TVS Diode Arrays (SPA® Diodes) Lightning Surge Protection - LC03-3.3 Series LC03-3.3 Series 3.3V 150A Diode Array RoHS Pb GREEN Description This LC03-3.3 series provides overvoltage protection for applications such as 10/100/1000 BaseT Ethernet and T3/E3 interfaces. This new protector combines the TVS diode element with a diode rectifier bridge to provide both longitudinal and differential protection in one package. This design results in a capacitive loading characteristic that is log-linear with respect to the signal voltage across the device. This reduces intermodulation (IM) distortion caused by a typical solid-state protection solution. The application schematic provides the connection information and the LC03-3.3 is rated for GR-1089, intra-building transient immunity requirements for telecommunication installations. Pinout Features • Lightning Protection, IEC • UL 94V-0 epoxy molding 61000-4-5 2nd edition, • RoHS and Lead-free 1 8 150A (tp=8/20µs) compliant • EFT, IEC 61000-4-4, 40A • Moisture Sensitivity Level 2 7 (tp=5/50ns) (MSL-1) 3 6 • Low insertion loss, log- linear capacitance 4 5 • Low clamping voltage • SOIC-8 surface mount SOIC-8 (Top View) package (JEDEC MS-012) Functional Block Diagram Applications Pin 1 and 8 • T1/E1 Line cards • 10/100/1000 BaseT Line in Line out • T3/E3 and DS3 Interfaces Ethernet • STS-1 Interfaces Pin 2, 3, 6, Application Example and 7 TeleLink (0461 1.25) LC03-3.3BTG Line in Line out Pin 4 and 5 1 8 to chipset 2 7 (Ethernet PHY, T3/E3 PHY, etc.) 3 6 4 5 Additional Information This schematic shows a high-speed data interface protection solution. The LC03-3.3BTG is compatible with Datasheet Resources Samples the intra-building surge requirements of Telcordia’s GR- 1089-CORE, and the Basic Level Recommendations of ITU K.20 and K.21. The TeleLink fuse provides overcurrent protection for the long term 50/60 Hz power fault events. Life Support Note: Not Intended for Use in Life Support or Life Saving Applications The products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated. © 2017 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 02/23/17

TVS Diode Arrays (SPA® Diodes) Lightning Surge Protection - LC03-3.3 Series Absolute Maximum Ratings Thermal Information Parameter Rating Units Parameter Rating Units Peak Pulse Current (8/20µs) 150 A SOIC Package 170 °C/W Peak Pulse Power (8/20µs) 3300 W Operating Temperature Range –40 to 125 °C IEC 61000-4-2, Direct Discharge, (Level 4) 30 kV Storage Temperature Range –55 to 150 °C 3 IEC 61000-4-2, Air Discharge, (Level 4) 30 kV Maximum Junction Temperature 150 °C . 3 IEC 61000-4-5 (8/20µs) 150 A Maximum Lead Temperature (Soldering 260 °C A- Telcordia GR 1089 (Intra-Building) (2/10µs) 100 A 20-40s) (SOIC - Lead Tips Only) 3 0 ITU K.20 (5/310µs) 40 A P S CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Electrical Characteristics (T = 25°C) OP Parameter Symbol Test Conditions Min Typ Max Units Reverse Stand-Off Voltage V I≤1µA - - 3.3 V RWM T Reverse Breakdown Voltage V I= 2µA 3.3 - - V BR T Snap Back Voltage V I= 50mA 3.3 - - V SB T Reverse Leakage Current I V = 3.3V, T= 25°C - - 1 µA R RWM Clamping Voltage, Line-Ground V I = 50A, t=8/20 µs - - 13 V C PP p Clamping Voltage, Line-Ground V I = 100A, t=8/20 µs - - 17 V C PP p Dynamic Resistance, Line-Ground R (V -V )/(I -I ) - 0.15 - W DYN C2 C1 PP2 PP1 Clamping Voltage, Line-Line V I = 50A, t=8/20 µs - - 15 V C PP p Clamping Voltage, Line-Line V I = 100A, t=8/20 µs - - 20 V C PP p Dynamic Resistance , Line-Line R (V -V )/(I -I ) - 0.25 - W DYN C2 C1 PP2 PP1 Between I/O Pins and Ground - 9 12 pF V =0V, f= 1MHz Junction Capacitance C R j Between I/O Pins - 4.5 6 pF V =0V, f= 1MHz R Figure 1: Non-repetitive Peak Pulse Current vs. Pulse Time Figure 2: Current Derating Curve 1000 120 )I%P100 )A( tn100 ( tnerruC 80 erruC esluP k 10 detaR fo ega 4600 aeP tnecreP 20 1 0 1 10 100 1000 0 20 40 60 80 100 120 140 160 Pulse decay time (µs) Ambient Temperature (C) © 2017 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 02/23/17

TVS Diode Arrays (SPA® Diodes) Lightning Surge Protection - LC03-3.3 Series Figure 3: 8/20 µs Pulse Waveform Figure 4: Clamping Voltage vs. Peak Pulse Current 110% 18 100% 16 90% 14 80% V(V)C 12 Line to Line nt of IPP6700%% Voltage- 180 Line to Ground Perce 4500%% Clamp 46 30% 2 20% 0 10% 0 10 20 30 40 50 60 70 80 90 100 0% 0.0 5.0 10.0 15.0 20.0 25.0 30.0 Peak Pulse Current-IPP(A) Time (μs) Figure 5: Capacitance vs. Reverse Voltage Figure 6: Forward Voltage vs. Forward Current 10 7 9 Line to Ground 6 8 Ground-to-Line F) 7 )V 5 e (p 6 ( eg c a 4 Capacitan 345 Line to Line tloV drawro 23 F 2 1 1 0 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 0 10 20 30 40 50 60 70 80 90 100 Bias Voltage (V) Forward Current (A) Soldering Parameters Reflow Condition Pb – Free assembly tP TP CCrriittiiccaall ZZoonnee - Temperature Min (Ts(min)) 150°C e RRaammpp--uupp TTLL ttoo TTPP Pre Heat -- TTeimmep e(mraitnu rteo Mmaaxx )( T(ts()max)) 2600 0–° C180 secs rutare TS(mTaxL) tL s pm RRaammpp--ddoown Average ramp up rate (Liquidus) Temp e PPrreehheeaatt 3°C/second max T (TL) to peak TS(min) tS T to T - Ramp-up Rate 3°C/second max S(max) L Reflow -- TTeemmppeerraattuurree ((tTL)) (Liquidus) 26107 –° C1 50 seconds 25 time to peak temperature Time L Peak Temperature (T ) 260+0/-5 °C P Time within 5°C of actual peak 20 – 40 seconds Temperature (t ) p Ramp-down Rate 6°C/second max Time 25°C to peak Temperature (T ) 8 minutes Max. P Do not exceed 260°C © 2017 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 02/23/17

TVS Diode Arrays (SPA® Diodes) Lightning Surge Protection - LC03-3.3 Series Package Dimensions — Mechanical Drawings and Recommended Solder Pad Outline Package SOIC-8 Pins 8 JEDEC MS-012 Millimetres Inches LF 3 Min Max Min Max . 3 A 1.35 1.75 0.053 0.069 - o A A1 0.10 0.25 0.004 0.010 3 0 Recommended A2 1.25 1.65 0.050 0.065 P Soldering Pad Outline B 0.31 0.51 0.012 0.020 S (Reference Only) c 0.17 0.25 0.007 0.010 D 4.80 5.00 0.189 0.197 E 5.80 6.20 0.228 0.244 E1 3.80 4.00 0.150 0.157 e 1.27 BSC 0.050 BSC L 0.40 1.27 0.016 0.050 Embossed Carrier Tape & Reel Specification — SOIC Package Millimetres Inches User Feeding Direction Min Max Min Max E 1.65 1.85 0.065 0.073 F 5.4 5.6 0.213 0.22 P2 1.95 2.05 0.077 0.081 Pin 1 Location D 1.5 1.6 0.059 0.063 D1 1.50 Min 0.059 Min P0 3.9 4.1 0.154 0.161 10P0 40.0 ± 0.20 1.574 ± 0.008 Part Numbering System W 11.9 12.1 0.468 0.476 LC03–3.3 B T G P 7.9 8.1 0.311 0.319 A0 6.3 6.5 0.248 0.256 G= Green B0 5.1 5.3 0.2 0.209 T= Tape & Reel K0 2 2.2 0.079 0.087 Series Package t 0.30 ± 0.05 0.012 ± 0.002 B = SOIC Working Voltage Product Characteristics Part Marking System Lead Plating Matte Tin Lead Material Copper Alloy LF LC03-3.3 Lead Coplanarity 0.004 inches (0.102mm) XXXXXXXX First Line: Part number Substitute Material Silicon Second Line: Date code Body Material Molded Epoxy Ordering Information Flammability UL 94 V-0 Notes : Part Number Package Marking Min. Order Qty. 1. All dimensions are in millimeters 2. Dimensions include solder plating. LC03-3.3BTG SOIC-8 LC03-3.3 2500 3. Dimensions are exclusive of mold flash & metal burr. 4. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. 5. Package surface matte finish VDI 11-13. Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications. Read complete Disclaimer Notice at www.littelfuse.com/disclaimer-electronics. © 2017 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 02/23/17