SMD LED Product Data Sheet LTST-C170TBKT Spec No.: DS-22-99-0226 Effective Date: 07/30/2010 Revision: I LITE-ON DCC RELEASE BNS-OD-FC001/A4 LITE-ON Technology Corp. / Optoelectronics No.90,Chien 1 Road, Chung Ho, New Taipei City 23585, Taiwan, R.O.C. Tel: 886-2-2222-6181 Fax: 886-2-2221-1948 / 886-2-2221-0660 http://www.liteon.com/opto BBNNSS--OODD--FFCC000011//AA44 BNS-OD-FC001/A4

LITE-ON TECHNOLOGY CORPORATION Property of Lite-On Only Features * Meet ROHS, Green Product. * Package In 8mm Tape On 7" Diameter Reels. * Compatible With Automatic Placement Equipment. * Compatible With Infrared And Vapor Phase Reflow Solder Process. * EIA STD package. * I.C. compatible. Package Dimensions Part No. Lens Source Color LTST-C170TBKT Water Clear InGaN Blue Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is ± 0.10 mm (.004") unless otherwise noted. Part No. : LTST-C170TBKT Page : 1 of 11 BNS-OD-C131/A4

LITE-ON TECHNOLOGY CORPORATION Property of Lite-On Only Absolute Maximum Ratings At Ta=25℃ Parameter LTST-C170TBKT Unit Power Dissipation 76 mW Peak Forward Current 100 mA (1/10 Duty Cycle, 0.1ms Pulse Width) DC Forward Current 20 mA Derating Linear From 25°C 0.25 mA/°C Reverse Voltage Note A 5 V Operating Temperature Range -20°C to + 80°C Storage Temperature Range -30°C to + 100°C Wave Soldering Condition 260°C For 5 Seconds Infrared Soldering Condition 260°C For 5 Seconds Vapor Phase Soldering Condition 215°C For 3 Minutes Note A: Reverse Voltage can’t be continued operating Part No. : LTST-C170TBKT Page : 2 of 11 BNS-OD-C131/A4

LITE-ON TECHNOLOGY CORPORATION Property of Lite-On Only Suggestion Profile: (1) Suggestion IR Reflow Profile For Normal Process (2) Suggestion IR Reflow Profile For Pb Free Process Recommended Profile Between Assemble And Heat-Resistance Line The Profile is available that must to use SnAg Cu solder paste Part No. : LTST-C170TBKT Page : 3 of 11 BNS-OD-C131/A4

LITE-ON TECHNOLOGY CORPORATION Property of Lite-On Only Electrical Optical Characteristics At Ta=25℃ Part No. Parameter Symbol Min. Typ. Max. Unit Test Condition LTST- IF = 20mA Luminous Intensity IV C170TBKT 28.0 - 180 mcd Note 1 Viewing Angle 2θ1/2 C170TBKT 130 deg Note 2 (Fig.6) Measurement Peak Emission Wavelength λP C170TBKT 468 nm @Peak (Fig.1) IF = 20mA Dominant Wavelength λd C170TBKT 465.0 - 475.0 nm Note 3 Spectral Line Half-Width Δλ C170TBKT 25 nm Forward Voltage VF C170TBKT 2.80 - 3.80 V IF = 20mA Reverse Current IR C170TBKT 10 μA VR = 5V Notes: 1. Luminous intensity is measured with a light sensor and filter combination that approximates the CIE eye-response curve. 2. θ1/2 is the off-axis angle at which the luminous intensity is half the axial luminous intensity. 3. The dominant wavelength, λd is derived from the CIE chromaticity diagram and represents the single wavelength which defines the color of the device. 4. Caution in ESD: Static Electricity and surge damages the LED. It is recommend to use a wrist band or anti-electrostatic glove when handling the LED. All devices, equipment and machinery must be properly grounded. Part No. : LTST-C170TBKT Page : 4 of 11 BNS-OD-C131/A4

LITE-ON TECHNOLOGY CORPORATION Property of Lite-On Only Bin Code List Forward Voltage Unit: V @20mA Bin Code Min. Max. D7 2.80 3.00 D8 3.00 3.20 D9 3.20 3.40 D10 3.40 3.60 D11 3.60 3.80 Tolerance on each Forward Voltage bin is +/-0.1 volt Luminous Intensity Unit : mcd @20mA Bin Code Min. Max. N 28.0 45.0 P 45.0 71.0 Q 71.0 112.0 R 112.0 180.0 Tolerance on each Intensity bin is +/-15% Dominant Wavelength Unit : nm @20mA Bin Code Min. Max. AC 465.0 470.0 AD 470.0 475.0 Tolerance for each Dominate Wavelength bin is +/- 1nm Part No. : LTST-C170TBKT Page : 5 of 11 BNS-OD-C131/A4

LITE-ON TECHNOLOGY CORPORATION Property of Lite-On Only Typical Electrical / Optical Characteristics Curves (25 C Ambient Temperature Unless Otherwise Noted) Part No. : LTST-C170TBKT Page : 6 of 11 BNS-OD-C131/A4

LITE-ON TECHNOLOGY CORPORATION Property of Lite-On Only Cleaning Do not use unspecified chemical liquid to clean LED they could harm the package. If clean is necessary, immerse the LED in ethyl alcohol or in isopropyl alcohol at normal temperature for less one minute. Suggest Soldering Pad Dimensions Package Dimensions Of Tape And Reel Notes: 1. All dimensions are in millimeters (inches). Part No. : LTST-C170TBKT Page : 7 of 11 BNS-OD-C131/A4

LITE-ON TECHNOLOGY CORPORATION Property of Lite-On Only Notes: 1. Empty component pockets sealed with top cover tape. 2. 7 inch reel-3000 pieces per reel. 3. Minimum packing quantity is 500 pcs for remainders. 4. The maximum number of consecutive missing lamps is two. 5. In accordance with ANSI/EIA 481-1-A-1994 specifications. Part No. : LTST-C170TBKT Page : 8 of 11 BNS-OD-C131/A4

LITE-ON TECHNOLOGY CORPORATION Property of Lite-On Only CAUTIONS 1. Application The LEDs described here are intended to be used for ordinary electronic equipment (such as office equipment, communication equipment and household applications).Consult Liteon’s Sales in advance for information on applications in which exceptional reliability is required, particularly when the failure or malfunction of the LEDs may directly jeopardize life or health (such as in aviation, transportation, traffic control equipment, medical and life support systems and safety devices). 2. Storage The storage ambient for the LEDs should not exceed 30°C temperature or 70% relative humidity. It is recommended that LEDs out of their original packaging are IR-reflowed within one week. For extended storage out of their original packaging, it is recommended that the LEDs be stored in a sealed container with appropriate desiccant, or in a desiccators with nitrogen ambient. LEDs stored out of their original packaging for more than a week should be baked at about 60 deg C for at least 24 hours before solder assembly. 3. Cleaning Use alcohol-based cleaning solvents such as isopropyl alcohol to clean the LED if necessary. 4. Soldering Recommended soldering conditions: Reflow soldering Wave Soldering Soldering iron Pre-heat 120~150°C Pre-heat 100°C Max. Temperature 300°C Max. Pre-heat time 120 sec. Max. Pre-heat time 60 sec. Max. Soldering time 3 sec. Max. Peak temperature 240°C Max. Solder wave 260°C Max. (one time only) Soldering time 10 sec. Max. Soldering time 10 sec. Max. 5. Drive Method An LED is a current-operated device. In order to ensure intensity uniformity on multiple LEDs connected in parallel in an application, it is recommended that a current limiting resistor be incorporated in the drive circuit, in series with each LED as shown in Circuit A below. Circuit model A Circuit model B LED LED (A) Recommended circuit. (B) The brightness of each LED might appear different due to the differences in the I-V characteristics of those LEDs. 6. ESD (Electrostatic Discharge) Static Electricity or power surge will damage the LED. Suggestions to prevent ESD damage:  Use of a conductive wrist band or anti-electrostatic glove when handling these LEDs.  All devices, equipment, and machinery must be properly grounded.  Work tables, storage racks, etc. should be properly grounded.  Use ion blower to neutralize the static charge which might have built up on surface of the LED’s plastic lens as a result of friction between LEDs during storage and handling. Part No. : LTST-C170TBKT Page : 9 of 11 BNS-OD-C131/A4

LITE-ON TECHNOLOGY CORPORATION Property of Lite-On Only ESD-damaged LEDs will exhibit abnormal characteristics such as high reverse leakage current, low forward voltage, or “ no lightup ” at low currents. To verify for ESD damage, check for “ lightup ” and Vf of the suspect LEDs at low currents. The Vf of “ good ” LEDs should be >2.0V@0.1mA for InGaN product and >1.4V@0.1mA for AlInGaP product. 7. Reliability Test Classification Test Item Test Condition Reference Standard Ta= Under Room Temperature As Per Data Sheet MIL-STD-750D:1026 (1995) Operation Life Maximum Rating MIL-STD-883D:1005 (1991) *Test Time= 1000HRS (-24HRS,+72HRS) JIS C 7021:B-1 (1982) High Temperature IR-Reflow In-Board, 2 Times MIL-STD-202F:103B(1980) Endurance High Humidity Ta= 65±5℃,RH= 90～95% JIS C 7021:B-11(1982) Storage *Test Time= 240HRS±2HRS Test High Temperature Ta= 105±5℃ MIL-STD-883D:1008 (1991) Storage *Test Time= 1000HRS (-24HRS,+72HRS) JIS C 7021:B-10 (1982) Low Temperature Ta= -55±5℃ JIS C 7021:B-12 (1982) Storage *Test Time=1000HRS (-24HRS,+72H RS) MIL-STD-202F:107D (1980) 105℃ ～ 25℃ ～ -55℃ ～ 25℃ Temperature MIL-STD-750D:1051(1995) 30mins 5mins 30mins 5mins Cycling MIL-STD-883D:1010 (1991) 10 Cycles JIS C 7021:A-4(1982) IR-Reflow In-Board, 2 Times MIL-STD-202F:107D(1980) Thermal 85 ± 5℃ ～ -40℃ ± 5℃ MIL-STD-750D:1051(1995) Shock 10mins 10mins 10 Cycles MIL-STD-883D:1011 (1991) MIL-STD-202F:210A(1980) Solder T.sol= 260 ± 5℃ MIL-STD-750D:2031(1995) Resistance Dwell Time= 10 ± 1secs JIS C 7021:A-1(1982) Ramp-up rate(183℃ to Peak) +3℃/ second max MIL-STD-750D:2031.2(1995) Temp. maintain at 125(±25)℃ 120 seconds max J-STD-020(1999) Temp. maintain above 183℃ 60-150 seconds IR-Reflow Environmental Peak temperature range 235℃+5/-0℃ Normal Process Test Time within 5°C of actual Peak Temperature (tp) 10-30 seconds Ramp-down rate +6℃/second max Ramp-up rate(217℃ to Peak) +3℃/ second max MIL-STD-750D:2031.2(1995) Temp. maintain at 175(±25)℃ 180 seconds max J-STD-020(1999) Temp. maintain above 217℃ 60-150 seconds IR-Reflow Peak temperature range 260℃+0/-5℃ Pb Free Process Time within 5°C of actual Peak Temperature (tp) 20-40 seconds Ramp-down rate +6℃/second max MIL-STD-202F:208D(1980) T.sol= 235 ± 5℃ MIL-STD-750D:2026(1995) Immersion time 2±0.5 sec Solderability MIL-STD-883D:2003(1991) Immersion rate 25±2.5 mm/sec IEC 68 Part 2-20 Coverage ≧95% of the dipped surface JIS C 7021:A-2(1982) 8. Others The appearance and specifications of the product may be modified for improvement without prior notice. Part No. : LTST-C170TBKT Page : 10 of 11 BNS-OD-C131/A4

LITE-ON TECHNOLOGY CORPORATION Property of Lite-On Only 9. Suggested Checking List Training and Certification 1. Everyone working in a static-safe area is ESD-certified? 2. Training records kept and re-certification dates monitored? Static-Safe Workstation & Work Areas 1. Static-safe workstation or work-areas have ESD signs? 2. All surfaces and objects at all static-safe workstation and within 1 ft measure less than 100V? 3. All ionizer activated, positioned towards the units? 4. Each work surface mats grounding is good? Personnel Grounding 1. Every person (including visitors) handling ESD sensitive (ESDS) items wears wrist strap, heel strap or conductive shoes with conductive flooring? 2. If conductive footwear used, conductive flooring also present where operator stand or walk? 3. Garments, hairs or anything closer than 1 ft to ESD items measure less than 100V*? 4. Every wrist strap or heel strap/conductive shoes checked daily and result recorded for all DLs? 5. All wrist strap or heel strap checkers calibration up to date? Note: *50V for Blue LED. Device Handling 1. Every ESDS items identified by EIA-471 labels on item or packaging? 2. All ESDS items completely inside properly closed static-shielding containers when not at static-safe workstation? 3. No static charge generators (e.g. plastics) inside shielding containers with ESDS items? 4. All flexible conductive and dissipative package materials inspected before reuse or recycles? Others 1. Audit result reported to entity ESD control coordinator? 2. Corrective action from previous audits completed? 3. Are audit records complete and on file? Part No. : LTST-C170TBKT Page : 11 of 11 BNS-OD-C131/A4