STTH3R02 Ultrafast recovery diode Datasheet - production data Table 1. Device summary A K I 3 A F(AV) V 200 V RRM T (max) 175 °C j AA AA V (typ) 0.7 V F KK DO-201AD KK DO-15 trr (typ) 16 ns STTH3R02 STTH3R02Q A K SMC STTH3R02S Features • Very low conduction losses • Negligible switching losses • Low forward and reverse recovery times • High junction temperature Description The STTH3R02 uses ST's new 200 V planar Pt doping technology, and it is specially suited for switching mode base drive and transistor circuits. Packaged in DO-201AD, DO-15, and SMC, this device is intended for use in low voltage, high frequency inverters, free wheeling and polarity protection. April 2014 DocID12359 Rev 3 1/9 This is information on a product in full production. www.st.com

Characteristics STTH3R02 1 Characteristics Table 2. Absolute ratings (limiting values at T = 25 °C, unless otherwise specified) j Symbol Parameter Value Unit V Repetitive peak reverse voltage 200 V RRM IFRM Repetitive peak forward current tp = 5 µs, F = 5 kHz 110 A DO-201AD / DO-15 70 I Forward rms current A F(RMS) SMC 70 DO-15 T = 50 °C lead I Average forward current, δ = 0.5 DO-201AD T = 90 °C 3 A F(AV) lead SMC T = 110 °C c I Surge non repetitive forward current t = 10 ms Sinusoidal 75 A FSM p T Storage temperature range -65 to + 175 °C stg T Maximum operating junction temperature 175 °C j Maximum lead temperature for soldering during 10 s at 4 mm from T 230 °C L case Table 3. Thermal parameters Symbol Parameter Value Unit Lead Length = 10 mm on infinite DO-15 45 R Junction to lead th(j-l) heatsink DO-201AD 30 °C/W R Junction to case SMC 20 th(j-c) Table 4. Static electrical characteristics Symbol Parameter Test conditions Min. Typ. Max. Unit I (1) Reverse leakage Tj = 25 °C V = V 3 µA R current T = 125 °C R RRM 3 30 j T = 25 °C I = 9 A 1.20 j F T = 25 °C 0.89 1.0 V (2) Forward voltage drop j V F T = 100 °C I = 3 A 0.76 0.85 j F T = 150 °C 0.70 0.80 j 1. Pulse test: t = 5 ms, δ < 2 % p 2. Pulse test: t = 380 µs, δ < 2 % p To evaluate the conduction losses use the following equation: P = 0.68 x I + 0.04 I 2 F(AV) F (RMS) 2/9 DocID12359 Rev 3

STTH3R02 Characteristics Table 5. Dynamic characteristics Symbol Parameter Test conditions Min. Typ. Max. Unit I = 1 A, dI /dt = -50 A/µs, F F 24 30 V = 30 V, T = 25 °C R j t Reverse recovery time ns rr I = 1 A, dI /dt = -100 A/µs, F F 16 20 V = 30 V, T = 25 °C R j I = 3 A, dI /dt = -200 A/µs, I Reverse recovery current F F 3.5 4.5 A RM V = 160 V, T = 125 °C R j I = 3 A, dI /dt = 100 A/µs t Forward recovery time F F 40 ns fr V = 1.1 x V , T = 25 °C FR Fmax j I = 3 A, dI /dt = 100 A/µs, F F V Forward recovery voltage 1.9 V FP T = 25 °C j Figure 1 . peak current versus duty cycle Figure 2. Forward voltage drop versus forward current (typical values) IM(A) 100 IFM(A) TT 50 IIMM 80 dδ==ttpp//TT ttpp 40 60 30 PP == 1100WW 40 20 PP == 55WW PP == 33WW 20 10 Tj=150°C δ Tj=25°C VFM(V) 0 0 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 0.0 0.5 1.0 1.5 2.0 Figure 3. Fo r ward voltage drop versus forward Figure 4. Relative variation of thermal current (maximum values) impedance junction to ambient versus pulse duration - DO-201AD 50 IFM(A) 1.0 Zth(j-a)/Rth(j-a) 0.9 Epoxy printed circuit board FR4,eCU= 35 µm 40 0.8 LDleOad-s2=0110A mDm 0.7 30 0.6 0.5 20 0.4 Tj=150°C 0.3 10 Tj=25°C 0.2 Single pulse VFM(V) 0.1 tP(s) 0 0.0 0.0 0.5 1.0 1.5 2.0 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03 DocID12359 Rev 3 3/9 9

Characteristics STTH3R02 Figure 5 . Relative variation of thermal Figure 6. Relative variation of thermal impedance junction to ambient versus pulse impedance junction to ambient versus pulse duration - DO-15 duration - SMC 1.0 Zth(j-a)/Rth(j(-ja-a)) 1.0 Zth(j-a)/Rth(j-a) 0.9 Epoxy printed circuit board FR4,eCU= 35 µm 0.9 Epoxy printed circuit board FR4,eCU= 35 µm 0.8 LleaDdsO=1-105 mm 0.8 SMC 0.7 0.7 Scu=1 cm² 0.6 0.6 0.5 0.5 0.4 0.4 0.3 0.3 0.2 0.2 0.1 Single pulse 0.1 Single pulse 0.0 tP(s) 0.0 tP(s) 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03 1.E-03 1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03 Figure 7. Ju n ction capacitance versus reverse Figure 8. Reverse recovery charges versus applied voltage (typical values) dI /dt (typical values) F 100 C(pF) 80 QRR(nC) VosFcT==j=3120M5m°HVCzRMS 70 VRIF==136A0V 60 50 10 40 Tj=125°C 30 20 Tj=25°C 10 VR(V) dIF/dt(A/µs) 1 0 1 10 100 1000 10 100 1000 Figure 9. R e verse recovery time versus dI /dt Figure 10. Peak reverse recovery current F (typical values) versus dI /dt (typical values) F tRR(ns) IRM(A) 60 8 VRIF==136A0V 7 VRIF==136A0V 50 6 40 5 Tj=125°C 30 4 Tj=125°C 20 Tj=25°C 3 2 10 1 Tj=25°C dIF/dt(A/µs) dIF/dt(A/µs) 0 0 10 100 1000 10 100 1000 4/9 DocID12359 Rev 3

STTH3R02 Ordering information scheme Figure 11. D y namic parameters versus junction Figure 12. Thermal resistance junction to temperature ambient versus copper surface under each lead QRR;IRM[Tj]/QRR;IRM[Tj=125°C] Rth(j-a)(°C/W) 1.4 100 1.2 VRIF==136A0V 90 Epoxy printed circuit board FR4,eCU= 35 µm 80 1.0 70 0.8 IRM 60 DO-15 50 0.6 DO-201AD QRR 40 0.4 30 20 0.2 0.0 Tj(°C) 100 SCu(cm²) 25 50 75 100 125 150 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 Figure 13. T hermal resistance versus copper Figure 14. Thermal resistance versus lead surface under each lead for SMC length for DO-201AD package 100 Rth(j-a)(°C/W) 100 Rth(°C/W) Epoxy printed circuit board FR4,eCU= 35 µm SMC 90 DO-201AD 80 80 Rth(j-a) 70 60 60 50 40 40 Rth(j-l) 30 20 20 SCU(cm²) 10 Lleads(mm) 0 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5 10 15 20 25 2 Ordering information scheme Figure 15. Ordering information scheme STTH 3 R 02 XXX Ultrafast switching diode Average forward current 3 = 3 A Model R Repetitive peak reverse voltage 02 = 200V Package Blank = DO-201 in Ammopack RL = DO-201 inTape and reel Q = DO-15 in Ammopack QRL = DO-15 inTape and reel S= SMC inTape and reel DocID12359 Rev 3 5/9 9

Package information STTH3R02 3 Package information • Epoxy meets UL94, V0 • Cooling method: by conduction (C) In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Table 6. DO-201AD dimensions Dimensions Ref. Millimeters Inches Min. Max. Min. Max. B A B A 9.50 0.374 Note 1 E E Note 1 B 25.40 1.000 ØD Note 2 C 5.30 0.209 ØC D 1.30 0.051 E 1.25 0.049 1 - The lead diameter ø D is not controlled over zone E Notes 2 - The minimum length which must stay straight between the right angles after bending is 0.59"(15mm) Table 7. DO-15 dimensions Dimensions C A C Ref. Millimeters Inches Min. Max. Min. Max. A 6.05 6.75 0.238 0.266 B 2.95 3.53 0.116 0.139 D B C 26 31 1.024 1.220 D 0.71 0.88 0.028 0.035 6/9 DocID12359 Rev 3

STTH3R02 Package information Table 8. SMC dimensions Dimensions Ref. Millimeters Inches E1 Min. Max. Min. Max. A1 1.90 2.45 0.075 0.096 D A2 0.05 0.20 0.002 0.008 b 2.90 3.2 0.114 0.126 c 0.15 0.41 0.006 0.016 E E 7.75 8.15 0.305 0.321 A1 E1 6.60 7.15 0.260 0.281 C A2 E2 4.40 4.70 0.173 0.185 E2 L b D 5.55 6.25 0.218 0.246 L 0.75 1.60 0.030 0.063 Figure 16. SMC footprint (dimensions in mm) 2.20 4.25 2.20 3.30 8.65 DocID12359 Rev 3 7/9 9

Ordering information STTH3R02 4 Ordering information Table 9. Ordering information Order code Marking Package Weight Base qty Delivery mode STTH3R02 STTH3R02 DO-201AD 1.16 g 600 Ammopack STTH3R02RL STTH3R02 DO-201AD 1.16 g 1900 Tape and reel STTH3R02Q STTH3R02 DO-15 0.4 g 1000 Ammopack STTH3R02QRL STTH3R02 DO-15 0.4 g 6000 Tape and reel STTH3R02S 3R2S SMC 0.243 g 2500 Tape and reel 5 Revision history Table 10. Document revision history Date Revision Changes 03-May-2006 1 First issue. 10-Oct-2006 2 Added SMC package. 17-Apr-2014 3 Updated ECOPACK statement. Reformatted to current standards. 8/9 DocID12359 Rev 3

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