SN74LV244AT OCTAL BUFFER/DRIVER WITH 3-STATE OUTPUTS www.ti.com SCES572C–JUNE2004–REVISEDAUGUST2005 FEATURES • InputsAreTTL-VoltageCompatible • I SupportsPartial-Power-DownMode off • 4.5-Vto5.5-VV Operation Operation CC • Typicalt =5.4nsat5V • Latch-UpPerformanceExceeds250mAPer pd • TypicalV (OutputGroundBounce) JESD17 <0.8VatOVLP =5V,T =25(cid:176) C • ESDProtectionExceedsJESD22 CC A • TypicalV (OutputV Undershoot) – 2000-VHuman-BodyModel(A114-A) OHV OH >2.3VatV =5V,T =25(cid:176) C – 200-VMachineModel(A115-A) CC A • SupportsMixed-ModeVoltageOperationon – 1000-VCharged-DeviceModel(C101) AllPorts DB, DGV, DW, NS, OR PW PACKAGE RGY PACKAGE (TOP VIEW) (TOP VIEW) E C O C 1OE 1 20 VCC 1 V 1A1 2 19 2OE 1 20 2Y4 3 18 1Y1 1A1 2 19 2OE 1A2 4 17 2A4 2Y4 3 18 1Y1 2Y3 5 16 1Y2 1A2 4 17 2A4 1A3 6 15 2A3 2Y3 5 16 1Y2 2Y2 7 14 1Y3 1A3 6 15 2A3 1A4 8 13 2A2 2Y2 7 14 1Y3 2Y1 9 12 1Y4 1A4 8 13 2A2 GND 10 11 2A1 2Y1 9 12 1Y4 10 11 D 1 N A G 2 DESCRIPTION/ORDERING INFORMATION This octal buffer/driver is designed specifically to improve both the performance and density of 3-state memory-addressdrivers,clockdrivers,andbus-orientedreceiversandtransmitters. The SN74LV244AT is organized as two 4-bit buffers/line drivers with separate output-enable (OE) inputs. When OE is low, the device passes data from the A inputs to the Y outputs. When OE is high, the outputs are in the high-impedancestate. ORDERINGINFORMATION T PACKAGE(1) ORDERABLEPARTNUMBER TOP-SIDEMARKING A QFN–RGY Reelof1000 SN74LV244ATRGYR VV244 Tubeof25 SN74LV244ATDW SOIC–DW LV244AT Reelof2000 SN74LV244ATDWR SOP–NS Reelof2000 SN74LV244ATNSR 74LV244AT –40(cid:176) Cto85(cid:176) C SSOP–DB Reelof2000 SN74LV244ATDBR LV244AT Tubeof70 SN74LV244ATPW TSSOP–PW Reelof2000 SN74LV244ATPWR LV244AT Reelof250 SN74LV244ATPWT TVSOP–DGV Reelof2000 SN74LV244ATDGVR LV244AT (1) Packagedrawings,standardpackingquantities,thermaldata,symbolization,andPCBdesignguidelinesareavailableat www.ti.com/sc/package. Pleasebeawarethatanimportantnoticeconcerningavailability,standardwarranty,anduseincriticalapplicationsofTexas Instrumentssemiconductorproductsanddisclaimerstheretoappearsattheendofthisdatasheet. PRODUCTIONDATAinformationiscurrentasofpublicationdate. Copyright©2004–2005,TexasInstrumentsIncorporated Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarilyincludetestingofallparameters.

SN74LV244AT OCTAL BUFFER/DRIVER WITH 3-STATE OUTPUTS www.ti.com SCES572C–JUNE2004–REVISEDAUGUST2005 DESCRIPTION/ORDERING INFORMATION (CONTINUED) To ensure the high-impedance state during power up or power down, OE shall be tied to V through a pullup CC resistor;theminimumvalueoftheresistorisdeterminedbythecurrent-sinkingcapabilityofthedriver. This device is fully specified for partial-power-down applications using I . The I circuitry disables the outputs, off off preventingdamagingcurrentbackflowthroughthedevicewhenitispowereddown. FUNCTIONTABLE (EACH4-BITBUFFER/DRIVER) INPUTS OUTPUT OE A Y L H H L L L H X Z LOGICDIAGRAM(POSITIVELOGIC) 1 19 1OE 2OE 2 18 11 9 1A1 1Y1 2A1 2Y1 4 16 13 7 1A2 1Y2 2A2 2Y2 6 14 15 5 1A3 1Y3 2A3 2Y3 8 12 17 3 1A4 1Y4 2A4 2Y4 2

SN74LV244AT OCTAL BUFFER/DRIVER WITH 3-STATE OUTPUTS www.ti.com SCES572C–JUNE2004–REVISEDAUGUST2005 Absolute Maximum Ratings(1) overoperatingfree-airtemperaturerange(unlessotherwisenoted) MIN MAX UNIT V Supplyvoltagerange –0.5 7 V CC V Inputvoltagerange(2) –0.5 7 V I V Voltagerangeappliedtoanyoutputinthehigh-impedanceorpower-offstate(2) –0.5 7 V O V Outputvoltagerangeappliedinthehighorlowstate(2)(3) –0.5 V +0.5 V O CC I Inputclampcurrent V <0 –20 mA IK I I Outputclampcurrent V <0 –50 mA OK O I Continuousoutputcurrent V =0toV – 35 mA O O CC ContinuouscurrentthroughV orGND – 70 mA CC DBpackage(4) 70 DGVpackage(4) 92 DWpackage(4) 58 q Packagethermalimpedance (cid:176) C/W JA NSpackage(4) 60 PWpackage(4) 83 RGYpackage(5) 37 T Storagetemperaturerange –65 150 (cid:176) C stg (1) Stressesbeyondthoselistedunder"absolutemaximumratings"maycausepermanentdamagetothedevice.Thesearestressratings only,andfunctionaloperationofthedeviceattheseoranyotherconditionsbeyondthoseindicatedunder"recommendedoperating conditions"isnotimplied.Exposuretoabsolute-maximum-ratedconditionsforextendedperiodsmayaffectdevicereliability. (2) Theinputandoutputnegative-voltageratingsmaybeexceedediftheinputandoutputcurrentratingsareobserved. (3) Thisvalueislimitedto5.5Vmaximum. (4) ThepackagethermalimpedanceiscalculatedinaccordancewithJESD51-7 (5) ThepackagethermalimpedanceiscalculatedinaccordancewithJESD51-5. Recommended Operating Conditions(1) MIN MAX UNIT V Supplyvoltage 4.5 5.5 V CC V High-levelinputvoltage V =4.5Vto5.5V 2 V IH CC V Low-levelinputvoltage V =4.5Vto5.5V 0.8 V IL CC V Inputvoltage 0 5.5 V I Highorlowstate 0 V CC V Outputvoltage V O 3-state 0 5.5 I High-leveloutputcurrent V =4.5Vto5.5V –16 mA OH CC I Low-leveloutputcurrent V =4.5Vto5.5V 16 mA OL CC D t/D v Inputtransitionriseorfallrate V =4.5Vto5.5V 20 ns/V CC T Operatingfree-airtemperature –40 85 (cid:176) C A (1) AllunusedinputsofthedevicemustbeheldatV orGNDtoensureproperdeviceoperation.RefertotheTIapplicationreport, CC ImplicationsofSloworFloatingCMOSInputs,literaturenumberSCBA004. 3

SN74LV244AT OCTAL BUFFER/DRIVER WITH 3-STATE OUTPUTS www.ti.com SCES572C–JUNE2004–REVISEDAUGUST2005 Electrical Characteristics overrecommendedoperatingfree-airtemperaturerange(unlessotherwisenoted) PARAMETER TESTCONDITIONS V TA=25(cid:176) C TAto=8–54(cid:176)0C(cid:176) C UNIT CC MIN TYP MAX MIN MAX I =–50m A 4.5V 4.4 4.5 4.4 OH V V OH I =–16mA 4.5V 3.8 3.8 OH I =50m A 4.5V 0 0.1 0.1 OL V V OL I =16mA 4.5V 0.55 0.55 OL I V =5.5VorGND 0to5.5V – 0.1 – 1 m A I I I V =V orGND 5.5V – 0.25 – 2.5 m A OZ O CC I V =V orGND, I =0 5.5V 2 20 m A CC I CC O D I (1) Oneinputat3.4V, OtherinputsatV orGND 5.5V 1.35 1.5 mA CC CC I V orV =0to5.5V 0 0.5 5 m A off I O C V =V orGND 4.5 pF i I CC (1) ThisistheincreaseinsupplycurrentforeachinputatoneofthespecifiedTTLvoltagelevels,ratherthan0VorV . CC Switching Characteristics overrecommendedoperatingfree-airtemperaturerange,V =5V– 0.5V(unlessotherwisenoted)(seeFigure1) CC FROM TO LOAD TA=25(cid:176) C PARAMETER MIN MAX UNIT (INPUT) (OUTPUT) CAPACITANCE MIN TYP MAX t 2.6 5/4 7.4 1 8.5 PLH AorB BorA C =15pF ns L t 2.4 5.4 7.4 1 8.5 PHL t 2.2 7.7 10.4 1 12 PZH OE AorB C =15pF ns L t 2.7 7.7 10.4 1 12 PZL t 2.2 3.9 7.7 1 8 PHZ OE AorB C =15pF ns L t 2.5 3.9 7.7 1 8 PLZ t 4 5.9 8.9 1 9.5 PLH AorB BorA C =50pF ns L t 4.7 5.9 8.9 1 9.5 PHL t 3.9 8.2 11.4 1 13 PZH OE AorB C =50pF ns L t 4.9 8.2 11.4 1 13 PZL t 3.3 8.8 11.4 1 13 PHZ OE AorB C =50pF ns L t 3.2 8.8 11.4 1 13 PLZ t C =50pF 1 1 ns sk(o) L Noise Characteristics(1) V =5V,C =50pF CC L T =25(cid:176) C A PARAMETER UNIT MIN TYP MAX V Quietoutput,maximumdynamicV 0.8 1 V OL(P) OL V Quietoutput,minimumdynamicV –0.8 –1 V OL(V) OL V Quietoutput,minimumdynamicV 4 V OH(V) OH V High-leveldynamicinputvoltage 2 V IH(D) V Low-leveldynamicinputvoltage 0.8 V IL(D) (1) Characteristicsareforsurface-mountpackagesonly. 4

SN74LV244AT OCTAL BUFFER/DRIVER WITH 3-STATE OUTPUTS www.ti.com SCES572C–JUNE2004–REVISEDAUGUST2005 Operating Characteristics V =5V,T =25(cid:176) C CC A PARAMETER TESTCONDITIONS TYP UNIT C Powerdissipationcapacitance Outputsenabled C =50pF, f=10MHz 8 pF pd L 5

SN74LV244AT OCTAL BUFFER/DRIVER WITH 3-STATE OUTPUTS www.ti.com SCES572C–JUNE2004–REVISEDAUGUST2005 PARAMETER MEASUREMENT INFORMATION VCC From Output Test From Output RL = 1 kW S1 Open TEST S1 Under Test Point Under Test GND tPLH/tPHL Open CL CL tPLZ/tPZL VCC (see Note A) (see Note A) tPHZ/tPZH GND Open Drain VCC LOAD CIRCUIT FOR LOAD CIRCUIT FOR TOTEM-POLE OUTPUTS 3-STATE AND OPEN-DRAIN OUTPUTS 3 V Timing Input 1.5 V tw 0 V th 3 V tsu 3 V Input 1.5 V 1.5 V Data Input 1.5 V 1.5 V 0 V 0 V VOLTAGE WAVEFORMS VOLTAGE WAVEFORMS PULSE DURATION SETUP AND HOLD TIMES 3 V 3 V Output Input 1.5 V 1.5 V 1.5 V 1.5 V Control 0 V 0 V tPLH tPHL tPZL tPLZ Output VOH Waveform 1 ≈VCC InO-Puhtapsuet 50% VCC 50% VCVCOL (seSe 1N aott eV CBC) 50% VCC VOL + 0.3 V VOL tPHL tPLH tPZH tPHZ Output Out-ofO-Puhtapsuet 50% VCC 50% VCVVCOOHL (WseSae1v eNaftoo GtremN B D2) 50% VCC VOH − 0.3 V V≈0O HV VOLTAGE WAVEFORMS VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES ENABLE AND DISABLE TIMES INVERTING AND NONINVERTING OUTPUTS LOW- AND HIGH-LEVEL ENABLING NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO = 50 W , tr ≤(cid:0)3 ns, tf ≤ 3 ns. D. The outputs are measured one at a time, with one input transition per measurement. E. tPLZ and tPHZ are the same as tdis. F. tPZL and tPZH are the same as ten. G. tPHL and tPLH are the same as tpd. H. All parameters and waveforms are not applicable to all devices. Figure1.LoadCircuitsandVoltageWaveforms 6

PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2020 PACKAGING INFORMATION Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples (1) Drawing Qty (2) (6) (3) (4/5) SN74LV244ATDWR ACTIVE SOIC DW 20 2000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 LV244AT & no Sb/Br) SN74LV244ATNSR ACTIVE SO NS 20 2000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 74LV244AT & no Sb/Br) SN74LV244ATPW ACTIVE TSSOP PW 20 70 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 LV244AT & no Sb/Br) SN74LV244ATPWR ACTIVE TSSOP PW 20 2000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 LV244AT & no Sb/Br) SN74LV244ATRGYR ACTIVE VQFN RGY 20 3000 Green (RoHS NIPDAU Level-2-260C-1 YEAR -40 to 85 VV244 & no Sb/Br) SN74LV244ATRGYRG4 ACTIVE VQFN RGY 20 3000 Green (RoHS NIPDAU Level-2-260C-1 YEAR -40 to 85 VV244 & no Sb/Br) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement. (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. Addendum-Page 1

PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2020 (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2

PACKAGE MATERIALS INFORMATION www.ti.com 6-May-2017 TAPE AND REEL INFORMATION *Alldimensionsarenominal Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1 Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant (mm) W1(mm) SN74LV244ATDWR SOIC DW 20 2000 330.0 24.4 10.8 13.3 2.7 12.0 24.0 Q1 SN74LV244ATNSR SO NS 20 2000 330.0 24.4 8.4 13.0 2.5 12.0 24.0 Q1 SN74LV244ATPWR TSSOP PW 20 2000 330.0 16.4 6.95 7.1 1.6 8.0 16.0 Q1 SN74LV244ATRGYR VQFN RGY 20 3000 330.0 12.4 3.8 4.8 1.6 8.0 12.0 Q1 PackMaterials-Page1

PACKAGE MATERIALS INFORMATION www.ti.com 6-May-2017 *Alldimensionsarenominal Device PackageType PackageDrawing Pins SPQ Length(mm) Width(mm) Height(mm) SN74LV244ATDWR SOIC DW 20 2000 367.0 367.0 45.0 SN74LV244ATNSR SO NS 20 2000 367.0 367.0 45.0 SN74LV244ATPWR TSSOP PW 20 2000 367.0 367.0 38.0 SN74LV244ATRGYR VQFN RGY 20 3000 367.0 367.0 35.0 PackMaterials-Page2

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GENERIC PACKAGE VIEW RGY 20 VQFN - 1 mm max height 3.5 x 4.5, 0.5 mm pitch PLASTIC QUAD FGLATPACK - NO LEAD This image is a representation of the package family, actual package may vary. Refer to the product data sheet for package details. 4225264/A www.ti.com

PACKAGE OUTLINE RGY0020A VQFN - 1 mm max height SCALE 3.000 PLASTIC QUAD FLATPACK - NO LEAD A 3.65 B 3.35 PIN 1 INDEX AREA 4.65 4.35 1.0 0.8 C SEATING PLANE 0.05 0.00 0.08 C 2.05 0.1 2X 1.5 (0.2) TYP 10 11 EXPOSED THERMAL PAD 9 12 14X 0.5 2X SYMM 21 3.05 0.1 3.5 2 19 0.30 PIN 1 ID 1 20 20X 0.18 SYMM 0.1 C A B 0.5 0.05 20X 0.3 4225320/A 09/2019 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance. www.ti.com

EXAMPLE BOARD LAYOUT RGY0020A VQFN - 1 mm max height PLASTIC QUAD FLATPACK - NO LEAD (2.05) SYMM 1 20 20X (0.6) 2 19 20X (0.24) (1.275) (4.3) SYMM 21 (3.05) 14X (0.5) (0.775) 9 12 (R0.05) TYP ( 0.2) TYP VIA 10 11 (0.75) TYP (3.3) LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE:18X 0.07 MAX 0.07 MIN ALL AROUND ALL AROUND SOLDER MASK METAL OPENING EXPOSED METAL SOLDER MASK EXPOSED METAL UNDER OPENING METAL SOLDER MASK NON SOLDER MASK SOLDER MASK DEFINED DEFINED (PREFERRED) SOLDER MASK DETAILS 4225320/A 09/2019 NOTES: (continued) 4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature number SLUA271 (www.ti.com/lit/slua271). 5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown on this view. It is recommended that vias under paste be filled, plugged or tented. www.ti.com

EXAMPLE STENCIL DESIGN RGY0020A VQFN - 1 mm max height PLASTIC QUAD FLATPACK - NO LEAD SYMM 4X (0.92) 1 20 (R0.05) TYP 20X (0.6) 2 19 20X (0.24) 4X (1.33) 21 SYMM (4.3) (0.77) 14X (0.5) (0.56) 9 12 METAL TYP 10 11 (0.75) TYP (3.3) SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL EXPOSED PAD 21 78% PRINTED SOLDER COVERAGE BY AREA UNDER PACKAGE SCALE:20X 4225320/A 09/2019 NOTES: (continued) 6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. www.ti.com

PACKAGE OUTLINE DW0020A SOIC - 2.65 mm max height SCALE 1.200 SOIC C 10.63 SEATING PLANE TYP 9.97 A PIN 1 ID 0.1 C AREA 18X 1.27 20 1 13.0 2X 12.6 11.43 NOTE 3 10 11 0.51 20X 7.6 0.31 2.65 MAX B 7.4 0.25 C A B NOTE 4 0.33 TYP 0.10 0.25 SEE DETAIL A GAGE PLANE 0.3 1.27 0 - 8 0.1 0.40 DETAIL A TYPICAL 4220724/A 05/2016 NOTES: 1. All linear dimensions are in millimeters. Dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.15 mm per side. 4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.43 mm per side. 5. Reference JEDEC registration MS-013. www.ti.com

EXAMPLE BOARD LAYOUT DW0020A SOIC - 2.65 mm max height SOIC 20X (2) SYMM 1 20 20X (0.6) 18X (1.27) SYMM (R0.05) TYP 10 11 (9.3) LAND PATTERN EXAMPLE SCALE:6X SOOPLEDNEINRG MASK METAL MSOELTDAEL RU NMDAESRK SOOPLEDNEINRG MASK 0.07 MAX 0.07 MIN ALL AROUND ALL AROUND NON SOLDER MASK SOLDER MASK DEFINED DEFINED SOLDER MASK DETAILS 4220724/A 05/2016 NOTES: (continued) 6. Publication IPC-7351 may have alternate designs. 7. Solder mask tolerances between and around signal pads can vary based on board fabrication site. www.ti.com

EXAMPLE STENCIL DESIGN DW0020A SOIC - 2.65 mm max height SOIC 20X (2) SYMM 1 20 20X (0.6) 18X (1.27) SYMM 10 11 (9.3) SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL SCALE:6X 4220724/A 05/2016 NOTES: (continued) 8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 9. Board assembly site may have different recommendations for stencil design. www.ti.com

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