STTH102 Datasheet 200 V - 1 A high efficiency ultrafast diode K A Features • Very low conduction losses A • Negligible switching losses • Low forward voltage drop A • High junction temperature • ECOPACK®2 compliant K K Applications SMA DO-41 • Switching diode • LED Lighting • Auxiliary power supply • Flyback diode Description The STTH102 uses ST's new 200 V planar Pt doping technology, and it is specially suited for switching mode base drive and transistor circuits. Packaged in SMA and DO-41, the STTH102 is ideal for use as a free wheeling diode in power supplies and other power switching applications. Product status STTH102 Product summary Symbol Value IF(AV) 1 A VRRM 200 V T j(max.) 175 °C VF(typ.) 0.68 V trr(typ.) 12 ns DS2448 - Rev 6 - December 2018 www.st.com For further information contact your local STMicroelectronics sales office.

STTH102 Characteristics 1 Characteristics Table 1. Absolute ratings (limiting values at 25 °C, unless otherwise specified) Symbol Parameter Value Unit VRRM Repetitive peak reverse voltage 200 V SMA TL = 145 °C IF(AV) Average forward current δ = 0.5, square wave 1 A DO-41 TL = 130 °C SMA 40 IFSM Surge non repetitive forward current tp = 10 ms sinusoidal A DO-41 50 Tstg Storage temperature range -65 to +175 °C Tj Operating junction temperature +175 °C Table 2. Thermal resistance parameter Symbol Parameter Max. value Unit Junction to lead SMA 30 Rth(j-l) °C/W Junction to lead Lead length = 10 mm DO-41 50 For more information, please refer to the following application note : • AN5088 : Rectifiers thermal management, handling and mounting recommendations Table 3. Static electrical characteristics Symbol Parameter Test conditions Min. Typ. Max. Unit Tj = 25 °C - 1 IR(1) Reverse leakage current VR = VRRM µA Tj = 125 °C - 1 25 Tj = 25 °C - 0.97 VF(2) Forward voltage drop IF = 1 A V Tj = 125 °C - 0.68 0.78 1. Pulse test: tp = 5 ms, δ < 2% 2. Pulse test: tp = 380 µs, δ < 2% To evaluate the conduction losses, use the following equation: P = 0.65 x I + 0.130 x I 2 F(AV) F (RMS) For more information, please refer to the following application notes related to the power losses : • AN604: Calculation of conduction losses in a power rectifier • AN4021: Calculation of reverse losses on a power diode DS2448 - Rev 6 page 2/12

STTH102 Characteristics Table 4. Dynamic characteristics (T = 25 °C unless otherwise stated) j Symbol Parameters Test conditions Min. Typ. Max. Unit trr Reverse recovery time IF = 0.5 A, Irr = 0.25 A, IR = 1 A - 12 20 ns tfr Forward recovery time IF = 1 A, dIF/dt = 50 A/ms, VFR = 1.1 VF(max.) - 50 ns VFP Forward recovery voltage IF = 1 A, dIF/dt = 50 A/µs - 1.8 V DS2448 - Rev 6 page 3/12

STTH102 Characteristics (curves) 1.1 Characteristics (curves) Figure 1. Average forward power dissipation versus Figure 2. Average forward power dissipation versus average forward current (SMA) average forward current (DO-41) PF(AV)(W) PF(AV)(W) 1.0 1.0 0.9 δ= 0.05 δ= 0.1 δ= 0.2 δ= 0.5 0.9 δ= 0.05 δ= 0.1 δ= 0.2 δ= 0.5 0.8 0.8 0.7 δ= 1 0.7 δ= 1 0.6 0.6 0.5 0.5 0.4 0.4 0.3 0.3 T T 0.2 0.2 0.1 IF(AV)(A) δ=tp/T tp 0.1 IF(AV)(A) δ=tp/T tp 0.0 0.0 0.0 0.2 0.4 0.6 0.8 1.0 1.2 0.00 0.25 0.50 0.75 1.00 1.25 Figure 4. (DO-41)Average forward current versus ambient Figure 3. Average forward current versus ambient temperature (δ = 0.5) (DO-41) temperature (δ = 0.5) (SMA) IF(AV)(A) 1.2 IF(AV)(A) Rth(j-a)=Rth(j-I) 1.2 1.0 Rth(j-a)=Rth(j-I) 1.0 0.8 0.8 0.6 Rth(j-a)=120°C/W 0.6 Rth(j-a)=110°C/W 0.4 T 0.4 0.2 T d=tp/T tp Tamb(°C) 0.2 0.0 d=tp/T tp Tamb(°C) 0 25 50 75 100 125 150 175 0.0 0 25 50 75 100 125 150 175 DS2448 - Rev 6 page 4/12

STTH102 Characteristics (curves) Figure 5. Relative variation of thermal impedance junction Figure 6. Relative variation of thermal impedance junction to ambient versus pulse duration (epoxy printed circuit to ambient versus pulse duration (DO-41) board, e(Cu) = 35 μm,recommended pad layout) (SMA) Zth(j-c)/Rth(j-c) 1.0 Zth(j-a)/Rth(j-a) 1.0 0.9 0.9 0.8 0.8 0.7 0.7 0.6 0.6 0.5 0.5 0.4 0.4 0.3 0.3 0.2 0.2 0.1 0.1 Single pulse tp(s) Single pulse tp(s) 0.0 0.0 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03 Figure 8. Junction capacitance versus reverse voltage Figure 7. Forward voltage drop versus forward current applied (typical values) I F (A) 100.0 C(pF) 100 F=1MHz (maxTimj=u1m25 v°aClues) VOSCT=j=3205m°CVRMS 10.0 Tj=125°C (typical values) (maxiTmj=u2m5 °vCalues) 10 1.0 0.1 VF (V) VR(V) 1 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 1 10 100 1000 Figure 10. Thermal resistance junction to ambient versus Figure 9. Relative variations of dynamic parameters copper surface under each lead (typical values) versus junction temperature IRM;trr;Qrr[Tj] /IRM;trr;Qrr[Tj=25°C] 200 Rth(j-a)(°C/W) 3.5 SMA IF=IF(AV) dIF/dt=200A/µs VR=100V 3.0 150 QRR 2.5 100 2.0 Epoxy printed board FR4, eCu = 35 µm trr 50 1.5 IRM SCu(cm²) Tj(°C) 0 1.0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 25 50 75 100 125 150 175 DS2448 - Rev 6 page 5/12

STTH102 Characteristics (curves) Figure 11. Thermal resistance versus lead length (DO-41) Rth(°C/W) 120 Rth(j-a) 100 80 60 Rth(j-I) 40 20 Lleads(mm) 0 5 10 15 20 25 DS2448 - Rev 6 page 6/12

STTH102 Package information 2 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. 2.1 DO-41 package information • Epoxy meets UL 94, V0 Figure 12. DO-41 package outline C A C ØD ØB Table 5. DO-41 package mechanical data Dimensions Ref. Millimeters Inches (for reference only) Min. Typ. Max. Min. Typ. Max. A 4.07 - 5.20 0.160 - 0.205 B 2.04 - 2.71 0.080 - 0.107 C 25.40 - 1.000 - D 0.71 - 0.86 0.028 - 0.0034 DS2448 - Rev 6 page 7/12

STTH102 SMA package information 2.2 SMA package information • Epoxy meets UL94, V0 • Cooling method : by conduction (C) Figure 13. SMA package outline E1 D E A1 C A2 L b Table 6. SMA package mechanical data Dimensions Ref. Millimeters Inches (for reference only) Min. Max. Min. Max. A1 1.90 2.45 0.074 0.097 A2 0.05 0.20 0.001 0.008 b 1.25 1.65 0.049 0.065 c 0.15 0.40 0.005 0.016 D 2.25 2.90 0.088 0.115 E 4.80 5.35 0.188 0.211 E1 3.95 4.60 0.155 0.182 L 0.75 1.50 0.029 0.060 DS2448 - Rev 6 page 8/12

STTH102 SMA package information Figure 14. SMA recommended footprint in mm (inches) 1.4 2.63 1.4 (0.055) (0.104) (0.055) 1.64 (0.065) 5.43 (0.214) DS2448 - Rev 6 page 9/12

STTH102 Ordering information 3 Ordering information Table 7. Ordering information Order code Marking Package Weight Base qty. Delivery mode STTH102A U12 SMA 0.068 g 5000 Tape and reel STTH102 STTH102 DO-41 0.34 g 2000 Ammopack STTH102RL STTH102 DO-41 0.34 g 5000 Tape and reel DS2448 - Rev 6 page 10/12

STTH102 Revision history Table 8. Document revision history Date Revision Changes Jul-2003 2A Last update. SMA package dimensions update. Reference A1 max. changed from 2.70mm (0.106inc.) to 2.03mm Aug-2004 3 (0.080). SMA and DO-41 datasheets merged. 27-Jun-2005 4 Corrected error in title. Reformatted to current standards. Added Table 4. Dynamic electrical characteristics. Updated 21-Nov-2006 5 dimensions table for DO-41 plastic package. Added cathode bands to package illustrations. 05-Dec-2018 6 Add electrical schematics of single diode and ECOPACK®2 compliant. DS2448 - Rev 6 page 11/12

STTH102 IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2018 STMicroelectronics – All rights reserved DS2448 - Rev 6 page 12/12