INTEGRATED CIRCUITS DATA SHEET TDA3681 Multiple voltage regulator with switch and ignition buffer Product specification 2004 Mar 31 Supersedes data of 2002 Apr 10

Philips Semiconductors Product specification Multiple voltage regulator with switch and TDA3681 ignition buffer FEATURES • ESD protection on all pins General • Thermal protections • Extremely low noise behaviour and good stability with • Load dump protection very small output capacitors • Foldback current limit protection for regulators1,2,3 • Second supply pin for regulators3and4 to reduce and4 power dissipation (e.g. via a DC-to-DC converter) • Delayed second current limit protection for the power • Three V -state controlled regulators (regulators1,3 switch (at short-circuit) P and4) and a power switch • The regulator outputs and the power switch are • Regulator2,resetandignitionbufferoperationalduring DCshort-circuit safe to ground and supply (VP). load dump and thermal shutdown • Combined control pin for switching regulators 1and3 GENERAL DESCRIPTION • Separate control pins for switching regulator4 and the TheTDA3681isamultipleoutputvoltageregulatorwitha power switch powerswitchandanignitionbuffer.Itisintendedforusein • Supply voltage range from- 18to+50V carradioswithorwithoutamicrocontroller.TheTDA3681 contains the following: • Low quiescent current in standby mode (when • Four fixed voltage regulators with a foldback current regulators1,3and4andpowerswitchareswitchedoff protection(regulators1,2,3and4).Regulator2,which and ignition input is low) is intended to supply a microcontroller, also operates • Hold output (open-collector output stage) for lowV P during load dump and thermal shutdown (regulators1,3and4 and power switch off) • Regulators3and4 have a second supply pin that can • Hold output when one of regulators1and3and/or4 is be connected to a lower supply voltage (>6.5V) to out of regulation reduce the power dissipation • Hold output for foldback mode of power switch and • A power switch with protection, operated by a control regulators1,3and4 input • Hold output for load dump and temperature protection • Reset and hold outputs that can be used to interface • Reset (push-pull output stage) for regulator2 withthemicrocontroller;theresetsignalcanbeusedto • Adjustable reset delay time call up the microcontroller • High supply voltage ripple rejection • Both supply pins can withstand load dump pulses and negative supply voltages • Backup capacitor for regulator2 • Regulator2, which is in regulation at a backup voltage • One independent ignition buffer (active HIGH). above 6.5V Protections • Aprovisionfortheuseofareservesupplycapacitorthat willholdenoughenergyforregulator2(5Vcontinuous) • Reverse polarity safe (down to- 18V without high to allow a microcontroller to prepare for loss of voltage reverse current) • An ignition input Schmitt trigger with push-pull output • Able to withstand voltages up to 18V at the outputs stage. (supply line may be short-circuited) ORDERING INFORMATION PACKAGE TYPE NUMBER NAME DESCRIPTION VERSION TDA3681J DBS17P plastic DIL-bent-SIL power package; 17leads (leadlength7.7mm) SOT243-3 TDA3681JR DBS17P plastic DIL-bent-SIL (special bent) power package; 17leads SOT475-1 (leadlength12mm) TDA3681TH HSOP20 plastic, heatsink small outline package; 20leads; low stand-off height SOT418-3 2004Mar31 2

Philips Semiconductors Product specification Multiple voltage regulator with switch and TDA3681 ignition buffer QUICK REFERENCE DATA SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT Supplies V supply voltage1 P1 operating 9.5 14.4 18 V reverse polarity non-operating - - 18 V regulator2 on 4 14.4 50 V jump start t£ 10minutes - - 30 V load dump protection t£ 50ms; t ‡ 2.5ms - - 50 V r V supply voltage2 P2 operating 6.5 14.4 18 V reverse polarity non-operating - - 18 V regulator2 on 0 - 50 V jump start t£ 10minutes - - 30 V load dump protection t£ 50ms; t ‡ 2.5ms - - 50 V r I total quiescent supply current standby mode - 110 150 m A q(tot) T junction temperature - - 150 (cid:176) C j Voltage regulators V output voltage of regulator1 1mA£ I £ 600mA; V =14.4V 8.0 8.5 9.0 V o(REG1) REG1 P V output voltage of regulator2 1mA£ I £ 300mA; V =14.4V 4.75 5.0 5.25 V o(REG2) REG2 P V output voltage of regulator3 1mA£ I £ 1400mA; V =14.4V 4.75 5.0 5.25 V o(REG3) REG3 P V output voltage of regulator4 1mA£ I £ 1A; V =14.4V 3.14 3.3 3.46 V o(REG4) REG4 P Power switch V drop-out voltage I =1A; V =13.5V - 0.45 0.65 V drop(SW) SW P1 I =1.8A; V =13.5V - 1.0 1.8 V SW P1 I peak current 3 - - A M(SW) 2004Mar31 3

Philips Semiconductors Product specification Multiple voltage regulator with switch and TDA3681 ignition buffer BLOCK DIAGRAMS (14 V/ (14.4 V) 17 POWER SWITCH 16 3 A) VP1 SW 11 TEMPERATURE ENSW & LOAD DUMP PROTECTION (14 V/ BACKUP SWITCH 14 100 mA) BU BACKUP CONTROL (5 V/ 15 300 mA) REGULATOR 2 REG2 3 VP2 (3.3 V/ 4 1 A) REGULATOR 4 REG4 & 9 EN4 (5 V/ 2 1400 mA) REGULATOR 3 REG3 & TDA3681J TDA3681JR (8.5 V/ 1 600 mA) REGULATOR 1 REG1 & 10 EN1/3 12 HOLD + OR & 7 RES 8 CRES 5 6 IGNIN IGNITION BUFFER IGNOUT 13 mgl902 GND Fig.1 Block diagram of TDA3681J and TDA3681JR. 2004Mar31 4

Philips Semiconductors Product specification Multiple voltage regulator with switch and TDA3681 ignition buffer (14 V/ (14.4 V) 14 POWER SWITCH 16 3 A) VP1 SW 8 TEMPERATURE ENSW & LOAD DUMP PROTECTION (14 V/ BACKUP SWITCH 13 100 mA) BU BACKUP CONTROL (5 V/ 12 300 mA) REGULATOR 2 REG2 20 VP2 (3.3 V/ 1 1 A) REGULATOR 4 REG4 & 6 EN4 11 HEATTAB (5 V/ n.c. 15 REGULATOR 3 19 1400 mA) REG3 18 & n.c. TDA3681TH (8.5 V/ 17 600 mA) REGULATOR 1 REG1 & 7 EN1/3 9 HOLD + OR & 4 RES 5 CRES 2 3 IGNIN IGNITION BUFFER IGNOUT 10 mgu353 GND Fig.2 Block diagram of TDA3681TH. 2004Mar31 5

Philips Semiconductors Product specification Multiple voltage regulator with switch and TDA3681 ignition buffer PINNING Pin description of TDA3681Jand TDA3681JR SYMBOL PIN DESCRIPTION handbook, halfpage REG1 1 REG1 1 regulator1 output REG3 2 REG3 2 regulator3 output VP2 3 V 3 second supply voltage P2 REG4 4 REG4 4 regulator4 output IGNIN 5 ignition input IGNIN 5 IGNOUT 6 ignition output (active HIGH) IGNOUT 6 RES 7 reset output (active LOW) RES 7 C 8 reset delay capacitor RES CRES 8 EN4 9 enable input for regulator4 TDA3681J EN4 9 EN1/3 10 enable input for regulators1and3 TDA3681JR EN1/3 10 ENSW 11 enable input for power switch HOLD 12 hold output (active LOW) ENSW 11 GND 13 ground; note1 HOLD 12 BU 14 backup switch output GND 13 REG2 15 regulator2 output BU 14 SW 16 power switch output REG2 15 V 17 supply voltage P1 SW 16 Note VP1 17 1. The heat tab is internally connected to pin GND. MGL903 Fig.3 Pin configuration for TDA3681J and TDA3681JR. 2004Mar31 6

Philips Semiconductors Product specification Multiple voltage regulator with switch and TDA3681 ignition buffer Pin description of TDA3681TH SYMBOL PIN DESCRIPTION REG4 1 regulator4 output IGN 2 ignition input IN handbook, halfpage IGNOUT 3 ignition output (active HIGH) VP2 20 1 REG4 RES 4 reset output (active LOW) REG3 19 2 IGNIN C 5 reset delay capacitor RES n.c. 18 3 IGNOUT EN4 6 enable input for regulator4 REG1 17 4 RES EN1/3 7 enable input for regulators1and3 ENSW 8 enable input for power switch SW 16 5 CRES TDA3681TH HOLD 9 hold output (active LOW) n.c. 15 6 EN4 GND 10 ground VP1 14 7 EN1/3 HEATTAB 11 heat tab connection; note1 BU 13 8 ENSW REG2 12 regulator2 output REG2 12 9 HOLD BU 13 backup switch output HEATTAB 11 10 GND V 14 supply voltage P1 MGU329 n.c. 15 not connected SW 16 power switch output REG1 17 regulator1 output n.c. 18 not connected REG3 19 regulator3 output Fig.4 Pin configuration for TDA3681TH. V 20 second supply voltage P2 Note 1. The pin is used for final test purposes. In the application it should be connected directly to ground. 2004Mar31 7

Philips Semiconductors Product specification Multiple voltage regulator with switch and TDA3681 ignition buffer FUNCTIONAL DESCRIPTION Therefore, regulator1 is the most critical regulator with respect to an out of regulation condition caused by a low TheTDA3681isamultipleoutputvoltageregulatorwitha battery voltage. powerswitch,intendedforuseincarradioswithorwithout amicrocontroller.Becauseofthelowvoltageoperationof Theholdfunctionincludeshysteresistoavoidoscillations the car radio, low voltage drop regulators are used. when the regulator voltage crosses the hold threshold level. The hold output also becomes active when the Regulator2 is in regulation when the backup voltage power switch is in foldback protection mode; seeFig.8. exceeds 6.5V for the first time. When regulator2 is The block diagram of the hold function is illustrated in switched on and its output voltage is within its voltage Fig.5. range, the reset output is disabled to release the microcontroller. The reset delay time before release can All output pins are fully protected. The regulators are beextendedbyanexternalcapacitor(C ).Thisstart-up protectedagainstloaddump(regulators1,3and4switch RES feature is included to secure a smooth start-up of the off at supply voltages >18V) and short-circuit (foldback microcontroller at first connection, without uncontrolled current protection). switching of regulator2 during the start-up sequence. Thepowerswitchcontainsacurrentprotection.However, Thechargeonthebackupcapacitorcanbeusedtosupply thisprotectionisdelayedatshort-circuitbytheresetdelay regulator2 for a short period when the external supply capacitor (it should be noted that this is the second voltagedropsto0V(thetimedependsonthevalueofthe function of the reset delay capacitor C ). During this RES backup capacitor). time,theoutputcurrentislimitedtoapeakvalueofatleast 3A (after a delay, the power switch can deliver 1.8A The output stages of all switchable regulators have an continuous if V £ 18V). extremelylownoisebehaviourandgoodstability,evenfor P small values of the output capacitors. In a normal situation, the voltage on the reset delay capacitor is approximately 3.5V (depending on the When both regulator2 and the supply voltages (V and P1 temperature). The power switch output is approximately V >4.5V) are available, regulators1and3 can be P2 V - 0.4V. At operating temperature, the power switch operated by means of one enable input. P can deliver at least 3A. At high temperature, the switch Regulator4andthepowerswitchhaveaseparateenable can deliver approximately 2A. input. During an overload condition or a short circuit PinHOLDisnormallyHIGHbutisactiveLOW.PinHOLD (V <V - 3.7V), the voltage on the reset delay SW P isconnectedtoanopen-collectorNPNtransistorandmust capacitorrises0.6Vabovethevoltageofregulator2.This have an external pull-up resistor to operate. The hold risetimedependsonthecapacitorconnectedtopinC . RES output is controlled by a low voltage detection circuit During this time, the power switch can deliver more than which, when activated, pulls the hold output LOW 3A.Whenregulator2isoutofregulationandgeneratesa (enabled). The hold outputs of the regulators are reset, the power switch can only deliver 2A and will connected to an OR gate inside the IC so that the hold immediately go into foldback protection. circuitisactivatedwhenoneormoreregulators(1,3or4) At supply voltages >17V, the power switch is clamped at areoutofregulationforanyreason.Eachregulatorenable 16V maximum (to avoid externally connected circuits input controls its own hold triggering circuit, so that if a being damaged by an overvoltage) and the power switch regulatorisdisabledorswitchedoff,theholdcircuitforthat will switch off at load dump. regulator is disabled. Interfacing with the microcontroller (simple full or semi The hold circuit is also controlled by the temperature and on/off logic applications) can be realized with an load dump protection. Activating the temperature or load independent ignition Schmitt trigger and ignition output dumpprotectioncausesahold(LOW)duringthetimethat buffer (push-pull output). the protection is activated. When all regulators are switched off, the hold output is controlled by the battery The timing diagrams are illustrated in Figs6and7. lineV ,temperatureprotectionandloaddumpprotection. P1 ThesecondsupplyvoltageV isusedfortheswitchable P2 The hold circuit is enabled at low battery voltages. This regulators3and4.Thisinputcanbeconnectedtoalower indicates that it is not possible to get regulator1 into supply voltage of‡ 6V to reduce the power dissipation of regulationwhenswitchingiton:regulator1hasthehighest theTDA3681.ADC-to-DCconvertercouldbeusedforthis output voltage (8.5V) of all switchable regulators. purpose. 2004Mar31 8

Philips Semiconductors Product specification Multiple voltage regulator with switch and TDA3681 ignition buffer handbook, full pagewidth low battery VP1 detector internal voltage reference 1 TDA3681 internal output stage voltage REG1 reference 2 output of regulation enable detector EN1/3 REGULATOR 1 output stage REG3 output of regulation enable detector OR & REGULATOR 3 output stage REG4 OR HOLD output of buffer regulation enable detector POWER SWITCH TEMPERATURE EN4 LOAD DUMP FOLDBACK PROTECTION REGULATOR 4 MODE MGL904 Fig.5 Block diagram of the hold circuit. 2004Mar31 9

Philips Semiconductors Product specification Multiple voltage regulator with switch and TDA3681 ignition buffer load dump VP1 VBU 56..45 VV 5.0 V regulator 2 0 V reset 5.0 V delay 3.0 V capacitor 0 V 5.0 V reset Back-up Schmitt trigger and reset behaviour load dump VP1 = VP2 50 V ignition input 0 V - 100 V ignition 5.0 V output 0 V Enable Schmitt trigger ignition >22 V VP1 = VP2 enable >1.8 V regulator 1/3 <1.3 V enable >1.8 V regulator 4 <1.3 V regulator 1 and 3 regulator 4 temperature active protection 150 (cid:176)C passive HIGH HOLD LOW Hold behaviour mgl905 Fig.6 Timing diagram of ignition Schmitt triggers and hold circuit. 2004Mar31 10

Philips Semiconductors Product specification Multiple voltage regulator with switch and TDA3681 ignition buffer handbook, full pagewidth load dump 18 V VP1 = VP2 87..90 VV 4.0 V enable ‡ 1.8 V regulator 1/3 1.3 V 8.5 V regulator 1 0 V 5.0 V regulator 3 0 V enable >1.8 V regulator 4 <1.3 V 3.3 V regulator 4 0 V VP and enable Schmitt trigger load dump 16.9 V VP 7.0 V 4.0 V enable >1.8 V power switch <1.3 V 16 V power switch output 0 V MGL906 Power switch behaviour Fig.7 Timing diagram of regulators and power switch. 2004Mar31 11

Philips Semiconductors Product specification Multiple voltage regulator with switch and TDA3681 ignition buffer LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC60134). SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT V supply voltage1 P1 operating - 18 V reverse polarity non-operating - 18 V jump start t£ 10minutes - 30 V load dump protection t£ 50ms; t ‡ 2.5ms - 50 V r V supply voltage2 P2 operating - 18 V reverse polarity non-operating - 18 V jump start t£ 10minutes - 30 V load dump protection t£ 50ms; t ‡ 2.5ms - 50 V r P total power dissipation - 62 W tot T storage temperature non-operating - 55 +150 (cid:176) C stg T ambient temperature operating - 40 +85 (cid:176) C amb T junction temperature operating - 40 +150 (cid:176) C j THERMAL CHARACTERISTICS SYMBOL PARAMETER CONDITIONS VALUE UNIT R thermal resistance from junction to case 1.3 K/W th(j-c) R thermal resistance from junction to ambient in free air 50 K/W th(j-a) QUALITY SPECIFICATION In accordance with“General Quality Specification For Integrated Circuits (SNW-FQ-611D)”. 2004Mar31 12

Philips Semiconductors Product specification Multiple voltage regulator with switch and TDA3681 ignition buffer CHARACTERISTICS V =V =V =14.4V; T =25(cid:176) C; measured in test circuits of Figs10and11; unless otherwise specified. P P1 P2 amb SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT Supplies V supply voltage1 P1 operating 9.5 14.4 18 V reverse polarity non-operating - - 18 V regulator2 on note1 4 14.4 50 V jump start t£ 10minutes - - 30 V load dump protection t£ 50ms; t ‡ 2.5ms - - 50 V r V supply voltage2 P2 operating 6.5 14.4 18 V reverse polarity non-operating - - 18 V regulator2 on 0 - 50 V jump start t£ 10minutes - - 30 V load dump protection t£ 50ms; t ‡ 2.5ms - - 50 V r V battery overvoltage V and/orV 18 20 22 V bat(loaddump) P1 P2 shutdown I total quiescent supply V =12.4V; note2 - 105 145 m A q(tot) P current V =14.4V; note2 - 110 150 m A P Schmitt trigger for power supply (regulators1,3and4) V rising threshold voltage V rising 6.5 7.0 7.5 V th(r) P1 V falling threshold voltage V falling 4.0 4.5 5.0 V th(f) P1 V hysteresis voltage - 2.5 - V hys Schmitt trigger for enable input (regulators1,3,4 and power switch) V rising threshold voltage 1.4 1.8 2.4 V th(r) V falling threshold voltage 0.9 1.3 1.9 V th(f) V hysteresis voltage I =I =1mA - 0.5 - V hys REG SW I input leakage current V =5V 1 5 20 m A LI EN Reset trigger level of regulator2 V rising threshold voltage V rising; I =50mA; 4.43 V - 0.15 V - 0.1 V th(r) P1 REG2 REG2 REG2 note3 V falling threshold voltage V falling; I =50mA; 4.4 V - 0.25 V - 0.13 V th(f) P1 REG2 REG2 REG2 note3 Schmitt triggers for hold circuit output V rising threshold voltage V rising; note3 - V - 0.15 V - 0.075 V th(r)(REG1) P1 REG1 REG1 of regulator1 V falling threshold voltage V falling; note3 7.67 V - 0.35 - V th(f)(REG1) P1 REG1 of regulator1 V hysteresisvoltagedueto - 0.2 - V hys(REG1) regulator1 2004Mar31 13

Philips Semiconductors Product specification Multiple voltage regulator with switch and TDA3681 ignition buffer SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT V rising threshold voltage V rising; note3 - V - 0.15 V - 0.075 V th(r)(REG3) P2 REG3 REG3 of regulator3 V falling threshold voltage V falling; note3 4.3 V - 0.35 - V th(f)(REG3) P2 REG3 of regulator3 V hysteresisvoltagedueto - 0.2 - V hys(REG3) regulator3 V rising threshold voltage V rising; note3 - V - 0.15 V - 0.075 V th(r)(REG4) P2 REG4 REG4 of regulator4 V falling threshold voltage V falling; note3 2.7 V - 0.3 - V th(f)(REG4) P2 REG4 of regulator4 V hysteresisvoltagedueto - 0.15 - V hys(REG4) regulator4 V rising threshold voltage V =0V 9.1 9.7 10.3 V th(r)(VP) EN of supply voltage V falling threshold voltage V =0V 9.0 9.4 9.8 V th(f)(VP) EN of supply voltage V hysteresis voltage of V =0V - 0.3 - V hys(VP) EN supply voltage Reset and hold buffer I LOW-level sink current V £ 0.8V; V £ 0.8V 2 - - mA sink(L) RES HOLD I output leakage current V =14.4V; V =5V - 0.1 5 m A LO P2 HOLD I HIGH-level source V =14.4V; V ‡ 4.5V 240 400 900 m A source(H) P2 RES current t rise time note4 - 7 50 m s r t fall time note4 - 1 50 m s f Reset delay I reset delay capacitor V =0V 2 4 8 m A ch CRES charge current I reset delay capacitor V =3V; 1.0 1.6 - mA dch CRES discharge current V =V =4.3V P1 P2 V rising voltage threshold 2.5 3.0 3.5 V th(r)(RES) reset signal V falling voltage threshold 1.0 1.2 1.4 V th(f)(RES) reset signal t delay reset signal C =47nF; note5 20 35 70 ms d(RES) RES t delay power switch C =47nF; note6 8 17.6 40 ms d(SW) RES foldback protection Regulator1 (I =5mA; unless otherwise specified) REG1 V output voltage off - 1 400 mV o(off) V output voltage 1mA£ I £ 600mA 8.0 8.5 9.0 V o(REG1) REG1 9.5V£ V £ 18V 8.0 8.5 9.0 V P1 D V line regulation 9.5V£ V £ 18V - 2 75 mV line P1 D V load regulation 1mA£ I £ 600mA - 20 85 mV load REG1 2004Mar31 14

Philips Semiconductors Product specification Multiple voltage regulator with switch and TDA3681 ignition buffer SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT I quiescent current I =600mA - 25 60 mA q REG1 SVRR supply voltage ripple f =3kHz; V =2V(p-p) 60 70 - dB i i rejection V drop-out voltage I =550mA;V =8.55V; - 0.4 0.7 V drop(REG1) REG1 P1 note7 I current limit V >7V; note8 0.65 1.2 - A m(REG1) REG1 I short-circuit current R £ 0.5W ; note9 250 800 - mA sc(REG1) L Regulator2 (I =5mA; unless otherwise specified) REG2 V output voltage 0.5mA£ I £ 300mA 4.75 5.0 5.25 V o(REG2) REG2 7V£ V £ 18V 4.75 5.0 5.25 V P1 18V£ V £ 50V; 4.75 5.0 5.25 V P1 I £ 150mA REG2 D V line regulation 6V£ V £ 18V - 2 50 mV line P1 6V£ V £ 50V - 15 75 mV P1 D V load regulation 1mA£ I £ 150mA - 20 50 mV load REG2 1mA£ I £ 300mA - - 100 mV REG2 SVRR supply voltage ripple f =3kHz; V =2V(p-p) 50 55 - dB i i rejection V drop-out voltage I =100mA;V =4.75V; - 0.4 0.6 V drop(REG2) REG2 P1 note7 I =200mA;V =5.75V; - 0.8 1.2 V REG2 P1 note7 I =100mA;V =4.75V; - 0.2 0.5 V REG2 BU note10 I =200mA;V =5.75V; - 0.8 1.0 V REG2 BU note10 I current limit V >4.5V; note8 0.32 0.37 - A m(REG2) REG2 I short-circuit current R £ 0.5W ; note9 95 120 - mA sc(REG2) L Regulator3 (I =5mA; unless otherwise specified) REG3 V output voltage off - 1 400 mV o(off) V output voltage 1mA£ I £ 1400mA 4.75 5.0 5.25 V o(REG3) REG3 7V£ V and/or V £ 18V 4.75 5.0 5.25 V P1 P2 D V line regulation 7V£ V and/or V £ 18V - 2 50 mV line P1 P2 D V load regulation 1mA£ I £ 1400mA - 20 150 mV load REG3 I quiescent current I =1400mA - 19 45 mA q REG3 SVRR supply voltage ripple f =3kHz; V =2V(p-p) 60 70 - dB i i rejection V drop-out voltage I =1400mA; V =6V; - 1 1.5 V drop(REG3) REG3 P2 note7 I current limit V >4.5V; note8 1.5 1.7 - A m(REG3) REG3 I short-circuit current R £ 0.5W ; note9 430 750 - mA sc(REG3) L 2004Mar31 15

Philips Semiconductors Product specification Multiple voltage regulator with switch and TDA3681 ignition buffer SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT Regulator4 (I =5mA; unless otherwise specified) REG4 V output voltage off - 1 400 mV o(off) V output voltage 1mA£ I £ 1A 3.14 3.3 3.46 V o(REG4) REG4 6.5V£ V and/or V £ 18V 3.14 3.3 3.46 V P1 P2 D V line regulation 6.5V£ V and/or V £ 18V - 2 50 mV line P1 P2 D V load regulation 1mA£ I £ 1A - 20 50 mV load REG4 I quiescent current I =1A - 15 40 mA q REG4 SVRR supply voltage ripple f =3kHz; V =2V(p-p) 60 70 - dB i i rejection V drop-out voltage I =1A; V =5V; note7 - 1.7 2.4 V drop(REG4) REG4 P2 I current limit V >3.0V; note8 1.1 1.5 - A m(REG4) REG4 I short-circuit current R £ 0.5W ; note9 470 750 - mA sc(REG4) L Power switch V drop-out voltage I =1A; V =13.5V; - 0.45 0.65 V drop(SW) SW P1 note11 I =1.8A; V =13.5V; - 1.0 1.8 V SW P1 note11 I continuous current V =16V; V =13.5V 1.8 2.0 - A DC(SW) P1 SW V clamping voltage V ‡ 17V; 13.5 15.0 16.0 V clamp(SW) P1 1mA<I <1.8A SW I peak current V <17V; 3 - - A M(SW) P1 notes6,12and13 V flyback voltage I =- 100mA - V +3 22 V fb(SW) SW P1 behaviour I short-circuit current V =14.4V; V <1.2V; 0.5 1.7 - A sc(SW) P1 SW note13 Backup switch I continuous current V >5V 0.3 0.35 - A DC(BU) BU V clamping voltage V ‡ 16.7V; I =100mA - - 16 V clamp(BU) P1 REG2 I reverse current V =0V; V =12.4V - - 900 m A r(BU) P1 BU Schmitt trigger for enable ignition input V rising threshold voltage V >3.5V 1.9 2.2 2.5 V th(r)(IGNIN) P1 of ignition input V falling threshold voltage V >3.5V 1.7 2.0 2.3 V th(f)(IGNIN) P1 of ignition input V hysteresis voltage V >3.5V 0.1 0.2 0.5 V hys(IGNIN) P I input leakage current V =5V - - 1.0 m A LI IGNIN I input clamp current V £ 50V - - 50 mA i(clamp) IGNIN V HIGH-level input V - 50 V IH(clamp) P1 clamping voltage V LOW-level input V ‡- 100V - 0.6 - 0 V IL(clamp) IGNIN clamping voltage 2004Mar31 16

Philips Semiconductors Product specification Multiple voltage regulator with switch and TDA3681 ignition buffer SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT Ignition buffer V LOW-level output voltage I =0mA 0 0.2 0.8 V OL IGNOUT V HIGH-level output I =0mA 4.5 5.0 5.25 V OH IGNOUT voltage I LOW-level sink current V £ 0.8V 0.45 0.8 - mA OL IGNOUT I HIGH-level source V ‡ 4.5V 0.45 2.0 - mA OH IGNOUT current t LOW-to-HIGH V rising from 1.7to2.5V - - 500 m s PLH IGNIN propagation time t HIGH-to-LOW V falling from 2.5to1.7V - - 500 m s PHL IGNIN propagation time Temperature protection T junction temperature for 150 160 170 (cid:176) C j(sd) shutdown T junction temperature for 150 160 170 (cid:176) C j(hold) hold trigger Notes 1. Minimum operating voltage, only if V has exceeded 6.5V. P1 2. Thetotalquiescentcurrentismeasuredinthestandbymode.Therefore,theenableinputsofregulators1,3,4and the power switch are grounded and R =¥ ; seeFigs10and11. L(REG2) 3. ThevoltageoftheregulatordropsasaresultofaV dropforregulators1and2.Regulators3and4dropasaresult P1 of V drop. P2 4. The rise and fall times are measured with a 10kW pull-up resistor and a 50pF load capacitor. 5. The delay time depends on the value of the reset delay capacitor: t = --C----· V = C· (750· 103)[s] d(RES) I C(th) ch 6. The delay time depends on the value of the reset delay capacitor: t = --C----· V = C· (375· 103)[s] d(SW) I C(th) ch 7. The drop-out voltage of regulators1 and2 is measured between pinsV andREGn. The drop-out voltage of P1 regulators3and4 is measured between pinsV andREGn. P2 8. At current limit, I is held constant (see Fig.8). m(REGn) 9. The foldback current protection limits the dissipated power at short-circuit (see Fig.8). 10. The drop-out voltage is measured between pins BU and REG2. 11. The drop-out voltage of the power switch is measured between pins V andSW. P1 12. The maximum output current of the power switch is limited to 1.8A when the supply voltage exceeds 18V. 13. Atshort-circuit,I ofthepowerswitchisheldconstanttoalowervaluethanthecontinuouscurrentafteradelay sc(SW) of at least 10ms. 2004Mar31 17

Philips Semiconductors Product specification Multiple voltage regulator with switch and TDA3681 ignition buffer handbook, halfpage MGL907 handbook, halfpage 8.5 V Vo(REG2) MGL908 5.0 V Vo(REG1) Isc(REG2) Im(REG2) IREG2 Isc(REG1) Im(REG1) IREG1 a. Regulator1. b. Regulator2. handbook, halfpage handbook, halfpage Vo(REG3) Vo(REG4) MGL909 MGL910 5.0 V 3.3 V Isc(REG3) Im(REG3) Isc(REG4) Im(REG4) IREG3 IREG4 c. Regulator3. d. Regulator4. Fig.8 Foldback current protection of the regulators. handbook, full pagewidth MGR931 VSW VP - 3.3 V not generates delayed delayed hold 2VBE 1 A >1.8 A >3 A ISW Fig.9 Current protection of the power switch. 2004Mar31 18

Philips Semiconductors Product specification Multiple voltage regulator with switch and TDA3681 ignition buffer TEST AND APPLICATION INFORMATION Test information supply voltage 1 power switch output 17 16 VP1 220 CnF1 (1) C101030 m F 100C n1F5 C102 m F R12L (kSWW) regulator 2 enable input power switch output 5 V 11 15 VENSW 100C n1F6 C103 m F R5 Lk(WREG2) regulator 1 enable input regulator 1/3 output 8.5 V 10 1 VEN1/3 100C n1F7 C104 m F R10L (kRWEG1) regulator 3 enable input regulator 4 output 5 V 9 2 VEN4 100C n1F8 C105 m F R5 Lk(WREG3) regulator 4 TDA3681J output 3.3 V supply voltage 2 TDA3681JR 4 VP2 220 CnF7 (1) C101040 m F 3 100C n1F9 C106 m F R5 Lk(WREG4) reset delay capacitor reset 8 output C8 7 47 nF (3) C9 50 pF R3 10 kW backup hold output 14 12 C10 C12 VBU (2) 100 m F (3) 50 pF R6 ignition input ignition output 5 6 VIGNIN 10 kW C11 13 mgl911 1 nF ground (1) A minimum capacitor of 220nF on the supply lines VP1 and VP2 is required for stability. (2) A minimum capacitor of 1m F for backup supply is required for stability. (3) Capacitor represents the typical input capacitance of CMOS logic connected to the reset and hold outputs. Fig.10 Test circuit of TDA3681J and TDA3681JR. 2004Mar31 19

Philips Semiconductors Product specification Multiple voltage regulator with switch and TDA3681 ignition buffer supply voltage 1 power switch output 14 16 VP1 220 CnF1 (1) C101030 m F 100C n1F5 C102 m F R12L (kSWW) regulator 2 enable input power switch output 5 V 8 12 VENSW 100C n1F6 C103 m F R5 Lk(WREG2) regulator 1 enable input regulator 1/3 output 8.5 V 7 17 VEN1/3 100C n1F7 C104 m F R10L (kRWEG1) regulator 3 enable input regulator 4 output 5 V 6 19 VEN4 100C n1F8 C105 m F R5 Lk(WREG3) regulator 4 TDA3681TH output 3.3 V supply voltage 2 1 VP2 220 CnF7 (1) C101040 m F 20 100C n1F9 C106 m F R5 Lk(WREG4) reset delay capacitor reset 5 output C8 4 47 nF (3) C9 50 pF R3 10 kW backup hold output 13 9 C10 C12 VBU (2) 100 m F (3) 50 pF R6 ignition input ignition output 2 3 VIGNIN 10 kW C11 11 10 mgu355 1 nF heat tab ground (1) A minimum capacitor of 220nF on the supply lines VP1 and VP2 is required for stability. (2) A minimum capacitor of 1m F for backup supply is required for stability. (3) Capacitor represents the typical input capacitance of CMOS logic connected to the reset and hold outputs. Fig.11 Test circuit of TDA3681TH. 2004Mar31 20

Philips Semiconductors Product specification Multiple voltage regulator with switch and TDA3681 ignition buffer Application information Theoutputcapacitorscanbeselectedbyusingthegraphs giveninFigs12and13.Whenanelectrolyticcapacitoris NOISE used, its temperature behaviour can cause oscillations at Table 1 Noise figures alowtemperature.Thetwoexamplesbelowshowhowan output capacitor value is selected. NOISE FIGURE (m V)(1) REGULATOR C =10m F C =47m F C =100m F Example1 o o o 1 170 110 110 Regulators1,3and4 are stabilized with an electrolytic 2 440 240 190 output capacitor of 220m F (ESR=0.15W ). AtT =- 30(cid:176) C, the capacitor value is decreased to 3 120 100 80 amb 73m F and the ESR is increased to 1.1W . The regulator 4 85 70 55 remains stable at T =- 30(cid:176) C; see Fig.12. amb Note Example2 1. Measured at a bandwidth of 30kHz. Regulator2isstabilizedwitha10m Felectrolyticcapacitor (ESR=3W ). At T =- 30(cid:176) C, the capacitor value is amb The noise on the supply line depends on the value of the decreased to 3m F and the ESR is increased to 23.1W . supply capacitor and is caused by a current noise (the AscanbeseenfromFig.13,theregulatorwillbeunstable output noise of the regulators is translated to a current at T =- 30(cid:176) C. amb noisebytheoutputcapacitors).Thenoiseisminimalwhen a high frequency capacitor of 220nF in parallel with an Solution electrolyticcapacitorof100m Fisconnecteddirectlytothe supply pinsV , V andGND. To avoid problems with stability at low temperatures, the P1 P2 use of tantalum capacitors is recommended. Use a STABILITY tantalum capacitor of 10m F or a larger electrolytic capacitor. The regulators are stabilized by the externally connected output capacitors. handbook, halfpage MGL912 handbook, halfpage MGL913 20 14 ESR maximum ESR E(WSR) (W )12 15 10 8 maximum ESR 10 6 stable region 4 5 stable region 2 minimum ESR 0 0 - 2 0.1 1 10 C (m F) 100 0.22 1 10 C (m F)100 Fig.12 Curve for selecting the value of the output Fig.13 Curve for selecting the value of the output capacitor for regulators1,3and4. capacitor for regulator2. 2004Mar31 21

Philips Semiconductors Product specification Multiple voltage regulator with switch and TDA3681 ignition buffer PACKAGE OUTLINES DBS17P: plastic DIL-bent-SIL power package; 17 leads (lead length 7.7 mm) SOT243-3 non-concave x Dh D Eh view B: mounting base side d A2 B j E A L3 L Q c v M 1 17 Z e1 w M m e2 bp e 0 5 10 mm scale DIMENSIONS (mm are the original dimensions) UNIT A A2 bp c D(1) d Dh E(1) e e1 e2 Eh j L L3 m Q v w x Z(1) mm 17.0 4.6 0.75 0.48 24.0 20.0 10 12.2 2.54 1.27 5.08 6 3.4 8.4 2.4 4.3 2.1 0.6 0.25 0.03 2.00 15.5 4.4 0.60 0.38 23.6 19.6 11.8 3.1 7.0 1.6 1.8 1.45 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE REFERENCES EUROPEAN ISSUE DATE VERSION IEC JEDEC JEITA PROJECTION 99-12-17 SOT243-3 03-03-12 2004Mar31 22

Philips Semiconductors Product specification Multiple voltage regulator with switch and TDA3681 ignition buffer DBS17P: plastic DIL-bent-SIL (special bent) power package; 17 leads (lead length 12 mm) SOT475-1 non-concave x Dh D Eh view B: mounting base side d A2 B j E A L3 L Q 1 17 Z e1 w M c v M e bp m e2 0 5 10 mm scale DIMENSIONS (mm are the original dimensions) UNIT A A2 bp c D(1) d Dh E(1) e e1 e2 Eh j L L3 m Q v w x Z(1) mm 17.0 4.6 0.75 0.48 24.0 20.0 10 12.2 2.54 1.27 5.08 6 3.4 12.4 2.4 4.3 2.1 0.8 0.4 0.03 2.00 15.5 4.4 0.60 0.38 23.6 19.6 11.8 3.1 11.0 1.6 1.8 1.45 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE REFERENCES EUROPEAN ISSUE DATE VERSION IEC JEDEC JEITA PROJECTION 99-12-17 SOT475-1 03-03-12 2004Mar31 23

Philips Semiconductors Product specification Multiple voltage regulator with switch and TDA3681 ignition buffer HSOP20: plastic, heatsink small outline package; 20 leads; low stand-off height SOT418-3 E A D x X c y E2 HE v M A D1 D2 1 10 pin 1 index Q A2 A E1 A4 (A3) q Lp detail X 20 11 Z w M e bp 0 5 10 mm scale DIMENSIONS (mm are the original dimensions) UNIT mAax. A2 A3 A4(1) bp c D(2) D1 D2 E(2) E1 E2 e HE Lp Q v w x y Z q 3.5 +0.08 0.53 0.32 16.0 13.0 1.1 11.1 6.2 2.9 14.5 1.1 1.7 2.5 8(cid:176) mm 3.5 3.2 0.35 - 0.04 0.40 0.23 15.8 12.6 0.9 10.9 5.8 2.5 1.27 13.9 0.8 1.5 0.25 0.25 0.03 0.07 2.0 0(cid:176) Notes 1. Limits per individual lead. 2. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE REFERENCES EUROPEAN ISSUE DATE VERSION IEC JEDEC JEITA PROJECTION 02-02-12 SOT418-3 03-07-23 2004Mar31 24

Philips Semiconductors Product specification Multiple voltage regulator with switch and TDA3681 ignition buffer SOLDERING Surface mount packages Introduction REFLOWSOLDERING Thistextgivesaverybriefinsighttoacomplextechnology. Reflow soldering requires solder paste (a suspension of Amorein-depthaccountofsolderingICscanbefoundin finesolderparticles,fluxandbindingagent)tobeapplied our“Data Handbook IC26; Integrated Circuit Packages” totheprinted-circuitboardbyscreenprinting,stencillingor (document order number 939865290011). pressure-syringe dispensing before package placement. There is no soldering method that is ideal for all IC Several methods exist for reflowing; for example, packages. Wave soldering is often preferred when convection or convection/infrared heating in a conveyor through-holeandsurfacemountcomponentsaremixedon type oven. oneprinted-circuitboard.Wavesolderingcanstillbeused Throughputtimes(preheating,solderingandcooling)vary forcertainsurfacemountICs,butitisnotsuitableforfine between 100and200seconds depending on heating pitch SMDs. In these situations reflow soldering is method. recommended. Driven by legislation and environmental forces the worldwide use of lead-free solder pastes is Typical reflow peak temperatures range from increasing. 215to270(cid:176) C depending on solder paste material. The top-surface temperature of the packages should Through-hole mount packages preferably be kept: SOLDERINGBYDIPPINGORBYSOLDERWAVE • below225(cid:176) C(SnPbprocess)orbelow245(cid:176) C(Pb-free process) Typical dwell time of the leads in the wave ranges from 3to4seconds at 250(cid:176) C or 265(cid:176) C, depending on solder – for all the BGA, HTSSON..T and SSOP-T packages material applied, SnPb or Pb-free respectively. – for packages with a thickness‡ 2.5mm – for packages with a thickness <2.5mm and a Thetotalcontacttimeofsuccessivesolderwavesmustnot volume‡ 350mm3 so called thick/large packages. exceed 5seconds. • below240(cid:176) C(SnPbprocess)orbelow260(cid:176) C(Pb-free The device may be mounted up to the seating plane, but process)forpackageswithathickness<2.5mmanda the temperature of the plastic body must not exceed the volume <350mm3 so called small/thin packages. specified maximum storage temperature (T ). If the stg(max) printed-circuit board has been pre-heated, forced cooling Moisture sensitivity precautions, as indicated on packing, maybenecessaryimmediatelyaftersolderingtokeepthe must be respected at all times. temperature within the permissible limit. WAVESOLDERING MANUALSOLDERING Conventional single wave soldering is not recommended Applythesolderingiron(24Vorless)tothelead(s)ofthe forsurfacemountdevices(SMDs)orprinted-circuitboards package,eitherbelowtheseatingplaneornotmorethan with a high component density, as solder bridging and 2mm above it. If the temperature of the soldering iron bit non-wetting can present major problems. is less than 300(cid:176) C it may remain in contact for up to To overcome these problems the double-wave soldering 10seconds. If the bit temperature is between method was specifically developed. 300and400(cid:176) C, contact may be up to 5seconds. 2004Mar31 25

Philips Semiconductors Product specification Multiple voltage regulator with switch and TDA3681 ignition buffer Ifwavesolderingisusedthefollowingconditionsmustbe The adhesive can be applied by screen printing, pin observed for optimal results: transfer or syringe dispensing. The package can be • Use a double-wave soldering method comprising a soldered after the adhesive is cured. turbulentwavewithhighupwardpressurefollowedbya Typical dwell time of the leads in the wave ranges from smooth laminar wave. 3to4seconds at 250(cid:176) C or 265(cid:176) C, depending on solder • For packages with leads on two sides and a pitch (e): material applied, SnPb or Pb-free respectively. – larger than or equal to 1.27mm, the footprint Amildly-activated flux will eliminate the need for removal longitudinal axis ispreferred to be parallel to the of corrosive residues in most applications. transport direction of the printed-circuit board; – smaller than 1.27mm, the footprint longitudinal axis MANUALSOLDERING must be parallel to the transport direction of the Fix the component by first soldering two printed-circuit board. diagonally-oppositeendleads.Usealowvoltage(24Vor The footprint must incorporate solder thieves at the less) soldering iron applied to the flat part of the lead. downstream end. Contact time must be limited to 10seconds at up to • Forpackageswithleadsonfoursides,thefootprintmust 300(cid:176) C. When using a dedicated tool, all other leads can beplacedata45(cid:176) angletothetransportdirectionofthe be soldered in one operation within 2to5seconds between 270and320(cid:176) C. printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. Duringplacementandbeforesoldering,thepackagemust be fixed with a droplet of adhesive. 2004Mar31 26

Philips Semiconductors Product specification Multiple voltage regulator with switch and TDA3681 ignition buffer Suitability of IC packages for wave, reflow and dipping soldering methods SOLDERING METHOD MOUNTING PACKAGE(1) WAVE REFLOW(2) DIPPING Through-hole mount CPGA, HCPGA suitable - suitable DBS, DIP, HDIP, RDBS, SDIP, SIL suitable(3) - - Through-hole- PMFP(4) not suitable not suitable - surface mount Surface mount BGA, HTSSON..T(5), LBGA, LFBGA, SQFP, not suitable suitable - SSOP-T(5), TFBGA, USON, VFBGA DHVQFN, HBCC, HBGA, HLQFP, HSO, not suitable(6) suitable - HSOP, HSQFP, HSSON, HTQFP, HTSSOP, HVQFN, HVSON, SMS PLCC(7), SO, SOJ suitable suitable - LQFP, QFP, TQFP not recommended(7)(8) suitable - SSOP, TSSOP, VSO, VSSOP not recommended(9) suitable - CWQCCN..L(11), PMFP(10), WQCCN32L(11) not suitable not suitable - Notes 1. FormoredetailedinformationontheBGApackagesrefertothe“(LF)BGAApplicationNote”(AN01026);orderacopy from your Philips Semiconductors sales office. 2. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracksmayoccurduetovaporizationofthemoistureinthem(thesocalledpopcorneffect).Fordetails,refertothe Drypack information in the“DataHandbook IC26; Integrated Circuit Packages; Section: Packing Methods”. 3. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board. 4. Hot bar soldering or manual soldering is suitable for PMFP packages. 5. These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no account beprocessedthroughmorethanonesolderingcycleorsubjectedtoinfraredreflowsolderingwithpeaktemperature exceeding 217(cid:176) C– 10(cid:176) C measured in the atmosphere of the reflow oven. The package body peak temperature must be kept as low as possible. 6. These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder cannotpenetratebetweentheprinted-circuitboardandtheheatsink.Onversionswiththeheatsinkonthetopside, the solder might be deposited on the heatsink surface. 7. If wave soldering is considered, then the package must be placed at a 45(cid:176) angle to the solder wave direction. Thepackage footprint must incorporate solder thieves downstream and at the side corners. 8. WavesolderingissuitableforLQFP,QFPandTQFPpackageswithapitch(e)largerthan0.8mm;itisdefinitelynot suitable for packages with a pitch (e) equal to or smaller than 0.65mm. 9. Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger than 0.65mm; itis definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5mm. 10. Hot bar or manual soldering is suitable for PMFP packages. 11. Imagesensorpackagesinprincipleshouldnotbesoldered.Theyaremountedinsocketsordeliveredpre-mounted on flex foil. However, the image sensor package can be mounted by the client on a flex foil by using a hot bar soldering process. The appropriate soldering profile can be provided on request. 2004Mar31 27

Philips Semiconductors Product specification Multiple voltage regulator with switch and TDA3681 ignition buffer DATA SHEET STATUS DATA SHEET PRODUCT LEVEL DEFINITION STATUS(1) STATUS(2)(3) I Objective data Development This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. II Preliminarydata Qualification This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. III Product data Production This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Notes 1. Please consult the most recently issued data sheet before initiating or completing a design. 2. The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. 3. Fordatasheetsdescribingmultipletypenumbers,thehighest-levelproductstatusdeterminesthedatasheetstatus. DEFINITIONS DISCLAIMERS Short-form specification(cid:190) The data in a short-form Life support applications(cid:190) These products are not specification is extracted from a full data sheet with the designed for use in life support appliances, devices, or same type number and title. For detailed information see systems where malfunction of these products can the relevant data sheet or data handbook. reasonablybeexpectedtoresultinpersonalinjury.Philips Semiconductorscustomersusingorsellingtheseproducts Limitingvaluesdefinition(cid:190) Limitingvaluesgivenarein for use in such applications do so at their own risk and accordance with the Absolute Maximum Rating System agree to fully indemnify Philips Semiconductors for any (IEC60134). Stress above one or more of the limiting damages resulting from such application. values may cause permanent damage to the device. These are stress ratings only and operation of the device Right to make changes(cid:190) Philips Semiconductors attheseoratanyotherconditionsabovethosegiveninthe reserves the right to make changes in the products - Characteristicssectionsofthespecificationisnotimplied. including circuits, standard cells, and/or software - Exposure to limiting values for extended periods may described or contained herein in order to improve design affect device reliability. and/orperformance.Whentheproductisinfullproduction (status ‘Production’), relevant changes will be Application information(cid:190) Applications that are communicated via a Customer Product/Process Change described herein for any of these products are for Notification(CPCN).PhilipsSemiconductorsassumesno illustrative purposes only. Philips Semiconductors make responsibility or liability for the use of any of these norepresentationorwarrantythatsuchapplicationswillbe products, conveys no licence or title under any patent, suitable for the specified use without further testing or copyright, or mask work right to these products, and modification. makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. 2004Mar31 28

Philips Semiconductors – a worldwide company Contact information For additional information please visit http://www.semiconductors.philips.com. Fax:+31402724825 For sales offices addresses send e-mail to:sales.addresses@www.semiconductors.philips.com. © Koninklijke Philips Electronics N.V. 2004 SCA76 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. Theinformationpresentedinthisdocumentdoesnotformpartofanyquotationorcontract,isbelievedtobeaccurateandreliableandmaybechanged without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands R32/06/pp29 Date of release:2004Mar31 Document order number: 939775012427

Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: N XP: TDA3681JR/N2C TDA3681J/N2C,112 TDA3681J/N2S,112 TDA3681JR/N2S TDA3681TH/N2S,518