TPS3513 www.ti.com SLVS313B–FEBRUARY2001–REVISEDSEPTEMBER2010 PC POWER SUPPLY SUPERVISOR CheckforSamples:TPS3513 FEATURES 1 D OR N PACKAGE • OvervoltageProtectionandLockoutfor12V, (TOP VIEW) 5V,and3.3V • OvercurrentProtectionandLockoutfor12V, PGI 1 14 PGO 5V,and3.3V GND 2 13 VDD • UndervoltageProtectionandLockoutfor12V, FPO 3 12 VS5 andUndervoltageDetectfor5Vand3.3V PSON 4 11 VS33 IS12 5 10 VS12 • Fault-ProtectionOutputWithOpenDrain RI 6 9 IS33 OutputStage NC 7 8 IS5 • Open-Drain,PowerGoodOutputSignalfor Power-GoodInput,3.3Vand5V NC – No internal connection • 300-msPower-GoodDelay DESCRIPTION • 75-msDelayfor5-Vand3.3-VPowerSupply Short-CircuitTurnonProtection The TPS3513 is designed to optimize PC switching • 2.3msPSONControltoFPOTurnoffDelay power supply system with minimum external components. It provides undervoltage lockout • 38msPSONControlDebounce (UVLO), protection circuits, power good indicator, and • WideSupplyVoltageRangeFrom4.5V on/offcontrol. to15V TYPICAL APPLICATION 0.01 W IO 12 V 12 V 0.01 W 5 V 5 V 0.01 W 3.3 V 3.3 V 5 V VSB 5 V VSB PG R1 W 470 kW TPS3513 1 kW From Transformer R2 W PGI PGO GND VDD FPO VS5 System Side Power Supply PSON VS33 Output Side 560 W IS12 VS12 820 W RI IS33 56 kW NC IS5 1.5 kW Max Over Current Output Current Protection Trip Point† 12 V 6 A 9.2 A 5 V 16 A 24.6 A 3.3 v 9 A 13.5 A †Over current protection trip point can be programmable. 1 Pleasebeawarethatanimportantnoticeconcerningavailability,standardwarranty,anduseincriticalapplicationsofTexas Instrumentssemiconductorproductsanddisclaimerstheretoappearsattheendofthisdatasheet. PRODUCTIONDATAinformationiscurrentasofpublicationdate. Copyright©2001–2010,TexasInstrumentsIncorporated Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarilyincludetestingofallparameters.

TPS3513 SLVS313B–FEBRUARY2001–REVISEDSEPTEMBER2010 www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriateprecautions.Failuretoobserveproperhandlingandinstallationprocedurescancausedamage. ESDdamagecanrangefromsubtleperformancedegradationtocompletedevicefailure.Precisionintegratedcircuitsmaybemore susceptibletodamagebecauseverysmallparametricchangescouldcausethedevicenottomeetitspublishedspecifications. DESCRIPTION (CONTINUED) UVLO thresholds are 4.45 V (on) and 3.65 V (off). Overcurrent protection (OCP) and overvoltage protection (OVP) monitor 3.3 V, 5 V, and 12 V. When an OC or OV condition is detected, the power-good output (PGO) is asserted low and the fault protection output (FPO) is latched high. PSON from low-to-high resets the latch. The OCP function will be enabled 75 ms after PSON goes low, and a debounce of typically 38 ms. A built-in 2.3-ms delaywith38-msdebouncefromPSONtoFPOoutputisenabledatturnoff. An external resistor is connected between the RI pin and the GND pin. This will introduce an accurate I for (ref) OCP function. The I range is from 12.5 µA to 62.5 µA. The formula for choosing RI resistor is V /I . Three (ref) (RI) (ref) OCP comparators and the I section are supplied by VS12. The current draw from the VS12 pin is less (ref) than1mA. ThepowergoodfeaturemonitorsPGI,3.3Vand5V,andissuesapowergoodsignalwhentheoutputisready. TheTPS3513ischaracterizedforoperationfrom–40°Cto85°C. Table1.FUNCTIONTABLE(1) UVCONDITION UVCONDITION12V PGI PSON OVCONDITIONS FPO PGO 3.3V/5V OCConditions <0.9V L No No No L L <0.9V L No No Yes L L <0.9V L No Yes No H L <0.9V L No Yes Yes H L <0.9V L Yes No No L L <0.9V L Yes No Yes L L <0.9V L Yes Yes No H L <0.9V L Yes Yes Yes H L 1.0V<PGI<1.1V L No No No L L 1.0V<PGI<1.1V L No No Yes H L 1.0V<PGI<1.1V L No Yes No H L 1.0V<PGI<1.1V L No Yes Yes H L 1.0V<PGI<1.1V L Yes No No L L 1.0V<PGI<1.1V L Yes No Yes H L 1.0V<PGI<1.1V L Yes Yes No H L 1.0V<PGI<1.1V L Yes Yes Yes H L >1.2V L No No No L H >1.2V L No No Yes H L >1.2V L No Yes No H L >1.2V L No Yes Yes H L >1.2V L Yes No No L L >1.2V L Yes No Yes H L >1.2V L Yes Yes No H L >1.2V L Yes Yes Yes H L x H x x x H L (1) x=don'tcare,FPO=Lmeans:faultisnotlatched,FPO=Hmeans:faultislatched,PGO=Lmeans:fault,PGO=Hmeans:Nofault 2 SubmitDocumentationFeedback Copyright©2001–2010,TexasInstrumentsIncorporated ProductFolderLink(s):TPS3513

TPS3513 www.ti.com SLVS313B–FEBRUARY2001–REVISEDSEPTEMBER2010 SCHEMATIC 0.95 V Copyright©2001–2010,TexasInstrumentsIncorporated SubmitDocumentationFeedback 3 ProductFolderLink(s):TPS3513

TPS3513 SLVS313B–FEBRUARY2001–REVISEDSEPTEMBER2010 www.ti.com TIMING REQUIREMENTS FPO Figure1. ACTurnonandOvervoltageProtect VDD PSON FPO PGI 3.3 V/5 V 12 V 300 ms 300 ms PGO 38 ms 300 ms 38 ms 300 ms OCP Occurs 3.3-V or 5-V Drop 12-V UVP Occurs Figure2. OvercurrentandUndervoltageDetect/Protect 4 SubmitDocumentationFeedback Copyright©2001–2010,TexasInstrumentsIncorporated ProductFolderLink(s):TPS3513

TPS3513 www.ti.com SLVS313B–FEBRUARY2001–REVISEDSEPTEMBER2010 TerminalFunctions TERMINAL I/O DESCRIPTION NAME NO. FPO 3 O Invertedfaultprotectionoutput,open-drain,outputstage. Alowlevelindicatesthatthefaultisnotlatched,whilefloatingindicatesthatthefaultislatched. GND 2 Ground IS12 5 I 12-Vovercurrentprotection IS5 8 I 5-Vovercurrentprotection IS33 9 I 3.3-Vovercurrentprotection NC 7 Nointernalconnection PGI 1 I Power-goodinput. Alowlevelindicatesthatpowerisnotgood,whileahigh(>1.2V)indicatesthatpowerisgood. PGO 14 O Power-goodoutput,opendrainoutputstage. Alowlevelindicatesthatpowerisnotgood,whilefloatingindicatesthatpowerisgood. PSON 4 I On/offcontrol. PulllowtoenablethePCPowerSupply;floattodisableit. RI 6 I Currentsensesetting V 13 I Supplyvoltage DD VS12 10 I 12-Vovervoltage/undervoltageprotection VS33 11 I 3.3-Vovervoltageprotect/undervoltagedetect VS5 12 I 5-Vovervoltageprotect/undervoltagedetect DETAILED DESCRIPTION Power-Good and Power-Good Delay A PC power supply is commonly designed to provide a power-good signal, which is defined by the computer manufacturers.PGOisapower-goodsignalandshouldbeassertedhighbythePCpowersupplytoindicatethat the 5-VDC and 3.3-VDC outputs are above the undervoltage threshold limit. At this time the converter should be able to provide enough power to assure continuous operation within the specification. Conversely, when either the 5-VDC or the 3.3-VDC output voltages fall below the undervoltage threshold, or when main power has been removed for a sufficiently long time so that power supply operation is no longer assured, PGO should be deassertedtoalowstate. Thepower-good(PGO),DCenable(PSON),andthe5-V/3.3-VsupplyrailsareshowninFigure3. Figure3. TimingofPSONandPGO Although there is no requirement to meet specific timing parameters, the following signal timings are recommended: 2ms≤ t2 ≤ 20ms,100ms<t3 <2000ms,t4 > 1ms,t5≤ 10ms Furthermore, motherboards should be designed to comply with the above recommended timing. If timings other thantheseareimplementedorrequired,thisinformationshouldbeclearlyspecified. Copyright©2001–2010,TexasInstrumentsIncorporated SubmitDocumentationFeedback 5 ProductFolderLink(s):TPS3513

TPS3513 SLVS313B–FEBRUARY2001–REVISEDSEPTEMBER2010 www.ti.com The TPS3513 family of power-supply supervisors provides a power-good output (PGO) for the 3.3-V and 5-V supply voltage rails and a separate power-good input (PGI). An internal timer is used to generate a 300-ms power-gooddelay. If the voltage signals at PGI, VS33, and VS5 rise above the undervoltage threshold, the open-drain, power-good output(PGO)willgohighafteradelayof300ms.WhenthePGIvoltageoranyofthe3.3-V,5-Vraildropsbelow theundervoltagethreshold,PGOwillbedisabledimmediately. Power-Supply Remote On/Off (PSON) and Fault Protect Output (FPO) Sincethelatestpersonalcomputergenerationfocusesoneasyturnonandpowersavingfunctions,thePCpower supply will require two characteristics. One is a dc power supply remote on/off function; the other is standby voltagetoachieveverylowpowerconsumptionofthePCsystem.Thus,themainpowerneedstobeshutdown. The power supply remote on/off (PSON) is an active-low signal that turns on all of the main power rails including the 3.3-V, 5-V, -5-V, and -12-V power rails. When this signal is held high by the PC motherboard or left open circuited, the signal of the fault protect output (FPO) also goes high. Thus, the main power rails should not delivercurrentandshouldbeheldat0V. When the FPO signal is held high due to an occurring fault condition, the fault status will be latched and the outputs of the main power rails should not deliver current and should be held at 0 V. Toggling the power-supply remote on/off (PSON) from low-to-high will reset the fault-protection latch. During this fault condition only the standbypowerisnotaffected. When PSON goes from high to low or low-to-high, the 38-ms debounce block will be active to avoid that a glitch on the input will disable/enable the FPO output. During this period, the undervoltage function is disabled to preventturnonfailure. Power should be delivered to the rails only if the PSON signal is held at ground potential, thus, FPO is active low.TheFPOpincanbeconnectedto5VDC(orupto15VDC)throughapullupresistor. Under-Voltage Protection The TPS3513 provides undervoltage protection (UVP) for the 12-V rail and undervoltage detect for the 3.3-V and 5-V rails. When an undervoltage condition appears at the VS12 input pin for more than 150 µs, the FPO output goes high and PGO goes low. Also, this fault condition will be latched until PSON is toggled from low-to-high or VDDisremoved. In flyback or forward type off-line switching power supplies, usually designed for small power, the overload protection design is very simple. Most of these type of power supplies are only sensing the input current for an overload condition. The trigger-point needs to be set much higher than the maximum load in order to prevent falseturnon. However, this will cause one critical issue. In case that the connected load is larger than the maximum allowable load but smaller than the trigger-point, the system will always become over-heated and cause failure and damage. Overcurrent Protection In bridge or forward type, off-line switching power supplies, usually designed for medium to large power, the overload protection design needs to be very precise. Most of these types of power supplies are sensing the output current for an overload condition. The trigger-point needs to be set higher than the maximum load in order topreventfalseturnon. The TPS3513 provides overcurrent protection (OCP) for the 3.3-V, 5-V, and 12-V rails. When an over current condition appears at the OCP comparator input pins for more than 73 µs, the FPO output goes high and PGO goeslow.Also,thisfaultconditionwillbelatcheduntilPSONistoggledfromlow-to-highorVDDisremoved. The resistor connected between the RI pin and the GND pin will introduce an accurate I for the OCP function. (ref) Of course, a more accurate resistor tolerance will be better. The formula for choosing the RI resistor is V /I . (RI) (ref) The I range is from 12.5 µA to 62.5 mA. Three OCP comparators and the I section are supplied by VS12. (ref) (ref) CurrentdrawnfromtheVS12pinislessthan1mA. FollowingisanexampleoncalculatingOCPforthe12-Vrail: RI=V /I =1.15V/20µA=56kΩ (RI) (ref) 6 SubmitDocumentationFeedback Copyright©2001–2010,TexasInstrumentsIncorporated ProductFolderLink(s):TPS3513

TPS3513 www.ti.com SLVS313B–FEBRUARY2001–REVISEDSEPTEMBER2010 I xCxR =R xI (ref) (IS12) (sense) (OCP_Trip) I =20µAx8x560Ω/0.01Ω =9.2A (OCP_Trip) C=Currentratio(seerecommendedoperatingconditions) Overvoltage Protection The overvoltage protection (OVP) of the TPS3513 monitors 3.3 V, 5 V, and 12 V. When an overvoltage condition appears at one of the 3.3-V, 5-V, or 12-V input pins for more than 73 µs, the FPO output goes high and PGO goes low. Also, this fault condition will be latched until PSON is toggled from low-to-high or VDD is removed. During fault conditions, most power supplies have the potential to deliver higher output voltages than those normally specified or required. In unprotected equipment, it is possible for output voltages to be high enough to cause internal or external damage of the system. To protect the system under these abnormal conditions, it is commonpracticetoprovideovervoltageprotectionwithinthepowersupply. ABSOLUTE MAXIMUM RATINGS overoperatingfree-airtemperaturerange(unlessotherwisenoted)(1) UNIT V Supplyvoltage(2) 16V DD Inputvoltage(2) PSON,IS5,IS33,PGI 8V V I Inputvoltage VS33,VS5 16V FPO V +0.3Vor16V(whicheverisless) DD V Outputvoltage O PGO V +0.3Vor8V(whicheverisless) DD Allotherpins(2) –0.3Vto16V Continuoustotalpowerdissipation SeeDissipationRatingTable T Operatingfree-airtemperaturerange –40°Cto85°C A T Storagetemperaturerange –65°Cto150°C stg Solderingtemperature 260°C (1) Stressesbeyondthoselistedunderabsolutemaximumratingsmaycausepermanentdamagetothedevice.Thesearestressratings only,andfunctionaloperationofthedeviceattheseoranyotherconditionsbeyondthoseindicatedunderrecommendedoperating conditionsisnotimplied.Exposuretoabsolute-maximum-ratedconditionsforextendedperiodsmayaffectdevicereliability. (2) AllvoltagevaluesarewithrespecttoGND. DISSIPATION RATING TABLE T ≤25°C DERATINGFACTOR T =70°C T =85°C PACKAGE A A A POWERRATING ABOVET =25°C POWERRATING POWERRATING A D 956mW 7.65mW/°C 612mW 497mW N 1512mW 12.1mW/°C 968mW 786mW Copyright©2001–2010,TexasInstrumentsIncorporated SubmitDocumentationFeedback 7 ProductFolderLink(s):TPS3513

TPS3513 SLVS313B–FEBRUARY2001–REVISEDSEPTEMBER2010 www.ti.com RECOMMENDED OPERATING CONDITIONS atspecifiedtemperaturerange MIN MAX UNIT V Supplyvoltage 4.5 15 V DD PSON,VS5,VS33,IS5,IS33 7 V VS12,IS12 15 V Inputvoltage I V +0.3V PGI DD V (max=7V) FPO 15 V Outputvoltage V O PGO 7 FPO 20 I Outputsinkcurrent mA O(Sink) PGO 10 t Supplyvoltagerisingtime See (1) 1 ms r I Outputcurrent RI 12.5 62.5 µA O(RI) T Operatingfree-airtemperaturerange 40 85 °C A (1) V risingandfallingslewratemustbelessthan14V/ms. DD ELECTRICAL CHARACTERISTICS overrecommendedoperatingfree-airtemperaturerange(unlessotherwisenoted) PARAMETER TESTCONDITIONS MIN TYP MAX UNIT OVER-VOLTAGEPROTECTIONANDOVER-CURRENTPROTECTION VS33 3.7 3.9 4.1 Overvoltagethreshold VS5 5.7 6.1 6.5 V VS12 13.2 13.8 14.4 Ratioofcurrentsensesinkcurrenttocurrentsense I ResistoratRI=30kΩ,0.1%resistor 7.6 8 8.4 (ref) settingpin(RI)sourcecurrent I Leakagecurrent(FPO) V =5V 5 µA lkg (FPO) V Low-leveloutputvoltage(FPO) I =20mA,V =5V 0.7 V OL (sink) DD NoisedeglitchtimeOVP V =5V 35 73 110 µs DD V Currentsourcereferencevoltage V =5V 1.1 1.15 1.2 V (RI) DD UNDERVOLTAGELOCKOUTSECTION Startthresholdvoltage 4.45 V Minimumoperationvoltageafterstart-up 3.65 V PGIANDPGO PGI1 1.10 1.15 1.20 V Inputthresholdvoltage V IT(PGI) PGI2 0.9 0.95 1 VS33 2 2.2 2.4 Undervoltagethreshold VS5 3.3 3.5 3.7 V VS12 8.5 9 9.5 InputoffsetvoltageforOCPcomparators 5 5 mV I Leakagecurrent(PGO) PGO=5V 5 µA lkg V Low-leveloutputvoltage(PGO) I =10mA,V =4.5V 0.4 V OL (sink) DD Short-circuitprotectiondelay 3.3V,5V 49 75 114 ms PGItoPGO V =5V 200 300 450 DD t Delaytime ms d(1) PGItoFPO 3.2 4.8 7.2 PGItoPGO V =5V 88 150 225 DD Noisedeglitchtime PGItoFPO µs 12-VUVPtoFPO PSONCONTROL I Inputpullupcurrent PSON=0V 120 µA I 8 SubmitDocumentationFeedback Copyright©2001–2010,TexasInstrumentsIncorporated ProductFolderLink(s):TPS3513

TPS3513 www.ti.com SLVS313B–FEBRUARY2001–REVISEDSEPTEMBER2010 ELECTRICAL CHARACTERISTICS (continued) overrecommendedoperatingfree-airtemperaturerange(unlessotherwisenoted) PARAMETER TESTCONDITIONS MIN TYP MAX UNIT V High-levelinputvoltage 2.4 V IH V Low-levelinputvoltage 1.2 V IL t Debouncetime(PSON) V =5V 24 38 57 ms (b) DD t Delaytime(PSONtoFPO) V =5V t +1.1 t +2.3 t +4 ms d(2) DD b b b TOTALDEVICE I Supplycurrent PSON=5V 1 mA DD Copyright©2001–2010,TexasInstrumentsIncorporated SubmitDocumentationFeedback 9 ProductFolderLink(s):TPS3513

TPS3513 SLVS313B–FEBRUARY2001–REVISEDSEPTEMBER2010 www.ti.com TYPICAL CHARACTERISTICS SUPPLYCURRENT INPUTCURRENT(PSON) vs vs SUPPLYVOLTAGE INPUTVOLTAGE(PSON) 400 20 TA = −40°C VDD = 4 V 300 0 A −20 m− 200 TA = 85°C A y Current 100 TA = 25T°AC = 0°C mCurrent − −−6400 − Suppl 0 − Input −80 TA = −40°C IDD −100 II −100 TTAA == 205°C°C TA = 85°C −200 PGI = 1.4 V −120 PSON = 5 V −300 −140 0 2.5 5 7.5 10 12.5 15 0 1 2 3 4 5 6 7 VDD − Supply Voltage − V VI − Input Voltage − V Figure4. Figure5. LOW-LEVELOUTPUTVOLTAGE(FPO) LOW-LEVELOUTPUTVOLTAGE(FPO) vs vs LOW-LEVELOUTPUTCURRENT(FPO) LOW-LEVELOUTPUTCURRENT(FPO) 4 800 VDD = 4 V VDD = 4 V PSON = GND V 700 PSON = GND V m Exploded View − − oltage 3 TA = 85°C oltage 600 TA = 85°C ut V ut V 500 p p ut ut O 2 O 400 el el v v ow-Le TA = 25°C TA = −40°C ow-Le 300 TA = 25°C TA = −40°C L L − 1 − 200 VOL TA = 0°C VOL 100 TA = 0°C 0 0 0 20 40 60 80 100 120 0 5 10 15 20 25 IOL − Low-Level Output Current − mA IOL − Low-Level Output Current − mA Figure6. Figure7. 10 SubmitDocumentationFeedback Copyright©2001–2010,TexasInstrumentsIncorporated ProductFolderLink(s):TPS3513

TPS3513 www.ti.com SLVS313B–FEBRUARY2001–REVISEDSEPTEMBER2010 TYPICAL CHARACTERISTICS (continued) LOW-LEVELOUTPUTVOLTAGE(PGO) LOW-LEVELOUTPUTVOLTAGE(PGO) vs vs LOW-LEVELOUTPUTCURRENT(PGO) LOW-LEVELOUTPUTCURRENT(PGO) 4 600 VDD = 4 V VDD = 4 V PSON = GND PSON = GND V V m 500 Exploded View e − TA = 85°C e − g 3 g a a olt olt V V 400 ut ut TA = 85°C p p ut ut O 2 O 300 evel TA = −40°C evel ow-L TA = 25°C ow-L 200 TA = 25°C − L 1 − L TA = −40°C VOL TA = 0°C VOL 100 TA = 0°C 0 0 0 25 50 75 100 125 150 0 5 10 15 20 IOL − Low-Level Output Current − mA IOL − Low-Level Output Current − mA Figure8. Figure9. NORMALIZEDSENSETHRESHOLDVOLTAGE CURRENTRATIO vs vs FREE-AIRTEMPERATUREATV FREE-AIRTEMPERATURE DD °T(25 )C 1.001 VPDSDO =N 4= VGND 8 RI = 30 kW VI I(IS5) TA)/ 1 7.99 I(ref) T( VI − 0.999 e o 7.98 ag ati Volt 0.998 nt R d e shol 0.997 Curr 7.97 e hr T ut 0.996 p 7.96 n d I ze 0.995 ali m 7.95 or 0.994 −40 −20 0 20 40 60 80 N −40 −15 10 35 60 85 TA − Free-Air Temperature − °C TA − Free-Air Temperature − °C Figure10. Figure11. Copyright©2001–2010,TexasInstrumentsIncorporated SubmitDocumentationFeedback 11 ProductFolderLink(s):TPS3513

TPS3513 SLVS313B–FEBRUARY2001–REVISEDSEPTEMBER2010 www.ti.com REVISION HISTORY Note:Pagenumbersofcurrentversionmaydifferfrompreviousversions. ChangesfromRevisionA(June2005)toRevisionB Page • DeletedspacebetweenOVintheOVConditionscolumnofFunctionTable.Alsochanged2H'sinFPOcolumnto L's(5throwfrombottomand13throwfrombottom) ........................................................................................................... 2 • Changedschematic,Figure1,andFigure3imageobjects. ................................................................................................ 3 • AddedtexttodescriptionsforFPO,PGI,PGO,andPSONpinsforclarification. ................................................................ 5 • Changedt inMINcolumn,delaytimerowtot +1.1 ....................................................................................................... 9 b+1.1 b 12 SubmitDocumentationFeedback Copyright©2001–2010,TexasInstrumentsIncorporated ProductFolderLink(s):TPS3513

PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2020 PACKAGING INFORMATION Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples (1) Drawing Qty (2) (6) (3) (4/5) TPS3513D ACTIVE SOIC D 14 50 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 TPS3513D & no Sb/Br) TPS3513DR ACTIVE SOIC D 14 2500 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 TPS3513D & no Sb/Br) TPS3513DRG4 ACTIVE SOIC D 14 2500 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 TPS3513D & no Sb/Br) TPS3513N ACTIVE PDIP N 14 25 Green (RoHS NIPDAU N / A for Pkg Type -40 to 85 TPS3513N & no Sb/Br) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement. (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and Addendum-Page 1

PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2020 continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2

PACKAGE MATERIALS INFORMATION www.ti.com 8-Sep-2010 TAPE AND REEL INFORMATION *Alldimensionsarenominal Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1 Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant (mm) W1(mm) TPS3513DR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 PackMaterials-Page1

PACKAGE MATERIALS INFORMATION www.ti.com 8-Sep-2010 *Alldimensionsarenominal Device PackageType PackageDrawing Pins SPQ Length(mm) Width(mm) Height(mm) TPS3513DR SOIC D 14 2500 333.2 345.9 28.6 PackMaterials-Page2

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