EV-VND7030AJ VND7030AJ evaluation board Data brief  Diagnostic functions  Multiplexed analog feedback of: load current with high precision proportional current mirror, V supply voltage and CC T device temperature CHIP  Overload and short to ground (power limitation) indication  Thermal shutdown indication  OFF-state open-load detection  Output short to V detection CC  Sense enable/disable  Protections Features  Undervoltage shutdown  Overvoltage clamp Max transient supply voltage V 40 V  Load current limitation CC  Self limiting of fast thermal transients Operating voltage range V 4 to 28 V CC  Configurable latch-off on Typ. on-state resistance (per Ch) RON 31 mΩ overtemperature or power limitation with dedicated fault reset pin Current limitation (typ) I 56 A LIMH  Loss of ground and loss of V CC Stand-by current (max) I 0.5 µA STBY  Reverse battery with external components  Electrostatic discharge protection  Simple single IC application board dedicated for VND7030AJ Applications  Provides electrical connectivity and thermal heat-sinking for easy prototyping Typical applications are all types of automotive  General device features resistive, inductive and capacitive loads.  Double channel smart high-side driver Table 1: Device summary with MultiSense analog feedback  Very low standby current Order code Reference  Compatible with 3 V and 5 V CMOS EV-VND7030AJ VND7030AJ evaluation board outputs September 2015 DocID026359 Rev 3 1/7 www.st.com

Description EV-VND7030AJ 1 Description This board provides you an easy way to connect STMicroelectronics® VIPower® M0-7 technology into your existing system. The board comes pre-assembled with VND7030AJ high-side driver. On board minimum set of electrical components (as for device datasheet recommendation) is enabling the user to directly connect the load, the power supply and the microcontroller without any additional effort in external component design and connection. The VND7030AJ is a double channel high-side driver manufactured using ST proprietary VIPower technology and housed in PowerSSO-16 package. The device is designed to drive 12 V automotive grounded loads through a 3 V and 5 V CMOS-compatible interface and to provide protection and diagnostics. The device integrates advanced protective functions such as load current limitation, overload active management by power limitation and overtemperature shutdown with configurable latch-off. A FaultRST pin unlatches the output in case of fault or disables the latch-off functionality. A dedicated multifunction multiplexed analog output pin delivers sophisticated diagnostic functions including high precision proportional load current sense, supply voltage feedback and chip temperature sense, in addition to the detection of overload and short circuit to ground, short to V and OFF-state open-load. A sense enable pin allows OFF-state CC diagnosis to be disabled during the module low-power mode as well as external sense resistor sharing among similar devices. Figure 1: Evaluation board schematic Vbat Vbat J1 C1 100nF 12345678910 Vbat PGND In_PullUP J2 0 U1 R_UP1 R_UP2 IISSSMFINnNaE_E_u01uELLPltli1N0tuSRlelSUnTsPe +5V J31234567891111110234 Mul1tiC0Sn3eFnPseGNDRR5s e1n5sKePGIINNN01D TTPP1112FSa_uElNtRRSSREE12S LL11T0155KKRRRR4367 11115555KKKK 52364781 SFSSGMIINNaEEENuPPuLnLlDtUUli01tSRTTeS10nTse VBATT OOOOOOOOUUUUUUUUTTTTTTTTPPPPPPPPUUUUUUUUTTTTTTTT00001111 111111191206543 Out0O1ut12 15 PSS0-16 111678 ES1DD1L R4K87 CON18 PGND LED1 LED2 C4 C2 10nF 10nF 12345678910 R9 R10 PGND 2k2 2k2 J4 PGND PGND GAPG1704141132CFT 2/7 DocID026359 Rev 3

EV-VND7030AJ Board connections 2 Board connections Figure 2: "Evaluation board connections" shows the placement of the connectors to be used for supplying the evaluation board, connecting the load and controlling the functionality and diagnostic of the device. Figure 2: Evaluation board connections Table 2: J3 connector: pin functions Pin Connector Pin name Pin function number J3 1…4 N/A Not connected Connection to optional external pull-up resistor for open load J3 5 IN_PullUP detection in off-state. J3 6 +5V 5 V Power Supply Active low compatible with 3 V and 5 V CMOS outputs pin; it J3 7 FaultRST unlatches the output in case of fault; If kept low, sets the outputs in auto-restart Multiplexed analog sense output pin; it delivers a current J3 8 MultiSense proportional to the selected diagnostic: load current, supply voltage or chip temperature Active high compatible with 3 V and 5 V CMOS outputs pin; J3 9 S_EN it enables the MultiSense diagnostic pin. Active high compatible with 3 V and 5 V CMOS outputs pin; J3 10 SEL0 together with SEL1, it addresses the MultiSense multiplexer Active high compatible with 3 V and 5 V CMOS outputs pin; J3 11 SEL1 together with SEL0, it addresses the MultiSense multiplexer J3 12 N/A Not connected Voltage controlled input pin with hysteresis, compatible with J3 13 IN0 3 V and 5 V CMOS outputs. It controls OUT0 switch state Voltage controlled input pin with hysteresis, compatible with J3 14 IN1 3 V and 5 V CMOS outputs. It controls OUT1 switch state J3 15…18 N/A Not connected DocID026359 Rev 3 3/7

Board connections EV-VND7030AJ In case the user wishes to utilize the Current Sense/MultiSense function of the device, it is necessary to plug a sense resistor in R . SENSE The package includes a through-hole resistor, to be mounted on TP1-TP2 (see Figure 4: "Mounting through-hole sense resistor"). Different R values can be adopted based on user preference. SENSE Another option is soldering an SMD resistor on the dedicated PCB pad, as shown in Figure 5: "Pads for soldering SMD resistor". Figure 3: No sense resistor Figure 4: Mounting through-hole sense resistor Figure 5: Pads for soldering SMD resistor 4/7 DocID026359 Rev 3

EV-VND7030AJ Thermal data 3 Thermal data Table 3: Thermal data Symbol Parameter Max Unit R Thermal resistance junction-ambient (MAX) 39 °C/W thj-amb Table 4: PCB specifications Parameter Value Board dimensions 25 mm x 41.5 mm Number of Cu layer 2 Layer Cu thickness 35 μm Board finish thickness 1.6 mm +/- 10% Board Material FR4 Thermal vias separation 1.1 mm Thermal vias diameter 0.5 mm DocID026359 Rev 3 5/7

Revision history EV-VND7030AJ 4 Revision history Table 5: Revision history Revis Date Changes ion 15-May-2014 1 Initial release. 21-Jul-2014 2 Updated Figure 1: "Evaluation board schematic" Changed EV-VND7030AJ-E in EV-VND7030AJ. Updated Section 01-Sep-2015 3 "Features" and Section 1: "Description" 6/7 DocID026359 Rev 3

EV-VND7030AJ IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2015 STMicroelectronics – All rights reserved DocID026359 Rev 3 7/7