TVS Diode Arrays (SPA® Diodes) Lightning Surge Protection - SP3051 Series SP3051 Series 6V 20A Diode Array RoHS Pb GREEN Description The SP3051 integrates low capacitance rail-to-rail diodes with an additional zener diode to protect each I/O pin against ESD and high surge events. This robust device can safely absorb 20A of current per IEC 61000-4-5, 2nd Edition (t =8/20µs) without performance degradation and P a minimum ±30kV ESD per IEC 61000-4-2. Their very low 1 5 loading capacitance also makes them ideal for protecting 0 high speed signal pins. 3 P Features S • E SD, IEC 61000-4-2, • Low leakage current of ±30kV contact, ±30kV air 0.5μA (MAX) at 5V • EFT, IEC 61000-4-4, 40A • S mall SOT23-6 (JEDEC Pinout (5/50ns) MO-178AB) packaging • L ightning, IEC 61000-4-5, • L ead-free and RoHS I/O 1 I/O 4 2nd edition 20A (8/20μs) compliant • L ow capacitance of 3.8pF (TYP) per I/O GND V CC Applications I/O 2 I/O 3 • LCD/PDP TVs • Femto/Pico/Micro Cells • Monitors • Set Top Boxes Functional Block Diagram • Notebooks • Flat Panel Displays 6 5 4 • 10/100/1000 Ethernet • Portable Medical 10/100 Ethernet Differential Protection RJ45 ApplicaTtXi +on Examples Unused Unused 10/100 TTXX -+ work EtPhHerYnetTX - USB DualR RPTTort ProtecStP12i33o05n1-04HT6V54GBUS DVD -B+US RXUP +oSrBt wisted-Pair Net ConUtSrRoXB l+ler CT CT VBUSSP3051-04HTG GND URnXu -sed To T Unused 75 75 75VBUS75 1 2 3 VRCXC - VCRCT VDB +US USB GND RT D - Port CT CT GND Additional Information 10/100/1000 Ethernet Protection RJ45 Unused TX + Unused 10/100/1000 TTXX -+ work Datasheet Resources Samples EtPhHerYnetTX - 123 654 RX + wisted-Pair Net RX + SP3051-04HTG URnXu -sed To T Unused 75 75 75 75 Life Support Note: RX - VCC Not Intended for Use in Life Support or Life Saving Applications VCC The products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated. GND © 2016 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 12/29/16

TVS Diode Arrays (SPA® Diodes) Lightning Surge Protection - SP3051 Series Absolute Maximum Ratings Thermal Information Symbol Parameter Value Units Parameter Rating Units I Peak Current (t=8/20μs)1 20 A Storage Temperature Range -55 to 150 °C PP p Maximum Junction Temperature 150 °C P Peak Pulse Power (t=8/20μs) 400 W PK p Maximum Lead Temperature 260 °C T Operating Temperature -40 to125 °C OP (Soldering 20-40s) T Storage Temperature -55 to 150 °C STOR CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Electrical Characteristics (T =25ºC) OP Parameter Symbol Test Conditions Min Typ Max Units Reverse Standoff Voltage V I ≤ 1µA 6.0 V RWM R Breakdown Voltage V I = 1mA 8.0 V R R Reverse Leakage Current I V =5V 0.1 0.5 µA LEAK R I =1A, t=8/20µs, I/O to GND2 9.0 10.5 V PP p Clamp Voltage1 V I =10A, t=8/20µs, I/O to GND2 11.5 15.0 V C PP p I =20A, t=8/20µs, I/O to GND2 14.3 17.0 V PP p Dynamic Resistance R (V - V ) / (I - I ) 0.3 Ω DYN C2 C1 PP2 PP1 IEC61000-4-2 (Contact) ±30 kV ESD Withstand Voltage1 V ESD IEC61000-4-2 (Air) ±30 kV Reverse Bias=0V 3.8 4.2 pF Diode Capacitance1 C I/O-GND Vcc=5V, Reverse Bias=2.5V 1.7 2.0 pF Diode Capacitance1 C Reverse Bias=0V 2.0 pF I/O-I/O Notes: 1 Parameter is guaranteed by design and/or device characterization. 2 Repetitive pulse per waveform shown on page 3. Capacitance vs. Reverse Voltage Clamping Voltage vs. Peak Pulse Current 5.0 15.0 4.0 F) V)C 10.0 pacitance (p 23..00 VVVcccccc===530V.V3V p Voltage ( a m C a 5.0 Cl 1.0 0.0 0.0 0.0 1.0 2.0 3.0 4.0 5.0 1 5 10 15 20 Bias Voltage (V) Peak Pulse Current -I (A) PP © 2016 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 12/29/16

TVS Diode Arrays (SPA® Diodes) Lightning Surge Protection - SP3051 Series Pulse Waveform Product Characteristics Lead Plating Pre-Plated Frame 110% 100% Lead Material Copper Alloy 90% Lead Coplanarity 0.0004 inches (0.102mm) 80% Substitute Material Silicon ent of IPP 567000%%% Body Material Molded Epoxy, rated UL 94 V-0 3051 Perc 40% N1. o Atells d :i mensions are in millimeters SP 30% 2. Dimensions include solder plating. 20% 3. Dimensions are exclusive of mold flash & metal burr. 10% 4. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. 5. Package surface matte finish VDI 11-13. 0% 6. All specifications comply to JEDEC Spec MO-178AB Issue C 0.0 5.0 10.0 15.0 20.0 25.0 30.0 Time (μs) Soldering Parameters Transmission Line Pulsing(TLP) Plot Reflow Condition Pb – Free assembly 20 - Temperature Min (T ) 150°C s(min) 18 Pre Heat - Temperature Max (T ) 200°C s(max) 16 - Time (min to max) (t) 60 – 180 secs A) 14 s TLP Current ( 11802 TA(TSvL(me) artxao) g tpoee TraLak -m Rpa mupp r-uatpe R(Laitqeuidus) Temp 33°°CC//sseeccoonndd mmaaxx - Temperature (T) (Liquidus) 217°C 6 Reflow L 4 - Temperature (t) 60 – 150 seconds L 2 Peak Temperature (T) 260+0/-5 °C P 0 Time within 5°C of actual peak 0 3 6 9 12 15 20 – 40 seconds TLP Voltage (V) Temperature (tp) Ramp-down Rate 6°C/second max Part Numbering System Time 25°C to peak Temperature (TP) 8 minutes Max. Do not exceed 260°C SP 3051 –04 H T G TVS Diode Arrays G= Green (SPA® Diodes) tP T= Tape & Reel TP CCrriittiiccaall ZZoonnee Series Package e RRaammpp--uupp TTLL ttoo TTPP NChuamnbneerl sof H: SOT23-6 rutare TS(mTaxL) tL Part Marking System pm RRaammpp--ddoown e PPrreehheeaatt T Y*4 TS(min) tS Y*4 Product Series Number of Channels 25 Assembly Site time to peak temperature Time ((VVaarriieess)) Ordering Information Part Number Package Marking Min. Order Qty. SP3051-04HTG SOT23-6 YH4 3000 © 2016 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 12/29/16

TVS Diode Arrays (SPA® Diodes) Lightning Surge Protection - SP3051 Series Package Dimensions — SOT23-6 Package SOT23 Pins 6 JEDEC MO-178AB Millimeters Inches Notes Min Max Min Max A 0.900 1.450 0.035 0.057 - A1 0.000 0.150 0.000 0.006 - A2 0.900 1.300 0.035 0.051 - b 0.30 0.500 0.0118 0.0196 - C 0.080 0.220 0.0031 0.009 - D 2.800 3.000 0.11 0.118 3 E 2.600 3.000 0.102 0.118 - E1 1.500 1.750 0.06 0.069 3 e 0.95 Ref 0.0374 ref - e1 1.9 Ref 0.0748 Ref - L 0.30 0.600 0.012 0.023 4,5 N 6 6 6 Recommended Solder Pad Layout a 0º 8º 0º 8º - M 2.590 0.102 - O 0.690 .027 TYP - P 0.990 .039 TYP - M R 0.950 0.038 - Notes: 1. Dimensioning and tolerancing Per ASME Y14.5M-1994. 2. Package conforms to EIAJ SC-74 (1992). P 3. Dimensions D and E1 are exclusive of mold flash, protrusions, or gate burrs. 4. Foot length L measured at reference to seating plane. 5. “L” is the length of flat foot surface for soldering to substrate. R 6. “N” is the number of terminal positions. 7. Controlling dimension: MILLIMETER. Converted inch dimensions are not necessarily exact. O Embossed Carrier Tape & Reel Specification — SOT23-6 8mm TAPE AND REEL ACCESS HOLE DIA1..5 HmOmLE 4.0mm 2.0mm 1.75mm 14.4mm 8mm CL 4.0mm 13mm SOT-23 (8mm POCKET PITCH) GENERAL INFORMATION 1. 3000 PIECES PER REEL. 2. ORDER IN MULTIPLES OF FULL REELS ONLY. 180mm 60mm 3. MEETS EIA-481 REVISION "A" SPECIFICATIONS. 8.4mm USER DIRECTION OF FEED PIN 1 © 2016 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 12/29/16 COVER TAPE