NTC thermistors for temperature measurement Miniature sensors with bendable wires Series/Type: B57861S Date: January2018 ©EPCOSAG2018.Reproduction,publicationanddisseminationofthispublication,enclosuresheretoandthe informationcontainedthereinwithoutEPCOS'priorexpressconsentisprohibited. EPCOSAGisaTDKGroupCompany.

Temperaturemeasurement B57861S Miniaturesensorswithbendablewires S861 Applications Dimensionaldrawings Temperaturemeasurement Length 50mm 350mm Features Shortresponsetime Highmeasuringaccuracy TightBvaluetolerances available Epoxyencapsulation PTFE-insulatedleadsof silver-platednickelwire, AWG30(50mm) PTFE-insulatedleadsof silver-platedCuwire (19x0.07mm), AWG28(350mm) ULapproval(E69802) Options Alternativeleadlengthson request Dimensionsinmm Deliverymode Bulk Generaltechnicaldata Climaticcategory (IEC60068-1) 55/155/56 Max.power (at25(cid:176) C) P 60 mW 25 Resistancetolerance D R /R – 1,– 3,– 5 % R R Ratedtemperature T 25 (cid:176) C R Dissipationfactor (inair) d approx.1.5/3.21) mW/K th Thermalcoolingtimeconstant (inair) t approx.15/121) s c Heatcapacity C approx.22.5/38.41) mJ/K th 1) ForPTFE-insulatedleadsofsilver-platedCuwire(19x0.07mm),AWG28(350mm). PleasereadCautionsandwarningsand Page2of21 Importantnotesattheendofthisdocument.

Temperaturemeasurement B57861S Miniaturesensorswithbendablewires S861 Electricalspecificationandorderingcodes R Componentlength No.ofR/T B Orderingcode 25 25/100 W mm characteristic K Bvaluetolerance=0.3%,resistancetolerance=– 1% 5k 50 8016 3988– 0.3% B57861S0502F045 10k 50 8016 3988– 0.3% B57861S0103F045 30k 50 8018 3964– 0.3% B57861S0303F045 Bvaluetolerance=1%,resistancetolerance=– 1% 10k 350 8016 3988– 1% B57861S0103A039 Bvaluetolerance=1%,resistancetolerance=– 1%,– 3%or– 5% 2k 50 1038 3560– 1% B57861S0202+041 3k 50 8016 3988– 1% B57861S0302+040 5k 50 8016 3988– 1% B57861S0502+040 10k 50 8016 3988– 1% B57861S0103+040 30k 50 8018 3964– 1% B57861S0303+040 50k 50 2901 3760– 1% B57861S0503+040 100k 50 2014 4540– 1% B57861S0104+040 += Resistancetolerance F=– 1% H=– 3% J= – 5% Reliabilitydata Test Standard Testconditions D R /R Remarks 25 25 (typical) Storagein IEC Storageatupper <2% Novisible dryheat 60068-2-2 categorytemperature damage T:155(cid:176) C t:1000h Storageindamp IEC Temperatureofair:40(cid:176) C <1% Novisible heat,steadystate 60068-2-78 Relativehumidityofair:93% damage Duration:56days Rapidtemperature IEC Lowertesttemperature:(cid:4)55(cid:176) C <1% Novisible cycling 60068-2-14 Uppertesttemperature:155(cid:176) C damage Numberofcycles:100 Endurance P :60mW <3% Novisible max t:1000h damage Long-termstability Temperature:70(cid:176) C <2% Novisible (empiricalvalue) t:10000h damage PleasereadCautionsandwarningsand Page3of21 Importantnotesattheendofthisdocument.

Temperaturemeasurement B57861S Miniaturesensorswithbendablewires S861 ReliabilitydataaccordingtoAEC-Q200,Rev.D Test Standard Testconditions D R /R Remarks 25 25 (typical) Hightemperature MIL-STD-202, StorageatT=+125(cid:176) C <2% Novisible exposure(storage) method108 t=1000h damage Biasedhumidity MIL-STD-202, T=85(cid:176) C <2% Novisible method103 Relativehumidityofair85% damage t=1000h Testvoltagemax.0.3VDCon NTC1) Operationallife MIL-STD-202, T=+125(cid:176) C <2% Novisible method108 t=1000h damage Testvoltagemax.0.3VDCon NTC1) Temperature JESD22, Lowertesttemperature:(cid:4)55(cid:176) C <2% Novisible cycling methodJA-104 Uppertesttemperature:125(cid:176) C damage 1000cycles Dwelltime:max.30minateach temperature Transitiontimeinair:max.1min Terminalstrength MIL-STD-202, Testleadeddeviceintegrity <1% Novisible (leaded) method211 ConditionA:2.27N2) damage Mechanicalshock MIL-STD-202, Acceleration:40g2) <1% Novisible method213, Pulseduration:6ms damage conditionC Numberofbumps:3,each direction Vibration MIL-STD-202, Acceleration:5g <1% Novisible method204 t=20min damage 12cyclesineachof3directions Frequencyrange:10...2000Hz 1) SelfheatingoftheNTCthermistormustnotexceed0.2K,steadystate.TestconditionsdeviatingfromAEC-Q200,Rev.D. 2) DeviatingfromAEC-Q200,Rev.D. Note ContactofNTCthermistorswithanyliquidsandsolventsshallbeprevented.Itmustbe ensuredthatnowaterenterstheNTCthermistors(e.g.throughplugterminals). Avoiddewingandcondensationunlessthermistorisspecifiedfortheseconditions. PleasereadCautionsandwarningsand Page4of21 Importantnotesattheendofthisdocument.

Temperaturemeasurement B57861S Miniaturesensorswithbendablewires S861 R/Tcharacteristics R/TNo. 1038 2014 2901 T((cid:176) C) B =3560K B =4540K B =3760K 25/100 25/100 25/100 R/R a (%/K) R/R a (%/K) R/R a (%/K) T 25 T 25 T 25 (cid:4)55.0 58.796 6.6 142 7.8 63.969 6.7 (cid:4)50.0 42.515 6.4 96.615 7.6 46.179 6.4 (cid:4)45.0 31.095 6.1 66.562 7.3 33.738 6.2 (cid:4)40.0 22.992 5.9 46.4 7.1 24.927 6.0 (cid:4)35.0 17.177 5.7 32.708 6.9 18.611 5.8 (cid:4)30.0 12.960 5.5 23.302 6.7 14.033 5.6 (cid:4)25.0 9.8708 5.4 16.77 6.5 10.679 5.4 (cid:4)20.0 7.5858 5.2 12.186 6.3 8.198 5.3 (cid:4)15.0 5.8799 5.0 8.937 6.1 6.3123 5.2 (cid:4)10.0 4.5951 4.9 6.6125 5.9 4.9014 5.1 (cid:4)5.0 3.6193 4.7 4.9342 5.8 3.821 4.9 0.0 2.8720 4.6 3.712 5.6 3.0027 4.7 5.0 2.2954 4.4 2.8145 5.5 2.3801 4.6 10.0 1.8472 4.3 2.15 5.3 1.9 4.5 15.0 1.4962 4.2 1.6544 5.2 1.5257 4.3 20.0 1.2195 4.0 1.2819 5.0 1.233 4.3 25.0 1.0000 3.9 1.0000 4.9 1.0000 4.1 30.0 0.82472 3.8 0.78514 4.8 0.81679 4.0 35.0 0.68393 3.7 0.62031 4.7 0.67166 3.9 40.0 0.57018 3.6 0.49304 4.5 0.55527 3.8 45.0 0.47777 3.5 0.39417 4.4 0.46095 3.8 50.0 0.40229 3.4 0.3169 4.3 0.38459 3.7 55.0 0.34033 3.3 0.25616 4.2 0.32184 3.6 60.0 0.28920 3.2 0.20815 4.1 0.27068 3.5 65.0 0.24683 3.1 0.17 4.0 0.22907 3.3 70.0 0.21154 3.0 0.13952 3.9 0.19468 3.2 75.0 0.18203 3.0 0.11505 3.8 0.16607 3.1 80.0 0.15722 2.9 0.095302 3.7 0.14221 3.1 85.0 0.13631 2.8 0.079296 3.6 0.12218 3.0 90.0 0.11861 2.7 0.066263 3.5 0.10533 2.9 95.0 0.10358 2.7 0.055601 3.5 0.09123 2.8 100.0 0.090775 2.6 0.046843 3.4 0.079284 2.8 105.0 0.079839 2.5 0.039618 3.3 0.069062 2.7 110.0 0.070433 2.5 0.033634 3.2 0.06034 2.7 115.0 0.062311 2.4 0.028658 3.2 0.052886 2.6 120.0 0.055278 2.4 0.024505 3.1 0.046482 2.5 125.0 0.049170 2.3 0.021026 3.0 0.040985 2.5 130.0 0.043851 2.3 0.018101 3.0 0.036233 2.5 135.0 0.039207 2.2 0.015633 2.9 0.032101 2.4 140.0 0.035142 2.2 0.013544 2.8 0.02851 2.4 145.0 0.031574 2.1 0.011769 2.8 0.025373 2.3 150.0 0.028435 2.1 0.010258 2.7 0.022633 2.3 155.0 0.025666 2.0 0.0089659 2.7 0.020231 2.3 PleasereadCautionsandwarningsand Page5of21 Importantnotesattheendofthisdocument.

Temperaturemeasurement B57861S Miniaturesensorswithbendablewires S861 R/Tcharacteristics R/TNo. 8016 8018 T((cid:176) C) B =3988K B =3964K 25/100 25/100 R/R a (%/K) R/R a (%/K) T 25 T 25 (cid:4)55.0 96.3 7.4 82.408 7.0 (cid:4)50.0 67.01 7.2 58.344 6.8 (cid:4)45.0 47.17 6.9 41.775 6.6 (cid:4)40.0 33.65 6.7 30.235 6.4 (cid:4)35.0 24.26 6.4 22.109 6.2 (cid:4)30.0 17.7 6.2 16.327 6.0 (cid:4)25.0 13.04 6.0 12.171 5.8 (cid:4)20.0 9.707 5.8 9.1548 5.6 (cid:4)15.0 7.293 5.6 6.9458 5.4 (cid:4)10.0 5.533 5.5 5.3135 5.3 (cid:4)5.0 4.232 5.3 4.0972 5.1 0.0 3.265 5.1 3.1834 5.0 5.0 2.539 5.0 2.4915 4.8 10.0 1.99 4.8 1.9637 4.7 15.0 1.571 4.7 1.5582 4.6 20.0 1.249 4.5 1.2444 4.4 25.0 1.0000 4.4 1.0000 4.3 30.0 0.8057 4.3 0.80843 4.2 35.0 0.6531 4.1 0.65732 4.1 40.0 0.5327 4.0 0.53743 4.0 45.0 0.4369 3.9 0.44175 3.9 50.0 0.3603 3.8 0.36497 3.8 55.0 0.2986 3.7 0.30303 3.7 60.0 0.2488 3.6 0.2528 3.6 65.0 0.2083 3.5 0.21187 3.5 70.0 0.1752 3.4 0.17836 3.4 75.0 0.1481 3.3 0.15079 3.3 80.0 0.1258 3.2 0.128 3.2 85.0 0.1072 3.2 0.1091 3.2 90.0 0.09177 3.1 0.093342 3.1 95.0 0.07885 3.0 0.080158 3.0 100.0 0.068 2.9 0.069084 2.9 105.0 0.05886 2.9 0.059747 2.9 110.0 0.05112 2.8 0.051845 2.8 115.0 0.04454 2.7 0.045134 2.7 120.0 0.03893 2.6 0.039416 2.7 125.0 0.03417 2.6 0.034527 2.6 130.0 0.03009 2.5 0.030333 2.6 135.0 0.02654 2.5 0.026724 2.5 140.0 0.02348 2.4 0.02361 2.5 145.0 0.02083 2.4 0.020914 2.4 150.0 0.01853 2.3 0.018575 2.3 155.0 0.01653 2.3 0.016538 2.3 PleasereadCautionsandwarningsand Page6of21 Importantnotesattheendofthisdocument.

Temperaturemeasurement B57861S Miniaturesensorswithbendablewires S861 Mountinginstructions 1 Soldering 1.1 LeadedNTCthermistors LeadedthermistorscomplywiththesolderabilityrequirementsspecifiedbyCECC. When soldering, care must be taken that the NTC thermistors are not damaged by excessive heat.Thefollowingmaximumtemperatures,maximumtimespansandminimumdistanceshave tobeobserved: Dipsoldering Ironsoldering Bathtemperature max.260(cid:176) C max.360(cid:176) C Solderingtime max.4s max.2s Distancefromthermistor min.6mm min.6mm Undermoreseveresolderingconditionstheresistancemaychange. 1.1.1 Wavesoldering Temperaturecharacteristicatcomponentterminalwithdualwavesoldering PleasereadCautionsandwarningsand Page7of21 Importantnotesattheendofthisdocument.

Temperaturemeasurement B57861S Miniaturesensorswithbendablewires S861 1.2 LeadlessNTCthermistors In case of NTC thermistors without leads, soldering is restricted to devices which are provided with a solderable metallization. The temperature shock caused by the application of hot solder mayproducefinecracksintheceramic,resultinginchangesinresistance. To prevent leaching of the metallization, solder with silver additives or with a low tin content shouldbeused.Inaddition,solderingmethodsshouldbeemployedwhichpermitshortsoldering times. 1.3 SMDNTCthermistors SMDNTCthermistorscanbeprovidedwithanickelbarrierterminationoronspecialrequestwith silver-palladium termination. The use of no-clean solder products is recommended. In any case mild,non-activatedfluxesshouldbeused.Fluxresiduesaftersolderingshouldbeminimized. SMDNTCswithAgPdterminationarenotapprovedforlead-freesoldering. Nickelbarriertermination Figure1 SMDNTCthermistors,structureofnickel barriertermination Thenickelbarrierlayerofthesilver/nickel/tintermination(seefigure1)preventsleachingofthe silverbasemetallizationlayer.Thisallowsgreatflexibilityintheselectionofsolderingparameters. Thetinpreventsthenickellayerfromoxidizingandthusensuresbetterwettingbythesolder.The nickel barrier termination is tested for all commonly-used soldering methods according to IEC 60068-2-58. Insufficient preheating may cause ceramic cracks. Rapid cooling by dipping in sol- ventisnotrecommended. Thefollowingtestandprocessconditionsapplyfornickelbarriertermination. PleasereadCautionsandwarningsand Page8of21 Importantnotesattheendofthisdocument.

Temperaturemeasurement B57861S Miniaturesensorswithbendablewires S861 1.3.1 Solderability(testtoIEC60068-2-58) Preconditioning:ImmersionintofluxF-SW32. Evaluationcriterion:Wettingofsolderingareas‡ 95%. Solder Bathtemperature((cid:176) C) Dwelltime(s) SnPb60/40 215– 3 3– 0.3 SnAg(3.0...4.0),Cu(0.5...0.9) 245– 3 3– 0.3 1.3.2 Resistancetosolderingheat(testtoIEC60068-2-58) Preconditioning:ImmersionintofluxF-SW32. Evaluationcriterion:Leachingofsideedges£ 1/3. Solder Bathtemperature((cid:176) C) Dwelltime(s) SnPb60/40 260– 5 10– 1 SnAg(3.0...4.0),Cu(0.5...0.9) 260– 5 10– 1 1.3.3 Reflowsoldering Temperaturerangesforreflowsolderingacc.toIEC60068-2-58recommendations. PleasereadCautionsandwarningsand Page9of21 Importantnotesattheendofthisdocument.

Temperaturemeasurement B57861S Miniaturesensorswithbendablewires S861 Profilefeature Sn-Pbeutecticassembly Pb-freeassembly Preheatandsoak -Temperaturemin T 100(cid:176) C 150(cid:176) C smin -Temperaturemax T 150(cid:176) C 200(cid:176) C smax -Time t tot 60...120s 60...120s smin smax Averageramp-uprate T toT 3(cid:176) C/smax. 3(cid:176) C/smax. smax p Liquidoustemperature T 183(cid:176) C 217(cid:176) C L Timeatliquidous t 40...150s 40...150s L Peakpackagebodytemperature T 215(cid:176) C...260(cid:176) C1) 235(cid:176) C...260(cid:176) C p Timeabove(TP(cid:4)5(cid:176) C) tp 10...40s 10...40s Averageramp-downrate T toT 6(cid:176) C/smax. 6(cid:176) C/smax. p smax Time25(cid:176) Ctopeaktemperature max.8minutes max.8minutes 1) Dependingonpackagethickness. Notes: Alltemperaturesrefertotopsideofthepackage,measuredonthepackagebody surface. Numberofreflowcycles:3 Ironsolderingshouldbeavoided,hotairmethodsarerecommendedforrepair purposes. Solderjointprofilesforsilver/nickel/tinterminations PleasereadCautionsandwarningsand Page10of21 Importantnotesattheendofthisdocument.

Temperaturemeasurement B57861S Miniaturesensorswithbendablewires S861 1.3.4 Recommendedgeometryofsolderpads Recommendedmaximumdimensions(mm) Casesize A B C inch/mm 0402/1005 0.6 0.6 1.7 0603/1608 1.0 1.0 3.0 0805/2012 1.3 1.2 3.4 1206/3216 1.8 1.2 4.5 2 Conductiveadhesion Analternativetosolderingforsilver-palladiumterminatedcomponentsisthegluingofthermistors with conductive adhesives. The benefit of this method is that it involves no thermal stress. The adhesivesusedmustbechemicallyinert. 3 Clampcontacting Pressurecontactingbymeansofclampsisparticularlysuitableforapplicationsinvolvingfrequent switchingandhighturn-onpowers. 4 Robustnessofterminations(leadedtypes) The leads meet the requirements of IEC 60068-2-21. They may not be bent closer than 4 mm from the solder joint on the thermistor body or from the point at which they leave the feed- throughs.Duringbending,anymechanicalstressattheoutletoftheleadsmustberemoved.The bendingradiusshouldbeatleast0.75mm. PleasereadCautionsandwarningsand Page11of21 Importantnotesattheendofthisdocument.

Temperaturemeasurement B57861S Miniaturesensorswithbendablewires S861 Tensilestrength: TestUa1: ValueofappliedforceforUa1test: Diameter(d)of Forcewithtoleranceof– 10% correspondingroundleads ˘£ 0.25mm 1.0N 0.25<˘£ 0.35mm 2.5N 0.35<˘£ 0.50mm 5.0N 0.50<˘£ 0.80mm 10.0N Bendingstrength: TestUb: Two90(cid:176) -bendsinoppositedirections ValueofappliedforceforUbtest: Diameter(d)of Forcewithtoleranceof– 10% correspondingroundleads ˘£ 0.25mm 0.5N 0.25<˘£ 0.35mm 1.25N 0.35<˘£ 0.50mm 2.5N 0.50<˘£ 0.80mm 5N Torsionalstrength: TestUc:severity2 Theleadisbentby90(cid:176) atadistanceof6to6.5mmfromthethermistorbody. Thebendingradiusoftheleadsshouldbeapprox.0.75mm.Twotorsionsof 180(cid:176) each(severity2). Whensubjectingleadstomechanicalstress,thefollowingshouldbeobserved: Tensilestressonleads Duringmountingandoperationtensileforcesontheleadsaretobeavoided. Bendingofleads Bendingoftheleadsdirectlyonthethermistorbodyisnotpermissible. A lead may be bent at a minimum distance of twice the wire's diameter +4 mm from the solder jointonthethermistorbody.Duringbendingthewiremustbemechanicallyrelievedatitsoutlet. Thebendingradiusshouldbeatleast0.75mm. PleasereadCautionsandwarningsand Page12of21 Importantnotesattheendofthisdocument.

Temperaturemeasurement B57861S Miniaturesensorswithbendablewires S861 5 Sealingandpotting Sealingorpottingprocessescanaffectthereliabilityofthecomponent. Whenthermistorsaresealed,pottedorovermolded,theremustbenomechanicalstresscaused by thermal expansion during the production process (curing / overmolding process) and during lateroperation.Theuppercategorytemperatureofthethermistormustnotbeexceeded.Ensure thatthematerialsused(sealing/pottingcompoundand plasticmaterial)arechemicallyneutral. Asthermistorsaretemperaturesensitivecomponentsitshouldbeconsideredthatmoldingcanaf- fectthethermalsurroundingandmayinfluencee.g.theresponsetime. Extensivetestingisencouragedinordertodeterminewhetherovermoldingorpottinginfluences thefunctionalityand/orreliabilityofthecomponent. 6 Cleaning Cleaningprocessescanaffectthereliabilityofthecomponent. Ifcleaningisnecessary,mildcleaningagentsarerecommended.Cleaningagentsbasedonwa- ter are not allowed. Washing processes may damage the product due to the possible static or cyclicmechanicalloads(e.g.ultrasoniccleaning).Theymaycausecrackswhichmightleadtore- ducedreliabilityand/orlifetime. 7 Storage Inordertomaintaintheirsolderability,thermistorsmustbestoredinanon-corrosiveatmosphere. Humidity,temperatureandcontainermaterialsarecriticalfactors. DonotstoreSMDswheretheyareexposedtoheatordirectsunlight.Otherwise,thepackingma- terial may be deformed or SMDs may stick together, causing problems during mounting. After openingthefactoryseals,suchaspolyvinyl-sealedpackages,usetheSMDsassoonaspossible. Thecomponentsshouldbeleftintheoriginalpacking.Touchingthemetallizationofunsoldered thermistorsmaychangetheirsolderingproperties. Storagetemperature: (cid:4)25(cid:176) Cupto45(cid:176) C Relativehumidity(withoutcondensation): £ 75%annualmean <95%,maximum30daysperannum SolderthethermistorslistedinthisdatabookaftershipmentfromEPCOSwithinthetimespeci- fied: SMDswithAgPdtermination: 6months SMDswithnickelbarriertermination: 12months Leadlesscomponents: 12months Leadedcomponents: 24months PleasereadCautionsandwarningsand Page13of21 Importantnotesattheendofthisdocument.

Temperaturemeasurement B57861S Miniaturesensorswithbendablewires S861 8 PlacementandorientationofSMDNTCthermistorsonPCB a)Componentplacement ItisrecommendedthatthePCboard shouldbeheldbymeansofsome adequatesupportingpinssuchas shownlefttopreventtheSMDsfrom beingdamagedorcracked. b)Cracks Whenplacingacomponentnearan areawhichisapttobendoragrid grooveonthePCboard,itisadvisable tohavebothelectrodessubjectedto uniformstress,ortopositionthe component'selectrodesatrightangles tothegridgrooveorbendingline(see c)Componentorientation). c)Componentorientation Chooseamountingpositionthat minimizesthestressimposedonthe chipduringflexingorbendingofthe board. PleasereadCautionsandwarningsand Page14of21 Importantnotesattheendofthisdocument.

Temperaturemeasurement B57861S Miniaturesensorswithbendablewires S861 Cautionsandwarnings General See"Importantnotes"onpage2. Storage Storethermistorsonlyinoriginalpackaging.Donotopenthepackagepriortoprocessing. Storageconditionsinoriginalpackaging:storagetemperature(cid:4)25(cid:176) C...+45(cid:176) C,relative humidity£ 75%annualmean,<95%maximum30daysperannum,dewprecipitationis inadmissible. Donotstorethermistorswheretheyareexposedtoheatordirectsunlight.Otherwise,the packingmaterialmaybedeformedorcomponentsmaysticktogether,causingproblemsduring mounting. Avoidcontaminationofthermistorsurfaceduringstorage,handlingandprocessing. Avoidstorageofthermistorsinharmfulenvironmentslikecorrosivegases(SO,Cletc). x Usethecomponentsassoonaspossibleafteropeningtheoriginalpackaging. SolderthermistorswithinthetimespecifiedaftershipmentfromEPCOS. Forleadedcomponentsthisis24months,forSMDcomponentswithnickelbarriertermination 12months,forleadlesscomponentsthisis12months,forSMDcomponentswithAgPd termination6months. Handling NTCthermistorsmustnotbedropped.Chip-offsoranyotherdamagemustnotbecaused duringhandlingofNTCs. Donottouchcomponentswithbarehands.Glovesarerecommended. Avoidcontaminationofthermistorsurfaceduringhandling. Washingprocessesmaydamagetheproductduetothepossiblestaticorcyclicmechanical loads(e.g.ultrasoniccleaning).Theymaycausecrackstodevelopontheproductanditsparts, whichmightleadtoreducedreliabilityorlifetime. Bending/twistingleads Alead(wire)maybebentataminimumdistanceoftwicethewire’sdiameterplus4mmfrom thecomponentheadorhousing.Whenbendingensurethewireismechanicallyrelievedatthe componentheadorhousing.Thebendingradiusshouldbeatleast0.75mm. Soldering Useresin-typefluxornon-activatedflux. Insufficientpreheatingmaycauseceramiccracks. Rapidcoolingbydippinginsolventisnotrecommended. Completeremovaloffluxisrecommended. PleasereadCautionsandwarningsand Page15of21 Importantnotesattheendofthisdocument.

Temperaturemeasurement B57861S Miniaturesensorswithbendablewires S861 Mounting Ensurethatnothermo-mechanicalstressoccursduetoproductionprocesses(curingor overmoldingprocesses)whenthermistorsaresealed,pottedorovermoldedorduringtheir subsequentoperation.Themaximumtemperatureofthethermistormustnotbeexceeded. Ensurethatthematerialsused(sealing/pottingcompoundandplasticmaterial)arechemically neutral. Electrodes/contactsmustnotbescratchedordamagedbefore/during/afterthemounting process. Contactsandhousingusedforassemblywiththethermistormustbecleanbeforemounting. Ensurethatadjacentmaterialsaredesignedforoperationattemperaturescomparabletothe surfacetemperatureofthethermistor.Besurethatsurroundingpartsandmaterialscan withstandthetemperature. Avoidcontaminationofthethermistorsurfaceduringprocessing. Theconnectionsofsensors(e.g.cableend,wireend,plugterminal)mayonlybeexposedto anenvironmentwithnormalatmosphericconditions. Tensileforcesoncablesorleadsmustbeavoidedduringmountingandoperation. Bendingortwistingofcablesorleadsdirectlyonthethermistorbodyisnotpermissible. Avoidusingchemicalsubstancesasmountingaids.Itmustbeensuredthatnowaterorother liquidsentertheNTCthermistors(e.g.throughplugterminals).Inparticular,waterbased substances(e.g.soapsuds)mustnotbeusedasmountingaidsforsensors. Theuseofno-cleansolderproductsisrecommended.Inanycasemild,non-activatedfluxes shouldbeused.Fluxresiduesaftersolderingshouldbeminimized. Operation Usethermistorsonlywithinthespecifiedoperatingtemperaturerange. Usethermistorsonlywithinthespecifiedpowerrange. Environmentalconditionsmustnotharmthethermistors.Onlyusethethermistorsunder normalatmosphericconditionsorwithinthespecifiedconditions. ContactofNTCthermistorswithanyliquidsandsolventsshallbeprevented.Itmustbe ensuredthatnowaterenterstheNTCthermistors(e.g.throughplugterminals).For measurementpurposes(checkingthespecifiedresistancevs.temperature),thecomponent mustnotbeimmersedinwaterbutinsuitableliquids(e.g.perfluoropolyetherssuchasGalden). Avoiddewingandcondensationunlessthermistorisspecifiedfortheseconditions. Bendingortwistingofcablesand/orwiresisnotpermissibleduringoperationofthesensorin theapplication. Besuretoprovideanappropriatefail-safefunctiontopreventsecondaryproductdamage causedbymalfunction. Thislistingdoesnotclaimtobecomplete,butmerelyreflectstheexperienceofEPCOSAG. DisplayoforderingcodesforEPCOSproducts TheorderingcodeforoneandthesameEPCOSproductcanberepresenteddifferentlyindata PleasereadCautionsandwarningsand Page16of21 Importantnotesattheendofthisdocument.

Temperaturemeasurement B57861S Miniaturesensorswithbendablewires S861 sheets,databooks,otherpublications,ontheEPCOSwebsite,orinorder-relateddocuments suchasshippingnotes,orderconfirmationsandproductlabels.Thevaryingrepresentationsof theorderingcodesareduetodifferentprocessesemployedanddonotaffectthe specificationsoftherespectiveproducts.DetailedinformationcanbefoundontheInternet underwww.epcos.com/orderingcodes PleasereadCautionsandwarningsand Page17of21 Importantnotesattheendofthisdocument.

Temperaturemeasurement B57861S Miniaturesensorswithbendablewires S861 Symbolsandterms Symbol English German A Area Fläche AWG AmericanWireGauge AmerikanischeNormfürDrahtquerschnitte B Bvalue B-Wert B Bvaluedeterminedbyresistance B-Wert,ermitteltdurchWiderstands- 25/100 measurementat25(cid:176) Cand100(cid:176) C messungenbei25(cid:176) Cund100(cid:176) C C Heatcapacitance Wärmekapazität th I Current Strom N Number(integer) Anzahl(ganzzahligerWert) P Maximumpowerat25(cid:176) C MaximaleLeistungbei25(cid:176) C 25 P Powerdissipation Verlustleistung diss P Electricalpower ElektrischeLeistung el P Maximumpowerwithinstated MaximaleLeistungim max temperaturerange angegebenenTemperaturbereich D R /R Resistancetolerancecausedby Widerstandstoleranz,diedurchdie B B spreadofBvalue StreuungdesB-Wertesverursachtwird R Insulationresistance Isolationswiderstand ins R Parallelresistance Parallelwiderstand P R Ratedresistance Nennwiderstand R D R /R Resistancetolerance Widerstandstoleranz R R R Seriesresistance Serienwiderstand S R ResistanceattemperatureT WiderstandbeiTemperaturT T (e.g.R =resistanceat25(cid:176) C) (z.B.R =Widerstandbei25(cid:176) C) 25 25 T Temperature Temperatur D T Temperaturetolerance Temperaturtoleranz t Time Zeit T Ambienttemperature Umgebungstemperatur A T Uppercategorytemperature ObereGrenztemperatur max (Kategorietemperatur) T Lowercategorytemperature UntereGrenztemperatur min (Kategorietemperatur) T Operatingtemperature Betriebstemperatur op T Ratedtemperature Nenntemperatur R T Surfacetemperature Oberflächentemperatur surf V Voltage Spannung V Insulationtestvoltage Isolationsprüfspannung ins V Operatingvoltage Betriebsspannung op V Testvoltage Prüfspannung test PleasereadCautionsandwarningsand Page18of21 Importantnotesattheendofthisdocument.

Temperaturemeasurement B57861S Miniaturesensorswithbendablewires S861 Symbol English German a Temperaturecoefficient Temperaturkoeffizient D Tolerance,change Toleranz,Änderung d Dissipationfactor Wärmeleitwert th t Thermalcoolingtimeconstant ThermischeAbkühlzeitkonstante c t Thermaltimeconstant ThermischeZeitkonstante a Abbreviations/Notes Symbol English German Surface-mounteddevices OberflächenmontierbaresBauelement * Tobereplacedbyanumberinordering PlatzhalterfürZahlimBestellnummern- codes,typedesignationsetc. codeoderfürdieTypenbezeichnung. + Tobereplacedbyaletter. PlatzhalterfüreinenBuchstaben. Alldimensionsaregiveninmm. AlleMaßesindinmmangegeben. Thecommasusedinnumericalvalues VerwendeteKommasinZahlenwerten denotedecimalpoints. bezeichnenDezimalpunkte. PleasereadCautionsandwarningsand Page19of21 Importantnotesattheendofthisdocument.

Importantnotes Thefollowingappliestoallproductsnamedinthispublication: 1. Somepartsofthispublicationcontainstatementsaboutthesuitabilityofourproductsfor certain areas of application. These statements are based on our knowledge of typical re- quirementsthatareoftenplacedonourproductsintheareasofapplicationconcerned.We nevertheless expressly point out that such statements cannot be regarded as binding statementsaboutthesuitabilityofourproductsforaparticularcustomerapplication. As a rule, EPCOS is either unfamiliar with individual customer applications or less familiar with them than the customers themselves. For these reasons, it is always ultimately incum- bentonthecustomertocheckanddecidewhetheranEPCOSproductwiththepropertiesde- scribedintheproductspecificationissuitableforuseinaparticularcustomerapplication. 2. We also point out that in individual cases, a malfunction of electronic components or failurebeforetheendoftheirusualservicelifecannotbecompletelyruledoutinthe currentstateoftheart,eveniftheyareoperatedasspecified.Incustomerapplications requiring a very high level of operational safety and especially in customer applications in which the malfunction or failure of an electronic component could endanger human life or health (e.g. in accident prevention or lifesaving systems), it must therefore be ensured by means of suitable design of the customer application or other action taken by the customer (e.g.installationofprotectivecircuitryorredundancy)thatnoinjuryordamageissustainedby thirdpartiesintheeventofmalfunctionorfailureofanelectroniccomponent. 3. Thewarnings,cautionsandproduct-specificnotesmustbeobserved. 4. In order to satisfy certain technical requirements, some of the products described in this publicationmaycontainsubstancessubjecttorestrictionsincertainjurisdictions(e.g. becausetheyareclassedashazardous).UsefulinformationonthiswillbefoundinourMa- terialDataSheetsontheInternet(www.epcos.com/material).Shouldyouhaveanymorede- tailedquestions,pleasecontactoursalesoffices. 5. Weconstantlystrivetoimproveourproducts.Consequently,theproductsdescribedinthis publicationmaychangefromtimetotime.Thesameistrueofthecorrespondingproduct specifications.Pleasecheckthereforetowhatextentproductdescriptionsandspecifications containedinthispublicationarestillapplicablebeforeorwhenyouplaceanorder.Wealso reservetherighttodiscontinueproductionanddeliveryofproducts.Consequently,we cannot guarantee that all products named in this publication will always be available. The aforementioneddoesnotapplyinthecaseofindividualagreementsdeviatingfromthefore- goingforcustomer-specificproducts. 6. Unless otherwise agreed in individual contracts, all orders are subject to the current ver- sion of the "General Terms of Delivery for Products and Services in the Electrical In- dustry" published by the German Electrical and Electronics Industry Association (ZVEI). Page20of21

Importantnotes 7. The trade names EPCOS, CeraCharge, CeraDiode, CeraLink, CeraPad, CeraPlas, CSMP, CTVS,DeltaCap,DigiSiMic,ExoCore,FilterCap,FormFit,LeaXield,MiniBlue,MiniCell,MKD, MKK, MotorCap, PCC, PhaseCap, PhaseCube, PhaseMod, PhiCap, PowerHap, PQSine, PQvar, SIFERRIT, SIFI, SIKOREL, SilverCap, SIMDAD, SiMic, SIMID, SineFormer, SIOV, ThermoFuse,WindCaparetrademarksregisteredorpendinginEuropeandinothercoun- tries.FurtherinformationwillbefoundontheInternetatwww.epcos.com/trademarks. Page21of21

Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: E PCOS / TDK: B57861S103F40 B57861S103J40 B57861S104F40 B57861S202F40 B57861S302F40 B57861S303F40 B57861S502F40 B57861S503F40 B57861S0103G040 B57861S202H40 B57861S104H40 B57861S302H40 B57861S303F45 B57861S503J40 B57861S502J40 B57861S202J40 B57861S104J40 B57861S302J40 B57861S303H40 B57861S103F45 B57861S103H40 B57861S303J40 B57861S502H40 B57861S503H40 B57861S502F45 B57861S0103A039 B57861S0502F045 B57861S0303F045 B57861S0302F040 B57861S0103J040 B57861S0103F045 B57861S0303J040 B57861S0503F040 B57861S0202H040 B57861S0302J040 B57861S0502H040 B57861S0202J040 B57861S0303H040 B57861S0104J040 B57861S0104H040 B57861S0104F040 B57861S0302H040 B57861S0202F040 B57861S0502F040 B57861S0503J040 B57861S0503H040 B57861S0303F040 B57861S0103H040