TC74 Tiny Serial Digital Thermal Sensor Features General Description • Digital Temperature Sensing in SOT-23-5 or The TC74 is a serially accessible, digital temperature TO-220 Packages sensor particularly suited for low cost and small form- • Outputs Temperature as an 8-Bit Digital Word factor applications. Temperature data is converted from • Simple SMBus/I2C™ Serial Port Interface the onboard thermal sensing element and made available as an 8-bit digital word. • Solid-State Temperature Sensing: Communication with the TC74 is accomplished via a 2- - ±2°C (max.) Accuracy from +25°C to +85°C wire SMBus/I2C compatible serial port. This bus also - ±3°C (max.) Accuracy from 0°C to +125°C can be used to implement multi-drop/multi-zone • Supply Voltage of 2.7V to 5.5V monitoring. The SHDN bit in the CONFIG register can • Low Power: be used to activate the low power Standby mode. - 200µA (typ.) Operating Current Temperature resolution is 1°C. Conversion rate is a - 5µA (typ.) Standby Mode Current nominal 8 samples/sec. During normal operation, the quiescent current is 200µA (typ). During standby Applications operation, the quiescent current is 5µA (typ). • Thermal Protection for Hard Disk Drives Small size, low installed cost and ease of use make the and other PC Peripherals TC74 an ideal choice for implementing thermal • PC Card Devices for Notebook Computers management in a variety of systems. • Low Cost Thermostat Controls Functional Block Diagram • Power Supplies • Thermistor Replacement Package Types Internal Sensor SDA (Diode) Serial Port Interface TO-220 SOT-23 SCLK SDA SCLK  Modulator 5 4 TC74 Control Logic 12 3 45 TC74 1 2 3 NC GND V Temperature CADKD DD NDNLD Register SGCV S Note: The TO-220 tab is connected to pin 3 (GND)  2001-2012 Microchip Technology Inc. DS21462D-page 1

TC74 1.0 ELECTRICAL † Notice: Stresses above those listed under "Maximum CHARACTERISTICS Ratings" may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those 1.1 Absolute Maximum Ratings† indicated in the operation listings of this specification is Supply Voltage (V )............................................ +6V not implied. Exposure to maximum rating conditions for DD extended periods may affect device reliability. Voltage On Any Pin.......(GND – 0.3V) to (V + 0.3V) DD Current On Any Pin..........................................±50mA Operating Temperature (T )........-40°C  T  +125°C A A Storage Temperature (T )..............-65°C to +150°C STG Junction Temperature (T )................................+150°C J DC CHARACTERISTICS Electrical Specifications: Unless otherwise noted, V = 3.3V for TC74AX-3.3VXX and DD V = 5.0V for TC74AX-5.0VXX, -40°C  T  125°C. Note5 DD A Parameters Sym Min Typ Max Units Conditions Power Supply Power-on Reset Threshold V 1.2 — 2.2 V V Falling Edge or Rising POR DD Edge Supply Voltage V 2.7 — 5.5 V Note5 DD Operating Current I — 200 350 µA V = 5.5V, Note1 DD DD Standby Supply Current I — 5.0 10 µA V = 3.3V DD-STANDBY DD Serial Port Inactive, Note4 Temperature-to-Bits Converter Temperature Accuracy T -2.0 — +2.0 °C +25°C <T < +85°C ERR A -3.0 — +3.0 0°C < T < +125°C A — ±2.0 — -40°C < T < 0°C A Conversion Rate CR 4 8 — SPS Note2 Serial Port Interface Logic Input High V 0.8 x V — — V IH DD Logic Input Low V — — 0.2 x V V IL DD SDA Output Low V — — 0.4 V I = 3mA OL OL — — 0.6 V I = 6mA, Note3 OL Input Capacitance SDA, SCLK C — 5.0 — pF IN I/O Leakage I -1.0 0.1 1.0 µA LEAK Serial Port AC Timing (C = 80pF) LOAD SMBus/I2C Clock Frequency f 10 — 100 kHz SMB Low Clock Period t 4.7 — — µsec 10% to 10% LOW High Clock Period t 4.0 — — µsec 90% to 90% HIGH SMBus/I2C Rise Time t — — 1000 nsec 10% to 90% R SMBus/I2C Fall Time t — — 300 nsec 90% to10% F Note 1: Operating current is an average value integrated over multiple conversion cycles. Transient current may exceed this specification. 2: Maximum ensured conversion time after Power-on Reset (POR to DATA_RDY) is 250msec. 3: Output current should be minimized for best temperature accuracy. Power dissipation within the TC74 will cause self-heating and temperature drift error. 4: SDA and SCLK must be connected to V or GND. DD 5: V = 3.3V for TC74AX -3.3VXX. V = 5.0V for TC74AX -5.0VXX. All part types of the TC74 will operate DD DD properly over the wider power supply range of 2.7V to 5.5V. Each part type is tested and specified for rated accuracy at its nominal supply voltage. As V varies from the nominal value, accuracy will degrade 1°C/V DD of V change. DD DS21462D-page 2  2001-2012 Microchip Technology Inc.

TC74 DC CHARACTERISTICS (CONTINUED) Electrical Specifications: Unless otherwise noted, V = 3.3V for TC74AX-3.3VXX and DD V = 5.0V for TC74AX-5.0VXX, -40°C  T  125°C. Note5 DD A Parameters Sym Min Typ Max Units Conditions START Condition Setup Time t 4.0 — — µsec 90% SCLK to 10% SDA SU(START) (for repeated START Condition) START Condition Hold Time t 4.0 — — µsec H(START) Data In Setup Time t 1000 — — nsec SU-DATA Data In Hold Time t 1250 — — nsec H-DAT STOP Condition Setup Time t 4.0 — — µsec SU(STOP) Bus Free Time Prior to New t 4.7 — — µsec IDLE Transition Power-on Reset Delay t — 500 — µsec V V (Rising Edge) POR DD POR Note 1: Operating current is an average value integrated over multiple conversion cycles. Transient current may exceed this specification. 2: Maximum ensured conversion time after Power-on Reset (POR to DATA_RDY) is 250msec. 3: Output current should be minimized for best temperature accuracy. Power dissipation within the TC74 will cause self-heating and temperature drift error. 4: SDA and SCLK must be connected to V or GND. DD 5: V = 3.3V for TC74AX -3.3VXX. V = 5.0V for TC74AX -5.0VXX. All part types of the TC74 will operate DD DD properly over the wider power supply range of 2.7V to 5.5V. Each part type is tested and specified for rated accuracy at its nominal supply voltage. As V varies from the nominal value, accuracy will degrade 1°C/V DD of V change. DD  2001-2012 Microchip Technology Inc. DS21462D-page 3

TC74 SMBUS Read Timing Diagram A B C D E F G H I J K t t LOW HIGH SCLK SDA t t t t t SU(START) H(START) SU-DATA SU(STOP) IDLE A = Start Condition E = Slave Pulls SDA Line Low I = Acknowledge Clock Pulse B = MSB of Address Clocked into Slave F = Acknowledge Bit Clocked into Master J = Stop Condition C = LSB of Address Clocked into Slave G = MSB of Data Clocked into Master K = New Start Condition D = R/W Bit Clocked into Slave H = LSB of Data Clocked into Master SMBUS Write Timing Diagram A B C D E F G H I J K L M t t LOW HIGH SCLK SDA t t t t t t SU(START) H(START) SU-DATA H-DATA SU(STOP) IDLE A = Start Condition F = Acknowledge Bit Clocked into Master J = Acknowledge Clocked into Master B = MSB of Address Clocked into Slave G = MSB of Data Clocked into Slave K = Acknowledge Clock Pulse C = LSB of Address Clocked into Slave H = LSB of Data Clocked into Slave L = Stop Condition, Data Executed by Slave D = R/W Bit Clocked into Slave I = Slave Pulls SDA Line Low M = New Start Condition E = Slave Pulls SDA Line Low FIGURE 1-1: Timing Diagrams. DS21462D-page 4  2001-2012 Microchip Technology Inc.

TC74 2.0 PIN DESCRIPTIONS The descriptions of the pins are listed in Table2-1. TABLE 2-1: PIN FUNCTION TABLE Pin No. Pin No. (5-Pin Symbol Type Description (5-Pin TO-220) SOT-23) 1 1 NC None No Internal Connection 2 3 GND Power System Ground 3 5 V Power Power Supply Input DD 4 4 SCLK Input SMBus/I2C Serial Clock 5 2 SDA Bidirectional SMBus/I2C Serial Data 2.1 Ground (GND) Input. Ground return for all TC74 functions. 2.2 Power Supply Input (V ) DD Power supply input. See Electrical Specifications. 2.3 SMBus/I2C Serial Clock (SCLK) Input. SMBus/I2C serial clock. Clocks data into and out of the TC74. See System Management Bus Specification, Rev. 1.0, for timing diagrams. 2.4 Serial Data (SDA) Bidirectional. Serial data is transferred on the SMBus/ I2C in both directions using this pin. See System Management Bus Specification, Rev. 1.0 for timing diagrams.  2001-2012 Microchip Technology Inc. DS21462D-page 5

TC74 3.0 DETAILED DESCRIPTION TABLE 3-2: SERIAL BUS CONVENTIONS Term Explanation 3.1 Functional Description Transmitter The device sending data to the bus. The TC74 acquires and converts temperature Receiver The device receiving data from the bus. information from its onboard solid-state sensor with a Master The device which controls the bus initi- resolution of ±1°C. It stores the data in an internal ating transfers (START), generating the register which is then read through the serial port. The system interface is a slave SMBus/I2C port, through clock and terminating transfers (STOP). which temperature data can be read at any time. Eight SMBus/I2C addresses are programmable for the TC74, Slave The device addressed by the master. which allows for a multi-sensor configuration. Also, START A unique condition signaling the begin- there is low power Standby mode when temperature ning of a transfer indicated by SDA acquisition is suspended. falling (high-low) while SCLK is high. STOP A unique condition signaling the end of 3.1.1 STANDBY MODE a transfer indicated by SDA rising (low- The host is allowed, by the TC74, to put it into a low high) while SCLK is high. power (I = 5µA, typical) Standby mode. In this mode, DD ACK A Receiver acknowledges the receipt the A/D converter is halted and the temperature data of each byte with this unique condition. registers are frozen. The SMBus/I2C port, though, The Receiver drives SDA low during operates normally. Standby mode is enabled by setting SCLK high of the ACK clock-pulse. The the SHDN bit in the CONFIG register. Table3-1 Master provides the clock pulse for the summarizes this operation. ACK cycle. Busy Communication is not possible TABLE 3-1: STANDBY MODE OPERATION because the bus is in use. SHDN Bit Operating Mode NOT Busy When the bus is idle, both SDA and 0 Normal SCLK will remain high. 1 Standby Data Valid The state of SDA must remain stable during the high period of SCLK in order 3.1.2 SMBUS/I2C SLAVE ADDRESS for a data bit to be considered valid. SDA only changes state while SCLK is The TC74 is internally programmed to have a default low during normal data transfers (see SMBus/I2C address value of 1001 101b. Seven other START and STOP conditions). addresses are available by custom order (contact Microchip Technology Inc. All transfers take place under the control of a host, usu- ally a CPU or microcontroller, acting as the Master. This 3.2 Serial Port Operation host provides the clock signal for all transfers. The TC74 always operates as a Slave. The serial protocol The Serial Clock input (SCLK) and bidirectional data is illustrated in Figure3-1. All data transfers have two port (SDA) form a 2-wire bidirectional serial port for pro- phases and all bytes are transferred MSB first. gramming and interrogating the TC74. The Accesses are initiated by a START condition, followed conventions used in this bus architecture are listed in by a device address byte and one or more data bytes. Table3-2. The device address byte includes a Read/Write selec- tion bit. Each access must be terminated by a STOP condition. A convention called “Acknowledge” (ACK) confirms receipt of each byte. Note that SDA can change only during periods when SCLK is low (SDA changes while SCLK is high are reserved for START and STOP conditions). DS21462D-page 6  2001-2012 Microchip Technology Inc.

TC74 Write Byte Format S Address WR ACK Command ACK Data ACK P 7 Bits 8 Bits 8 Bits Slave Address Command Byte: selects Data Byte: data goes which register you are into the register set writing to. by the command byte. Read Byte Format S Address WR ACK Command ACK S Address RD ACK Data NACK P 7 Bits 8 Bits 7 Bits 8 Bits Slave Address Command Byte: selects Slave Address: repeated Data Byte: reads from which register you are due to change in data- the register set by the reading from. flow direction. command byte. Receive Byte Format S Address RD ACK Data NACK P 7 Bits 8 Bits S = START Condition Data Byte: reads data from P = STOP Condition the register commanded by Shaded = Slave Transmission the last Read Byte or Write Byte transmission. FIGURE 3-1: SMBus/I2C Protocols. 3.3 START Condition (S) 3.6 Data Byte The TC74 continuously monitors the SDA and SCLK After a successful ACK of the address byte, the host lines for a START condition (a high-to-low transition of must transmit the data byte to be written, or clock-in the SDA while SCLK is high) and will not respond until this data to be read (see the appropriate timing diagrams). condition is met. ACK will be generated upon a successful write of a data byte into the TC74. 3.4 Address Byte 3.7 STOP Condition (P) Immediately following the START condition, the host must transmit the address byte to the TC74. The states Communications must be terminated by a STOP of A2, A1 and A0 determine the SMBus/I2C address for condition (a low-to-high transition of SDA while SCLK the TC74. The 7-bit address transmitted in the serial bit is high). The STOP condition must be communicated stream must match for the TC74 to respond with an by the transmitter to the TC74. Refer to Figure1-1, Acknowledge (indicating the TC74 is on the bus and “Timing Diagrams”, for serial bus timing. ready to accept data). The 8-bit in the address byte is a Read/Write bit. This bit is a ‘1’ for a read operation or ‘0’ for a write operation. During the first phase of any transfer, this bit will be set = 0, indicating that the command byte is being written. 3.5 Acknowledge (ACK) Acknowledge (ACK) provides a positive handshake between the host and the TC74. The host releases SDA after transmitting 8 bits. The host then generates a ninth clock cycle to allow the TC74 to pull the SDA line low. This action acknowledges that the TC74 successfully received the previous 8 bits of data or address.  2001-2012 Microchip Technology Inc. DS21462D-page 7

TC74 4.0 REGISTER SET AND TABLE 4-3: TEMPERATURE REGISTER PROGRAMMER’S MODEL (TEMP) D[7] D[6] D[5] D[4] D[3] D[2] D[1] D[0] TABLE 4-1: COMMAND BYTE MSB X X X X X X LSB DESCRIPTION In temperature data registers, each unit value repre- (SMBUS/I2C READ_BYTE AND sents one degree (Celsius). The value is in 2’s WRITE_BYTE) complement binary format such that a reading of 0000 Command Code Function 0000b corresponds to 0°C. Examples of this temperature to binary value relationship are shown in RTR 00h Read Temperature (TEMP) Table4-4. RWCR 01h Read/Write Configuration (CONFIG) TABLE 4-4: TEMPERATURE-TO-DIGITAL VALUE CONVERSION TABLE 4-2: CONFIGURATION REGISTER (TEMP) (CONFIG); 8 BITS, READ/ Actual Registered Binary WRITE) Temperature Temperature Hex Bit POR Function Type Operation +130.00°C +127°C 0111 1111 D[7] 0 STANDBY Read/ 1 = standby, +127.00°C +127°C 0111 1111 Switch Write 0 = normal +126.50°C +126°C 0111 1110 D[6] 0 Data Ready * Read 1 = ready +25.25°C +25°C 0001 1001 Only 0 = not ready +0.50°C 0°C 0000 0000 D[5]- 0 Reserved - N/A N/A D[0] Always +0.25°C 0°C 0000 0000 returns zero 0.00°C 0°C 0000 0000 when read -0.25°C -1°C 1111 1111 Note 1: *DATA_RDY bit RESET at power-up and -0.50°C -1°C 1111 1111 SHDN enable. -0.75°C -1°C 1111 1111 -1.00°C -1°C 1111 1111 -25.00°C -25°C 1110 0111 -25.25°C -26°C 1110 0110 V DD -54.75°C -55°C 1100 1001 -55.00°C -55°C 1100 1001 -65.00°C -65°C 1011 1111 DATA_RDY 4.2 Register Set Summary The TC74 register set is summarized in Table4-5. All SHDN registers are 8 bits wide. tconv tconv TABLE 4-5: TC74 REGISTER SET FIGURE 4-1: DATA_RDY, SHDN SUMMARY Operation Logic Diagram. POR Name Description Read Write State 4.1 Temperature Register (TEMP), 8 Bits, READ ONLY TEMP Internal Sensor 0000 Temperature (2’s 0000b (1)  N/A The binary value (2’s complement format) in this regis- Complement) ter represents temperature of the onboard sensor CONFIG CONFIG 0000 following a conversion cycle. The registers are   Register 0000b automatically updated in an alternating manner. Note 1: The TEMP register will be immediately updated by the A/D converter after the DATA_RDY Bit goes high. DS21462D-page 8  2001-2012 Microchip Technology Inc.

TC74 5.0 PACKAGING INFORMATION 5.1 SOT23A Package Marking Information 5-Pin SOT-23A 5 4 1 & 2 = part number code + temp. range and voltage 3 = year and quarter code 1 2 3 4 4 = lot ID number 1 2 3 SOT-23 Package Marking Codes SOT-23 (V) Address Code SOT-23 (V) Address Code TC74A0-3.3VCT 1001 000 V0 TC74A0-5.0VCT 1001 000 U0 TC74A1-3.3VCT 1001 001 V1 TC74A1-5.0VCT 1001 001 U1 TC74A2-3.3VCT 1001 010 V2 TC74A2-5.0VCT 1001 010 U2 TC74A3-3.3VCT 1001 011 V3 TC74A3-5.0VCT 1001 011 U3 TC74A4-3.3VCT 1001 100 V4 TC74A4-5.0VCT 1001 100 U4 TC74A5-3.3VCT 1001 101* V5 TC74A5-5.0VCT 1001 101* U5 TC74A6-3.3VCT 1001 110 V6 TC74A6-5.0VCT 1001 110 U6 TC74A7-3.3VCT 1001 111 V7 TC74A7-5.0VCT 1001 111 U7 Note: * Default Address TO-220 Package Marking Information TO-220 Legend: XX...X Customer specific information* YY Year code (last 2 digits of calendar year) WW Week code (week of January 1 is week ‘01’) NNN Alphanumeric traceability code Note: In the event the full Microchip part number cannot be TC74A0- marked on one line, it will be carried over to the next line thus lim- 3.3VAT iting the number of available characters for customer specific infor- 0229123 mation. 1 2 3 4 5 * Standard marking consists of Microchip part number, year code, week code, and traceability code.  2001-2012 Microchip Technology Inc. DS21462D-page 9

TC74 5.2 Taping Forms Component Taping Orientation for 5-Pin SOT-23A (EIAJ SC-74A) Devices User Direction of Feed Device Marking W PIN 1 P Standard Reel Component Orientation for TR Suffix Device (Mark Right Side Up) Carrier Tape, Number of Components Per Reel and Reel Size: Package Carrier Width (W) Pitch (P) Part Per Full Reel Reel Size 5-Pin SOT-23A 8 mm 4 mm 3000 7 in. DS21462D-page 10  2001-2012 Microchip Technology Inc.

TC74 5.3 Package Dimensions Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging SOT-23A-5 .075 (1.90) REF. .122 (3.10) .071 (1.80) .098 (2.50) .059 (1.50) .020 (0.50) .012 (0.30) .037 (0.95) PIN 1 REF. .118 (3.00) .010 (2.80) .057 (1.45) .035 (0.90) .010 (0.25) 10° MAX. .004 (0.09) .006 (0.15) .024 (0.60) .000 (0.00) .004 (0.10) Dimensions: inches (mm)  2001-2012 Microchip Technology Inc. DS21462D-page 11

TC74 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 5-Pin TO-220 .185 (4.70) .165 (4.19) .415 (10.54) .117 (2.97) .390 (9.91) .156 (3.96) .055 (1.40) .103 (2.62) .140 (3.56) .045 (1.14) DIA. .293 (7.44) .204 (5.18) 3 - 7.5 .613 (15.57) 5 PLCS. .569 (14.45) .037 (0.95) .590 (14.99) .025 (0.64) .482 (12.24) .025 (0.64) .012 (0.30) PIN 1 .072 (1.83) .062 (1.57) .115 (2.92) .273 (6.93) .087 (2.21) .263 (6.68) Dimensions: inches (mm) DS21462D-page 12  2001-2012 Microchip Technology Inc.

TC74 6.0 REVISION HISTORY Revision D (December 2012) Added a note to each package outline drawing.  2001-2012 Microchip Technology Inc. DS21462D-page 13

TC74 NOTES: DS21462D-page 14  2001-2012 Microchip Technology Inc.

TC74 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. XX -XX X XX Examples: a) TC74A0-3.3VCTTR: SOT-23 Serial Digital Thermal Sensor Device Address Supply Operating Package b) TC74A1-3.3VCTTR: SOT-23 Serial Digital Thermal Sensor Options Voltage Temperature c) TC74A2-3.3VCTTR: SOT-23 Serial Digital Thermal Sensor d) TC74A3-3.3VCTTR: SOT-23 Serial Digital Thermal Sensor Device: TC74: Serial Digital Thermal Sensor e) TC74A4-3.3VCTTR: SOT-23 Serial Digital Thermal Sensor f) TC74A5-3.3VCTTR: SOT-23 Serial Digital Thermal Sensor * Address Options: A0 = 1001 000 A1 = 1001 001 g) TC74A6-3.3VCTTR: SOT-23 Serial Digital Thermal Sensor A2 = 1001 010 h) TC74A7-3.3VCTTR: SOT-23 Serial Digital Thermal Sensor A3 = 1001 011 A4 = 1001 100 A5 = 1001 101 * a) TC74A0-5.0VCTTR: SOT-23 Serial Digital Thermal Sensor A6 = 1001 110 b) TC74A1-5.0VCTTR: SOT-23 Serial Digital Thermal Sensor A7 = 1001 111 c) TC74A2-5.0VCTTR: SOT-23 Serial Digital Thermal Sensor * Default Address d) TC74A3-5.0VCTTR: SOT-23 Serial Digital Thermal Sensor e) TC74A4-5.0VCTTR: SOT-23 Serial Digital Thermal Sensor Supply Voltage: 3.3 = Accuracy optimized for 3.3V f) TC74A5-5.0VCTTR: SOT-23 Serial Digital Thermal Sensor * 5.0 = Accuracy optimized for 5.0V g) TC74A6-5.0VCTTR: SOT-23 Serial Digital Thermal Sensor h) TC74A7-5.0VCTTR: SOT-23 Serial Digital Thermal Sensor Operating Temperature: V = -40°C  TA  +125°C * Default Address Package: CTTR = SOT-23-5 (Tape and Reel only) PART NO. XX -XX X XX Examples: a) TC74A0-3.3VAT: TO-220 Serial Digital Thermal Sensor Device Address Supply Operating Package b) TC74A1-3.3VAT: TO-220 Serial Digital Thermal Sensor Options Voltage Temperature c) TC74A2-3.3VAT: TO-220 Serial Digital Thermal Sensor d) TC74A3-3.3VAT: TO-220 Serial Digital Thermal Sensor Device: TC74: Serial Digital Thermal Sensor e) TC74A4-3.3VAT: TO-220 Serial Digital Thermal Sensor f) TC74A5-3.3VAT: TO-220 Serial Digital Thermal Sensor * Address Options: A0 = 1001 000 A1 = 1001 001 g) TC74A6-3.3VAT: TO-220 Serial Digital Thermal Sensor A2 = 1001 010 h) TC74A7-3.3VAT: TO-220 Serial Digital Thermal Sensor A3 = 1001 011 A4 = 1001 100 a) TC74A0-5.0VAT: TO-220 Serial Digital Thermal Sensor A5 = 1001 101 * A6 = 1001 110 b) TC74A1-5.0VAT: TO-220 Serial Digital Thermal Sensor A7 = 1001 111 c) TC74A2-5.0VAT: TO-220 Serial Digital Thermal Sensor * Default Address d) TC74A3-5.0VAT: TO-220 Serial Digital Thermal Sensor e) TC74A4-5.0VAT: TO-220 Serial Digital Thermal Sensor Output Voltage: 3.3 = Accuracy optimized for 3.3V f) TC74A5-5.0VAT: TO-220 Serial Digital Thermal Sensor * 5.0 = Accuracy optimized for 5.0V g) TC74A6-5.0VAT: TO-220 Serial Digital Thermal Sensor h) TC74A7-5.0VAT: TO-220 Serial Digital Thermal Sensor Operating Temperature: V = -40°C  TA  +125°C * Default Address Package: AT = TO-220-5 Sales and Support Data Sheets Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recom- mended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following: 1. Your local Microchip sales office 2. The Microchip Worldwide Site (www.microchip.com) Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using. New Customer Notification System Register on our web site (www.microchip.com/cn) to receive the most current information on our products.  2001-2012 Microchip Technology Inc. DS21462D-page15

TC74 NOTES: DS21462D-page 16  2001-2012 Microchip Technology Inc.

Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. • Microchip is willing to work with the customer who is concerned about the integrity of their code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device Trademarks applications and the like is provided only for your convenience The Microchip name and logo, the Microchip logo, dsPIC, and may be superseded by updates. It is your responsibility to FlashFlex, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, ensure that your application meets with your specifications. PICSTART, PIC32 logo, rfPIC, SST, SST Logo, SuperFlash MICROCHIP MAKES NO REPRESENTATIONS OR and UNI/O are registered trademarks of Microchip Technology WARRANTIES OF ANY KIND WHETHER EXPRESS OR Incorporated in the U.S.A. and other countries. IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor, INCLUDING BUT NOT LIMITED TO ITS CONDITION, MTP, SEEVAL and The Embedded Control Solutions QUALITY, PERFORMANCE, MERCHANTABILITY OR Company are registered trademarks of Microchip Technology FITNESS FOR PURPOSE. Microchip disclaims all liability Incorporated in the U.S.A. arising from this information and its use. Use of Microchip Silicon Storage Technology is a registered trademark of devices in life support and/or safety applications is entirely at Microchip Technology Inc. in other countries. the buyer’s risk, and the buyer agrees to defend, indemnify and Analog-for-the-Digital Age, Application Maestro, BodyCom, hold harmless Microchip from any and all damages, claims, chipKIT, chipKIT logo, CodeGuard, dsPICDEM, suits, or expenses resulting from such use. No licenses are dsPICDEM.net, dsPICworks, dsSPEAK, ECAN, conveyed, implicitly or otherwise, under any Microchip ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial intellectual property rights. Programming, ICSP, Mindi, MiWi, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, mTouch, Omniscient Code Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit, PICtail, REAL ICE, rfLAB, Select Mode, SQI, Serial Quad I/O, Total Endurance, TSHARC, UniWinDriver, WiperLock, ZENA and Z-Scale are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. GestIC and ULPP are registered trademarks of Microchip Technology Germany II GmbH & Co. & KG, a subsidiary of Microchip Technology Inc., in other countries. All other trademarks mentioned herein are property of their respective companies. © 2001-2012, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. ISBN: 9781620768396 QUALITY MANAGEMENT SYSTEM Microchip received ISO/TS-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and CERTIFIED BY DNV Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures == ISO/TS 16949 == are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified.  2001-2012 Microchip Technology Inc. DS21462D-page 17

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