TC6501/2/3/4 Ultra Small Temperature Switches with Pin Selectable Hysteresis Features General Description • 5-Pin SOT-23A The TC6501/2/3/4 are SOT-23 temperature switches • Factory-programmed Thresholds from that require no external components and are available -45°C to +125°C in 10°C Increments with factory-programmed temperature thresholds. A choice of factory-trimmed temperature trip points are • Pin Selectable +2°C or +10°C Hysteresis also available. Pin-selectable hysteresis of +2°C or • ±0.5°C (Typ) Threshold Accuracy Over Full +10°C allows flexibility to the design of the application. Temperature Range These parts typically consume only 17µA of current • No External Components Required and operate over the entire -55°C to +135°C • 17µA Supply Current (Typ) temperature range, while offering accuracies of ±0.5°C (typ). Applications The TC6501 and TC6503 have an open-drain, active- • Thermal Management in PCs and Servers low output, which targets microcontroller reset control. • Over-temperature Fail-safe Circuits The TC6502 and TC6504 have a CMOS, active-high output designed to drive the logic level MOSFET that • Simple Fan Controller turns on a fan or heater element. • Temperature Alarms The TC6501/TC6502 are designed for hot temperature • Projectors/Printers monitoring (+35°C to +125°C). These devices assert a • Notebook Computers logic signal when the temperature goes above the • Network Boxes threshold. The TC6503/TC6504 are optimized for cold temperature monitoring (-45°C to +15°C) and assert a Package Types logic signal when the temperature goes below the threshold. The TC6501/2/3/4 are offered with five standard tem- GND 1 5 TOVER TC6501 perature thresholds. Available in 5-Pin SOT-23A pack- TOVER TC6502 ages, these parts are ideal for applications requiring TC6501 high integration, small size, low power and low installed GND 2 TC6502 cost. Functional Block Diagram HYST 3 4 VCC +2.7V to +5.5V 100pF GND 1 5 TUNDER TC6503 VCC VCC TUNDER TC6504 PIC® TC6502 TC6503 Microcontroller GND 2 TC6504 T INT OVER GNDGNDHYST GND HYST 3 4 VCC Note: 5-Pin SOT-23A is equivalent to EIAJ SC-74A  2002-2012 Microchip Technology Inc. DS21451E-page 1

TC6501/2/3/4 1.0 ELECTRICAL * Notice: Stresses above those listed under “Maximum CHARACTERISTICS Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those Absolute Maximum Ratings* indicated in the operational sections of the specifica- Supply Voltage (V ).............................. -0.3V to +7V tions is not implied. Exposure to maximum rating con- CC ditions for extended periods may affect device Input Current (All Pins).......................................20mA reliability. Output Current (All Pins)....................................20mA Operating Temperature Range..........- 55°C to +135°C Storage Temperature Range.............- 65°C to +165°C T (TC6501).......................................-0.3V to +7V OVER T (TC6502).........................-0.3V to (V + 0.3V) OVER CC T (TC6503).......................................-0.3V to 7V UNDER T (TC6504).......................-0.3V to (V + 0.3V) UNDER CC All Other Pins.............................-0.3V to (V + 0.3V) CC Maximum Junction Temperature, T ..................150°C J Power Dissipation (T = +70°C): A (Derate 7.1mW/°C Above +70°C)...............570mW ELECTRICAL SPECIFICATIONS Electrical Characteristics: Unless otherwise noted, V = +2.7V to +5.5V, R = 100k (TC6501/TC6503 only), 100pF CC PULL-UP decoupling capacitor from V to GND, T = -55°C to +135°C. Typical values are at T = +25°C. CC AMB A Parameter Symbol Min Typ Max Unit Test Conditions Supply Voltage Range V 2.7 — 5.5 V CC Supply Current I — 17 40 µA CC HYST Input Threshold V 0.8 x V — — V IH CC HYST Input Threshold V — — 0.2 x V V IL CC Temperature Threshold Accuracy (Note1) T -6 ±0.5 6 °C -45°C to -25°C TH -4 ±0.5 4 °C -15°C to +15°C -4 ±0.5 4 °C +35°C to +65°C -6 ±0.5 6 °C +75°C to +125°C Temperature Threshold Hysteresis T — 2.0 — °C HYST = GND HYST — 10 — °C HYST = V CC Output Voltage High V 0.8 x V — — V I = 500µA, V > 2.7V OH CC SOURCE CC (TC6502/TC6504 Only) V - 1.5 — — V I = 800µA, V > 4.5V CC SOURCE CC (TC6502/TC6504 Only) Output Voltage Low V — — 0.3 V I = 1.2mA, V > 2.7V OL SINK CC — — 0.4 V I = 3.2mA, V > 4.5V SINK CC Open-Drain Output Leakage Current — 10 — nA V = 2.7V, T = 5.5V CC UNDER (TC6503); T = 5.5V OVER (TC6501) Note 1: The TC6501/2/3/4 are available with internal, factory-programmed temperature trip thresholds from -45°C to +125°C, in +10°C increments. DS21451E-page 2  2002-2012 Microchip Technology Inc.

TC6501/2/3/4 2.0 TYPICAL PERFORMANCE CURVES Note: The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. Note: Unless otherwise noted, V = 5.0V, R = 100k (TC6501/TC6503 only), 100pF decoupling CC PULL-UP capacitor from V to GND, T = +25°C. CC AMB . 60 40 50 35 40 A)30 ncy nt (µ25 Freque 3200 y Curre2105 pl up10 10 S 5 0 0 -5 -4 -3 -2 -1 0 1 2 3 4 5 -60-40-20 0 20 40 60 80100120140 Accuracy (˚C) Temperature (˚C) FIGURE 2-1: Trip Threshold Accuracy. FIGURE 2-4: Supply Current vs. Temperature. 80 70 VCC = 4.0V VCC = 2.7V 12 Ωe () 60 10 TC6503/H0Y4ST = VCTCC6501/02 anc 50 VCC = 5.0V C) 8 esist 40 sis (˚ put R 30 stere 6 ut 20 Hy 4 O 10 HYS = GND 2 0 TC6503/04 TC6501/02 0 10 20 30 40 50 60 70 80 90 100 Temperature (˚C) 0 -45 -25 -5 15 35 55 75 95 115 Trip Temperature (˚C) FIGURE 2-2: Output Sink Resistance vs. Temperature. FIGURE 2-5: Hysteresis vs. Trip Temperature. +100˚C +100˚C +15˚C/div +12.5 C/div Mounted On 0.75 in2 Mounted On 0.75 in2 of 2 oz. Copper of 2 oz. Copper +25˚C +25˚C 5sec/div 20sec/div FIGURE 2-3: Thermal Step Response in FIGURE 2-6: Thermal Step Response in Perfluorinated Fluid (SOT-23). Still Air (SOT-23).  2002-2012 Microchip Technology Inc. DS21451E-page 3

TC6501/2/3/4 Note: Unless otherwise noted, V = 5.0V, R = 100k (TC6501/TC6503 only), 100pF decoupling CC PULL-UP capacitor from V to GND, T = +25°C. CC AMB 180 )160 VCC = 2.7V ce (140 VCC = 4.0V n sta120 Resi100 VCC = 5.0V e 80 c ur 60 o S ut 180 p ut 40 O 20 0 20 40 60 80 100 120 140 Temperature (˚C) FIGURE 2-7: Output Source Resistance vs. Temperature (TC6502). DS21451E-page 4  2002-2012 Microchip Technology Inc.

TC6501/2/3/4 3.0 PIN DESCRIPTIONS The descriptions of the pins are listed in Table3-1. TABLE 3-1: PIN FUNCTION TABLE TC6501 TC6502 TC6503 TC6504 Symbol Description 1, 2 1, 2 1, 2 1, 2 GND Ground 3 3 3 3 HYST Hysteresis Input 4 4 4 4 V Supply Input (+2.7V to +5.5V) CC 5 — — — T Open-Drain, Active-Low Output OVER — 5 — — T Push/Pull Active-High Output OVER — — 5 — T Open-Drain, Active-Low Output UNDER — — — 5 T Push/Pull Active-High Output UNDER 3.1 Ground 3.5 Push/Pull Active-High Output (TC6502) (T ) Connect the device ground pins directly to the PCB OVER ground and minimize the length of the connection. The The voltage at T is equal to a logic-high level if the OVER thermal resistance to the die is at a minimum at Pin 2. sensor detects a temperature greater than the factory- programmed threshold temperature. 3.2 Hysteresis Input (HYST) 3.6 Open-Drain, Active-Low Output Either 2°C (GND) or 10°C (V ) of hysteresis is CC (TC6503) (T ) selected by connecting HYST to GND or V . UNDER CC The voltage at the T pin is equal to a logic-low UNDER 3.3 Supply Input (V ) CC level if the sensor detects a temperature that is less than the factory-programmed threshold temperature. A 100pF or greater decoupling capacitor from V to CC Because this is an open-drain output, an external pull- GND is recommended. up resistor is required (a 100k pull-up resistor is recommended). The voltage on this pin can be higher 3.4 Open-Drain, Active-Low Output than V , though the voltage must not exceed the CC (TC6501) (T ) OVER absolute maximum input voltage of 7.0V The voltage at the T pin is equal to a logic-low OVER 3.7 Push/Pull Active-High Output level if the sensor detects a temperature that is greater than the factory-programmed threshold temperature. (TC6504) (TUNDER) Because this is an open-drain output, an external pull- The voltage at T is equal to a logic-high level if up resistor is required (a 100k pull-up resistor is UNDER the sensor detects a temperature less than the factory- recommended). The voltage on this pin can be higher programmed threshold temperature. than V , though the voltage must not exceed the CC absolute maximum input voltage of 7.0V.  2002-2012 Microchip Technology Inc. DS21451E-page 5

TC6501/2/3/4 4.0 DETAILED DESCRIPTION 4.2 Thermal Considerations The TC6501/2/3/4 integrate a temperature sensor with With a 17µA typical supply current, the TC6501/2/3/4 a factory-programmed threshold switch (see Functional dissipates very little power. Thus, the die temperature Block Diagrams in Figure5-4 through Figure5-7). A is basically the same as the package temperature. To logic signal is asserted when the die temperature minimize the error in temperature readings, the load crosses the factory-programmed threshold. An external current should be limited to a few milliamps. For hysteresis input pin allows the user to select either 2°C example, the typical thermal resistance of a 5-Pin SOT- or 10°C hysteresis to give further flexibility to the design 23A package is 140°C/W. If, for instance, the TC6501 of the application. The TC6501 and TC6502 are had to sink 1mA, and the output voltage is ensured to intended for a temperature range of 35°C to 125°C in be less than 0.3V, an additional 0.3mW of power is 10°C increments. The TC6501 has an open-drain dissipated within the temperature sensor. This output, while the TC6502 has a push-pull output stage. corresponds to a 0.042°C rise in die temperature. The TC6503 and TC6504 are intended for a cold Temperature-monitoring accuracy depends on the temperature range of -45°C to +15°C in 10°C thermal resistance between the device being increments. The TC6503 has an open-drain output, monitored and the temperature switch die. Heat flows while the TC6504 has a push/pull output stage. The primarily through the leads onto the die. Pin 2 provides TC6501 and TC6503 are intended for applications with the lowest thermal resistance to the die. To achieve the a microcontroller reset input. The TC6502 and TC6504 best temperature-monitoring results, the TC6501/2/3/4 are intended for applications where a fan or heater should be placed closest to the device being element is turned on. monitored. Additionally, a short and wide copper trace from pin 2 to the device should be used. In some cases, Please contact Microchip Technology for the availability the 5-Pin SOT-23A package can be placed directly of a particular temperature threshold not included in under the socketed microcontroller for improved ther- Table4-1. mal contact. 4.1 Hysteresis Input To prevent the output from “chattering” at or near the trip point temperature, a selectable HYST input pin is provided. Hysteresis can be externally selected at 2°C (HYST = GND) or 10°C (HYST = V ) by means of the CC CMOS compatible HYST input pin. Do not let the HYST pin float, as this could cause an increase in supply current. The hysteresis does not depend on the part’s programmed trip threshold. TABLE 4-1: FACTORY-PROGRAMMED THRESHOLD RANGE Part Number Threshold (T ) Range TH TC6501 +35°C < T < +125°C TH TC6502 +35°C < T < +125°C TH TC6503 -45°C < T < +15°C TH TC6504 -45°C < T < +15°C TH DS21451E-page 6  2002-2012 Microchip Technology Inc.

TC6501/2/3/4 5.0 APPLICATIONS The TC6504, with its push-pull output, may be used in a similar fashion to turn on a heater element at cold The TC6501 and TC6503 have open-drain outputs and temperatures (see Figure5-3). are, therefore, intended to interface as microcontroller reset inputs. Moreover, the combination of these two +5V 12V devices can be used to implement a temperature window alarm by wire-ORing the outputs and using an 100pF external pull-up resistor (see Figure5-1). VCC Heater +5V TC6504 RPULL-UP 100pF Temperature T 100pF 100k Out of Range UNDER GND GND HYST VVCCCC VVCCCC TTCC66550011 TTCC66550033 Temperature TTOOVVEERR TTUUNNDDEERR GGNNDD GGNNDDHHHHYYYYSSSSTTTT GGNNDDGGNNDDHHYYSSTT T + 2°C UNDER T UNDER FIGURE 5-1: Over and Under Temperature Alarm. Time The TC6502 can be used to control a DC fan. The fan turns on when the sensed temperature rises above the factory-set threshold and remains on until the temperature falls below threshold minus the hysteresis TUNDER selected. An additional fail-safe measure could be Heater "On" designed by using a second TC6502 with a higher temperature threshold to alert the user of an impending FIGURE 5-3: TC6504 As Heater thermal shutdown, should the temperature continue to Thermostat. rise (see Figure5-2). +++555VVV VVV CCCCCC 100pF TTCCT6655C006225PP0OO26655 T emperature Fault GGGNNNDDD TTTOOOVVVEEERRR GGGNNNDDD HHHYYYSSSTTT Fan Control VVVCCCCCC TTTOOOVVVEEERRR HHHYYYSSSTTT 100pF TTCCT66C55006225PP0OO24455 GGGNNNDDD GGGNNNDDD FIGURE 5-2: Fan Control with Over Temperature Alert.  2002-2012 Microchip Technology Inc. DS21451E-page 7

TC6501/2/3/4 TC6501 TC6501 V with 100k Pull-Up Hysteresis HYST T Selection OVER Positive Temperature T + OVER Coefficient Reference – NNeeggaattivivee TeTmemppeerraattuurree CCooeefffifciciieenntt TEMP RReefefererennccee COLD +25°C TTH HOT FIGURE 5-4: TC6501 Functional Block Diagram. TC6502 TC6502 V Hysteresis HYST T Selection OVER Positive Temperature + Coefficient Reference TOVER – Negative Temperature TEMP Coefficient COLD +25°C T HOT TH Reference FIGURE 5-5: TC6502 Functional Block Diagram. TC6503 TC6503 V with 100k Pull-Up Positive T Temperature TUNDER UNDER – Coefficient Reference + Hysteresis Selection HYST Negative Temperature Coefficient TEMP Reference COLD T +25°C HOT TH FIGURE 5-6: TC6503 Functional Block Diagram. TC6504 TC6504 V T Positive UNDER Temperature – Coefficient Reference TUNDER + Hysteresis Selection HYST Negative Temperature Coefficient TEMP Reference COLD TTH +25°C HOT FIGURE 5-7: TC6504 Functional Block Diagram. DS21451E-page 8  2002-2012 Microchip Technology Inc.

TC6501/2/3/4 6.0 PACKAGING INFORMATION 6.1 Package Marking Diagram 5 4  1 2 3 Temperature Part Number Marking Code Threshold (°C) TC6501P045VCT HA 45 TC6501P065VCT HC 65 TC6501P075VCT HD 75 TC6501P095VCT HF 95 TC6501P105VCT HG 105 TC6501P115VCT HH 115 TC6501P120VCT HV 120 TC6501P125VCT HJ 125 TC6502P045VCT JA 45 TC6502P065VCT JC 65 TC6502P075VCT JD 75 TC6502P095VCT JF 95 TC6502P115VCT JH 115 TC6502P125VCT JJ 125 TC6503N015VCT KA -15 TC6503P005VCT KB 5 TC6504N015VCT LA -15 TC6504P005VCT LB 5 Note: Please contact Microchip Technology for the availability of a particular temperature threshold not included in Table4-1. Legend: XX...X Customer-specific information Y Year code (last digit of calendar year) YY Year code (last 2 digits of calendar year) WW Week code (week of January 1 is week ‘01’) NNN Alphanumeric traceability code e3 Pb-free JEDEC designator for Matte Tin (Sn) * This package is Pb-free. The Pb-free JEDEC designator ( e 3 ) can be found on the outer packaging for this package. Note: In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information.  2002-2012 Microchip Technology Inc. DS21451E-page 9

TC6501/2/3/4 5-Lead Plastic Small Outline Transistor (CT) (SOT-23) Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging E E1 p B p1 D n 1  c A A2  A1 L  Units INCHES* MILLIMETERS Dimension Limits MIN NOM MAX MIN NOM MAX Number of Pins n 5 5 Pitch p .038 0.95 Outside lead pitch (basic) p1 .075 1.90 Overall Height A .035 .046 .057 0.90 1.18 1.45 Molded Package Thickness A2 .035 .043 .051 0.90 1.10 1.30 Standoff § A1 .000 .003 .006 0.00 0.08 0.15 Overall Width E .102 .110 .118 2.60 2.80 3.00 Molded Package Width E1 .059 .064 .069 1.50 1.63 1.75 Overall Length D .110 .116 .122 2.80 2.95 3.10 Foot Length L .014 .018 .022 0.35 0.45 0.55 Foot Angle  0 5 10 0 5 10 Lead Thickness c .004 .006 .008 0.09 0.15 0.20 Lead Width B .014 .017 .020 0.35 0.43 0.50 Mold Draft Angle Top  0 5 10 0 5 10 Mold Draft Angle Bottom  0 5 10 0 5 10 * Controlling Parameter § Significant Characteristic Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side. JEDEC Equivalent: MO-178 Drawing No. C04-091 DS21451E-page 10  2002-2012 Microchip Technology Inc.

TC6501/2/3/4 Product Tape and Reel Specification Device Marking User Direction of Feed Pin 1 W, Width of Carrier Tape Pin 1 P, Pitch Standard Reel Component Orientation Reverse Reel Component Orientation  2002-2012 Microchip Technology Inc. DS21451E-page 11

TC6501/2/3/4 7.0 REVISION HISTORY Revision E (December 2012) Added a note to the package outline drawing. DS21451E-page 12  2002-2012 Microchip Technology Inc.

TC6501/2/3/4 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. XXXX XXXXX EExxaammpplleess:: aa)) TTCC66550011PP004455VVCCTTTTRR:: 55--PPiinn SSOOTT--2233AA,, 4455°°CC,, Device Standard Package OOppeenn--DDrraaiinn,, ttaappee aanndd rreeeell.. Temperature bb)) TTCC66550011PP006655VVCCTTTTRR:: 55--PPiinn SSOOTT--2233AA,, 6655°°CC,, Threshold OOppeenn--DDrraaiinn,, ttaappee aanndd rreeeell.. cc)) TTCC66550011PP009955VVCCTTTTRR:: 55--PPiinn SSOOTT--2233AA,, 9955°°CC,, OOppeenn--DDrraaiinn,, ttaappee aanndd rreeeell.. Device: TC6501: Ultra Small Temp Switch with Pin-Selectable dd)) TTCC66550011PP009955VVCCTTRRTT:: 55--PPiinn SSOOTT--2233AA,, 9955°°CC,, Hysteresis OOppeenn--DDrraaiinn,, TC6502: Ultra Small Temp Switch with Pin-Selectable rreevveerrssee ttaappee aanndd rreeeell.. Hysteresis ee)) TTCC66550011PP112255VVCCTTRRTT:: 55--PPiinn SSOOTT--2233AA,, 112255°°CC,, TC6503: Ultra Small Temp Switch with Pin-Selectable OOppeenn--DDrraaiinn,, Hysteresis rreevveerrssee ttaappee aanndd rreeeell.. TC6504: Ultra Small Temp Switch with Pin-Selectable Hysteresis aa)) TTCC66550022PP004455VVCCTTTTRR 55--PPiinn SSOOTT--2233AA,, 4455°°CC,, PPuusshh--PPuullll,, ttaappee aanndd rreeeell.. Standard Temperature N015 = -15°C (TC6503, TC6504) bb)) TTCC66550022PP006655VVCCTTTTRR 55--PPiinn SSOOTT--2233AA,, 6655°°CC,, Threshold: P005 = 5°C (TC6503, TC6504 PPuusshh--PPuullll,, ttaappee aanndd rreeeell.. P045 = 45°C (TC6501, TC6502) cc)) TTCC66550022PP009955VVCCTTTTRR:: 55--PPiinn SSOOTT--2233AA,, 9955°°CC,, P065 = 65°C (TC6501, TC6502) PPuusshh--PPuullll,, ttaappee aanndd rreeeell.. P075 = 75°C (TC6501, TC6502) P095 = 95°C (TC6501, TC6502) aa)) TTCC66550033NN001155VVCCTTTTRR 55--PPiinn SSOOTT--2233AA,, --1155°°CC,, P105 = 105°C (TC6501) OOppeenn--DDrraaiinn,, ttaappee aanndd rreeeell.. P115 = 115°C (TC6501, TC6502) bb)) TTCC66550033PP000055VVCCTTTTRR:: 55--PPiinn SSOOTT--2233AA,, 55°°CC,, P120 = 120°C (TC6501) OOppeenn--DDrraaiinn,, ttaappee aanndd rreeeell.. P125 = 125°C (TC6501, TC6502) aa)) TTCC66550044NN001155VVCCTTTTRR:: 55--PPiinn SSOOTT--2233AA,, --1155°°CC,, Package: VCTTR = SOT-23, 5-lead (Tape and Reel) PPuusshh--PPuullll,, ttaappee aanndd rreeeell.. VCTRT = SOT-23, 5-lead (Reverse Tape and Reel) bb)) TTCC66550044PP000055VVCCTTTTRR:: 55--PPiinn SSOOTT--2233AA,, 55°°CC,, (Available only in 95°C and 125°C PPuusshh--PPuullll,, ttaappee aanndd rreeeell.. temperatures for TC6501) Sales and Support Data Sheets Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following: 1. Your local Microchip sales office 2. The Microchip Worldwide Site (www.microchip.com) Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using. Customer Notification System Register on our web site (www.microchip.com/cn) to receive the most current information on our products.  2002-2012 Microchip Technology Inc. DS21451E-page 13

TC6501/2/3/4 NOTES: DS21451E-page 14  2002-2012 Microchip Technology Inc.

Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. • Microchip is willing to work with the customer who is concerned about the integrity of their code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device Trademarks applications and the like is provided only for your convenience The Microchip name and logo, the Microchip logo, dsPIC, and may be superseded by updates. It is your responsibility to FlashFlex, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, ensure that your application meets with your specifications. PICSTART, PIC32 logo, rfPIC, SST, SST Logo, SuperFlash MICROCHIP MAKES NO REPRESENTATIONS OR and UNI/O are registered trademarks of Microchip Technology WARRANTIES OF ANY KIND WHETHER EXPRESS OR Incorporated in the U.S.A. and other countries. IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor, INCLUDING BUT NOT LIMITED TO ITS CONDITION, MTP, SEEVAL and The Embedded Control Solutions QUALITY, PERFORMANCE, MERCHANTABILITY OR Company are registered trademarks of Microchip Technology FITNESS FOR PURPOSE. Microchip disclaims all liability Incorporated in the U.S.A. arising from this information and its use. Use of Microchip Silicon Storage Technology is a registered trademark of devices in life support and/or safety applications is entirely at Microchip Technology Inc. in other countries. the buyer’s risk, and the buyer agrees to defend, indemnify and Analog-for-the-Digital Age, Application Maestro, BodyCom, hold harmless Microchip from any and all damages, claims, chipKIT, chipKIT logo, CodeGuard, dsPICDEM, suits, or expenses resulting from such use. No licenses are dsPICDEM.net, dsPICworks, dsSPEAK, ECAN, conveyed, implicitly or otherwise, under any Microchip ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial intellectual property rights. Programming, ICSP, Mindi, MiWi, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, mTouch, Omniscient Code Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit, PICtail, REAL ICE, rfLAB, Select Mode, SQI, Serial Quad I/O, Total Endurance, TSHARC, UniWinDriver, WiperLock, ZENA and Z-Scale are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. GestIC and ULPP are registered trademarks of Microchip Technology Germany II GmbH & Co. & KG, a subsidiary of Microchip Technology Inc., in other countries. All other trademarks mentioned herein are property of their respective companies. © 2002-2012, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. ISBN: 9781620768327 QUALITY MANAGEMENT SYSTEM Microchip received ISO/TS-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and CERTIFIED BY DNV Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures == ISO/TS 16949 == are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified.  2002-2012 Microchip Technology Inc. DS21451E-page 15

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