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PACKAGE OPTION ADDENDUM www.ti.com 6-Sep-2013 PACKAGING INFORMATION Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples (1) Drawing Qty (2) (3) (4/5) 5962-86806012A ACTIVE LCCC FK 20 1 TBD Call TI Call TI -55 to 125 5962- 86806012A UC1846L/ 883B 5962-8680601EA ACTIVE CDIP J 16 1 TBD Call TI Call TI -55 to 125 5962-8680601EA UC1846J/883B UC1846J ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 UC1846J UC1846J/80257 OBSOLETE CDIP J 16 TBD Call TI Call TI -55 to 125 UC1846J/80364 OBSOLETE CDIP J 16 TBD Call TI Call TI -55 to 125 UC1846J/80619 OBSOLETE CDIP J 16 TBD Call TI Call TI -55 to 125 UC1846J883B ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 5962-8680601EA UC1846J/883B UC1846L883B ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 5962- 86806012A UC1846L/ 883B UC1847J OBSOLETE CDIP J 16 TBD Call TI Call TI -55 to 125 UC1847J883B OBSOLETE CDIP J 16 TBD Call TI Call TI -55 to 125 UC1847L OBSOLETE LCCC FK 20 TBD Call TI Call TI -55 to 125 UC1847L883B OBSOLETE LCCC FK 20 TBD Call TI Call TI -55 to 125 UC2846DW ACTIVE SOIC DW 16 40 Green (RoHS CU NIPDAU Level-2-260C-1 YEAR -40 to 85 UC2846DW & no Sb/Br) UC2846DWG4 ACTIVE SOIC DW 16 40 Green (RoHS CU NIPDAU Level-2-260C-1 YEAR -40 to 85 UC2846DW & no Sb/Br) UC2846DWTR ACTIVE SOIC DW 16 2000 Green (RoHS CU NIPDAU Level-2-260C-1 YEAR -40 to 85 UC2846DW & no Sb/Br) UC2846DWTR/81265 OBSOLETE SOIC DW 16 TBD Call TI Call TI UC2846DWTR/81265G4 OBSOLETE SOIC DW 16 TBD Call TI Call TI UC2846DWTRG4 ACTIVE SOIC DW 16 2000 Green (RoHS CU NIPDAU Level-2-260C-1 YEAR -40 to 85 UC2846DW & no Sb/Br) UC2846J ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -40 to 85 UC2846J Addendum-Page 1

PACKAGE OPTION ADDENDUM www.ti.com 6-Sep-2013 Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples (1) Drawing Qty (2) (3) (4/5) UC2846N ACTIVE PDIP N 16 25 Green (RoHS CU NIPDAU N / A for Pkg Type -40 to 85 UC2846N & no Sb/Br) UC2846NG4 ACTIVE PDIP N 16 25 Green (RoHS CU NIPDAU N / A for Pkg Type -40 to 85 UC2846N & no Sb/Br) UC2846QTR ACTIVE PLCC FN 20 1000 Green (RoHS CU SN Level-2-260C-1 YEAR -40 to 85 UC2846Q & no Sb/Br) UC2846QTRG3 ACTIVE PLCC FN 20 1000 Green (RoHS CU SN Level-2-260C-1 YEAR -40 to 85 UC2846Q & no Sb/Br) UC2847DW ACTIVE SOIC DW 16 40 Green (RoHS CU NIPDAU Level-2-260C-1 YEAR -40 to 85 UC2847DW & no Sb/Br) UC2847DWG4 ACTIVE SOIC DW 16 40 Green (RoHS CU NIPDAU Level-2-260C-1 YEAR -40 to 85 UC2847DW & no Sb/Br) UC2847N ACTIVE PDIP N 16 25 Green (RoHS CU NIPDAU N / A for Pkg Type -40 to 85 UC2847N & no Sb/Br) UC2847NG4 ACTIVE PDIP N 16 25 Green (RoHS CU NIPDAU N / A for Pkg Type -40 to 85 UC2847N & no Sb/Br) UC3846DW ACTIVE SOIC DW 16 40 Green (RoHS CU NIPDAU Level-2-260C-1 YEAR 0 to 70 UC3846DW & no Sb/Br) UC3846DWG4 ACTIVE SOIC DW 16 40 Green (RoHS CU NIPDAU Level-2-260C-1 YEAR 0 to 70 UC3846DW & no Sb/Br) UC3846DWTR ACTIVE SOIC DW 16 2000 Green (RoHS CU NIPDAU Level-2-260C-1 YEAR 0 to 70 UC3846DW & no Sb/Br) UC3846DWTRG4 ACTIVE SOIC DW 16 2000 Green (RoHS CU NIPDAU Level-2-260C-1 YEAR 0 to 70 UC3846DW & no Sb/Br) UC3846J ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type 0 to 70 UC3846J UC3846N ACTIVE PDIP N 16 25 Green (RoHS CU NIPDAU N / A for Pkg Type 0 to 70 UC3846N & no Sb/Br) UC3846NG4 ACTIVE PDIP N 16 25 Green (RoHS CU NIPDAU N / A for Pkg Type 0 to 70 UC3846N & no Sb/Br) UC3846Q ACTIVE PLCC FN 20 46 Green (RoHS CU SN Level-2-260C-1 YEAR 0 to 70 UC3846Q & no Sb/Br) UC3846QG3 ACTIVE PLCC FN 20 46 Green (RoHS CU SN Level-2-260C-1 YEAR 0 to 70 UC3846Q & no Sb/Br) UC3846QTR ACTIVE PLCC FN 20 1000 Green (RoHS CU SN Level-2-260C-1 YEAR 0 to 70 UC3846Q & no Sb/Br) Addendum-Page 2

PACKAGE OPTION ADDENDUM www.ti.com 6-Sep-2013 Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples (1) Drawing Qty (2) (3) (4/5) UC3846QTRG3 ACTIVE PLCC FN 20 1000 Green (RoHS CU SN Level-2-260C-1 YEAR 0 to 70 UC3846Q & no Sb/Br) UC3847DW ACTIVE SOIC DW 16 40 Green (RoHS CU NIPDAU Level-2-260C-1 YEAR 0 to 70 UC3847DW & no Sb/Br) UC3847DWG4 ACTIVE SOIC DW 16 40 Green (RoHS CU NIPDAU Level-2-260C-1 YEAR 0 to 70 UC3847DW & no Sb/Br) UC3847J OBSOLETE CDIP J 16 TBD Call TI Call TI 0 to 70 UC3847N ACTIVE PDIP N 16 25 Green (RoHS CU NIPDAU N / A for Pkg Type 0 to 70 UC3847N & no Sb/Br) UC3847NG4 ACTIVE PDIP N 16 25 Green (RoHS CU NIPDAU N / A for Pkg Type 0 to 70 UC3847N & no Sb/Br) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and Addendum-Page 3

PACKAGE OPTION ADDENDUM www.ti.com 6-Sep-2013 continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF UC1846, UC1847, UC2846, UC2846M, UC3846, UC3846M, UC3847 : •Catalog: UC3846, UC3847, UC2846, UC3846M, UC3846 •Enhanced Product: UC1846-EP, UC1846-EP •Military: UC2846M, UC1846, UC1847 •Space: UC1846-SP, UC1846-SP NOTE: Qualified Version Definitions: •Catalog - TI's standard catalog product •Enhanced Product - Supports Defense, Aerospace and Medical Applications •Military - QML certified for Military and Defense Applications •Space - Radiation tolerant, ceramic packaging and qualified for use in Space-based application Addendum-Page 4

IMPORTANTNOTICE TexasInstrumentsIncorporatedanditssubsidiaries(TI)reservetherighttomakecorrections,enhancements,improvementsandother changestoitssemiconductorproductsandservicesperJESD46,latestissue,andtodiscontinueanyproductorserviceperJESD48,latest issue.Buyersshouldobtainthelatestrelevantinformationbeforeplacingordersandshouldverifythatsuchinformationiscurrentand complete.Allsemiconductorproducts(alsoreferredtohereinas“components”)aresoldsubjecttoTI’stermsandconditionsofsale suppliedatthetimeoforderacknowledgment. TIwarrantsperformanceofitscomponentstothespecificationsapplicableatthetimeofsale,inaccordancewiththewarrantyinTI’sterms andconditionsofsaleofsemiconductorproducts.TestingandotherqualitycontroltechniquesareusedtotheextentTIdeemsnecessary tosupportthiswarranty.Exceptwheremandatedbyapplicablelaw,testingofallparametersofeachcomponentisnotnecessarily performed. TIassumesnoliabilityforapplicationsassistanceorthedesignofBuyers’products.Buyersareresponsiblefortheirproductsand applicationsusingTIcomponents.TominimizetherisksassociatedwithBuyers’productsandapplications,Buyersshouldprovide adequatedesignandoperatingsafeguards. TIdoesnotwarrantorrepresentthatanylicense,eitherexpressorimplied,isgrantedunderanypatentright,copyright,maskworkright,or otherintellectualpropertyrightrelatingtoanycombination,machine,orprocessinwhichTIcomponentsorservicesareused.Information publishedbyTIregardingthird-partyproductsorservicesdoesnotconstitutealicensetousesuchproductsorservicesorawarrantyor endorsementthereof.Useofsuchinformationmayrequirealicensefromathirdpartyunderthepatentsorotherintellectualpropertyofthe thirdparty,oralicensefromTIunderthepatentsorotherintellectualpropertyofTI. ReproductionofsignificantportionsofTIinformationinTIdatabooksordatasheetsispermissibleonlyifreproductioniswithoutalteration andisaccompaniedbyallassociatedwarranties,conditions,limitations,andnotices.TIisnotresponsibleorliableforsuchaltered documentation.Informationofthirdpartiesmaybesubjecttoadditionalrestrictions. ResaleofTIcomponentsorserviceswithstatementsdifferentfromorbeyondtheparametersstatedbyTIforthatcomponentorservice voidsallexpressandanyimpliedwarrantiesfortheassociatedTIcomponentorserviceandisanunfairanddeceptivebusinesspractice. TIisnotresponsibleorliableforanysuchstatements. Buyeracknowledgesandagreesthatitissolelyresponsibleforcompliancewithalllegal,regulatoryandsafety-relatedrequirements concerningitsproducts,andanyuseofTIcomponentsinitsapplications,notwithstandinganyapplications-relatedinformationorsupport thatmaybeprovidedbyTI.Buyerrepresentsandagreesthatithasallthenecessaryexpertisetocreateandimplementsafeguardswhich anticipatedangerousconsequencesoffailures,monitorfailuresandtheirconsequences,lessenthelikelihoodoffailuresthatmightcause harmandtakeappropriateremedialactions.BuyerwillfullyindemnifyTIanditsrepresentativesagainstanydamagesarisingoutoftheuse ofanyTIcomponentsinsafety-criticalapplications. Insomecases,TIcomponentsmaybepromotedspecificallytofacilitatesafety-relatedapplications.Withsuchcomponents,TI’sgoalisto helpenablecustomerstodesignandcreatetheirownend-productsolutionsthatmeetapplicablefunctionalsafetystandardsand requirements.Nonetheless,suchcomponentsaresubjecttotheseterms. NoTIcomponentsareauthorizedforuseinFDAClassIII(orsimilarlife-criticalmedicalequipment)unlessauthorizedofficersoftheparties haveexecutedaspecialagreementspecificallygoverningsuchuse. OnlythoseTIcomponentswhichTIhasspecificallydesignatedasmilitarygradeor“enhancedplastic”aredesignedandintendedforusein military/aerospaceapplicationsorenvironments.BuyeracknowledgesandagreesthatanymilitaryoraerospaceuseofTIcomponents whichhavenotbeensodesignatedissolelyattheBuyer'srisk,andthatBuyerissolelyresponsibleforcompliancewithalllegaland regulatoryrequirementsinconnectionwithsuchuse. TIhasspecificallydesignatedcertaincomponentsasmeetingISO/TS16949requirements,mainlyforautomotiveuse.Inanycaseofuseof non-designatedproducts,TIwillnotberesponsibleforanyfailuretomeetISO/TS16949. Products Applications Audio www.ti.com/audio AutomotiveandTransportation www.ti.com/automotive Amplifiers amplifier.ti.com CommunicationsandTelecom www.ti.com/communications DataConverters dataconverter.ti.com ComputersandPeripherals www.ti.com/computers DLP®Products www.dlp.com ConsumerElectronics www.ti.com/consumer-apps DSP dsp.ti.com EnergyandLighting www.ti.com/energy ClocksandTimers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security PowerMgmt power.ti.com Space,AvionicsandDefense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com VideoandImaging www.ti.com/video RFID www.ti-rfid.com OMAPApplicationsProcessors www.ti.com/omap TIE2ECommunity e2e.ti.com WirelessConnectivity www.ti.com/wirelessconnectivity MailingAddress:TexasInstruments,PostOfficeBox655303,Dallas,Texas75265 Copyright©2013,TexasInstrumentsIncorporated