HSP062-2 2-line ESD protection for high speed lines Datasheet - production data Benefits • High ESD robustness of the equipment • Suitable for high density boards Complies with following standards • MIL-STD 883G Method 3015-7 Class 3B: – 8 kV HSP062-2M6 • IEC 61000-4-2 level 4: µQFN-6L package – 15 kV (air discharge) – 8 kV (contact discharge) Applications The HSP062-2M6 is designed to protect against Figure 1. Functional schematic (top view) electrostatic discharge on sub micron technology circuits driving: • HDMI 1.3 and 1.4 I/O1 1 6 NC • Digital Video Interface • Display Port I/O2 2 5 NC • USB 3.0 • Serial ATA GND 3 4 VBUS • Ethernet • HMI µQFN 6 leads Description Features The HSP062-2 is a 2-channel ESD array with a rail to rail architecture designed specifically for the • Flow-through routing to keep signal integrity protection of high speed differential lines. • Ultralarge bandwidth: 4.6 GHz The ultralow variation of the capacitance ensures • Ultralow capacitance: 0.6 pF very low influence on signal-skew. The large • Low leakage current: 100 nA at 25 °C bandwidth makes it compatible with 5 Gbps. • Extended operating junction temperature The device is packaged in µQFN-6L (1.45 x 1.0 range: -40 °C to 150 °C mm) with a 500µm pitch. • RoHS compliant October 2015 DocID022778 Rev 3 1/10 This is information on a product in full production. www.st.com

Characteristics HSP062-2 1 Characteristics Table 1. Absolute maximum ratings T = 25 °C amb Symbol Parameter Value Unit IEC 61000-4-2 contact discharge 8 V Peak pulse voltage kV PP IEC 61000-4-2 air discharge 15 I Repetitive peak pulse current (8/20 µs) 3 A pp T Operating junction temperature range -40 to +150 °C j T Storage temperature range -65 to +150 °C stg T Maximum lead temperature for soldering during 10 s 260 °C L Table 2. Electrical characteristics T = 25 °C amb Symbol Parameter Test conditions Min. Typ. Max. Unit V Breakdown voltage I = 1 mA 6 V BR R I Leakage current V = 3 V 100 nA RM RM IEC 61000-4-2, +8 kV contact (I V Clamping voltage PP 18 V CL = 30 A), measured at 30 ns Capacitance (input/output to V = 0 V, F = 200 to 3000 MHz, C I/O 0.6 0.9 pF I/O - GND ground) V = 30 mV OSC Capacitance variation V = 0 V F = 200 to 3000 MHz, ΔC I/O 0.09 0.17 pF I/O - GND (input/output to ground) V = 30 mV OSC f Cut-off frequency -3 dB 4.6 GHz C 2/10 DocID022778 Rev 3

HSP062-2 Characteristics Figure 2. L eakage current versus junction Figure 3. S21 attenuation measurement temperature (typical values) dB 10.00 0.00 IR(nA) VR=VRM= 3V -3.00 1.00 4.6 GHz @ -3dB -6.00 -9.00 0.10 -12.00 F(Hz) Tj(°C) 0.01 -15.00 25 50 75 100 125 150 300.0k 1.0M 3.0M 10.0M 30.0M 100.0M300.0M 1.0G 3.0G IO1 IO2 Figure 4. Ey e diagram - HDMI mask at 3.4Gbps Figure 5. ESD response to IEC 61000-4-2 per channel(1) (+8kV contact discharge) (HSP062-2M6) 250 mV/div 10V/Div 100ns/Div 49 ps/div 1. HDMI specification conditions. This information can be provided for other applications. Please contact your local ST office. Figure 6 . ESD response to IEC 61000-4-2 (-8kV contact discharge) 10V/Div 100ns/Div DocID022778 Rev 3 3/10 10

Ordering information scheme HSP062-2 2 Ordering information scheme Figure 7. Ordering information scheme HSP 06 2 - 2 M6 High speed line protection Breakdown Voltage Version Number of lines Package M6 = µQFN-6L 4/10 DocID022778 Rev 3

HSP062-2 Package information 3 Package information • Epoxy meets UL94, V0 • Lead-free package In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Table 3. Micro QFN 1.45x1.00 6L dimensions Dimensions 1 2 Ref. Millimeters Inches L k Min. Typ. Max. Min. Typ. Max. A 0.50 0.55 0.60 0.020 0.022 0.024 b e A1 0.00 0.02 0.05 0.000 0.001 0.002 b 0.18 0.25 0.30 0.007 0.010 0.012 A D 1.45 0.057 A1 D E 1.00 0.039 N e 0.50 0.020 E K 0.20 0.008 1 2 L 0.30 0.35 0.40 0.012 0.014 0.016 Figure 8. Footprint recommendations Figure 9. Marking for Micro QFN 1.45x1.00 dimensions in mm (inches) 6L 0.50 0.25 [0.020] [0.010] 0.65 [0.026] S 1.60 0.30 [0.063] [0.012] Note: Product marking may be rotated by 90° for assembly plant differentiation. In no case should this product marking be used to orient the component for its placement on a PCB. Only pin 1 mark is to be used for this purpose. DocID022778 Rev 3 5/10 10

Recommendation on PCB assembly HSP062-2 4 Recommendation on PCB assembly 4.1 Stencil opening design 1. General recommendation on stencil opening design a) Stencil opening dimensions: L (Length), W (Width), T (Thickness). Figure 10. Stencil opening dimensions L T W b) General design rule Stencil thickness (T) = 75 ~ 125 µm W Aspect Ratio = -----≥1.5 T L×W Aspect Area = ----------------------------≥0.66 2T(L+W) 2. Reference design a) Stencil opening thickness: 100 µm b) Stencil opening for leads: Opening to footprint ratio is 90%. Figure 11. Recommended stencil window position 7µm 7µm 15µm 650µm 620µm 236µm 15µm Footprint 250µm Stencilwindow Footprint 6/10 DocID022778 Rev 3

HSP062-2 Recommendation on PCB assembly 4.2 Solder paste 1. Halide-free flux qualification ROL0 according to ANSI/J-STD-004. 2. “No clean” solder paste is recommended. 3. Offers a high tack force to resist component movement during high speed. 4. Solder paste with fine particles: powder particle size is 20-45 µm. 4.3 Placement 1. Manual positioning is not recommended. 2. It is recommended to use the lead recognition capabilities of the placement system, not the outline centering. 3. Standard tolerance of ± 0.05 mm is recommended. 4. 3.5 N placement force is recommended. Too much placement force can lead to squeezed out solder paste and cause solder joints to short. Too low placement force can lead to insufficient contact between package and solder paste that could cause open solder joints or badly centered packages. 5. To improve the package placement accuracy, a bottom side optical control should be performed with a high resolution tool. 6. For assembly, a perfect supporting of the PCB (all the more on flexible PCB) is recommended during solder paste printing, pick and place and reflow soldering by using optimized tools. 4.4 PCB design preference 1. To control the solder paste amount, the closed via is recommended instead of open vias. 2. The position of tracks and open vias in the solder area should be well balanced. The symmetrical layout is recommended, in case any tilt phenomena caused by asymmetrical solder paste amount due to the solder flow away. DocID022778 Rev 3 7/10 10

Recommendation on PCB assembly HSP062-2 4.5 Reflow profile Figure 12. ST ECOPACK® recommended soldering reflow profile for PCB mounting TTeemmppeerraattuurree ((°°CC)) 226600°°CC mmaaxx 225555°°CC 222200°°CC 118800°°CC 112255 °°CC 2°C/s 2r°eCc/osm remceonmdmedended 3°C/s max 6°C/s max 6°C/s max 3°C/s max 00 00 11 22 33 44 55 66 77 1100--3300 sseecc TTiimmee ((mmiinn)) 9900 ttoo 115500 sseecc 9900 sseecc mmaaxx Note: Minimize air convection currents in the reflow oven to avoid component movement. 8/10 DocID022778 Rev 3

HSP062-2 Ordering information 5 Ordering information T able 4. Ordering information Order code Marking Package Weight Base qty Delivery mode HSP062-2M6 S(1) µQFN-6L 2.3 mg 3000 Tape and reel (7”) 1. The marking can be rotated by multiple of 90° to differentiate assembly location 6 Revision history Table 5. Document revision history Date Revision Changes 07-Feb-2012 1 Initial release. 19-Mar-2014 2 Minor text changes. Removed device in SOT-666. 07-Oct-2015 3 Updated document accordingly. DocID022778 Rev 3 9/10 10

HSP062-2 IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2015 STMicroelectronics – All rights reserved 10/10 DocID022778 Rev 3

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