UPS5817(e3) and UPS5819(e3) Schottky Barrier Rectifier Compliant 1.0 Amp, 20 and 40 Volt DESCRIPTION Single schottky rectifier assembled in Powermite 1 package which features a full metallic bottom that eliminates the possibility of solder flux entrapment during assembly. The package also incorporates a unique locking tab which acts as an efficient heat path from the die to the mounting plane for external heat sinking with very low thermal resistance junction to case (bottom). This product is suitable for use in switching and regulating power supplies and also charge pump circuits. Important: For the latest information, visit our website http://www.microsemi.com. FEATURES • Ultra low forward voltage drop. Powermite 1 • Efficient heat path with integral locking bottom metal tab. • Supplied in 8mm tape and reel. (DO-216AA) • RoHS compliant. Package APPLICATIONS / BENEFITS • High power surface mount package. • Guard ring construction for transient protection. • Compatible with Automatic Insertion Equipment. • Full-metallic bottom eliminates flux entrapment. • High surge capacity. • Ideal for OR’ing diode. MAXIMUM RATINGS @ 25 ºC unless otherwise stated Value Parameters/Test Conditions Symbol Unit UPS5817 UPS5819 Peak Repetitive Reverse Voltage and also VRRM 20 40 V Working Peak Reverse Voltage VRWM MSC – Lawrence DC Blocking Voltage VR 6 Lake Street, RMS Reverse Voltage VR(RMS) 14 28 V Lawrence, MA 01841 Junction and Storage Temperature TJ and TSTG -55 to +150 ºC Tel: 1-800-446-1158 or Thermal Resistance Junction-to-Case RӨJC 15 ºC/W (978) 620-2600 Thermal Resistance Junction-to-Ambient (1) RӨJA 240 ºC/W F ax: (978) 689-0803 Average Rectified Output Current @ TC = 135 ºC IO 1.0 A MSC – Ireland Repetitive Peak Forward Current IFRM 2.0 A Gort Road Business Park, Surge Peak Forward Current IFSM 50 A Ennis, Co. Clare, Ireland Tel: +353 (0) 65 6840044 Voltage Rate of Change @ Rated VR and TJ = 25 ºC dv/dt 10,000 V/µs Fax: +353 (0) 65 6822298 Solder Temperature @ 10 s TSP 260 oC Website: Notes: 1. Mounted on FR-4 PC board using 1 oz copper with recommended minimum foot print. www.microsemi.com RF01129, Rev. A (5/8/13) ©2013 Microsemi Corporation Page 1 of 4

UPS5817(e3) and UPS5819(e3) MECHANICAL and PACKAGING • CASE: Molded epoxy package meets UL94V-0. • TERMINALS: Copper with annealed matte-tin plating for RoHS compliance. Solderable per MIL-STD-750 method 2026. (Consult factory for tin-lead plating). • MARKING: Body marked with “S17” or “S19”. • POLARITY: Cathode designated by Tab 1 (bottom). • TAPE & REEL option: Packaging per EIA-481-B with 8 mm tape. Consult factory for quantities. • WEIGHT: Approximately 0.016 grams. • See Package Dimensions on last page. PART NOMENCLATURE UPS 5817 e3 Powermite Schottky RoHS Compliance e3 = RoHS compliant Series Number Blank = non-RoHS compliant ELECTRICAL CHARACTERISTICS VALUE RATING (Conditions) SYMBOL UNIT UPS5817 UPS5819 Maximum Instantaneous Forward Voltage (2) (IF = 1.0 A, TJ = +25 ºC) VF 0.45 0.55 Volts Maximum Instantaneous Reverse Current (2) (VR = 20 V, TJ = +25 ºC) IRM 1.0 1.0 mA Typical Junction Capacitance (VR = 5V, f = 1 MHz) CJ 105 60 pF Notes: 2. Measured with a test pulse of 380 µs to minimize self-heating effect. RF01129, Rev. A (5/8/13) ©2013 Microsemi Corporation Page 2 of 4

UPS5817(e3) and UPS5819(e3) GRAPHS ) ed z ali m r o N ( e c n a st si e R al Duty Factor m r e h T nt Percent Values are e Duty Cycle = 100 x t1/t2 si n a r T T), t, Pulse Width Time (s) R( FIGURE 1 Thermal Impedance Junction to Case ) d e aliz m r o N ( e c n a st si e R al Duty Factor m r e h T nt Percent Values are e si Duty Cycle = 100 x t1/t2 n a r T T), t, Pulse Width Time (s) R( FIGURE 2 Thermal Impedance Junction to Ambient RF01129, Rev. A (5/8/13) ©2013 Microsemi Corporation Page 3 of 4

UPS5817(e3) and UPS5819(e3) PACKAGE DIMENSIONS Dimensions Ltr Inch Millimeters Min Max Min Max A 0.029 0.039 0.73 0.99 B 0.016 0.026 0.40 0.66 C 0.070 0.080 1.77 2.03 D 0.087 0.097 2.21 2.46 E 0.020 0.030 0.50 0.76 F 0.051 0.061 1.29 1.54 G 0.021 0.031 0.53 0.78 H 0.004 0.008 0.10 0.20 J 0.070 0.080 1.77 2.03 K 0.035 0.045 0.89 1.14 PAD LAYOUT Dimensions Ltr Inch Millimeters A 0.100 2.54 B 0.105 2.67 C 0.050 1.27 D 0.030 0.76 E 0.025 0.64 SCHEMATIC RF01129, Rev. A (5/8/13) ©2013 Microsemi Corporation Page 4 of 4