STTH10R04 High efficiency rectifier Datasheet - production data Description A K The device is an ultrafast recovery power rectifier dedicated to energy recovery in PDP application. It is especially designed for clamping function in energy recovery block. K K The compromise between forward voltage drop and recovery time offers optimized performance. Table 1: Device summary A A NC NC Symbol Value D2PAK IF(peak) 10 A VRRM 400 V Features Tj (max) 175 °C VF (typ) 1.15 V  Ultrafast recovery  Low power losses trr (typ.) 15 ns  High surge capability  Low leakage current  High junction temperature  ECOPACK®2 compliant component for D²PAK on demand August 2017 DocID13971 Rev 2 1/11 This is information on a product in full production. www.st.com

Characteristics STTH10R04 1 Characteristics Table 2: Absolute ratings (limiting values, at 25 °C, unless otherwise specified) Symbol Parameter Value Unit VRRM Repetitive peak reverse voltage 400 V IF(RMS) Forward rms current 20 A TC = 135 °C IF(peak) Peak working forward current 10 A δ = 0.5 square wave IFSM Surge non repetitive forward current tp = 10 ms sinusoidal 100 A Tstg Storage temperature range -65 to +175 °C Tj Maximum operating junction temperature 175 °C Table 3: Thermal parameter Symbol Parameter Max. value Unit Rth(j-c) Junction to case 3.5 °C/W Table 4: Static electrical characteristics Symbol Parameter Test conditions Min. Typ. Max. Unit Tj = 25 °C - 10 IR(1) Reverse leakage current VR = VRRM µA Tj = 125 °C - 10 100 Tj = 25 °C - 1.50 1.70 VF(2) Forward voltage drop IF = 10 A V Tj = 125 °C - 1.15 1.35 Notes: (1)Pulse test: tp = 5 ms, δ < 2% (2)Pulse test: tp = 380 µs, δ < 2% To evaluate the conduction losses, use the following equation: P = 1.05 x I + 0.03 x I 2 F(AV) F (RMS) 2/11 DocID13971 Rev 2

STTH10R04 Characteristics Table 5: Dynamic electrical characteristics Symbol Parameter Test conditions Min. Typ. Max. Unit IF = 0.5 A, Irr = 0.25 A, - 15 20 Reverse recovery IR = 1 A trr time Tj = 25 °C IF = 1 A, ns VR = 30 V, - 40 dIF/dt = -50 A/μs IF = 10 A, Forward recovery tfr time Tj = 25 °C dIF/dt = 100 A/μs - 140 ns VFR = 1.1 x VFmax VFP Fvoolrtwagaerd recovery Tj = 25 °C IdFI F=/d 1t 0= A 1,0 0 A/μs - 3 V IRM Rcuervreenrst e recovery Tj = 125 °C IVFR = = 1 200 A0, V - 6.2 8.0 A Sfactor Softness factor dIF/dt = 200 A/μs - 0.3 - DocID13971 Rev 2 3/11

Characteristics STTH10R04 1.1 Characteristics (curves) Figure 1: Conduction losses versus average forward current Figure 2: Forward voltage drop versus forward current 18 P(W) 200 IF(A) δ=0.05 δ=0.1 δ=0.2 δ=0.5 δ=1 180 16 Tj=125°C 160 (Maximumvalues) 14 140 12 120 Tj=125°C (Typicalvalues) 10 100 8 80 Tj=25°C 6 (Maximumvalues) 60 4 T 40 2 IF(AV)(A) δ=tp/T tp 20 VF(V) 0 0 0 2 4 6 8 10 12 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 Figure 3: Relative variation of thermal impedance Figure 4: Peak reverse recovery current versus junction to case versus pulse duration dIF/dt (typical values) 1.0 Zth(j-c)/Rth(j-c) 14 IRM(A) 0.9 Singlepulse 13 IF=IF(PEAK) 12 VR=200V 0.8 11 Tj=125°C 0.7 10 9 0.6 8 0.5 7 6 0.4 5 0.3 4 0.2 3 2 0.1 tP(s) 1 dIF/dt(A/µs) 0.0 0 1.E-04 1.E-03 1.E-02 1.E-01 1.E+00 0 50 100 150 200 250 300 350 400 450 500 Figure 5: Reverse recovery time versus dIF/dt Figure 6: Reverse recovery charges versus dIF/dt (typical values) (typical values) 80 trr(ns) 300 Qrr(nC) 70 TVIFjR===1IF22(P05E0A°KCV) 250 TVIFjR===I1F22(P05E0A°KVC) 60 200 50 40 150 30 100 20 50 10 dIF/dt(A/µs) dIF/dt(A/µs) 0 0 0 50 100 150 200 250 300 350 400 450 500 0 50 100 150 200 250 300 350 400 450 500 4/11 DocID13971 Rev 2

STTH10R04 Characteristics Figure 7: Reverse recovery softness factor versus Figure 8: Relative variation of dynamic parameters dIF/dt (typical values) versus junction temperature S factor 3.0 0.8 00..67 IFTV<jR=2=1x22I05F0(P°ECVAK) 2222....2468 Sfactor RefereVIFnR=c=eI:F2(TP0jE0=AKV1)25°C 2.0 0.5 1.8 1.6 0.4 1.4 1.2 0.3 1.0 0.8 IRM 0.2 0.6 0.4 0.1 0.2 Qrr Tj(°C) dIF/dt(A/µs) 0.0 0.0 25 50 75 100 125 0 50 100 150 200 250 300 350 400 450 500 Figure 9: Forward recovery voltage versus dIF/dt Figure 10: Forw(atrydp irceaclo vvaelruye tsi)me versus dIF/dt (typical values) 12 VFP(V) 200 tfr(ns) 1101 TIFj==1IF2(P5EA°KC) 116800 VFR=TIFj1==.11IF2x(P5EVA°FKC)max. 9 140 8 120 7 6 100 5 80 4 60 3 40 2 20 1 dIF/dt(A/µs) 0 dIF/dt(A/µs) 0 0 50 100 150 200 250 300 350 400 450 500 0 50 100 150 200 250 300 350 400 450 500 Figure 12: Thermal resistance junction to ambient Figure 11: Junction capacitance versus reverse versus copper surface under tab voltage applied (typical values) 100 C(pF) 80 Rth(j-a)(°C/W) F=1MHz D²PAK VOSC=30mVRMS 70 EpoxyprintedboardFR4,copperthickness=35µm Tj=25°C 60 50 40 30 20 10 VR(V) SCu(cm²) 10 0 1 10 100 1000 0 5 10 15 20 25 30 35 40 DocID13971 Rev 2 5/11

Package information STTH10R04 2 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark.  Cooling method: by conduction (C)  Epoxy meets UL94,V0 6/11 DocID13971 Rev 2

STTH10R04 Package information 2.1 D²PAK package information Figure 13: D²PAK package outline This package drawing may slightly differ from the physical package. However, all the specified dimensions are guaranteed. DocID13971 Rev 2 7/11

Package information STTH10R04 Table 6: D²PAK package mechanical data Dimensions Ref. Millimeters Inches Min. Max. Min. Max. A 4.36 4.60 0.172 0.181 A1 0.00 0.25 0.000 0.010 b 0.70 0.93 0.028 0.037 b2 1.14 1.70 0.045 0.067 c 0.38 0.69 0.015 0.027 c2 1.19 1.36 0.047 0.053 D 8.60 9.35 0.339 0.368 D1 6.90 8.00 0.272 0.311 D2 1.10 1.50 0.043 0.060 E 10.00 10.55 0.394 0.415 E1 8.10 8.90 0.319 0.346 E2 6.85 7.25 0.266 0.282 e 2.54 typ. 0.100 e1 4.88 5.28 0.190 0.205 H 15.00 15.85 0.591 0.624 J1 2.49 2.90 0.097 0.112 L 1.90 2.79 0.075 0.110 L1 1.27 1.65 0.049 0.065 L2 1.30 1.78 0.050 0.070 R 0.4 typ. 0.015 V2 0° 8° 0° 8° 8/11 DocID13971 Rev 2

STTH10R04 Package information Figure 14: D²PAK recommended footprint (dimensions in mm) DocID13971 Rev 2 9/11

Ordering information STTH10R04 3 Ordering information Table 7: Ordering information Order code Marking Package Weight Base qty. Delivery mode STTH10R04G-TR STTH10R04G D2PAK 1.38 g 1000 Tape and reel 4 Revision history Table 8: Document revision history Date Revision Changes 07-Nov-2007 1 First issue. Updated features and package silhouette. Minor text changes to improve readability. 08-Aug-2017 2 Updated Section 1: "Characteristics", Section 1.1: "Characteristics (curves)", Section 2: "Package information" and Section 3: "Ordering information". 10/11 DocID13971 Rev 2

STTH10R04 IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2017 STMicroelectronics – All rights reserved DocID13971 Rev 2 11/11

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