M TC1412/TC1412N 2A High-Speed MOSFET Drivers Features General Description • Latch-Up Protected: Will Withstand 500mA The TC1412/TC1412N are 2A CMOS buffers/drivers. Reverse Current They will not latch-up under any conditions within their • Input Will Withstand Negative Inputs Up to 5V power and voltage ratings. They are not subject to damage when up to 5V of noise spiking of either • ESD Protected: 4kV polarity occurs on the ground pin. They can accept, • High Peak Output Current: 2A without damage or logic upset, up to 500mA of current • Wide Input Supply Voltage Operating Range: of either polarity being forced back into their output. All - 4.5V to 16V terminals are fully protected against up to 4kV of • High Capacitive Load Drive Capability: electrostatic discharge. - 1000pF in 18nsec As MOSFET drivers, the TC1412/TC1412N can easily • Short Delay Time: 35nsec Typ. charge a 1000pF gate capacitance in 18nsec with • Matched Delay Times matched rise and fall times, and provide low enough impedance in both the ON and the OFF states to • Low Supply Current: ensure the MOSFET’s intended state will not be - With Logic ‘1’ Input: 500µA affected, even by large transients. The leading and - With Logic ‘0’ Input: 100µA trailing edge propagation delay times are also matched • Low Output Impedance: 4Ω to allow driving short-duration inputs with greater • Available in Space-Saving 8-pin MSOP Package accuracy. • Pinout Same as TC1410/TC1411/TC1413 Applications • Switch Mode Power Supplies • Pulse Transformer Drive • Line Drivers • Relay Driver Package Type 8-Pin MSOP/PDIP/SOIC VDD 1 8 VDD VDD 1 8 VDD IN 2 7 OUT IN 2 7 OUT TC1412 TC1412N NC 3 6 OUT NC 3 6 OUT GND 4 5 GND GND 4 5 GND 2 6,7 2 6,7 Inverting Non-Inverting NC = No Internal Connection NOTE: Duplicate pins must be connected together for proper operation.  2003 Microchip Technology Inc. DS21391C-page 1

TC1412/TC1412N Functional Block Diagram V DD TC1412 Inverting Outputs 300mV Output Non-Inverting Input Outputs TC1412N Effective 4.7V Input C = 10pF GND DS21391C-page 2  2003 Microchip Technology Inc.

TC1412/TC1412N 1.0 ELECTRICAL PIN FUNCTION TABLE CHARACTERISTICS Symbol Description Absolute Maximum Ratings † V Supply input, 4.5V to 16V DD INPUT Control input Supply Voltage.....................................................+20V NC No connection Input Voltage......................V + 0.3V to GND – 5.0V DD Power Dissipation (T ≤ 70°C) GND Ground A MSOP..........................................................340mW GND Ground PDIP............................................................730mW OUTPUT CMOS push-pull output, SOIC............................................................470mW common to pin 7 Storage Temperature Range..............-65°C to +150°C OUTPUT CMOS push-pull output, Maximum Junction Temperature......................+150ºC common to pin 6 † Stresses above those listed under "Absolute Maximum V Supply input, 4.5V to 16V DD Ratings" may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions above those indicated in the operation sections of the specifications is not implied. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability. DC ELECTRICAL CHARACTERISTICS Electrical Specifications: Unless otherwise noted, over operating temperature range with 4.5V ≤ V ≤ 16V. DD Typical values are measured at T = +25°C, V = 16V. A DD Parameters Sym Min Typ Max Units Conditions Input Logic ‘1’, High Input Voltage V 2.0 — — V IH Logic ‘0’, Low Input Voltage V — — 0.8 V IL Input Current I -1.0 — 1.0 µA 0V ≤ V ≤ V T = +25°C IN IN DD, A -10 — 10 -40°C ≤ T ≤ +85°C A Output High Output Voltage V V – 0.025 — — V DC Test OH DD Low Output Voltage V — — 0.025 V DC Test OL Output Resistance R — 4 6 Ω V = 16V, I = 10mA, T = +25°C O DD O A — 5 7 0°C ≤ T ≤ +70°C A — 5 7 -40°C ≤ T ≤ +85°C A Peak Output Current I — 2.0 — A V = 16V PK DD Latch-Up Protection I — 0.5 — A Duty cycle ≤ 2%, t ≤ 300µsec, REV Withstand Reverse Current V = 16V DD Switching Time (Note1) Rise Time t — 18 26 nsec T = +25°C R A — 20 31 0°C ≤ T ≤ +70°C A — 22 31 -40°C ≤ T ≤ +85°C, Figure4-1 A Fall Time t — 18 26 nsec T = +25°C F A — 20 31 0°C ≤ T ≤ +70°C A — 22 31 -40°C ≤ T ≤ +85°C, Figure4-1 A Note 1: Switching times ensured by design.  2003 Microchip Technology Inc. DS21391C-page 3

TC1412/TC1412N DC ELECTRICAL CHARACTERISTICS (CONTINUED) Electrical Specifications: Unless otherwise noted, over operating temperature range with 4.5V ≤ V ≤ 16V. DD Typical values are measured at T = +25°C, V = 16V. A DD Parameters Sym Min Typ Max Units Conditions Delay Time t — 35 45 nsec T = +25°C, D1 A — 40 50 0°C ≤ T ≤ +70°C A — 40 50 -40°C ≤ T ≤ +85°C, Figure4-1 A Delay Time t — 35 45 nsec T = +25°C D2 A — 40 50 0°C ≤ T ≤ +70°C A — 40 50 -40°C ≤ T ≤ +85°C, Figure4-1 A Power Supply Power Supply Current I — 0.5 1.0 mA V = 3V, V = 16V S IN DD — 0.1 0.15 V = 0V IN Note 1: Switching times ensured by design. TEMPERATURE CHARACTERISTICS Electrical Specifications: Unless otherwise noted, all parameters apply with 4.5V ≤ V ≤ 18V. DD Parameters Sym Min Typ Max Units Conditions Temperature Ranges Specified Temperature Range (C) T 0 — +70 ºC A Specified Temperature Range (E) T -40 — +85 ºC A Maximum Junction Temperature T — — +150 ºC J Storage Temperature Range T -65 — +150 ºC A Package Thermal Resistances Thermal Resistance, 8L-MSOP θ — 206 — ºC/W JA Thermal Resistance, 8L-PDIP θ — 125 — ºC/W JA Thermal Resistance, 8L-SOIC θ — 155 — ºC/W JA DS21391C-page 4  2003 Microchip Technology Inc.

TC1412/TC1412N 2.0 TYPICAL PERFORMANCE CURVES Note: The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. Note: Unless otherwise indicated, over operating temperature range with 4.5V ≤ V ≤ 16V. DD 500 500 TA = +25°C VSUPPLY = 16V VIN = 3V 400 400 µI (A)SUPPLY 230000 VIN = 3V µI (A)SUPPLY 230000 100 VIN = 0V 100 VIN = 0V 0 0 4 6 8 10 12 14 16 -40 -20 0 20 40 60 80 VDD (V) TEMPERATURE (°C) FIGURE 2-1: Quiescent Supply Current FIGURE 2-4: Quiescent Supply Current vs. Supply Voltage. vs. Temperature. 1.6 1.6 TA = +25°C VSUPPLY = 16V 1.5 1.5 V) VIH V) VIH (D 1.4 (D 1.4 OL OL H H RES 1.3 RES 1.3 H H VT VT 1.2 VIL 1.2 VIL 1.1 1.1 4 6 8 10 12 14 16 -40 -20 0 20 40 60 80 VDD (V) TEMPERATURE (°C) FIGURE 2-2: Input Threshold vs. Supply FIGURE 2-5: Input Threshold vs. Voltage. Temperature. 13 13 11 11 s) 9 TA = +85°C s) 9 TA = +85°C m m h h (OON 7 TA = +25°C (OON 7 TA = +25°C S- S- D D R 5 R 5 3 TA = -40°C 3 TA = -40°C 1 1 4 6 8 10 12 14 16 4 6 8 10 12 14 16 VDD (V) VDD (V) FIGURE 2-3: High-State Output FIGURE 2-6: Low-State Output Resistance vs. Supply Voltage. Resistance vs. Supply Voltage.  2003 Microchip Technology Inc. DS21391C-page 5

TC1412/TC1412N Note: Unless otherwise indicated, over operating temperature range with 4.5V ≤ V ≤ 16V. DD 70 70 CLOAD = 1000 pF CLOAD = 1000 pF 60 60 (nsec)RISE 4500 TA = +85°C (nsec)ALL 4500 TA = +85°C t 30 TA = +25°C tF 30 TA = +25°C 20 20 TA = -40°C TA = -40°C 10 10 4 6 8 10 12 14 16 4 6 8 10 12 14 16 VDD (V) VDD (V) FIGURE 2-7: Rise Time vs. Supply FIGURE 2-10: Fall Time vs. Supply Voltage. Voltage. 100 100 CLOAD = 1000 pF CLOAD = 1000 pF 90 90 80 80 c) 70 TA = +85°C c) 70 TA = +85°C e e t(nsD1 5600 TA = +25°C t(nsD2 5600 TA = +25°C 40 40 30 TA = -40°C 30 TA = -40°C 20 20 4 6 8 10 12 14 16 4 6 8 10 12 14 16 VDD (V) VDD (V) FIGURE 2-8: Propagation Delay vs. FIGURE 2-11: Propagation Delay vs. Supply Voltage. Supply Voltage. 60 39 50 TVAD D= =+ 2156°VC tRISE c) 38 TVAD D= =+ 2156°VC tD2 e (nsec)LL 3400 tFALL Delays (ns 3367 , tSEFA 20 gation 35 tD1 tRI opa 34 10 Pr 33 0 32 0 1000 2000 3000 4000 5000 0 1000 2000 3000 4000 5000 CLOAD (pF) CLOAD (pF) FIGURE 2-9: Rise and Fall Times vs. FIGURE 2-12: Propagation Delays vs. Capacitive Load. Capacitive Load. DS21391C-page 6  2003 Microchip Technology Inc.

TC1412/TC1412N 3.0 PIN DESCRIPTIONS 3.3 CMOS Push-Pull Output (OUTPUT) The descriptions of the pins are listed in Table3-1. The MOSFET driver output is a low-impedance, CMOS TABLE 3-1: PIN FUNCTION TABLE push-pull style output, capable of driving a capacitive load with 2A peak currents. Pin Symbol Description No. 3.4 Ground (GND) 1 V Supply input, 4.5V to 16V DD The ground pins are the return path for the bias current 2 INPUT Control input and for the high peak currents that discharge the load 3 NC No connection capacitor. The ground pins should be tied into a ground plane or have very short traces to the bias supply 4 GND Ground source return. 5 GND Ground 6 OUTPUT CMOS push-pull output, 3.5 No Connect (NC) common to pin 7 No internal connection. 7 OUTPUT CMOS push-pull output, common to pin 6 8 V Supply input, 4.5V to 16V DD 3.1 Supply Input (V ) DD The V input is the bias supply for the MOSFET driver DD and is rated for 4.5V to 16V with respect to the ground pin. The V input should be bypassed to ground with DD a local ceramic capacitor. The value of the capacitor should be chosen based on the capacitive load that is being driven. A value of 1.0µF is suggested. 3.2 Control Input (INPUT) The MOSFET driver input is a high-impedance, TTL/CMOS-compatible input. The input has 300mV of hysteresis between the high and low thresholds which prevents output glitching even when the rise and fall time of the input signal is very slow.  2003 Microchip Technology Inc. DS21391C-page 7

TC1412/TC1412N 4.0 APPLICATION INFORMATION +5V 90% Input V = 16V DD 10% 0V tD1 tD2 t t 1.0µF 0.1µF V F R DD 90% 90% 1, 8 Output 2 6, 7 10% 10% Input Output 0V C = 1000pF L Inverting Driver TC1412 TC1412 TC1412N +5V 90% Input 4, 5 10% 0V Input: 100kHz, VDD 90% 90% square wave, tD1 tD2 tRISE = tFALL ≤ 10nsec Output tR tF 0V 10% 10% Non-Inverting Driver TC1412N FIGURE 4-1: Switching Time Test Circuit. DS21391C-page 8  2003 Microchip Technology Inc.

TC1412/TC1412N 5.0 PACKAGING INFORMATION 5.1 Package Marking Information 8-Lead PDIP (300 mil) Example: XXXXXXXX TC1412 XXXXXNNN CPA057 YYWW 0347 8-Lead SOIC (150 mil) Example: XXXXXXXX TC1412 XXXXYYWW COA0347 NNN 057 8-Lead MSOP Example: XXXXXXX 1412NE YWWNNN 347057 Legend: XX...X Customer specific information* YY Year code (last 2 digits of calendar year) WW Week code (week of January 1 is week ‘01’) NNN Alphanumeric traceability code Note: In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line thus limiting the number of available characters for customer specific information. * Standard marking consists of Microchip part number, year code, week code, traceability code (facility code, mask rev#, and assembly code). For marking beyond this, certain price adders apply. Please check with your Microchip Sales Office.  2003 Microchip Technology Inc. DS21391C-page 9

TC1412/TC1412N 8-Lead Plastic Dual In-line (PA) – 300 mil (PDIP) E1 D 2 n 1 α E A A2 L c A1 β B1 p eB B Units INCHES* MILLIMETERS Dimension Limits MIN NOM MAX MIN NOM MAX Number of Pins n 8 8 Pitch p .100 2.54 Top to Seating Plane A .140 .155 .170 3.56 3.94 4.32 Molded Package Thickness A2 .115 .130 .145 2.92 3.30 3.68 Base to Seating Plane A1 .015 0.38 Shoulder to Shoulder Width E .300 .313 .325 7.62 7.94 8.26 Molded Package Width E1 .240 .250 .260 6.10 6.35 6.60 Overall Length D .360 .373 .385 9.14 9.46 9.78 Tip to Seating Plane L .125 .130 .135 3.18 3.30 3.43 Lead Thickness c .008 .012 .015 0.20 0.29 0.38 Upper Lead Width B1 .045 .058 .070 1.14 1.46 1.78 Lower Lead Width B .014 .018 .022 0.36 0.46 0.56 Overall Row Spacing § eB .310 .370 .430 7.87 9.40 10.92 Mold Draft Angle Top α 5 10 15 5 10 15 Mold Draft Angle Bottom β 5 10 15 5 10 15 * Controlling Parameter § Significant Characteristic Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side. JEDEC Equivalent: MS-001 Drawing No. C04-018 DS21391C-page 10  2003 Microchip Technology Inc.

TC1412/TC1412N 8-Lead Plastic Small Outline (OA) – Narrow, 150 mil (SOIC) E E1 p D 2 B n 1 h α 45° c A A2 φ β L A1 Units INCHES* MILLIMETERS Dimension Limits MIN NOM MAX MIN NOM MAX Number of Pins n 8 8 Pitch p .050 1.27 Overall Height A .053 .061 .069 1.35 1.55 1.75 Molded Package Thickness A2 .052 .056 .061 1.32 1.42 1.55 Standoff § A1 .004 .007 .010 0.10 0.18 0.25 Overall Width E .228 .237 .244 5.79 6.02 6.20 Molded Package Width E1 .146 .154 .157 3.71 3.91 3.99 Overall Length D .189 .193 .197 4.80 4.90 5.00 Chamfer Distance h .010 .015 .020 0.25 0.38 0.51 Foot Length L .019 .025 .030 0.48 0.62 0.76 Foot Angle φ 0 4 8 0 4 8 Lead Thickness c .008 .009 .010 0.20 0.23 0.25 Lead Width B .013 .017 .020 0.33 0.42 0.51 Mold Draft Angle Top α 0 12 15 0 12 15 Mold Draft Angle Bottom β 0 12 15 0 12 15 * Controlling Parameter § Significant Characteristic Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side. JEDEC Equivalent: MS-012 Drawing No. C04-057  2003 Microchip Technology Inc. DS21391C-page 11

TC1412/TC1412N 8-Lead Plastic Micro Small Outline Package (UA) (MSOP) E E1 p D 2 B n 1 A A2 c A1 (F) L Units INCHES MILLIMETERS* Dimension Limits MIN NOM MAX MIN NOM MAX Number of Pins n 8 8 Pitch p .026 BSC 0.65 BSC Overall Height A - - .043 - - 1.10 Molded Package Thickness A2 .030 .033 .037 0.75 0.85 0.95 Standoff A1 .000 - .006 0.00 - 0.15 Overall Width E .193 BSC 4.90 BSC Molded Package Width E1 .118 BSC 3.00 BSC Overall Length D .118 BSC 3.00 BSC Foot Length L .016 .024 .031 0.40 0.60 0.80 Footprint (Reference) F .037 REF 0.95 REF Foot Angle 0˚ - 8˚ 0˚ - 8˚ Lead Thickness c .003 .006 .009 0.08 - 0.23 Lead Width B .009 .012 .016 0.22 - 0.40 Mold Draft Angle Top 5˚ - 15˚ 5˚ - 15˚ Mold Draft Angle Bottom 5˚ - 15˚ 5˚ - 15˚ *Controlling Parameter Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side. JEDEC Equivalent: MO-187 Drawing No. C04-111 DS21391C-page 12  2003 Microchip Technology Inc.

TC1412/TC1412N PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. X /XX Examples: a) TC1412COA: 2A Single MOSFET driver, Device Temperature Package SOIC package, 0°C to +70°C. Range b) TC1412CPA: 2A Single MOSFET driver, PDIP package, 0°C to +70°C. Device: TC1412: 2A Single MOSFET Driver, Inverting c) TC1412EUA713: Tape and Reel, 2A TC1412N: 2A Single MOSFET Driver, Non-Inverting Single MOSFET driver, MSOP package, -40°C to +85°C. Temperature Range: C = 0°C to +70°C E = -40°C to +85°C a) TC1412NCPA: 2A Single MOSFET driver, PDIP package, 0°C to +70°C. Package: OA = Plastic SOIC, (150 mil Body), 8-lead b) TC1412NEPA: 2A Single MOSFET OA713 = Plastic SOIC, (150 mil Body), 8-lead (Tape and Reel) driver, PDIP package, -40°C to +85°C. UA = Plastic Micro Small Outline (MSOP), 8-lead * c) TC1412NEUA: 2A Single MOSFET UA713 = Plastic Micro Small Outline (MSOP), 8-lead * driver, MSOP package, -40°C to +85°C. (Tape and Reel) PA = Plastic DIP (300 mil Body), 8-lead * MSOP package is only available in E-Temp. Sales and Support Data Sheets Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following: 1. Your local Microchip sales office 2. The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277 3. The Microchip Worldwide Site (www.microchip.com) Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using. Customer Notification System Register on our web site (www.microchip.com/cn) to receive the most current information on our products.  2003 Microchip Technology Inc. DS21391C-page 13

TC1412/TC1412N NOTES: DS21391C-page 14  2003 Microchip Technology Inc.

Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip's Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. • Microchip is willing to work with the customer who is concerned about the integrity of their code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device Trademarks applications and the like is intended through suggestion only and may be superseded by updates. It is your responsibility to The Microchip name and logo, the Microchip logo, KEELOQ, ensure that your application meets with your specifications. MPLAB, PIC, PICmicro, PICSTART, PRO MATE and No representation or warranty is given and no liability is PowerSmart are registered trademarks of Microchip assumed by Microchip Technology Incorporated with respect Technology Incorporated in the U.S.A. and other countries. to the accuracy or use of such information, or infringement of FilterLab, microID, MXDEV, MXLAB, PICMASTER, SEEVAL patents or other intellectual property rights arising from such and The Embedded Control Solutions Company are use or otherwise. Use of Microchip’s products as critical registered trademarks of Microchip Technology Incorporated components in life support systems is not authorized except in the U.S.A. with express written approval by Microchip. No licenses are conveyed, implicitly or otherwise, under any intellectual Accuron, Application Maestro, dsPIC, dsPICDEM, property rights. dsPICDEM.net, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC, microPort, Migratable Memory, MPASM, MPLIB, MPLINK, MPSIM, PICC, PICkit, PICDEM, PICDEM.net, PowerCal, PowerInfo, PowerMate, PowerTool, rfLAB, rfPIC, Select Mode, SmartSensor, SmartShunt, SmartTel and Total Endurance are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. Serialized Quick Turn Programming (SQTP) is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. © 2003, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. Microchip received QS-9000 quality system certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona in July 1999 and Mountain View, California in March 2002. The Company’s quality system processes and procedures are QS-9000 compliant for its PICmicro® 8-bit MCUs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, non-volatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001 certified.  2003 Microchip Technology Inc. DS21391C-page 15

M WORLDWIDE SALES AND SERVICE AMERICAS ASIA/PACIFIC Japan Microchip Technology Japan K.K. Corporate Office Australia Benex S-1 6F 2355 West Chandler Blvd. Microchip Technology Australia Pty Ltd 3-18-20, Shinyokohama Chandler, AZ 85224-6199 Marketing Support Division Kohoku-Ku, Yokohama-shi Tel: 480-792-7200 Fax: 480-792-7277 Suite 22, 41 Rawson Street Kanagawa, 222-0033, Japan Technical Support: 480-792-7627 Epping 2121, NSW Tel: 81-45-471- 6166 Fax: 81-45-471-6122 Web Address: http://www.microchip.com Australia Korea Atlanta Tel: 61-2-9868-6733 Fax: 61-2-9868-6755 China - Beijing Microchip Technology Korea 3780 Mansell Road, Suite 130 168-1, Youngbo Bldg. 3 Floor Alpharetta, GA 30022 Microchip Technology Consulting (Shanghai) Samsung-Dong, Kangnam-Ku Tel: 770-640-0034 Fax: 770-640-0307 Co., Ltd., Beijing Liaison Office Seoul, Korea 135-882 Unit 915 Boston Tel: 82-2-554-7200 Fax: 82-2-558-5934 Bei Hai Wan Tai Bldg. 2 Lan Drive, Suite 120 No. 6 Chaoyangmen Beidajie Singapore Westford, MA 01886 Beijing, 100027, No. China Microchip Technology Singapore Pte Ltd. Tel: 978-692-3848 Fax: 978-692-3821 Tel: 86-10-85282100 Fax: 86-10-85282104 200 Middle Road Chicago China - Chengdu #07-02 Prime Centre Singapore, 188980 333 Pierce Road, Suite 180 Microchip Technology Consulting (Shanghai) Tel: 65-6334-8870 Fax: 65-6334-8850 Itasca, IL 60143 Co., Ltd., Chengdu Liaison Office Taiwan Tel: 630-285-0071 Fax: 630-285-0075 Rm. 2401-2402, 24th Floor, Dallas Ming Xing Financial Tower Microchip Technology (Barbados) Inc., No. 88 TIDU Street Taiwan Branch 4570 Westgrove Drive, Suite 160 11F-3, No. 207 Addison, TX 75001 CTehle: n8g6d-2u8 6-81607061662, 0C0h inFaax: 86-28-86766599 Tung Hua North Road Tel: 972-818-7423 Fax: 972-818-2924 Taipei, 105, Taiwan China - Fuzhou Detroit Tel: 886-2-2717-7175 Fax: 886-2-2545-0139 Microchip Technology Consulting (Shanghai) Tri-Atria Office Building Co., Ltd., Fuzhou Liaison Office EUROPE 32255 Northwestern Highway, Suite 190 Farmington Hills, MI 48334 Unit 28F, World Trade Plaza Austria No. 71 Wusi Road Tel: 248-538-2250 Fax: 248-538-2260 Microchip Technology Austria GmbH Fuzhou 350001, China Kokomo Tel: 86-591-7503506 Fax: 86-591-7503521 Durisolstrasse 2 2767 S. Albright Road China - Hong Kong SAR A-4600 Wels Austria Kokomo, IN 46902 Microchip Technology Hongkong Ltd. Tel: 43-7242-2244-399 Tel: 765-864-8360 Fax: 765-864-8387 Unit 901-6, Tower 2, Metroplaza Fax: 43-7242-2244-393 Los Angeles 223 Hing Fong Road Denmark 18201 Von Karman, Suite 1090 Kwai Fong, N.T., Hong Kong Microchip Technology Nordic ApS Irvine, CA 92612 Tel: 852-2401-1200 Fax: 852-2401-3431 Regus Business Centre Tel: 949-263-1888 Fax: 949-263-1338 China - Shanghai Lautrup hoj 1-3 Phoenix Microchip Technology Consulting (Shanghai) Ballerup DK-2750 Denmark 2355 West Chandler Blvd. Co., Ltd. Tel: 45-4420-9895 Fax: 45-4420-9910 Chandler, AZ 85224-6199 Room 701, Bldg. B France Far East International Plaza Tel: 480-792-7966 Fax: 480-792-4338 Microchip Technology SARL No. 317 Xian Xia Road Parc d’Activite du Moulin de Massy San Jose Shanghai, 200051 43 Rue du Saule Trapu Microchip Technology Inc. Tel: 86-21-6275-5700 Fax: 86-21-6275-5060 Batiment A - ler Etage 2107 North First Street, Suite 590 China - Shenzhen 91300 Massy, France San Jose, CA 95131 Microchip Technology Consulting (Shanghai) Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79 Tel: 408-436-7950 Fax: 408-436-7955 Co., Ltd., Shenzhen Liaison Office Germany Toronto Rm. 1812, 18/F, Building A, United Plaza Microchip Technology GmbH 6285 Northam Drive, Suite 108 No. 5022 Binhe Road, Futian District Steinheilstrasse 10 Mississauga, Ontario L4V 1X5, Canada Shenzhen 518033, China D-85737 Ismaning, Germany Tel: 905-673-0699 Fax: 905-673-6509 Tel: 86-755-82901380 Fax: 86-755-82966626 Tel: 49-89-627-144-0 China - Qingdao Fax: 49-89-627-144-44 Rm. B505A, Fullhope Plaza, Italy No. 12 Hong Kong Central Rd. Microchip Technology SRL Qingdao 266071, China Via Quasimodo, 12 Tel: 86-532-5027355 Fax: 86-532-5027205 20025 Legnano (MI) India Milan, Italy Microchip Technology Inc. Tel: 39-0331-742611 Fax: 39-0331-466781 India Liaison Office United Kingdom Marketing Support Division Microchip Ltd. Divyasree Chambers 505 Eskdale Road 1 Floor, Wing A (A3/A4) Winnersh Triangle No. 11, O’Shaugnessey Road Wokingham Bangalore, 560 025, India Berkshire, England RG41 5TU Tel: 91-80-2290061 Fax: 91-80-2290062 Tel: 44-118-921-5869 Fax: 44-118-921-5820 03/25/03 DS21391C-page 16  2003 Microchip Technology Inc.

Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: M icrochip: TC1412EUA TC1412EPA TC1412EOA TC1412NCOA713 TC1412NEPA TC1412NEOA TC1412NEUA713 TC1412COA TC1412CPA TC1412NEOA713 TC1412EUA713 TC1412NEUA TC1412COA713 TC1412NCPA TC1412NCOA TC1412EOA713