1 15.3 17.1 18 18.9 1 25.2 59.5 0.106 32.5 308 0.044 8.8 SM15T22A/CA 0.2 1 18.8 20.9 22 23.1 1 30.6 49 0.153 39.3 254 0.064 9.2 SM15T24A/CA 0.2 1 20.5 22.8 24 25.2 1 33.2 45 0.178 42.8 234 0.075 9.4 SM15T27A/CA 0.2 1 23.1 25.7 27 28.4 1 37.5 40 0.228 48.3 207 0.096 9.6 SM15T30A/CA 0.2 1 25.6 28.5 30 31.5 1 41.5 36 0.278 53.5 187 0.12 9.7 SM15T33A/CA 0.2 1 28.2 31.4 33 34.7 1 45.7 33 0.333 59.0 169 0.14 9.8 SM15T36A/CA 0.2 1 30.8 34.2 36 37.8 1 49.9 30 0.403 64.3 156 0.17 9.9 SM15T39A/CA 0.2 1 33.3 37.1 39 41.0 1 53.9 28 0.461 69.7 143 0.20 10.0 SM15T68A/CA 0.2 1 58.1 64.6 68 71.4 1 92 16.3 1.26 121 83 0.60 10.4 SM15T75A/CA 0.2 1 64.1 71.3 75 78.8 1 103 14.6 1.66 134 75 0.74 10.5 SM15T100A/CA 0.2 1 85.5 95.0 100 105 1 137 11 2.91 178 56 1.30 10.6 SM15T150A/CA 0.2 1 128 143 150 158 1 207 7.2 6.81 265 38 2.82 10.8 SM15T200A/CA 0.2 1 171 190 200 210 1 274 5.5 11.6 353 28 5.11 10.8 SM15T220A/CA 0.2 1 188 209 220 231 1 328 4.6 21.1 388 26 6.04 10.8 1. To calculate VBR versus Tj : VBR at Tj = VBR at 25 °C x (1 + αT x (Tj - 25)) 2. To calculate VCL versus Tj : VCL at Tj = VCL at 25 °C x (1 + αT x (Tj - 25)) 3. To calculate VCL max versus IPPappli: VCLmax = VCL - RD x (IPP - IPPappli) where IPP appli is the surge current in the application 4. Surge capability given for both directions for unidirectional (A type) and bidirectional (CA type) devices DS0683 - Rev 7 page 3/12

SM15TxxA, SM15TxxCA Characteristics (curves) 1.1 Characteristics (curves) Figure 3. Maximum peak power dissipation versus initial Figure 4. Maximum peak pulse power versus exponential junction temperature pulse duration 2000 Ppp (W) 100000 PPP(W) 10/1000 µs Tjinitial = 25 °C 1500 10000 1000 1000 500 Tj (°C) tp (ms) 0 100 0 25 50 75 100 125 150 175 0.001 0.01 0.1 1 10 100 Figure 5. Maximum peak pulse current versus clamping Figure 6. Dynamic resistance versus pulse duration voltage RD(Ω) IPP(A) 1000 10000 8/20 µs 100 10/1000 µs 1000 10 SM15T220A/CA 100 1 SM15T82A/CA 10 0.1 SM15T30A/CA 1 SM15T6V8A/CA SM15T15A/CA SM15T30A/CA SM15T82A/CA SM15T220A/CA VCL (V) 00.0.0011 SSMM1155TT61V58AA//CCAA tp (ms) 0.1 0.01 0.1 1 10 100 1 10 100 1000 DS0683 - Rev 7 page 4/12

SM15TxxA, SM15TxxCA Characteristics (curves) Figure 7. Junction capacitance versus reverse applied Figure 8. Junction capacitance versus applied voltage voltage (unidirectional type) (bidirectional type) C (nF) C (nF) 10 10 f = 1 MHz f = 1 MHz SM15T6V8A VosTc j= = 3 205m°VCRMS SM15T6V8CA VoscT =j = 3 205m°VCRMS SM15T15A SM15T15CA 1 1 SM15T30A SM15T30CA SM15T82A SM15T82CA 0.1 0.1 SM15T220CA SM15T220A VR (V) VR (V) 0.01 0.01 1 10 100 1000 1 10 100 1000 Figure 10. Peak forward voltage drop versus peak forward Figure 9. Leakage current versus junction temperature current IR (nA) I (A) 100000 100 F VR = VRM single pulse 10000 VRM< 10V 10 1000 Tj= 125 °C Tj= 25 °C 100 1 VRM≥ 10V 10 1 Tj (°C) VF (V) 25 50 75 100 125 150 175 0 0 0.5 1 1.5 2 2.5 3 Figure 11. Thermal impedance junction to ambient versus Figure 12. Thermal resistance junction to ambient versus pulse duration copper area under each lead Z (°C/W) R (°C/W) 1000 th(j-a) 120 th(j-a) Single pulse on recommended footprint. Single pulse on recommended footprint. Epoxy printed circuit board FR4, 70 µm Cu thickness Epoxy printed circuit board FR4, 70 µm Cu thickness 100 100 80 60 10 40 20 tp (s) S (cm²) 10.01 0.1 1 10 100 1000 00 0.5 1 1.5 2 2.5 3 3.5 4 Cu4 .5 5 DS0683 - Rev 7 page 5/12

SM15TxxA, SM15TxxCA Package information 2 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. 2.1 SMC package information • Epoxy meets UL94, V0 Figure 13. SMC package outline E1 D E A1 A2 b C L E2 Table 3. SMC package mechanical data Dimensions Ref. Millimeters Inches (for reference only) Min. Max. Min. Max. A1 1.90 2.45 0.075 0.096 A2 0.05 0.20 0.002 0.008 b 2.90 3.20 0.114 0.126 c 0.15 0.40 0.006 0.016 D 5.55 6.25 0.218 0.246 E 7.75 8.15 0.305 0.321 E1 6.60 7.15 0.260 0.281 E2 4.40 4.70 0.173 0.185 L 0.75 1.50 0.030 0.060 DS0683 - Rev 7 page 6/12

SM15TxxA, SM15TxxCA SMC package information Figure 14. Footprint recommendation Figure 15. Marking layout 1.54 5.11 1.54 (0.061) (0.201) (0.061) 3.14 (0.124) 8.19 (0.323) millimeters (inches) Figure 16. Package orientation in reel Figure 17. Tape and reel orientation Figure 19. Inner box dimension values (mm) Figure 18. 13'' reel dimension values (mm) DS0683 - Rev 7 page 7/12

SM15TxxA, SM15TxxCA SMC package information Figure 20. Tape outline Table 4. Tape dimension values Dimensions Ref. Millimeters Min. Typ. Max. D0 1.4 1.5 1.6 D1 1.5 F 7.4 7.5 7.6 K0 2.39 2.49 2.59 P0 3.9 4.0 4.1 P1 7.9 8.0 8.1 P2 1.9 2.0 2.1 W 15.7 16 16.3 DS0683 - Rev 7 page 8/12

SM15TxxA, SM15TxxCA Reflow profile 2.2 Reflow profile Figure 21. ST ECOPACK recommended soldering reflow profile for PCB mounting 240-245 °C Temperature (°C) 250 -2°C/s 2 - 3 °C/s 200 60sec (90max) -3°C/s 150 -6°C/s 100 0.9 °C/s 50 Time (s) 0 30 60 90 120 150 180 210 240 270 300 Note: Minimize air convection currents in the reflow oven to avoid component movement. Maximum soldering profile corresponds to the latest IPC/JEDEC J-STD-020. DS0683 - Rev 7 page 9/12

SM15TxxA, SM15TxxCA Ordering information 3 Ordering information Table 5. Ordering information Order code Marking Package Weight Base qty. Delivery mode SM15TxxA/CA-TR(1) See Table 6. Marking SMC 0.25 g 2500 Tape and reel 1. Where xxx is nominal value of VBR and A or CA indicates unidirectional or bidirectional version. Table 6. Marking Order code Marking Order code Marking SM15T6V8A MDE SM15T6V8CA BDE SM15T7V5A MDG SM15T7V5CA BDG SM15T10A MDP SM15T10CA BDP SM15T12A MDT SM15T12CA BDT SM15T15A MDX SM15T15CA BDX SM15T18A MEE SM15T18CA BEE SM15T22A MEK SM15T22CA BEK SM15T24A MEM SM15T24CA BEM SM15T27A MEP SM15T27CA BEP SM15T30A MER SM15T30CA BER SM15T33A MET SM15T33CA BET SM15T36A MEV SM15T36CA BEV SM15T39A MEX SM15T39CA BEX SM15T68A MFP SM15T68CA BFP SM15T75A MFO SM15T75CA BFO SM15T100A MFX SM15T100CA BFX SM15T150A MGK SM15T150CA BGK SM15T200A MGV SM15T200CA BGV SM15T220A MGX SM15T220CA BGX DS0683 - Rev 7 page 10/12

SM15TxxA, SM15TxxCA Revision history Table 7. Document revision history Date Version Changes September-2001 3B Last issue 19-Feb-2007 4 Peak pulse power Figure 4 on page 4 updated. Updated ECOPACK statement. Added RD columns in Table 3. Updated 04-Feb-2009 5 characteristic curves, Figure 3 to Figure 11. 17-Sep-2009 6 Document updated for low leakage current. Removed figure 12. Minor text changes to improve the readability of the 24-Apr-2020 7 document. DS0683 - Rev 7 page 11/12

SM15TxxA, SM15TxxCA IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. For additional information about ST trademarks, please refer to www.st.com/trademarks. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2020 STMicroelectronics – All rights reserved DS0683 - Rev 7 page 12/12