Product Sample & Technical Tools & Support & Folder Buy Documents Software Community SN74LVC1G17 SCES351V–JULY2001–REVISEDAPRIL2014 SN74LVC1G17 Single Schmitt-Trigger Buffer 1 Features 3 Description • AvailableinUltraSmall0.64-mm2 This single Schmitt-trigger buffer is designed for 1 1.65-Vto5.5-VV operation. Package(DPW)With0.5-mmPitch CC • Supports5-VV Operation The SN74LVC1G17 device contains one buffer and CC performstheBooleanfunctionY=A. • InputsAcceptVoltagesto5.5V • Maxt of4.6nsat3.3V The CMOS device has high output drive while pd maintaining low static power dissipation over a broad • LowPowerConsumption,10-μAMaxI CC Vccoperatingrange. • ±24-mAOutputDriveat3.3V The SN74LVC1G17 is available in a variety of • I SupportsLiveInsertion,Partial-Power-Down off packages, including the ultra-small DPW package Mode,andBack-DriveProtection withabodysizeof0.8mm ×0.8mm. • Latch-UpPerformanceExceeds100mAPer JESD78,ClassII DeviceInformation(1) • ESDProtectionExceedsJESD22 DEVICENAME PACKAGE BODYSIZE – 2000-VHuman-BodyModel(A114-A) SOT-23(5) 2.9mm×1.6mm – 200-VMachineModel(A115-A) SC70(5) 2.0mm×1.25mm – 1000-VCharged-DeviceModel(C101) SN74LVC1G17 X2SON(4) 0.8mm×0.8mm SON(6) 1.45mm×1.0mm 2 Applications SON(6) 1.0mm×1.0mm • AVReceiver (1) For all available packages, see the orderable addendum at theendofthedatasheet. • AudioDock:Portable • Blu-rayPlayerandHomeTheater • MP3Player/Recorder • PersonalDigitalAssistant(PDA) • Power:Telecom/ServerAC/DCSupply:Single Controller:AnalogandDigital • SolidStateDrive(SSD):ClientandEnterprise • TV:LCD/DigitalandHigh-Definition(HDTV) • Tablet:Enterprise • VideoAnalytics:Server • WirelessHeadset,Keyboard,andMouse 4 Simplified Schematic 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectualpropertymattersandotherimportantdisclaimers.PRODUCTIONDATA.

SN74LVC1G17 SCES351V–JULY2001–REVISEDAPRIL2014 www.ti.com Table of Contents 1 Features.................................................................. 1 9 DetailedDescription............................................ 10 2 Applications........................................................... 1 9.1 Overview.................................................................10 3 Description............................................................. 1 9.2 FunctionalBlockDiagram.......................................10 4 SimplifiedSchematic............................................. 1 9.3 FeatureDescription.................................................10 9.4 DeviceFunctionalModes........................................10 5 RevisionHistory..................................................... 2 10 ApplicationsandImplementation...................... 11 6 PinConfigurationandFunctions......................... 3 10.1 ApplicationInformation..........................................11 7 Specifications......................................................... 4 10.2 TypicalApplication ...............................................11 7.1 AbsoluteMaximumRatings .....................................4 11 PowerSupplyRecommendations..................... 12 7.2 HandlingRatings.......................................................4 12 Layout................................................................... 12 7.3 RecommendedOperatingConditions......................5 7.4 ThermalInformation..................................................5 12.1 LayoutGuidelines.................................................12 7.5 ElectricalCharacteristics—DCLimitChanges..........6 12.2 LayoutExample....................................................12 7.6 SwitchingCharacteristics,C =15pF......................7 13 DeviceandDocumentationSupport................. 13 L 7.7 SwitchingCharacteristicsACLimit,–40°CTO85°C 7 13.1 Trademarks...........................................................13 7.8 SwitchingCharacteristicsACLimit,–40°CTO 13.2 ElectrostaticDischargeCaution............................13 125°C.........................................................................7 13.3 Glossary................................................................13 7.9 OperatingCharacteristics..........................................7 14 Mechanical,Packaging,andOrderable 7.10 TypicalCharacteristics............................................7 Information........................................................... 13 8 ParameterMeasurementInformation..................8 5 Revision History ChangesfromRevisionU(February2014)toRevisionV Page • AddedPinFunctionstable..................................................................................................................................................... 3 • AddedHandlingRatingstable. .............................................................................................................................................. 4 • AddedThermalInformationtable. ......................................................................................................................................... 5 • AddedTypicalCharacteristics. .............................................................................................................................................. 7 • AddedDetailedDescriptionsection..................................................................................................................................... 10 • AddedApplicationandImplementationsection. ................................................................................................................. 11 • AddedPowerSupplyRecommendationssection. .............................................................................................................. 12 • AddedLayoutsection. ......................................................................................................................................................... 12 ChangesfromRevisionT(November2012)toRevisionU Page • AddedApplications................................................................................................................................................................. 1 • MovedT toHandlingRatingstable..................................................................................................................................... 4 stg • ChangedMAXoperatingfree-airtemperaturefrom85°Cto125°C....................................................................................... 5 • Added–40°Cto125°CtoElectricalCharacteristicstable...................................................................................................... 6 • AddedSwitchingCharacteristicstablefor–40°Cto125°Ctemperaturerange..................................................................... 7 ChangesfromRevisionS(June2011)toRevisionT Page • RemovedOrderingInformationtable..................................................................................................................................... 3 2 SubmitDocumentationFeedback Copyright©2001–2014,TexasInstrumentsIncorporated ProductFolderLinks:SN74LVC1G17

SN74LVC1G17 www.ti.com SCES351V–JULY2001–REVISEDAPRIL2014 6 Pin Configuration and Functions DBV PACKAGE DCK PACKAGE DRLPACKAGE DRYPACKAGE (TOPVIEW) (TOPVIEW) (TOPVIEW) (TOPVIEW) N.C. 1 5 V N.C. 1 5 VCC N.C. 1 5 VCC N.C. 1 6 VCC CC A 2 A 2 A 2 5 N.C. A 2 GND 3 4 Y GND 3 4 Y GND 3 4 Y GND 3 4 Y YZPPACKAGE YZV PACKAGE DSF PACKAGE (TOPVIEW) (TOPVIEW) (TOPVIEW) DPW PACKAGE N.C(T.O1PVIE5WV) DNU A1 A2 VCC A A1 A2 VCC N.CA. 21 65 VNC.CC. GND A 2 3 4 YCC A B1 B2 GND B1 B2 Y GND 3 4 Y GND C1 C2 Y N.C.–No internal connection See mechanical drawings for dimensions. DNU–Do not use PinFunctions PIN DBV,DCK, DESCRIPTION NAME DRY,DSF YZP YZV DRL,DPW NC 1 1,5 A1,B2 – Notconnected A 2 2 B1 A1 Input GND 3 3 C1 B1 Ground Y 4 4 C2 B2 Output VCC 5 6 A2 A2 Powerterminal Copyright©2001–2014,TexasInstrumentsIncorporated SubmitDocumentationFeedback 3 ProductFolderLinks:SN74LVC1G17

SN74LVC1G17 SCES351V–JULY2001–REVISEDAPRIL2014 www.ti.com 7 Specifications 7.1 Absolute Maximum Ratings(1) overoperatingfree-airtemperaturerange(unlessotherwisenoted) MIN MAX UNIT V Supplyvoltagerange –0.5 6.5 V CC V Inputvoltagerange(2) –0.5 6.5 V I V Voltagerangeappliedtoanyoutputinthehigh-impedanceorpower-offstate(2) –0.5 6.5 V O V Voltagerangeappliedtoanyoutputinthehighorlowstate(2)(3) –0.5 V +0.5 V O CC I Inputclampcurrent V <0 –50 mA IK I I Outputclampcurrent V <0 –50 mA OK O I Continuousoutputcurrent ±50 mA O ContinuouscurrentthroughV orGND ±100 mA CC (1) StressesbeyondthoselistedunderAbsoluteMaximumRatingsmaycausepermanentdamagetothedevice.Thesearestressratings only,andfunctionaloperationofthedeviceattheseoranyotherconditionsbeyondthoseindicatedunderRecommendedOperating Conditionstablesisnotimplied.Exposuretoabsolute-maximum-ratedconditionsforextendedperiodsmayaffectdevicereliability. (2) Theinputandoutputnegative-voltageratingsmaybeexceedediftheinputandoutputcurrentratingsareobserved. (3) ThevalueofV isprovidedintheRecommendedOperatingConditionstable. CC 7.2 Handling Ratings MIN MAX UNIT T Storagetemperaturerange –65 150 °C stg Human-BodyModel(HBM)(2) 0 2 kV V (1) ESD Charged-DeviceModel(CDM)(3) 0 1 kV (1) Electrostaticdischarge(ESD)tomeasuredevicesensitivityandimmunitytodamagecausedbyassemblylineelectrostaticdischargesin tothedevice. (2) LevellistedaboveisthepassinglevelperANSI,ESDA,andJEDECJS-001.JEDECdocumentJEP155statesthat500-VHBMallows safemanufacturingwithastandardESDcontrolprocess. (3) LevellistedaboveisthepassinglevelperEIA-JEDECJESD22-C101.JEDECdocumentJEP157statesthat250-VCDMallowssafe manufacturingwithastandardESDcontrolprocess. 4 SubmitDocumentationFeedback Copyright©2001–2014,TexasInstrumentsIncorporated ProductFolderLinks:SN74LVC1G17

SN74LVC1G17 www.ti.com SCES351V–JULY2001–REVISEDAPRIL2014 7.3 Recommended Operating Conditions(1) MIN MAX UNIT Operating 1.65 5.5 V Supplyvoltage V CC Dataretentiononly 1.5 V Inputvoltage 0 5.5 V I V Outputvoltage 0 V V O CC V =1.65V –4 CC V =2.3V –8 CC I High-leveloutputcurrent –16 mA OH V =3V CC –24 V =4.5V –32 CC V =1.65V 4 CC V =2.3V 8 CC I Low-leveloutputcurrent 16 mA OL V =3V CC 24 V =4.5V 32 CC T Operatingfree-airtemperature –40 125 °C A (1) AllunusedinputsofthedevicemustbeheldatV orGNDtoensureproperdeviceoperation.RefertotheTIapplicationreport, CC ImplicationsofSloworFloatingCMOSInputs,literaturenumberSCBA004. 7.4 Thermal Information SN74LVC1G17 THERMALMETRIC(1) DBV DCK DRL DRY YZP DPW YZV UNIT 5PINS 5PINS 5PINS 6PINS 5PINS 4PINS 4PINS RθJA Junction-to-ambientthermalresistance 229 280 350 608 130 340 181 RθJC(top) Junction-to-case(top)thermalresistance 164 66 121 432 54 215 1 RθJB Junction-to-boardthermalresistance 62 67 171 446 51 294 39 °C/W ψJT Junction-to-topcharacterizationparameter 44 2 11 191 1 41 8 ψJB Junction-to-boardcharacterizationparameter 62 66 169 442 50 294 38 RθJC(bot) Junction-to-case(bottom)thermalresistance – – – 198 – 250 – (1) Formoreinformationabouttraditionalandnewthermalmetrics,seetheICPackageThermalMetricsapplicationreport,SPRA953. Copyright©2001–2014,TexasInstrumentsIncorporated SubmitDocumentationFeedback 5 ProductFolderLinks:SN74LVC1G17

SN74LVC1G17 SCES351V–JULY2001–REVISEDAPRIL2014 www.ti.com 7.5 Electrical Characteristics—DC Limit Changes overrecommendedoperatingfree-airtemperaturerange(unlessotherwisenoted) 25°C –40°CTO85°C –40°CTO125°C PARAMETER TESTCONDITIONS VCC MIN TYP(1) MAX MIN TYP(1) MAX MIN TYP MAX UNIT 1.65V 0.76 1.13 0.76 1.13 VT+ 2.3V 1.08 1.56 1.08 1.56 (Positive-going 3V 1.48 1.92 1.48 1.92 V inputthreshold voltage) 4.5V 2.19 2.74 2.19 2.74 5.5V 2.65 3.33 2.65 3.33 1.65V 0.35 0.59 0.35 0.59 VT– 2.3V 0.56 0.88 0.56 0.88 (Negative-going 3V 0.89 1.2 0.89 1.2 V inputthreshold voltage) 4.5V 1.51 1.97 1.51 1.97 5.5V 1.88 2.4 1.88 2.4 1.65V 0.36 0.64 0.36 0.64 2.3V 0.45 0.78 0.45 0.78 ΔVT Hysteresis 3V 0.51 0.83 0.51 0.83 V (VT+–VT–) 4.5V 0.58 0.93 0.58 0.93 5.5V 0.69 1.04 0.69 1.04 1.65Vto IOH=–100μA 5.5V VCC–0.1 VCC–0.1 IOH=–4mA 1.65V 1.2 1.2 VOH IOH=–8mA 2.3V 1.9 1.9 V IOH=–16mA 2.4 2.4 3V IOH=–24mA 2.3 2.3 IOH=–32mA 4.5V 3.8 3.8 1.65Vto IOL=100μA 5.5V 0.1 0.1 IOL=4mA 1.65V 0.45 0.45 VOL IOL=8mA 2.3V 0.3 0.3 V IOL=16mA 0.4 0.4 3V IOL=24mA 0.55 0.55 IOL=32mA 4.5V 0.55 0.55 0to II Ainput VI=5.5VorGND 5.5V ±5 ±5 μA Ioff VIorVO=5.5V 0 ±10 ±10 μA 1.65Vto VI=5.5VorGND, 5.5V 10 10 ICC IO=0 μA 3Vto VI=3.6VorGND, 3.6V 0.5 1.5 ΔICC OOntheerinipnuptuatstaVtCVCC–C0o.r6GVN,D 35.V5tVo 500 500 μA CI VI=VCCorGND 3.3V 4.5 pF (1) AlltypicalvaluesareatV =3.3V,T =25°C. CC A 6 SubmitDocumentationFeedback Copyright©2001–2014,TexasInstrumentsIncorporated ProductFolderLinks:SN74LVC1G17

SN74LVC1G17 www.ti.com SCES351V–JULY2001–REVISEDAPRIL2014 7.6 Switching Characteristics, C = 15 pF L overrecommendedoperatingfree-airtemperaturerange,C =15pF(unlessotherwisenoted)(seeFigure3) L –40°CTO85°C FROM TO V =1.8V V =2.5V V =3.3V V =5V PARAMETER CC CC CC CC UNIT (INPUT) (OUTPUT) ±0.15V ±0.2V ±0.3V ±0.5V MIN MAX MIN MAX MIN MAX MIN MAX t A Y 2.8 9.9 1.6 5.5 1.5 4.6 0.9 4.4 ns pd 7.7 Switching Characteristics AC Limit, –40°C TO 85°C overrecommendedoperatingfree-airtemperaturerange,C =30pFor50pF(unlessotherwisenoted)(seeFigure4) L –40°CTO85°C FROM TO V =1.8V V =2.5V V =3.3V V =5V PARAMETER CC CC CC CC UNIT (INPUT) (OUTPUT) ±0.15V ±0.2V ±0.3V ±0.5V MIN MAX MIN MAX MIN MAX MIN MAX t A Y 3.8 11 2 6.5 1.8 5.5 1.2 5 ns pd 7.8 Switching Characteristics AC Limit, –40°C TO 125°C overrecommendedoperatingfree-airtemperaturerange,C =30pFor50pF(unlessotherwisenoted)(seeFigure4) L –40°CTO125°C FROM TO V =1.8V V =2.5V V =3.3V V =5V PARAMETER CC CC CC CC UNIT (INPUT) (OUTPUT) ±0.15V ±0.2V ±0.3V ±0.5V MIN MAX MIN MAX MIN MAX MIN MAX t A Y 3.8 13 2 8 1.8 6.5 1.2 6 ns pd 7.9 Operating Characteristics T =25°C A TEST VCC=1.8V VCC=2.5V VCC=3.3V VCC=5V PARAMETER UNIT CONDITIONS TYP TYP TYP TYP C Powerdissipationcapacitance f=10MHz 20 21 22 26 pF pd 7.10 Typical Characteristics 3.8 8 TPD TPD 3.7 7 6 3.6 5 ns 3.5 ns D - D - 4 TP 3.4 TP 3 3.3 2 3.2 1 3.1 0 -100 -50 0 50 100 150 0 1 2 3 4 5 6 Temperature - °C Vcc - V D001 D002 Figure1.AcrossTemperatureat3.3VVcc Figure2.AcrossVccat25°C Copyright©2001–2014,TexasInstrumentsIncorporated SubmitDocumentationFeedback 7 ProductFolderLinks:SN74LVC1G17

SN74LVC1G17 SCES351V–JULY2001–REVISEDAPRIL2014 www.ti.com 8 Parameter Measurement Information V LOAD R S1 Open From Output L TEST S1 Under Test GND t /t Open C PLH PHL (see NoteA)L RL tPLZ/tPZL VLOAD t /t GND PHZ PZH LOAD CIRCUIT INPUTS V V V C R V CC V t/t M LOAD L L D I r f 1.8 V±0.15 V V £2 ns V /2 2 ×V 15 pF 1 MW 0.15 V CC CC CC 2.5 V±0.2 V V £2 ns V /2 2 ×V 15 pF 1 MW 0.15 V CC CC CC 3.3 V±0.3 V 3 V £2.5 ns 1.5 V 6 V 15 pF 1 MW 0.3 V 5 V±0.5 V V £2.5 ns V /2 2 ×V 15 pF 1 MW 0.3 V CC CC CC V I Timing Input V M 0 V t W VI tsu th V Input V V I M M Data Input V V M M 0 V 0 V VOLTAGE WAVEFORMS VOLTAGE WAVEFORMS PULSE DURATION SETUPAND HOLD TIMES Input VM VM VI COounttpruotl VM VM VI 0 V 0 V t t t t PLH PHL PZL PLZ V Output V /2 Output VM VM OH WSav1e afot rVm 1 VM V + V LOAD VOL (see NoteL OBAD) OL D VOL t t PHL PLH t t PZH PHZ Output VM VM VOH WSa1v eaOfto uGrtmpNu D2t VM VOH–VD VOH VOL (see Note B) »0 V VOLTAGE WAVEFORMS VOLTAGE WAVEFORMS PROPAGATION DELAYTIMES ENABLEAND DISABLE TIMES INVERTINGAND NONINVERTING OUTPUTS LOW-AND HIGH-LEVELENABLING NOTES: A. C includes probe and jig capacitance. L B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR£10 MHz, Z = 50W. O D. The outputs are measured one at a time, with one transition per measurement. E. t and t are the same as t . PLZ PHZ dis F. t and t are the same as t . PZL PZH en G.t and t are the same as t . PLH PHL pd H. All parameters and waveforms are not applicable to all devices. Figure3. LoadCircuitandVoltageWaveforms 8 SubmitDocumentationFeedback Copyright©2001–2014,TexasInstrumentsIncorporated ProductFolderLinks:SN74LVC1G17

SN74LVC1G17 www.ti.com SCES351V–JULY2001–REVISEDAPRIL2014 Parameter Measurement Information (continued) V LOAD R S1 Open From Output L TEST S1 Under Test GND t /t Open C PLH PHL (see NoteA)L RL tPLZ/tPZL VLOAD t /t GND PHZ PZH LOAD CIRCUIT INPUTS V V V C R V CC V t/t M LOAD L L D I r f 1.8 V±0.15 V V £2 ns V /2 2 ×V 30 pF 1 kW 0.15 V CC CC CC 2.5 V±0.2 V V £2 ns V /2 2 ×V 30 pF 500W 0.15 V CC CC CC 3.3 V±0.3 V 3 V £2.5 ns 1.5 V 6 V 50 pF 500W 0.3 V 5 V±0.5 V V £2.5 ns V /2 2 ×V 50 pF 500W 0.3 V CC CC CC V I Timing Input V M 0 V t W VI tsu th V Input V V I M M Data Input V V M M 0 V 0 V VOLTAGE WAVEFORMS VOLTAGE WAVEFORMS PULSE DURATION SETUPAND HOLD TIMES Input VM VM VI COounttpruotl VM VM VI 0 V 0 V t t t t PLH PHL PZL PLZ V Output V /2 Output VM VM OH WSav1e afot rVm 1 VM V + V LOAD VOL (see NoteL OBAD) OL D VOL t t PHL PLH t t PZH PHZ Output VM VM VOH WSa1v eaOfto uGrtmpNu D2t VM VOH–VD VOH VOL (see Note B) »0 V VOLTAGE WAVEFORMS VOLTAGE WAVEFORMS PROPAGATION DELAYTIMES ENABLEAND DISABLE TIMES INVERTINGAND NONINVERTING OUTPUTS LOW-AND HIGH-LEVELENABLING NOTES: A. C includes probe and jig capacitance. L B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR£10 MHz, Z = 50W. O D. The outputs are measured one at a time, with one transition per measurement. E. t and t are the same as t . PLZ PHZ dis F. t and t are the same as t . PZL PZH en G.t and t are the same as t . PLH PHL pd H. All parameters and waveforms are not applicable to all devices. Figure4. LoadCircuitandVoltageWaveforms Copyright©2001–2014,TexasInstrumentsIncorporated SubmitDocumentationFeedback 9 ProductFolderLinks:SN74LVC1G17

SN74LVC1G17 SCES351V–JULY2001–REVISEDAPRIL2014 www.ti.com 9 Detailed Description 9.1 Overview The SN74LVC1G17 device contains one Schmitt trigger buffer and performs the Boolean function Y = A. The device functions as an independent buffer, but because of Schmitt action, it will have different input threshold levelsforapositive-going(VT+)andnegative-goingsignals. The DPW package technology is a major breakthrough in IC packaging. Its tiny 0.64 mm square footprint saves significant board space over other package options while still retaining the traditional manufacturing friendly lead pitchof0.5mm. This device is fully specified for partial-power-down applications using I . The I circuitry disables the outputs, off off preventingdamagingcurrentbackflowthroughthedevicewhenitispowereddown. 9.2 Functional Block Diagram 9.3 Feature Description • Wideoperatingvoltagerange. – OperatesFrom1.65Vto5.5V. • AllowsDownvoltagetranslation. • Inputsacceptvoltagesto5.5V. • I featureallowsvoltagesontheinputsandoutputs,whenV is0V. off CC 9.4 Device Functional Modes Table1.FunctionTable INPUT OUTPUT A Y H H L L 10 SubmitDocumentationFeedback Copyright©2001–2014,TexasInstrumentsIncorporated ProductFolderLinks:SN74LVC1G17

SN74LVC1G17 www.ti.com SCES351V–JULY2001–REVISEDAPRIL2014 10 Applications and Implementation 10.1 Application Information The SN74LVC1G14 is a high drive CMOS device that can be used for a multitude of buffer type functions where the input is slow or noisy. It can produce 24 mA of drive current at 3.3 V making it Ideal for driving multiple outputs and good for high speed applications up to 100 MHz. The inputs are 5.5 V tolerant allowing it to translate downtoV . CC 10.2 Typical Application R F ~2.2 MΩ SN74LVC1G17 C R 50 pF S ~1 kΩ C C1 16 pLF C2 ~32 pF ~32 pF 10.2.1 DesignRequirements This device uses CMOS technology and has balanced output drive. Care should be taken to avoid bus contention because it can drive currents that would exceed maximum limits. The high drive will also create fast edgesintolightloadssoroutingandloadconditionsshouldbeconsideredtopreventringing. 10.2.2 DetailedDesignProcedure 1. RecommendedInputConditions – Risetimeandfalltimespecs.See(Δt/ΔV)intheRecommendedOperatingConditionstable. – Specifiedhighandlowlevels.See(V andV )intheRecommendedOperatingConditions table. IH IL – Inputs are overvoltage tolerant allowing them to go as high as (V max) in the Recommended Operating I ConditionstableatanyvalidV . CC 2. RecommendOutputConditions – Load currents should not exceed (I max) per output and should not exceed (continuous current through O V orGND)totalcurrentforthepart.TheselimitsarelocatedintheAbsoluteMaxRatings table. CC – OutputsshouldnotbepulledaboveV . CC Copyright©2001–2014,TexasInstrumentsIncorporated SubmitDocumentationFeedback 11 ProductFolderLinks:SN74LVC1G17

SN74LVC1G17 SCES351V–JULY2001–REVISEDAPRIL2014 www.ti.com Typical Application (continued) 10.2.3 ApplicationCurves 10 Icc 1.8V 9 Icc 2.5V 8 Icc 3.3V Icc 5V 7 6 A m c - 5 Ic 4 3 2 1 0 0 20 40 60 80 Frequency - MHz D003 Figure5.ICCvsFrequency 11 Power Supply Recommendations The power supply can be any voltage between the min and max supply voltage rating located in the RecommendedOperatingConditionstable. Each Vcc pin should have a good bypass capacitor to prevent power disturbance. For devices with a single supply a 0.1-μF capacitor is recommended and if there are multiple Vcc pins then a 0.01-μF or 0.022-μF capacitor is recommended for each power pin. It is ok to parallel multiple bypass caps to reject different frequencies of noise. 0.1-μF and 1-μF capacitors are commonly used in parallel. The bypass capacitor should be installedasclosetothepowerpinaspossibleforbestresults. 12 Layout 12.1 Layout Guidelines When using multiple bit logic devices inputs should not ever float. In many cases, functions or parts of functions of digital logic devices are unused, for example, when only two inputs of a triple-input AND gate are used or only 3 of the 4 buffer gates are used. Such input terminals should not be left unconnected because the undefined voltagesattheoutsideconnectionsresultinundefinedoperationalstates.Specifiedbelowaretherulesthatmust be observed under all circumstances. All unused inputs of digital logic devices must be connected to a high or low bias to prevent them from floating. The logic level that should be applied to any particular unused input depends on the function of the device. Generally they will be tied to Gnd or Vcc whichever make more sense or ismoreconvenient. 12.2 Layout Example VCC Input Unused Input Output Unused Input Output Input 12 SubmitDocumentationFeedback Copyright©2001–2014,TexasInstrumentsIncorporated ProductFolderLinks:SN74LVC1G17

SN74LVC1G17 www.ti.com SCES351V–JULY2001–REVISEDAPRIL2014 13 Device and Documentation Support 13.1 Trademarks Alltrademarksarethepropertyoftheirrespectiveowners. 13.2 Electrostatic Discharge Caution Thesedeviceshavelimitedbuilt-inESDprotection.Theleadsshouldbeshortedtogetherorthedeviceplacedinconductivefoam duringstorageorhandlingtopreventelectrostaticdamagetotheMOSgates. 13.3 Glossary SLYZ022—TIGlossary. Thisglossarylistsandexplainsterms,acronymsanddefinitions. 14 Mechanical, Packaging, and Orderable Information The following pages include mechanical packaging and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of thisdocument.Forbrowser-basedversionsofthisdatasheet,refertotheleft-handnavigation. Copyright©2001–2014,TexasInstrumentsIncorporated SubmitDocumentationFeedback 13 ProductFolderLinks:SN74LVC1G17

PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2020 PACKAGING INFORMATION Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples (1) Drawing Qty (2) (6) (3) (4/5) SN74LVC1G17DBVR ACTIVE SOT-23 DBV 5 3000 Green (RoHS NIPDAU | SN Level-1-260C-UNLIM -40 to 125 (C175, C17F, C17J, & no Sb/Br) C17K, C17R) (C17H, C17P, C17S) SN74LVC1G17DBVRE4 ACTIVE SOT-23 DBV 5 3000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 C17F & no Sb/Br) SN74LVC1G17DBVRG4 ACTIVE SOT-23 DBV 5 3000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 C17F & no Sb/Br) SN74LVC1G17DBVT ACTIVE SOT-23 DBV 5 250 Green (RoHS NIPDAU | SN Level-1-260C-UNLIM -40 to 125 (C175, C17F, C17J, & no Sb/Br) C17K, C17R) (C17H, C17P, C17S) SN74LVC1G17DBVTE4 ACTIVE SOT-23 DBV 5 250 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 C17F & no Sb/Br) SN74LVC1G17DBVTG4 ACTIVE SOT-23 DBV 5 250 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 C17F & no Sb/Br) SN74LVC1G17DCK3 ACTIVE SC70 DCK 5 3000 Pb-Free SNBI Level-1-260C-UNLIM -40 to 85 (C7F, C7Z) (RoHS) SN74LVC1G17DCKR ACTIVE SC70 DCK 5 3000 Green (RoHS NIPDAU | SN Level-1-260C-UNLIM -40 to 125 (C75, C7F, C7J, C7 & no Sb/Br) K, C7R, C7T) (C7H, C7P, C7S) SN74LVC1G17DCKRE4 ACTIVE SC70 DCK 5 3000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 C75 & no Sb/Br) C7S SN74LVC1G17DCKRG4 ACTIVE SC70 DCK 5 3000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 C75 & no Sb/Br) C7S SN74LVC1G17DCKT ACTIVE SC70 DCK 5 250 Green (RoHS NIPDAU | SN Level-1-260C-UNLIM -40 to 125 (C75, C7F, C7J, C7 & no Sb/Br) K, C7R, C7T) (C7H, C7P, C7S) SN74LVC1G17DCKTE4 ACTIVE SC70 DCK 5 250 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 C75 & no Sb/Br) C7S SN74LVC1G17DCKTG4 ACTIVE SC70 DCK 5 250 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 C75 & no Sb/Br) C7S SN74LVC1G17DPWR ACTIVE X2SON DPW 5 3000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 S4 & no Sb/Br) Addendum-Page 1

PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2020 Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples (1) Drawing Qty (2) (6) (3) (4/5) SN74LVC1G17DRLR ACTIVE SOT-5X3 DRL 5 4000 Green (RoHS NIPDAU | NIPDAUAG Level-1-260C-UNLIM -40 to 125 (C77, C7R) & no Sb/Br) SN74LVC1G17DRLRG4 ACTIVE SOT-5X3 DRL 5 4000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 (C77, C7R) & no Sb/Br) SN74LVC1G17DRYR ACTIVE SON DRY 6 5000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 C7 & no Sb/Br) SN74LVC1G17DSFR ACTIVE SON DSF 6 5000 Green (RoHS NIPDAU | NIPDAUAG Level-1-260C-UNLIM -40 to 125 C7 & no Sb/Br) SN74LVC1G17YZPR ACTIVE DSBGA YZP 5 3000 Green (RoHS SNAGCU Level-1-260C-UNLIM -40 to 85 C7N & no Sb/Br) SN74LVC1G17YZVR ACTIVE DSBGA YZV 4 3000 Green (RoHS SNAGCU Level-1-260C-UNLIM -40 to 85 C7 & no Sb/Br) (7, N) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement. (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Addendum-Page 2

PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2020 Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF SN74LVC1G17 : •Automotive: SN74LVC1G17-Q1 •Enhanced Product: SN74LVC1G17-EP NOTE: Qualified Version Definitions: •Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects •Enhanced Product - Supports Defense, Aerospace and Medical Applications Addendum-Page 3

PACKAGE MATERIALS INFORMATION www.ti.com 24-Jul-2020 TAPE AND REEL INFORMATION *Alldimensionsarenominal Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1 Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant (mm) W1(mm) SN74LVC1G17DBVR SOT-23 DBV 5 3000 180.0 8.4 3.23 3.17 1.37 4.0 8.0 Q3 SN74LVC1G17DBVR SOT-23 DBV 5 3000 178.0 9.2 3.3 3.23 1.55 4.0 8.0 Q3 SN74LVC1G17DBVR SOT-23 DBV 5 3000 178.0 9.0 3.3 3.2 1.4 4.0 8.0 Q3 SN74LVC1G17DBVRG4 SOT-23 DBV 5 3000 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3 SN74LVC1G17DBVT SOT-23 DBV 5 250 180.0 8.4 3.23 3.17 1.37 4.0 8.0 Q3 SN74LVC1G17DBVT SOT-23 DBV 5 250 178.0 9.0 3.3 3.2 1.4 4.0 8.0 Q3 SN74LVC1G17DBVT SOT-23 DBV 5 250 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3 SN74LVC1G17DBVT SOT-23 DBV 5 250 178.0 9.2 3.3 3.23 1.55 4.0 8.0 Q3 SN74LVC1G17DBVTG4 SOT-23 DBV 5 250 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3 SN74LVC1G17DCKR SC70 DCK 5 3000 178.0 9.2 2.4 2.4 1.22 4.0 8.0 Q3 SN74LVC1G17DCKR SC70 DCK 5 3000 180.0 8.4 2.47 2.3 1.25 4.0 8.0 Q3 SN74LVC1G17DCKR SC70 DCK 5 3000 178.0 9.0 2.4 2.5 1.2 4.0 8.0 Q3 SN74LVC1G17DCKRG4 SC70 DCK 5 3000 178.0 9.2 2.4 2.4 1.22 4.0 8.0 Q3 SN74LVC1G17DCKT SC70 DCK 5 250 180.0 8.4 2.47 2.3 1.25 4.0 8.0 Q3 SN74LVC1G17DCKT SC70 DCK 5 250 178.0 9.2 2.4 2.4 1.22 4.0 8.0 Q3 SN74LVC1G17DCKT SC70 DCK 5 250 178.0 9.0 2.4 2.5 1.2 4.0 8.0 Q3 SN74LVC1G17DCKTG4 SC70 DCK 5 250 178.0 9.2 2.4 2.4 1.22 4.0 8.0 Q3 SN74LVC1G17DPWR X2SON DPW 5 3000 178.0 8.4 0.91 0.91 0.5 2.0 8.0 Q3 PackMaterials-Page1

PACKAGE MATERIALS INFORMATION www.ti.com 24-Jul-2020 Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1 Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant (mm) W1(mm) SN74LVC1G17DRLR SOT-5X3 DRL 5 4000 180.0 8.4 1.98 1.78 0.69 4.0 8.0 Q3 SN74LVC1G17DRLR SOT-5X3 DRL 5 4000 180.0 9.5 1.78 1.78 0.69 4.0 8.0 Q3 SN74LVC1G17DRYR SON DRY 6 5000 180.0 9.5 1.15 1.6 0.75 4.0 8.0 Q1 SN74LVC1G17DSFR SON DSF 6 5000 180.0 9.5 1.16 1.16 0.5 4.0 8.0 Q2 SN74LVC1G17YZPR DSBGA YZP 5 3000 178.0 9.2 1.02 1.52 0.63 4.0 8.0 Q1 SN74LVC1G17YZVR DSBGA YZV 4 3000 178.0 9.2 1.0 1.0 0.63 4.0 8.0 Q1 *Alldimensionsarenominal Device PackageType PackageDrawing Pins SPQ Length(mm) Width(mm) Height(mm) SN74LVC1G17DBVR SOT-23 DBV 5 3000 202.0 201.0 28.0 SN74LVC1G17DBVR SOT-23 DBV 5 3000 180.0 180.0 18.0 SN74LVC1G17DBVR SOT-23 DBV 5 3000 180.0 180.0 18.0 SN74LVC1G17DBVRG4 SOT-23 DBV 5 3000 180.0 180.0 18.0 SN74LVC1G17DBVT SOT-23 DBV 5 250 202.0 201.0 28.0 SN74LVC1G17DBVT SOT-23 DBV 5 250 180.0 180.0 18.0 SN74LVC1G17DBVT SOT-23 DBV 5 250 180.0 180.0 18.0 SN74LVC1G17DBVT SOT-23 DBV 5 250 180.0 180.0 18.0 SN74LVC1G17DBVTG4 SOT-23 DBV 5 250 180.0 180.0 18.0 SN74LVC1G17DCKR SC70 DCK 5 3000 180.0 180.0 18.0 SN74LVC1G17DCKR SC70 DCK 5 3000 202.0 201.0 28.0 PackMaterials-Page2

PACKAGE MATERIALS INFORMATION www.ti.com 24-Jul-2020 Device PackageType PackageDrawing Pins SPQ Length(mm) Width(mm) Height(mm) SN74LVC1G17DCKR SC70 DCK 5 3000 180.0 180.0 18.0 SN74LVC1G17DCKRG4 SC70 DCK 5 3000 180.0 180.0 18.0 SN74LVC1G17DCKT SC70 DCK 5 250 202.0 201.0 28.0 SN74LVC1G17DCKT SC70 DCK 5 250 180.0 180.0 18.0 SN74LVC1G17DCKT SC70 DCK 5 250 180.0 180.0 18.0 SN74LVC1G17DCKTG4 SC70 DCK 5 250 180.0 180.0 18.0 SN74LVC1G17DPWR X2SON DPW 5 3000 205.0 200.0 33.0 SN74LVC1G17DRLR SOT-5X3 DRL 5 4000 202.0 201.0 28.0 SN74LVC1G17DRLR SOT-5X3 DRL 5 4000 184.0 184.0 19.0 SN74LVC1G17DRYR SON DRY 6 5000 184.0 184.0 19.0 SN74LVC1G17DSFR SON DSF 6 5000 184.0 184.0 19.0 SN74LVC1G17YZPR DSBGA YZP 5 3000 220.0 220.0 35.0 SN74LVC1G17YZVR DSBGA YZV 4 3000 220.0 220.0 35.0 PackMaterials-Page3

PACKAGE OUTLINE DBV0005A SOT-23 - 1.45 mm max height SCALE 4.000 SMALL OUTLINE TRANSISTOR C 3.0 2.6 0.1 C 1.75 1.45 1.45 B A 0.90 PIN 1 INDEX AREA 1 5 2X 0.95 3.05 2.75 1.9 1.9 2 4 3 0.5 5X 0.3 0.15 0.2 C A B (1.1) TYP 0.00 0.25 GAGE PLANE 0.22 TYP 0.08 8 TYP 0.6 0 0.3 TYP SEATING PLANE 4214839/E 09/2019 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. Refernce JEDEC MO-178. 4. Body dimensions do not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.15 mm per side. www.ti.com

EXAMPLE BOARD LAYOUT DBV0005A SOT-23 - 1.45 mm max height SMALL OUTLINE TRANSISTOR PKG 5X (1.1) 1 5 5X (0.6) SYMM (1.9) 2 2X (0.95) 3 4 (R0.05) TYP (2.6) LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE:15X SOLDER MASK SOLDER MASK METAL UNDER METAL OPENING OPENING SOLDER MASK EXPOSED METAL EXPOSED METAL 0.07 MAX 0.07 MIN ARROUND ARROUND NON SOLDER MASK SOLDER MASK DEFINED DEFINED (PREFERRED) SOLDER MASK DETAILS 4214839/E 09/2019 NOTES: (continued) 5. Publication IPC-7351 may have alternate designs. 6. Solder mask tolerances between and around signal pads can vary based on board fabrication site. www.ti.com

EXAMPLE STENCIL DESIGN DBV0005A SOT-23 - 1.45 mm max height SMALL OUTLINE TRANSISTOR PKG 5X (1.1) 1 5 5X (0.6) SYMM 2 (1.9) 2X(0.95) 3 4 (R0.05) TYP (2.6) SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL SCALE:15X 4214839/E 09/2019 NOTES: (continued) 7. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 8. Board assembly site may have different recommendations for stencil design. www.ti.com

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PACKAGE OUTLINE DPW0005A X2SON - 0.4 mm max height SCALE 12.000 PLASTIC SMALL OUTLINE - NO LEAD B 0.85 A 0.75 PIN 1 INDEX AREA 0.85 0.75 0.4 MAX C SEATING PLANE NOTE 3 (0.1) 0.05 (0.25) 4X (0.05) 0.00 0.25 0.1 2 4 NOTE 3 2X 3 2X (0.26) 0.48 5 1 0.27 0.27 4X 0.17 0.17 0.1 C A B (0.06) 0.05 C 0.32 3X 0.23 4223102/B 09/2017 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. The size and shape of this feature may vary. www.ti.com

EXAMPLE BOARD LAYOUT DPW0005A X2SON - 0.4 mm max height PLASTIC SMALL OUTLINE - NO LEAD (0.78) SYMM ( 0.1) 4X (0.42) VIA 0.05 MIN ALL AROUND 1 TYP 5 4X (0.22) SYMM 4X (0.26) (0.48) 3 2 4 (R0.05) TYP SOLDER MASK 4X (0.06) OPENING, TYP ( 0.25) (0.21) TYP METAL UNDER EXPOSED METAL SOLDER MASK CLEARANCE TYP LAND PATTERN EXAMPLE SOLDER MASK DEFINED SCALE:60X 4223102/B 09/2017 NOTES: (continued) 4. This package is designed to be soldered to a thermal pad on the board. For more information, refer to QFN/SON PCB application note in literature No. SLUA271 (www.ti.com/lit/slua271). www.ti.com

EXAMPLE STENCIL DESIGN DPW0005A X2SON - 0.4 mm max height PLASTIC SMALL OUTLINE - NO LEAD 4X (0.42) 4X (0.06) 5 4X (0.22) 1 ( 0.24) 4X (0.26) SYMM (0.21) (0.48) TYP SOLDER MASK 3 EDGE 2 4 (R0.05) TYP SYMM (0.78) SOLDER PASTE EXAMPLE BASED ON 0.1 mm THICK STENCIL EXPOSED PAD 92% PRINTED SOLDER COVERAGE BY AREA SCALE:100X 4223102/B 09/2017 NOTES: (continued) 5. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. www.ti.com

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PACKAGE OUTLINE YZP0005 DSBGA - 0.5 mm max height SCALE 8.000 DIE SIZE BALL GRID ARRAY B E A BALL A1 CORNER D C 0.5 MAX SEATING PLANE 0.19 0.05 C 0.15 BALL TYP 0.5 TYP C SYMM 1 B D: Max = 1.418 mm, Min =1 .357 mm TYP 0.5 TYP E: Max = 0.918 mm, Min =0 .857 mm A 0.25 5X 1 2 0.21 0.015 C A B SYMM 4219492/A 05/2017 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. www.ti.com

EXAMPLE BOARD LAYOUT YZP0005 DSBGA - 0.5 mm max height DIE SIZE BALL GRID ARRAY (0.5) TYP 5X ( 0.23) 1 2 A (0.5) TYP SYMM B C SYMM LAND PATTERN EXAMPLE SCALE:40X SOLDER MASK 0.05 MAX 0.05 MIN ( 0.23) OPENING SOLDER MASK OPENING ( 0.23) METAL METAL UNDER SOLDER MASK NON-SOLDER MASK SOLDER MASK DEFINED DEFINED (PREFERRED) SOLDER MASK DETAILS NOT TO SCALE 4219492/A 05/2017 NOTES: (continued) 3. Final dimensions may vary due to manufacturing tolerance considerations and also routing constraints. For more information, see Texas Instruments literature number SNVA009 (www.ti.com/lit/snva009). www.ti.com

EXAMPLE STENCIL DESIGN YZP0005 DSBGA - 0.5 mm max height DIE SIZE BALL GRID ARRAY (0.5) TYP 5X ( 0.25) (R0.05) TYP 1 2 A (0.5) TYP B SYMM C METAL SYMM TYP SOLDER PASTE EXAMPLE BASED ON 0.1 mm THICK STENCIL SCALE:40X 4219492/A 05/2017 NOTES: (continued) 4. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. www.ti.com

D: Max = 0.918 mm, Min =0 .858 mm E: Max = 0.918 mm, Min =0 .858 mm

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PACKAGE OUTLINE DSF0006A X2SON - 0.4 mm max height SCALE 10.000 PLASTIC SMALL OUTLINE - NO LEAD 1.05 B A 0.95 PIN 1 INDEX AREA 1.05 0.95 0.4 MAX C SEATING PLANE 0.05 C (0.11) TYP SYMM 0.05 0.00 3 4 2X SYMM 0.7 4X 0.35 6 1 0.22 6X 0.12 (0.1) PIN 1 ID 0.45 0.07 C B A 6X 0.35 0.05 C 4220597/A 06/2017 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. Reference JEDEC registration MO-287, variation X2AAF. www.ti.com

EXAMPLE BOARD LAYOUT DSF0006A X2SON - 0.4 mm max height PLASTIC SMALL OUTLINE - NO LEAD 6X (0.6) (R0.05) TYP 1 6X (0.17) 6 SYMM 4X (0.35) 4 3 SYMM (0.8) LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE:40X 0.07 MIN 0.07 MAX EXPOSED METAL ALL AROUND ALL AROUND EXPOSED METAL SOLDER MASK SOLDER MASK METAL METAL UNDER OPENING OPENING SOLDER MASK NON SOLDER MASK SOLDER MASK DEFINED DEFINED SOLDER MASK DETAILS 4220597/A 06/2017 NOTES: (continued) 4. For more information, see Texas Instruments literature number SLUA271 (www.ti.com/lit/slua271). www.ti.com

EXAMPLE STENCIL DESIGN DSF0006A X2SON - 0.4 mm max height PLASTIC SMALL OUTLINE - NO LEAD 6X (0.6) (R0.05) TYP 1 6X (0.17) 6 SYMM 4X (0.35) 4 3 SYMM (0.8) SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL PRINTED SOLDER COVERAGE BY AREA UNDER PACKAGE SCALE:40X 4220597/A 06/2017 4. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. www.ti.com

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GENERIC PACKAGE VIEW DRY 6 USON - 0.6 mm max height PLASTIC SMALL OUTLINE - NO LEAD Images above are just a representation of the package family, actual package may vary. Refer to the product data sheet for package details. 4207181/G

PACKAGE OUTLINE DRY0006A USON - 0.6 mm max height SCALE 8.500 PLASTIC SMALL OUTLINE - NO LEAD B 1.05 A 0.95 PIN 1 INDEX AREA 1.5 1.4 0.6 MAX C SEATING PLANE 0.05 0.00 0.08 C 3X 0.6 SYMM (0.127) TYP (0.05) TYP 3 4 4X 0.5 SYMM 2X 1 6 1 0.25 6X 0.15 0.4 0.3 0.1 C A B 0.05 C PIN 1 ID (OPTIONAL) 0.35 5X 0.25 4222894/A 01/2018 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. www.ti.com

EXAMPLE BOARD LAYOUT DRY0006A USON - 0.6 mm max height PLASTIC SMALL OUTLINE - NO LEAD SYMM (0.35) 5X (0.3) 1 6 6X (0.2) SYMM 4X (0.5) 4 3 (R0.05) TYP (0.6) LAND PATTERN EXAMPLE 1:1 RATIO WITH PKG SOLDER PADS EXPOSED METAL SHOWN SCALE:40X 0.05 MAX 0.05 MIN ALL AROUND ALL AROUND EXPOSED EXPOSED METAL METAL SOLDER MASK METAL METAL UNDER SOLDER MASK OPENING SOLDER MASK OPENING NON SOLDER MASK DEFINED SOLDER MASK DEFINED (PREFERRED) SOLDER MASK DETAILS 4222894/A 01/2018 NOTES: (continued) 3. For more information, see QFN/SON PCB application report in literature No. SLUA271 (www.ti.com/lit/slua271). www.ti.com

EXAMPLE STENCIL DESIGN DRY0006A USON - 0.6 mm max height PLASTIC SMALL OUTLINE - NO LEAD SYMM (0.35) 5X (0.3) 1 6 6X (0.2) SYMM 4X (0.5) 4 3 (R0.05) TYP (0.6) SOLDER PASTE EXAMPLE BASED ON 0.075 - 0.1 mm THICK STENCIL SCALE:40X 4222894/A 01/2018 NOTES: (continued) 4. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. www.ti.com

PACKAGE OUTLINE YZT0004 DSBGA - 0.625 mm max height SCALE 10.000 DIE SIZE BALL GRID ARRAY B E A BALL A1 CORNER D 0.625 MAX C SEATING PLANE 0.19 BALL TYP 0.15 0.05 C 0.5 TYP B SYMM 0.5 TYP D: Max = 0.918 mm, Min =0 .858 mm E: Max = 0.918 mm, Min =0 .858 mm A 0.25 1 2 4X SYMM 0.21 0.015 C A B 4219477/A 05/2017 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. www.ti.com

EXAMPLE BOARD LAYOUT YZT0004 DSBGA - 0.625 mm max height DIE SIZE BALL GRID ARRAY (0.5) TYP 4X ( 0.23) 1 2 A SYMM (0.5) TYP B SYMM LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE:50X ( 0.23) 0.05 MAX 0.05 MIN METAL METAL UNDER MASK EXPOSED SOLDER MASK METAL EXPOSED ( 0.23) OPENING METAL SOLDER MASK OPENING NON-SOLDER MASK DEFINED SOLDER MASK (PREFERRED) DEFINED SOLDER MASK DETAILS NOT TO SCALE 4219477/A 05/2017 NOTES: (continued) 3. Final dimensions may vary due to manufacturing tolerance considerations and also routing constraints. Refer to Texas Instruments Literature No. SNVA009 (www.ti.com/lit/snva009). www.ti.com

EXAMPLE STENCIL DESIGN YZT0004 DSBGA - 0.625 mm max height DIE SIZE BALL GRID ARRAY (0.5) TYP 4X ( 0.25) (R0.05) TYP 1 2 A (0.5) SYMM TYP B METAL TYP SYMM SOLDER PASTE EXAMPLE BASED ON 0.1 mm THICK STENCIL SCALE:50X 4219477/A 05/2017 NOTES: (continued) 4. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. www.ti.com

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