SPECIFICATION Part No. : SWLP.2450.12.4.B.02 Product Name : 12mm*12mm*4mm 2.4GHz SMD Patch Antenna Features : 2.4 - 2.5 GHz Patch Antenna For Wi-Fi/WLAN/ISM/Zigbee Industrial Applications High Gain 2dBi Linearly Polarized ROHS Compliant Top Bottom SPE-13-8-007/D/SS Page 1 of 19

1. Introduction This 12mm*12mm*4mm high gain 2.4GHz patch antenna is ideally suited for high performance industrial applications in the 2.4 GHz Wi-Fi, ISM, and Zigbee bands. This product has highest gain in the XZ (azimuth) plane direction, most suitable for fixed wireless applications where transmission and reception is focused to one hemisphere of the device, for example a wireless meter on a reinforced concrete wall. It can also be placed anywhere on the device ground-plane, unlike most chip or loop antennas which need to be edge mounted. 2. Key Antenna Performance Indicators* ELECTRICAL Frequency Range 2400 MHz to 2500 MHz Bandwidth 100 MHz @ -7dB Efficiency 80.12% @ 2450 MHz Polarization Linear VSWR 3.0 max @ Center Frequency Peak Gain +2 dBi typ. Impedance 50 Ohms MECHANICAL Dimensions 12mm x 12mm x 4mm Weight 4g ENVIRONMENTAL Operating Temperature -40℃ to +85℃ Storage Temperature -40℃ to +85℃ Termination Ag (Environmentally Friendly Pb Free) Original Patch Specification measured on EVB 50*50mm. Actual value depends on ground-plane and housing SPE-13-8-007/D/SS Page 2 of 19

3. Electrical Specifications 3.1 Return Loss SPE-13-8-007/D/SS Page 3 of 19

3.2 Definition of X-Y-Z Plane Y X Z SPE-13-8-007/D/SS Page 4 of 19

3.3 Radiation Patterns XY-Plane X 0 10 330 30 0 -10 300 60 -20 -30 270 -40 90 Y 2400MHz 240 120 2450MHz 210 150 2500MHz (dB) 180 SPE-13-8-007/D/SS Page 5 of 19

XZ-Plane Z 0 10 330 30 0 -10 300 60 -20 -30 270 -40 90 X 2400MHz 240 120 2450MHz 210 150 2500MHz (dB) 180 SPE-13-8-007/D/SS Page 6 of 19

YZ-Plane Z 0 10 330 30 0 -10 300 60 -20 -30 270 -40 90 Y 2400MHz 240 120 2450MHz 210 150 2500MHz (dB) 180 SPE-13-8-007/D/SS Page 7 of 19

3.4 Efficiency SPE-13-8-007/D/SS Page 8 of 19

3.5 Average Gain 3.6 Peak Gain SPE-13-8-007/D/SS Page 9 of 19

3.7 3D Radiation Pattern 2400MHz 2450MHz SPE-13-8-007/D/SS Page 10 of 19

2500MHz SPE-13-8-007/D/SS Page 11 of 19

4. Shape and Dimensions 4.1 Evaluation Board Dimensions SPE-13-8-007/D/SS Page 12 of 19

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5. Footprint 5.1 Top Copper SPE-13-8-007/D/SS Page 14 of 19

5.2 Top Solder paste SPE-13-8-007/D/SS Page 15 of 19

5.3 Top Solder Mask SPE-13-8-007/D/SS Page 16 of 19

5.4 Composite Diagram SPE-13-8-007/D/SS Page 17 of 19

6. Packaging SPE-13-8-007/D/SS Page 18 of 19

6. Recommended Reflow Temperature Profile SWLP.12B can be assembled following Pb-free assembly. According to the Standard IPC/JEDEC J-STD-020C, the temperature profile suggested is as follow: Phase Profile Features Pb-Free Assembly (SnAgCu) PREHEAT Temperature Min(Tsmin) 150°C Temperature Max(Tsmax) 200°C Time(ts) from (Tsmin to Tsmax) 60-120 seconds RAMP-UP Avg. Ramp-up Rate (Tsmax to 3°C/second(max) TP) REFLOW Temperature(TL) 217°C Total Time above TL (tL) 30-100 seconds PEAK Temperature(TP) 260°C Time(tp) 2-5 seconds RAMP-DOWN Rate 3°C/second(max) Time from 25°C to Peak Temperature 8 minutes max. Composition of solder paste 96.5Sn/3Ag/0.5Cu Solder Paste Model SHENMAO PF606-P26 Soldering Iron condition: Soldering iron temperature 270°C±10°C. Apply preheating at 120°C for 2-3 minutes. Finish soldering for each terminal within 3 seconds, if soldering iron temperature over270°C±10°C or 3 seconds, it will make cause component surface peeling or damage. SPE-13-8-007/D/SS Page 19 of 19