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  • 型号: WP710A10SGD
  • 制造商: Kingbright
  • 库位|库存: xxxx|xxxx
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WP710A10SGD产品简介:

ICGOO电子元器件商城为您提供WP710A10SGD由Kingbright设计生产,在icgoo商城现货销售,并且可以通过原厂、代理商等渠道进行代购。 WP710A10SGD价格参考¥0.37-¥0.37。KingbrightWP710A10SGD封装/规格:LED 指示 - 分立, 绿色 568nm LED 指示 - 分立 2.2V 径向。您可以下载WP710A10SGD参考资料、Datasheet数据手册功能说明书,资料中有WP710A10SGD 详细功能的应用电路图电压和使用方法及教程。

产品参数 图文手册 常见问题
参数 数值
产品目录

光电元件

描述

LED 3MM SS 565NM GREEN DIFFUSED标准LED-通孔 Grn 40mcd 568nm 40 deg Diffused

产品分类

LED 指示 - 分立

LED大小

T-1

品牌

KingbrightKingbright Company LLC

产品手册

点击此处下载产品Datasheet

产品图片

rohs

符合RoHS无铅 / 符合限制有害物质指令(RoHS)规范要求

产品系列

LED发射器,标准LED-通孔,Kingbright WP710A10SGD-

数据手册

点击此处下载产品Datasheet

产品型号

WP710A10SGDWP710A10SGD

产品种类

标准LED-通孔

光强度

40 mcd

其它名称

754-1723
WP710A10SGD-ND

包装

散装

商标

Kingbright

大小/尺寸

-

安装类型

通孔

安装风格

Through Hole

封装

Bulk

封装/外壳

径向

工厂包装数量

1000

显示角

40 deg

最大工作温度

+ 85 C

最小工作温度

- 40 C

标准包装

1,000

正向电压

2.2 V

正向电流

20 mA

毫烛光等级

40mcd

波长-主

568nm

波长-峰值

565nm

波长/色温

568 nm

测试电流时的光通量

-

照明颜色

Green

电压-正向(Vf)(典型值)

2.2V

电流-测试

20mA

类型

Solid State LED Lamp

视角

40°

透镜尺寸

3 mm x 4.6 mm

透镜形状

Dome

透镜样式/尺寸

圆形,带圆顶,3mm,T-1

透镜类型

散射,有色

透镜颜色/类型

Tinted, Diffused

颜色

绿

高度

4.60mm

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PDF Datasheet 数据手册内容提取

WP710A10SGD T-1 (3mm) Solid State Lamp DESCRIPTION PACKAGE DIMENSIONS The Super Bright Green source color devices are (cid:122) made with Gallium Phosphide Green Light Emitting Diode FEATURES Low power consumption (cid:122) Popular T-1 diameter package (cid:122) General purpose leads (cid:122) Reliable and rugged (cid:122) Long life - solid state reliability (cid:122) Available on tape and reel (cid:122) RoHS compliant (cid:122) APPLICATIONS Status indicator (cid:122) Illuminator (cid:122) Signage applications (cid:122) Decorative and entertainment lighting (cid:122) Commercial and residential architectural lighting (cid:122) Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is ±0.25(0.01") unless otherwise noted. 3. Lead spacing is measured where the leads emerge from the package. 4. The specifications, c haracteristics and technical data described in the datasheet are subject to change without prior notice. SELECTION GUIDE Iv (mcd) @ 20mA [2] V i e w i n g Angle [1] Emitting Color Part Number Lens Type (Material) Min. Typ. 2θ1/2 ■ WP710A10SGD Super Bright Green (GaP) Green Diffused 18 40 50° Notes: 1. θ1/2 is the angle from optical centerline where the luminous intensity is 1/2 of the optical peak value. 2. Luminous intensity / luminous flux: +/-15%. 3. Luminous intensity value is traceable to CIE127-2007 standards. Page 1 / 5 © 2017 Kingbright. All Rights Reserved. Spec No: DSAL0544 / 1101029079 Rev No: V.5B Date: 06/06/2017

WP710A10SGD ELECTRICAL / OPTICAL CHARACTERISTICS at T =25°C A Value Parameter Symbol Emitting Color Unit Typ. Max. Wavelength at Peak Emission IF = 20mA λpeak Super Bright Green 565 - nm Dominant Wavelength IF = 20mA λdom [1] Super Bright Green 568 - nm Spectral Bandwidth at 50% Φ REL MAX Δλ Super Bright Green 30 - nm IF = 20mA Capacitance C Super Bright Green 15 - pF Forward Voltage IF = 20mA VF [2] Super Bright Green 2.2 2.5 V Reverse Current (VR = 5V) IR Super Bright Green - 10 uA Temperature Coefficient of λ peak TC Super Bright Green - - nm/°C IF = 20mA, -10°C ≤ T ≤ 85°C λpeak Temperature Coefficient of λ dom TC Super Bright Green - - nm/°C IF = 20mA, -10°C ≤ T ≤ 85°C λdom Temperature Coefficient of VF TC Super Bright Green - - mV/°C IF = 20mA, -10°C ≤ T ≤ 85°C V Notes: 1. The dominant wavelength (λd) above is the setup value of the sorting machine. (Tolerance λd : ±1nm. ) 2. Forward voltage: ±0.1V. 3. Wavelength value is traceable to CIE127-2007 standards. 4. Excess driving current and / or operating temperature higher than recommended conditions may result in severe light degradation or premature failure. ABSOLUTE MAXIMUM RATINGS at T =25°C A Parameter Symbol Value Unit Power Dissipation P 62.5 mW D Reverse Voltage V 5 V R Junction Temperature T 110 °C j Operating Temperature T -40 To +85 °C op Storage Temperature T -40 To +85 °C stg DC Forward Current I 25 mA F Peak Forward Current IFM [1] 140 mA Electrostatic Discharge Threshold (HBM) - 8000 V Thermal Resistance (Junction / Ambient) R [2] 650 °C/W thJA Thermal Resistance (Junction / Solder point) R [2] 320 °C/W thJS Lead Solder Temperature [3] 260°C For 3 Seconds Lead Solder Temperature [4] 260°C For 5 Seconds Notes: 1. 1/10 Duty Cycle, 0.1ms Pulse Width. 2. Rth JA ,Rth JS Results from mounting on PC board FR4 (pad size ≥ 16 mm2 per pad). 3. 2mm below package base. 4. 5mm below package base. 5. Relative humidity levels maintained between 40% and 60% in production area are recommended to avoid the build-up of static electricity – Ref JEDEC/JESD625-A and JEDEC/J-STD-033. Page 2 / 5 © 2017 Kingbright. All Rights Reserved. Spec No: DSAL0544 / 1101029079 Rev No: V.5B Date: 06/06/2017

WP710A10SGD TECHNICAL DATA RELATIVE INTENSITY vs. WAVELENGTH SPATIAL DISTRIBUTION Green 100% -15° 0° 15° a. u.) 80% Ta = 25 °C Ta = 25 °C -30° 30° sity ( 60% -45° 45° n e e Int 40% -60° 60° v ati el 20% R -75° 75° 0% 350 400 450 500 550 600 650 700 750 800 Wavelength (nm) -90° 90° 1.0 0.5 0.0 0.5 1.0 SUPER BRIGHT GREEN Forward Current vs. Luminous Intensity vs. Forward Current Derating Curve Luminous Intensity vs. Forward Voltage Forward Current Ambient Temperature Forward current (mA) 12345000000 Ta = 25 °C Luminous intensity normalised at20 mA 001122......050505 Ta = 25 °C Permissible forward current (mA) 12345000000 Luminous intensity normalisedat T = 25 °Ca 001122......050505 1.7 1.9 2.1 2.3 2.5 2.7 0 10 20 30 40 50 -40 -20 0 20 40 60 80 100 -40 -20 0 20 40 60 80 100 Forward voltage (V) Forward current (mA) Ambient temperature (°C) Ambient temperature (°C) RECOMMENDED WAVE SOLDERING PROFILE Notes: 1. Recommend pre-heat temperature of 105°C or less (as measured with a thermocouple attached to the LED pins) prior to immersion in the solder wave with a maximum solder bath temperature of 260°C 2. Peak wave soldering temperature between 245°C ~ 255°C for 3 sec (5 sec max). 3. Do not apply stress to the epoxy resin while the temperature is above 85°C. 4. Fixtures should not incur stress on the component when mounting and during soldering process. 5. SAC 305 solder alloy is recommended. 6. No more than one wave soldering pass. PACKING & LABEL SPECIFICATIONS Page 3 / 5 © 2017 Kingbright. All Rights Reserved. Spec No: DSAL0544 / 1101029079 Rev No: V.5B Date: 06/06/2017

WP710A10SGD PRECAUTIONS Storage conditions 1. Avoid continued exposure to the condensing moisture environment and keep the product away from rapid transitions in ambient temperature. 2. LEDs should be stored with temperature ≤ 30°C and relative humidity < 60%. 3. Product in the original sealed package is recommended to be assembled within 72 hours of opening. Product in opened package for more than a week should be baked for 30 (+10/-0) hours at 85 ~ 100°C. LED Mounting Method 1. The lead pitch of the LED must match the pitch of the mounting holes on the PCB during component placement. Lead-forming may be required to insure the lead pitch matches the hole pitch. Refer to the figure below for proper lead forming procedures. Note 1-3: Do not route PCB trace in the contact area between the leadframe and the PCB to prevent short-circuits. " ○" Correct mounting method " x " Incorrect mounting method 2. When soldering wires to the LED, each wire joint should be separately insulated with heat-shrink tube to prevent short-circuit contact. Do not bundle both wires in one heat shrink tube to avoid pinching the LED leads. Pinching stress on the LED leads may damage the internal structures and cause failure. 3. Use stand-offs (Fig.1) or spacers (Fig.2) to securely position the LED above the PCB. 4. Maintain a minimum of 3mm clearance between the base of the LED lens and the first lead bend (Fig. 3 ,Fig. 4). 5. During lead forming, use tools or jigs to hold the leads securely so that the bending force will not be transmitted to the LED lens and its internal structures. Do not perform lead forming once the component has been mounted onto the PCB. (Fig. 5 ) Page 4 / 5 © 2017 Kingbright. All Rights Reserved. Spec No: DSAL0544 / 1101029079 Rev No: V.5B Date: 06/06/2017

WP710A10SGD Lead Forming Procedures 1. Do not bend the leads more than twice. (Fig. 6 ) 2. During soldering, component covers and holders should leave clearance to avoid placing damaging stress on the LED during soldering. (Fig. 7) 3. The tip of the soldering iron should never touch the lens epoxy. 4. Through-hole LEDs are incompatible with reflow soldering. 5. If the LED will undergo multiple soldering passes or face other processes where the part may be subjected to intense heat, please check with Kingbright for compatibility. PRECAUTIONARY NOTES 1. The information included in this document reflects representative usage scenarios and is intended for technical reference only. 2. The part number, type, and specifications mentioned in this document are subject to future change and improvement without notice. Before production usage customer should refer to the latest datasheet for the updated specifications. 3. When using the products referenced in this document, please make sure the product is being operated within the environmental and electrical limits specified in the datasheet. If customer usage exceeds the specified limits, Kingbright will not be responsible for any subsequent issues. 4. The information in this document applies to typical usage in consumer electronics applications. If customer's application has special reliability requirements or have life-threatening liabilities, such as automotive or medical usage, please consult with Kingbright representative for further assistance. 5. The contents and information of this document may not be reproduced or re-transmitted without permission by Kingbright. 6. All design applications should refer to Kingbright application notes available at http://www.KingbrightUSA.com/ApplicationNotes Page 5 / 5 © 2017 Kingbright. All Rights Reserved. Spec No: DSAL0544 / 1101029079 Rev No: V.5B Date: 06/06/2017

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