Spec. No. JENF243A-0016R-01 Ref erence Only P. 1/ 9 Chip Ferrite Bead Array BLA2A□□□□□SN4□ Reference Specification 1. Scope This reference specification is applied to Chip Ferrite Bead Array BLA2A Series used for electronic machinery. 2. Part Numbering (ex.) BL A 2A AG 121 S N 4 D (1) (2) (3) (4) (5) (6) (7) (8) (9) (1) Product ID (2) Type (3) Dimension (L×Ｗ) (4) Characteristics (5) Typical Impedance at 100MHz (6) Performance (7) Category (8) Numbers of Circuit (9) Packaging (D : Taping / B : Bulk) 3. Rating DC Resistance Impedance (Ω) Rated (Ω max.) Insulation Customer MURATA at 100MHz, Resistance Current Values Remark Part Number Part Number (Under Standard Initial between (mA) After Testing Condition) Values Elements Testing BLA2AAG121SN4D 120 ± 25 % 100 0.5 0.6 BLA2AAG121SN4B BLA2AAG221SN4D 220 ± 25 % 0.7 0.8 For BLA2AAG221SN4B general BLA2AAG601SN4D 600 ± 25 % 50 1.1 1.2 use BLA2AAG601SN4B BLA2AAG102SN4D 1000 ± 25 % 1.3 1.4 BLA2AAG102SN4B BLA2ABB100SN4D 10 ± 25 % 0.1 0.2 BLA2ABB100SN4B BLA2ABB220SN4D 22 ± 25 % 200 0.2 0.3 BLA2ABB220SN4B BLA2ABB470SN4D 47 ± 25 % 0.35 0.45 BLA2ABB470SN4B BLA2ABB121SN4D 100MΩ 120 ± 25 % 0.6 0.7 BLA2ABB121SN4B min. 50 BLA2ABB221SN4D 220 ± 25 % 0.9 1.0 BLA2ABB221SN4B For high BLA2ABD750SN4D speed 75 ± 25 % 0.20 0.30 BLA2ABD750SN4B signal 200 BLA2ABD121SN4D Line 120 ± 25 % 0.35 0.45 BLA2ABD121SN4B BLA2ABD221SN4D 220 ± 25 % 0.40 0.50 BLA2ABD221SN4B BLA2ABD471SN4D 470 ± 25 % 100 0.65 0.75 BLA2ABD471SN4B BLA2ABD601SN4D 600 ± 25 % 0.80 0.90 BLA2ABD601SN4B BLA2ABD102SN4D 1000 ± 25 % 50 1.00 1.10 BLA2ABD102SN4B · Operating Temperature: - 55 °C to + 125 °C · Storage Temperature: - 55 °C to + 125 °C MURATA MFG CO., LTD.

Spec. No. JENF243A-0016R-01 Ref erence Only P. 2/ 9 4. Style and Dimensions ■ Equivalent Circuit 2 0.15 0±0. 2± 1. 0. 2.0±0.2 0.5±0.1 :Electrode 0.25±0.15 0±.50.1 (inmm) No polarity ■ Unit Mass (Typical value) 0.005g 5. Marking No marking. 6. Standard Testing Conditions < Unless otherwise specified > < In case of doubt > Temperature : Ordinary Temp. 15 ºC to 35 °C Temperature: 20 °C ± 2 °C Humidity: Ordinary Humidity 25 %(RH) to 85 %(RH) Humidity : 60 %(RH) to 70 %(RH) Atmospheric pressure: 86 kPa to 106 kPa 7. Electrical Performance No. Item Specification Test Method 7.1 Impedance Meet item 3. Measuring Frequency : 100 MHz ± 1 MHz Measuring Equipment : KEYSIGHT 4291A or the equivalent (OSC = 0.05 V) Test Fixture : KEYSIGHT 16192A 7.2 DC Resistance Meet item 3. Measuring Equipment : Digital multi meter * Except resistance of the Substrate and Wire 7.3 Insulation Resistance Meet item 3. Measuring Voltage : 5 V(DC) between Elements Measuring Time : 1 min max. 8. Mechancal Performance No. Item Specification Test Method 8.1 Appearance and Meet item 4. Visual Inspection and measured with Slide Dimensions Calipers or Micrometer or Measuring Microscope. 8.2 Bonding Meet Table 1. It shall be soldered on the substrate. Strength Applying Force(F) : 9.8 N Table 1 Applying Time : 5 s ± 1 s Product F Appearance No damage Impedance Change Within ± 30 % (at 100MHz) Substrate DC 8.3 Bending Meet item 3. It shall be soldered on the substrate. Strength Resistance Subtrate : Glass-epoxy substrate (100mm × 40mm × 1.0mm) Deflection : 2.0 mm Speed of Applying Force : 0.5 mm / s Keeping Time : 30 s Pressurejig R340 F Deflection 45 45 Product MURATA MFG CO., LTD.

Spec. No. JENF243A-0016R-01 Ref erence Only P. 3/ 9 No. Item Specification Test Method 8.4 Solderability The electrodes shall be at least 95 % Flux : Ethanol solution of rosin, 25 (wt)% covered with new solder coating. Pre-Heating : 150 °C ± 10 °C, 60 s ~ 90 s Solder :Sn-3.0Ag-0.5Cu Solder Temperature : 240 °C ± 5 °C Immersion Time : 3 s ± 1 s Immersion and emersion rates : 25 mm / s 8.5 Resistance to Meet Table 1. Flux : Ethanol solution of rosin, 25 (wt)% Soldering Heat Pre-Heating : 150 °C ± 10 °C, 60 s ~ 90 s Solder : Sn-3.0Ag-0.5Cu Solder Temperature : 270 °C ± 5 °C Immersion Time : 10 s ± 1 s Immersion and emersion rates : 25 mm / s Then measured after exposure in the room condition for 48 h ± 4 h. 8.6 Vibration It shall be soldered on the substrate. Osclilation Frequency : 10Hz to 55Hz to 10Hz for 1 min Total Amplitude : 1.5 mm Testing Time : A period of 2 hours in each of 3 mutually erpendicular directions. 8.7 Drop Product shall be no failure after tested. It shall be dropped on concrete or steel board. Method : free fall Height : 75 cm Attitude from which the product is dropped : 3 directions The Number of Time : 3 times for each direction (Total 9 times) 9. Environmental Performance (It shall be soldered on the substrate.) No. Item Specification Test Method 9.1 Temperature Meet Table 1. 1 cycle Cycle 1 step : -55 °C (+0 °C , -3 °C ) / 30min ± 3min 2 step: Ordinary temp. / 10min to 15min 3 step : +125 °C (+3 °C , -0 °C) / 30min ± 3min 4 step: Ordinary temp. / 10min to 15min Total of 100 cycles Then measured after exposure in the room condition for 48 h ± 4 h. 9.2 Humidity Temperature : 40 °C ± 2 °C Humidity : 90 %(RH) to 95 %(RH) Time : 1000 h (+48 h , -0 h) Then measured after exposure in the room condition for 48 h ± 4 h. 9.3 Heat Life Temperature : 125 C ± 3 °C Applying Current : Rated Current Time : 1000 h (+48 h , -0 h) Then measured after exposure in the room condition for 48 h ± 4 h. 9.4 Cold Resistance Temperature : - 55 °C ± 2 °C Time : 1000 h (+48 h , -0 h) Then measured after exposure in the room condition for 48 h ± 4 h. MURATA MFG CO., LTD.

Spec. No. JENF243A-0016R-01 Ref erence Only P. 4/ 9 10. Specification of Packaging 10.1. Appearance and Dimensions (8 mm-wide paper tape) 1 . 2.0±0.1 0 2.0±0.1 4.0±0.1 φ1.5±00.1 75± . 1 1 . 0 0.1 3.5± ±0.3 ± 0 .2 8. 2 1.2±0.1 Direction of feed 0.8 max. (in mm) (1) Taping Products shall be packaged in the cavity of the base tape of 8 mm-wide , 2 mm-pitch continuously and sealed by top tape and bottom tape. (2) The sprocket holes are to the right as the tape is pulled toward the user. (3) Splice point : The base tape and top tape have no spliced point (4) Cavity : There shall not be burr in the cavity. (5) Missing components number Missing components number within 0.025% of the number per reel or 1 pc., whichever is greater, and are not continuous. The specified quantity per reel is kept. 10.2. Tape Strength (1) Pull Strength Top tape 5N min. Bottom tape Toptape 165to180degree F (2) Peeling off force of Top tape 0.1N to 0.6N (Minimum value is typical.) Bottomtape Basetape ∗ Speed of Peeling off : 300 mm / min 10.3. Taping Condition (1) Standard quantity per reel Quantity per 180 mm reel : 10000 pcs. / reel (2) There shall be leader-tape (top tape and empty tape) and trailer-tape (empty tape) as follows. (3) On paper tape, the top tape and the base tape shall no be adhered at the tip of the empty leader tape for more than 5 pitch. (4) Marking for reel The following items shall be marked on a label and the label is stuck on the reel. (Customer part number, MURATA part number, Inspection number(∗1), RoHS discrimination(∗2), Quantity, etc) ∗1) « Expression of Inspection No. » □□ OOOO ××× (1) (2) (3) (1) Factory Code (2) Date First digit : Year / Last digit of year Second digit : Month / Jan. to Sep. → 1 to 9, Oct. to Dec. → O, N, D Third, Fourth digit : Day (3) Serial No. ∗2) « Expression of RoHS discrimination » ROHS – Y (△) (1) (2) (1) RoHS regulation conformity parts. (2) MURATA classification number MURATA MFG CO., LTD.

Spec. No. JENF243A-0016R-01 Ref erence Only P. 5/ 9 (5) Outside package These reels shall be packed in the corrugated cardboard package and the following items shall be marked on a label and the label is stuck on the box. (Customer name, Purchasing Order Number, Customer Part Number, MURATA part number, RoHS discrimination(∗2) , Quantity , etc) (6) Dimensions of reel and taping (leader-tape , trailer-tape) 10-4. Specification of Outer Case Label Outer Case Dimensions H (mm) Standard Reel Quantity in Outer Case (Reel) W D H D 186 186 93 5 W ∗ Above Outer Case size is typical. It depends on a quantity of an order. 11. ! Caution 11.1. Surge current Excessive surge current (pulse current or rush current) than specified rated current applied to the product may cause a critical failure, such as an open circuit, burnout caused by excessive temperature rise. Please contact us in advance in case of applying the surge current. 11.2. Limitation of Applications Please contact us before using our products for the applications listed below which require especially high reliability for the prevention of defects which might directly cause damage to the third party's life, body or property. (1) Aircraft equipment (6) Disaster prevention / crime prevention equipment (2) Aerospace equipment (7) Traffic signal equipment (3) Undersea equipment (8) Transportation equipment (vehicles, trains, ships, etc.) (4) Power plant control equipment (9) Data-processing equipment (5) Medical equipment (10) Application of similar complexity and/or with reliability Requirements to the applications listed in the above. 12. Notice This product is designed for solder mounting. Please consult us in advance for applying other mounting method such as conductive adhesive. MURATA MFG CO., LTD.

Spec. No. JENF243A-0016R-01 Ref erence Only P. 6/ 9 12.1. Land pattern designing · Standard land dimensions (Reflow soldering) 0.25 0.5 ∗ The excessive heat by land pads may cause Pattern deterioration at joint of products with substrate. Solderresist 0.5 Product (inmm) 1.5 12.2. Soldering Conditions Products can be applied to reflow soldering. (1) Flux , Solder Flux Use rosin-based flux, but not highly acidic flux (with chlorine content exceeding 0.2(wt)%. ) Do not use water-soluble flux. Solder Use Sn-3.0Ag-0.5Cu solder Standard thickness of solder paste : 100 µm to 200 µm Use of Sn-Zn based solder will deteriorate performance of products. In case of using Sn-Zn based solder, please contact Murata in advance. (2) Soldering conditions · Pre-heating should be in such a way that the temperature difference between solder and ferrite surface is limited to 150°C max. Also cooling into solvent after soldering should be in such a way that the temperature difference is limited to 100 °C max. Insufficient pre-heating may cause cracks on the ferrite, resulting in the deterioration of product quality. · Standard soldering profile and the limit soldering profile is as follows. The excessive limit soldering conditions may cause leaching of the electrode and / or resulting in the deterioration of product quality. Temp. 260℃ (℃) 245℃±3℃ 230℃ 220℃ Limit Profile 180 150 30s～60s Standard Profile 60s max. 90s±30s Time.(s) Standard Profile Limit Profile Pre-heating 150～180°C 、90s±30s Heating above 220°C、30s～60s above 230°C、60s max. Peak temperature 245±3°C 260°C,10s Cycle of reflow 2 times 2 times 12.3. Reworking with soldering iron · Pre-heating : 150 °C , 1 min · Soldering iron output : 80W max. · Tip temperature: 350°C max. · Tip diameter: φ 3mm max. · Soldering time : 3(+1,-0) seconds. ·Times : 2times max. Note : Do not directly touch the products with the tip of the soldering iron in order to prevent the crack on the ferrite material due to the thermal shock. MURATA MFG CO., LTD.

Spec. No. JENF243A-0016R-01 Ref erence Only P. 7/ 9 12.4. Solder Volume Solder shall be used not to be exceeded as shown below. Accordingly increasing the solder volume, the mechanical stress to product is also increased. Exceeding solder volume may cause the failure of mechanical or electrical performance. UpperLimit Recommendabl t 1/3T≦t≦T (T:Chipthickness) 12.5. Attention regarding P.C.B bending The following shall be considered when designing and laying out P.C.B.’s (1) P.C.B. shall be designed so that products are not subject to the mechanical stress for board warpage. <Products direction> a Products shall be locatedin the sideways b direction (Length : a < b) to the mechanical stress. 〈Poorexample〉 〈Goodexample〉 (2)Components location on P.C.B. separation. It is effective to implement the following measures, to reduce stress in separating the board. It is best to implement all of the following three measures; however, implement as many measures as possible to reduce stress. Contents of Measures Stress Level (1) Turn the mounting direction of the component parallel to the board separation surface. A > D *1 (2) Add slits in the board separation part. A > B (3) Keep the mounting position of the component away from the board separation surface. A > C C Perforation B *1 A > D is valid when stress is added vertically to the perforation as with Hand Separation. If a Cutting Disc is used, stress will be diagonal to the PCB, therefore D A A > D is invalid. Sli (3) Mounting Components Near Screw Holes When a component is mounted near a screw hole, it may be affected by the board deflection that occurs during the tightening of the screw. Mount the component in a position as far away from the screw holes as possible. Screw Hole Recommended MURATA MFG CO., LTD.

Spec. No. JENF243A-0016R-01 Ref erence Only P. 8/ 9 12.6. Potential between Elements Products should be used within 5 V(DC) between elements. When the products are used the excessive voltage over 5 V(DC) , it may cause breaking of inner electrade and / or decreasing o insulation resistance between elements. 12.7. Mounting density Add special attention to radiating heat of products when mounting the inductor near the products with heating. The excessive heat by other products may cause deterioration at joint of this product with substrate. 12.8. Cleaning Conditions Products shall be cleaned on the following conditions. (1) Cleaning temperature shall be limited to 60 °C max. (40 °C max. for IPA.) (2) Ultrasonic cleaning shall comply with the following conditions, avoiding the resonance phenomenon at the mounted products and P.C.B Power : 20 W / l max. Frequency : 28 kHz to 40 kHz Time : 5 min max. (3) Cleaner 1. Cleaner · Isopropyl alcohol (IPA) 2. Aqueous agent · PINE ALPHA ST-100S (4) There shall be no residual flux and residual cleaner after cleaning. In the case of using aqueous agent, products shall be dried completely after rinese with de-ionized water in order to remove the cleaner. (5) Other cleaning Please contact us. 12.9. Handling of a substrate After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to the substrate. Excessive mechanical stress may cause cracking in the product. Bending Twisting 12.10. Operating Environment Do not use this product under the following environmental conditions, on deterioration of the Insulation Resistance of the Ferrite material and/or corrosion of Inner Electrode may result from the use. (1) In the corrodible atmosphere such as acidic gases, alkaline gases, chlorine, sulfur gases, organic gases and etc. (the sea breeze, Cl2, H2S, NH3, SO2, NO2,etc) (2) In the atmosphere where liquid such as organic solvent, may splash on the products. (3) In the atmosphere where the temperature / humidity changes rapidly and it is easy to dew. 12.11. Resin coating The impedance value may change and/or it may affect on the product's performance due to high cure-stress of resin to be used for coating / molding products. So please pay your careful attention when you select resin. In prior to use, please make the reliability evaluation with the product mounted in your application set. MURATA MFG CO., LTD.

Spec. No. JENF243A-0016R-01 Ref erence Only P. 9/ 9 12.12. Storage Conditions (1) Storage period Use the products within 6 months after delivered. Solderability should be checked if this period is exceeded. (2) Storage coditions · Products should be stored in the warehouse on the following conditions. Temperature : - 10 °C to 40 °C Humidity : 15 % to 85 % relative humidity No rapid change on temperature and humidity · Don’t keep products in corrosive gases such as sulfur, chlorine gas or acid, or it may cause oxidization of electrode, resulting in poor solderability. · Products should be stored on the palette for the prevention of the influence from humidity, dust and so on. · Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on. · Avoid storing the product by itself bare (i.e. exposed directly to air). (3) Delivery Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock. 13. ! Notes (1) Please make sure that your product has been evaluated in view of your specifications with our product being mounted to your product. (2) You are requested not to use our product deviating from the reference specifications. (3) The contents of this reference specification are subject to change without advance notice. Please approve our product specifications or transact the approval sheet for product specifications before ordering. MURATA MFG CO., LTD.