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v02.0106 MILITARY & SPACE PRODUCTS Military Level (Class B) MMIC Die and Packaged Die Screening E C Hittite Microwave performs Class B screening on standard A & custom product die and packaged die including SMT P plastic encapsulated devices for COTS applications. We S also design, produce and screen highly integrated MIC & modules and subsystems for major defense OEMs. Y Die are shipped at customer request in either conductive R standard Gel-Paks or conductive standard Waffl e-Paks. A Tables 1 & 2 summarize tests Hittite Microwave will T perform on die, packaged die, modules and subsystems I L for military and Hi-Rel commercial applications. I M Military Screened Sub-Assembly Containing MIC Modules COTS SMT COTS SMT Hermetic Class B Die Plastic Package Hermetic Package MIC Hybrids Connectorized Module Screen MIL-STD-883 Test Method and Condition 1. Electrostatic Discharge Sensitivity (ESD) 3015 2. Wafer Acceptance Table 2 herein. Class-B element evaluation 3. Internal visual 2010, Test Condition B 4. Temperature cycling 1010, Test Condition C, 10 cycles minimum 5. Constant acceleration 2001, Test Condition A, Y1 orientation only 6. Serialization In accordance with device specifi cation 7. Interim (pre burn-in) electrical parameters In accordance with device specifi cation 8. Burn-in test 1015, 160 hours at +125 °C, biased 9. Interim (post burn-in) electrical parameters In accordance with device specifi cation 10. Final electrical test In accordance with device specifi cation 11. Seal 1014, Test Condition A & C a. Fine b. Gross 12. External visual 2009 and product outline specifi cation Table 1: Class B Packaged MMIC Die and MIC Sub-Assembly Screening Procedure to MIL-PRF-38534 and MIL-PRF-38535 as applicable. For price, delivery, and to place orders, please contact Hittite Microwave Corporation: i - 46 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com

v02.0106 MILITARY & SPACE PRODUCTS E C A Class MIL-STD-883 Sub Group Test Quantity P (accept number) S B Method Condition S 1 x x Element electrical 100 percent & 2 x x Element visual 2010 A = Class S 100 percent Y B = Class B 2072 1/ R 2073 1/ A 3 x x Internal visual 2010 A = Class S 10 (0) T B = Class B I L 2072 1/ I 2073 1/ M 4 x Temperature cycling 1010 C 10 (0) x Interim electrical x Burn-in 1015 240 hours minimum at +125°C, biased x Post burn-in electrical x Steady-state life 1005 1000 hours minimum at +125°C, biased x x Final electrical 5 x x Wire bond evaluation 2011 D 10 (0) wires or 20 (1) wires 6 x Wafer Lot 5007 5 (0) die per wafer Acceptance Test (LAT) • SEM • Wafer Thickness • Metal Thickness • Glassivation Thickness 1/ MIL-PRF-38534 methods Table 2: Class S & B MMIC Die/Wafer Screening & Qualification Procedure For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 i - 47 Order On-line at www.hittite.com