Product Sample & Technical Tools & Support & Folder Buy Documents Software Community SN74AHCT1G08 SCLS315Q–MARCH1996–REVISEDAPRIL2016 SN74AHCT1G08 Single 2-Input Positive-AND Gate 1 Features 3 Description • OperatingRange:4.5Vto5.5V The SN74AHCT1G08 device is a single 2-input 1 positive-AND gate. The device performs the Boolean • Maximumt of7.1nsat5V pd function Y = A • B or Y = A + B in positive logic. Low • LowPowerConsumption:MaximumICCof10-µA ICC current allows this device to be used in power- • ±8-mAOutputDriveat5V sensitiveorbattery-poweredapplications. • InputsAreTTL-VoltageCompatible DeviceInformation(1) • Latch-UpPerformanceExceeds250mA PARTNUMBER PACKAGE BODYSIZE(NOM) PerJESD17 SN74AHCT1G08DBVR SOT-23(5) 2.90mmx1.60mm 2 Applications SN74AHCT1G08DCKR SC70(5) 2.00mmx1.25mm SN74AHCT1G08DRLR SOT(5) 1.60mmx1.20mm • TV,Set-TopBox,andAudio (1) For all available packages, see the orderable addendum at • WirelessInfrastructure theendofthedatasheet. • FactoryAutomationandControl LogicDiagram • PCandNotebooks • BuildingAutomation 1 A 4 • GridInfrastructure 2 Y B • Medical,Healthcare,andFitness • Printers • TestandMeasurement • EPOS(ElectronicPointofSale) • TelecomInfrastructure • Projectors 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectualpropertymattersandotherimportantdisclaimers.PRODUCTIONDATA.

SN74AHCT1G08 SCLS315Q–MARCH1996–REVISEDAPRIL2016 www.ti.com Table of Contents 1 Features.................................................................. 1 8.2 FunctionalBlockDiagram.........................................7 2 Applications........................................................... 1 8.3 FeatureDescription...................................................7 3 Description............................................................. 1 8.4 DeviceFunctionalModes..........................................7 4 RevisionHistory..................................................... 2 9 ApplicationandImplementation.......................... 8 9.1 ApplicationInformation..............................................8 5 PinConfigurationandFunctions......................... 3 9.2 TypicalApplication....................................................8 6 Specifications......................................................... 3 10 PowerSupplyRecommendations....................... 9 6.1 AbsoluteMaximumRatings......................................3 11 Layout..................................................................... 9 6.2 ESDRatings..............................................................3 6.3 RecommendedOperatingConditions.......................4 11.1 LayoutGuidelines...................................................9 6.4 ThermalInformation..................................................4 11.2 LayoutExample......................................................9 6.5 ElectricalCharacteristics...........................................4 12 DeviceandDocumentationSupport................. 10 6.6 SwitchingCharacteristics..........................................5 12.1 DocumentationSupport........................................10 6.7 OperatingCharacteristics..........................................5 12.2 CommunityResources..........................................10 6.8 TypicalCharacteristics..............................................5 12.3 Trademarks...........................................................10 7 ParameterMeasurementInformation..................6 12.4 ElectrostaticDischargeCaution............................10 12.5 Glossary................................................................10 8 DetailedDescription.............................................. 7 13 Mechanical,Packaging,andOrderable 8.1 Overview...................................................................7 Information........................................................... 10 4 Revision History NOTE:Pagenumbersforpreviousrevisionsmaydifferfrompagenumbersinthecurrentversion. ChangesfromRevisionP(May2013)toRevisionQ Page • AddedApplicationssection,DeviceInformationtable,TableofContents,PinConfigurationandFunctionssection, Specificationssection,ESDRatingstable,ThermalInformationtable,TypicalCharacteristicssection,Detailed Descriptionsection,ApplicationandImplementationsection,PowerSupplyRecommendationssection,Layout section,DeviceandDocumentationSupportsection,andMechanical,Packaging,andOrderableInformationsection......1 ChangesfromRevisionO(June2005)toRevisionP Page • Extendedoperatingtemperaturerangeto125°C................................................................................................................... 4 2 SubmitDocumentationFeedback Copyright©1996–2016,TexasInstrumentsIncorporated ProductFolderLinks:SN74AHCT1G08

SN74AHCT1G08 www.ti.com SCLS315Q–MARCH1996–REVISEDAPRIL2016 5 Pin Configuration and Functions DBV,DCK,andDRLPackages 5-PinSOT-23,SC70,andSOT TopView A 1 5 VCC  B 2 GND 3 4 Y PinFunctions PIN I/O DESCRIPTION NAME NO. A 1 I InputA B 2 I InputB GND 3 — GroundPin V 5 — SupplyPin CC Y 4 O Output 6 Specifications 6.1 Absolute Maximum Ratings overoperatingfree-airtemperaturerange(unlessotherwisenoted).(1) MIN MAX UNIT Supplyvoltage –0.5 7 V Inputvoltage(2) –0.5 7 V Outputvoltage(2) –0.5 V +0.5 V CC Inputclampcurrent V <0 –20 mA I Outputclampcurrent V <0orV >V ±20 mA O O CC Continuousoutputcurrent V =0toV ±25 mA O CC ContinuouscurrentthroughV orGND ±50 mA CC Maximumjunctiontemperature,T 150 °C J Storagetemperature,T –65 150 °C stg (1) StressesbeyondthoselistedunderAbsoluteMaximumRatingsmaycausepermanentdamagetothedevice.Thesearestressratings only,whichdonotimplyfunctionaloperationofthedeviceattheseoranyotherconditionsbeyondthoseindicatedunderRecommended OperatingConditions.Exposuretoabsolute-maximum-ratedconditionsforextendedperiodsmayaffectdevicereliability. (2) Theinputandoutputvoltageratingsmaybeexceedediftheinputandoutputcurrentratingsareobserved. 6.2 ESD Ratings VALUE UNIT Human-bodymodel(HBM),perANSI/ESDA/JEDECJS-001(1) ±2500 V Electrostaticdischarge V (ESD) Charged-devicemodel(CDM),perJEDECspecificationJESD22-C101(2) ±1000 (1) JEDECdocumentJEP155statesthat500-VHBMallowssafemanufacturingwithastandardESDcontrolprocess. (2) JEDECdocumentJEP157statesthat250-VCDMallowssafemanufacturingwithastandardESDcontrolprocess. Copyright©1996–2016,TexasInstrumentsIncorporated SubmitDocumentationFeedback 3 ProductFolderLinks:SN74AHCT1G08

SN74AHCT1G08 SCLS315Q–MARCH1996–REVISEDAPRIL2016 www.ti.com 6.3 Recommended Operating Conditions overoperatingfree-airtemperaturerange(unlessotherwisenoted)(1) MIN MAX UNIT V Supplyvoltage 4.5 5.5 V CC V High-levelinputvoltage 2 V IH V Low-levelinputvoltage 0.8 V IL V Inputvoltage 0 5.5 V I V Outputvoltage 0 V V O CC I High-leveloutputcurrent –8 mA OH I Low-leveloutputcurrent 8 mA OL Δt/Δv Inputtransitionriseandfallrate 20 ns/V T Operatingfree-airtemperature –40 125 °C A (1) AllunusedinputsofthedevicemustbeheldatV orGNDtoensureproperdeviceoperation.SeeTIapplicationreport,Implicationsof CC SloworFloatingCMOSInputs(SCBA004). 6.4 Thermal Information SN74AHCT1G08 THERMALMETRIC(1) DBV(SOT-23) DCK(SC70) DRL(SOT) UNIT 5PINS 5PINS 5PINS R Junction-to-ambientthermalresistance 226 277.5 242.9 °C/W θJA R Junction-to-case(top)thermalresistance 165 92.9 77.5 °C/W θJC(top) R Junction-to-boardthermalresistance 59.1 64.2 77.5 °C/W θJB ψ Junction-to-topcharacterizationparameter 45.5 1.9 9.6 °C/W JT ψ Junction-to-boardcharacterizationparameter 58.3 63.5 77.3 °C/W JB (1) Formoreinformationabouttraditionalandnewthermalmetrics,seetheSemiconductorandICPackageThermalMetricsapplication report,SPRA953. 6.5 Electrical Characteristics overoperatingfree-airtemperaturerange(unlessotherwisenoted) PARAMETER TESTCONDITIONS MIN TYP MAX UNIT T =25°C 4.4 4.5 A I =–50µA,V =4.5V OH CC High-leveloutput TA=–40°Cto125°C 4.4 V V OH voltage T =25°C 3.94 A I =–8mA,V =4.5V OH CC T =–40°Cto125°C 3.8 A I =50µA,V =4.5V 0.1 OL CC Low-leveloutput V T =25°C 0.36 V OL voltage I =8mA,V =4.5V A OL CC T =–40°Cto125°C 0.44 A I Inputcurrent VI=5.5VorGND, TA=25°C ±0.1 µA I VCC=0Vto5.5V TA=–40°Cto125°C ±1 I Supplycurrent VI=VCCorGND,IO=0, TA=25°C 1 µA CC VCC=5.5V TA=–40°Cto125°C 10 ΔI (1) Changeinsupply Oneinputat3.4V,OtherInputs TA=25°C 1.35 mA CC current atVCCorGND,VCC=5.5V TA=–40°Cto125°C 1.5 C Inputcapacitance V =V orGND,V =5V 4 10 pF I I CC CC (1) ThisistheincreaseinsupplycurrentforeachinputatoneofthespecifiedTTLvoltagelevels,ratherthan0VorV . CC 4 SubmitDocumentationFeedback Copyright©1996–2016,TexasInstrumentsIncorporated ProductFolderLinks:SN74AHCT1G08

SN74AHCT1G08 www.ti.com SCLS315Q–MARCH1996–REVISEDAPRIL2016 6.6 Switching Characteristics overrecommendedoperatingfree-airtemperaturerange,V =5V±0.5V(unlessotherwisenoted)(seeFigure2) CC FROM TO OUTPUT PARAMETER TESTCONDITIONS MIN TYP MAX UNIT (INPUT) (OUTPUT) CAPACITANCE T =25°C 5 6.2 A Propagationdelay, t AorB Y C =15pF T =–40°Cto85°C 1 7.1 ns PLH lowtohightransition L A T =–40°Cto125°C 1 7.5 A T =25°C 5 6.2 A Propagationdelay, t AorB Y C =15pF T =–40°Cto85°C 1 7.1 ns PHL hightolowtransition L A T =–40°Cto125°C 1 7.5 A T =25°C 5.5 7.9 A Propagationdelay, Propagationdelay, t AorB Y C =50pF 1 9 ns PLH lowtohightransition L hightolowtransition T =–40°Cto125°C 1 10 A T =25°C 5.5 7.9 A Propagationdelay, t AorB Y C =50pF T =–40°Cto85°C 1 9 ns PHL hightolowtransition L A T =–40°Cto125°C 1 10 A 6.7 Operating Characteristics V =5V,T =25°C CC A PARAMETER TESTCONDITIONS TYP UNIT C Powerdissipationcapacitance Noload,f=1MHz 18 pF pd 6.8 Typical Characteristics 8 7.5 7 6.5 s) n d ( 6 p T 5.5 5 4.5 Tpd vs. Temp 4 -25 -5 15 35 55 75 95 115 135 Temperature ((cid:131)C) C001 C =15pF L Figure1.T vsTemperature pd Copyright©1996–2016,TexasInstrumentsIncorporated SubmitDocumentationFeedback 5 ProductFolderLinks:SN74AHCT1G08

SN74AHCT1G08 SCLS315Q–MARCH1996–REVISEDAPRIL2016 www.ti.com 7 Parameter Measurement Information VCC From Output Test From Output RL= 1 kΩ S1 Open TEST S1 UnderTest Point UnderTest GND tPLH/tPHL Open CL CL tPLZ/tPZL VCC (see NoteA) (see NoteA) tPHZ/tPZH GND Open Drain VCC LOAD CIRCUIT FOR LOAD CIRCUIT FOR TOTEM-POLE OUTPUTS 3-STATEAND OPEN-DRAIN OUTPUTS 3 V Timing Input 1.5 V tw 0 V th 3 V tsu 3 V Input 1.5 V 1.5 V Data Input 1.5 V 1.5 V 0 V 0 V VOLTAGEWAVEFORMS VOLTAGEWAVEFORMS PULSEDURATION SETUPAND HOLD TIMES 3 V 3 V Output Input 1.5 V 1.5 V 1.5 V 1.5 V Control 0 V 0 V tPLH tPHL tPZL tPLZ Output VOH Waveform 1 ≈VCC InO-Puhtapsuet 50%VCC 50% VCC S1 at VCC 50% VCC VOL+0.3V VOL (see Note B) VOL tPHL tPLH tPZH tPHZ Output Out-ofO-Puhtapsuet 50% VCC 50% VCVVCOOHL (WseSae1v eNaftoo GtremN B D2) 50% VCC VOH−0.3V≈V0O VH VOLTAGEWAVEFORMS VOLTAGEWAVEFORMS PROPAGATIONDELAYTIMES ENABLEAND DISABLE TIMES INVERTINGAND NONINVERTING OUTPUTS LOW-AND HIGH-LEVELENABLING C includesprobeandjigcapacitance. L Waveform1isforanoutputwithinternalconditionssuchthattheoutputislowexceptwhendisabledbytheoutput control. Waveform2isforanoutputwithinternalconditionssuchthattheoutputishighexceptwhendisabledbytheoutput control. Allinputpulsesaresuppliedbygeneratorshavingthefollowingcharacteristics:PRR≤1MHz,Z =50Ω,t ≤3ns, O r t ≤3ns. f Theoutputsaremeasuredoneatatimewithoneinputtransitionpermeasurement. Allparametersandwaveformsarenotapplicabletoalldevices. Figure2. LoadCircuitandVoltageWaveforms 6 SubmitDocumentationFeedback Copyright©1996–2016,TexasInstrumentsIncorporated ProductFolderLinks:SN74AHCT1G08

SN74AHCT1G08 www.ti.com SCLS315Q–MARCH1996–REVISEDAPRIL2016 8 Detailed Description 8.1 Overview The SN74AHCT1G08 device is a single 2-input positive-AND gate. The device performs the Boolean AND function (Y = A • B or Y = A + B) in positive logic. Low I current allows this device to be used in power- CC sensitiveorbattery-poweredapplications.Robustinputsallowthedevicetoup-translatewithapropagationdelay of20ns. 8.2 Functional Block Diagram 1 A 4 2 Y B Figure3. LogicDiagram(PositiveLogic) 8.3 Feature Description TheV forthedeviceisoptimizedat5V. CC Upvoltagetranslationfrom3.3Vto5Visallowed.TheinputsacceptV levelsof2V. IH Outputringingisminimizedbyslowedgerates. InputsareTTL-Voltagecompatible. 8.4 Device Functional Modes Table1liststhefunctionalmodesoftheSN74AHCT1G08. Table1.FunctionTable INPUTS OUTPUT A B Y H H H L X L X L L Copyright©1996–2016,TexasInstrumentsIncorporated SubmitDocumentationFeedback 7 ProductFolderLinks:SN74AHCT1G08

SN74AHCT1G08 SCLS315Q–MARCH1996–REVISEDAPRIL2016 www.ti.com 9 Application and Implementation NOTE Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes. Customers should validateandtesttheirdesignimplementationtoconfirmsystemfunctionality. 9.1 Application Information The SN74AHCT1G08 device is a single AND gate, which is often used for many common functions like power sequencing or an on LED indicator. Because the device is configured to output LOW unless all inputs are HIGH, an LED tied to the output of the device will only turn HIGH when all systems connected are sending a HIGH, or readysignal. 9.2 Typical Application AND Logic Function Basic LED Driver V V CC CC A–uC or Logic A–uC or Logic Y–uC or Logic AHCT1G08 AHCT1G08 B–uC or Logic B–uC or Logic Copyright © 2016,Texas Instruments Incorporated Figure4. TypicalApplicationDiagram 9.2.1 DesignRequirements ThisdeviceusesCMOStechnologyandhasbalancedoutputdrive.Takecaretoavoidbuscontentionbecauseit can drive currents that would exceed maximum limits. The high drive also creates fast edges into light loads, so routingandloadconditionsmustbeconsideredtopreventringing. 9.2.2 DetailedDesignProcedure 1. RecommendedInputConditions – Forrisetimeandfalltimespecifications,see Δt/ΔVinRecommendedOperatingConditions. – Forspecifiedhighandlowlevels,seeV andV inRecommendedOperatingConditions. IH IL – Inputsareovervoltagetolerantallowingthemtogoashighas5.5VatanyvalidV . CC 2. RecommendedOutputConditions – Loadcurrentsmustnotexceed25mAperoutputand50mAtotalforthepart. – OutputsmustnotbepulledaboveV . CC 8 SubmitDocumentationFeedback Copyright©1996–2016,TexasInstrumentsIncorporated ProductFolderLinks:SN74AHCT1G08

SN74AHCT1G08 www.ti.com SCLS315Q–MARCH1996–REVISEDAPRIL2016 Typical Application (continued) 9.2.3 ApplicationCurve 5.5 AHCT1G08 5 AC 4.5 HC VI 4 3.5 3 V) 2.5 ge ( 2 a Volt 1.5 1 0.5 0 –0.5 –1.5 0 2 4 6 8 10 12 14 16 18 20 Time (ns) V =5V Load=50 Ω/50pF CC Figure5.TypicalSwitchingCharacteristics 10 Power Supply Recommendations The power supply can be any voltage between the minimum and maximum supply voltage rating located in RecommendedOperatingConditions. Each V pin must have a good bypass capacitor to prevent power disturbance. TI recommends a 0.1-µF CC capacitor for devices with a single supply; and a 0.01-µF or 0.022-µF capactor for each power pin if there are multipleV pins.Itisoktoparallelmultiplebypasscapacitorstorejectdifferentfrequenciesofnoise.0.1-μFand CC 1-μF capacitors are commonly used in parallel. The bypass capacitor must be installed as close to the power pin aspossibleforbestresults. 11 Layout 11.1 Layout Guidelines When using multiple bit logic devices inputs must not ever float. In many cases, functions or parts of functions of digital logic devices are unused; for example, when only two inputs of a triple-input AND gate are used or only 3 of the 4 buffer gates are used. Such input pins must not be left unconnected because the undefined voltages at the outside connections result in undefined operational states. Observe the following rules under all circumstances. • All unused inputs of digital logic devices must be connected to a high or low bias to prevent them from floating. • The logic level that must be applied to any particular unused input depends on the function of the device. GenerallytheywillbetiedtoGNDorV ,whichevermakemoresenseorismoreconvenient. CC 11.2 Layout Example VCC Input Unused Input Output Unused Input Output Input Figure6. LayoutDiagram Copyright©1996–2016,TexasInstrumentsIncorporated SubmitDocumentationFeedback 9 ProductFolderLinks:SN74AHCT1G08

SN74AHCT1G08 SCLS315Q–MARCH1996–REVISEDAPRIL2016 www.ti.com 12 Device and Documentation Support 12.1 Documentation Support 12.1.1 RelatedDocumentation Forrelateddocumentation,seethefollowing: ImplicationsofSloworFloatingCMOSInputs,SCBA004 12.2 Community Resources The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. TIE2E™OnlineCommunity TI'sEngineer-to-Engineer(E2E)Community.Createdtofostercollaboration amongengineers.Ate2e.ti.com,youcanaskquestions,shareknowledge,exploreideasandhelp solveproblemswithfellowengineers. DesignSupport TI'sDesignSupport QuicklyfindhelpfulE2Eforumsalongwithdesignsupporttoolsand contactinformationfortechnicalsupport. 12.3 Trademarks E2EisatrademarkofTexasInstruments. Allothertrademarksarethepropertyoftheirrespectiveowners. 12.4 Electrostatic Discharge Caution This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriateprecautions.Failuretoobserveproperhandlingandinstallationprocedurescancausedamage. ESDdamagecanrangefromsubtleperformancedegradationtocompletedevicefailure.Precisionintegratedcircuitsmaybemore susceptibletodamagebecauseverysmallparametricchangescouldcausethedevicenottomeetitspublishedspecifications. 12.5 Glossary SLYZ022—TIGlossary. Thisglossarylistsandexplainsterms,acronyms,anddefinitions. 13 Mechanical, Packaging, and Orderable Information The following pages include mechanical packaging and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of thisdocument.Forbrowserbasedversionsofthisdatasheet,refertothelefthandnavigation. 10 SubmitDocumentationFeedback Copyright©1996–2016,TexasInstrumentsIncorporated ProductFolderLinks:SN74AHCT1G08

PACKAGE OPTION ADDENDUM www.ti.com 4-Apr-2019 PACKAGING INFORMATION Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples (1) Drawing Qty (2) (6) (3) (4/5) 74AHCT1G08DBVRE4 ACTIVE SOT-23 DBV 5 3000 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 125 B08G & no Sb/Br) 74AHCT1G08DBVRG4 ACTIVE SOT-23 DBV 5 3000 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 125 B08G & no Sb/Br) 74AHCT1G08DCKRE4 ACTIVE SC70 DCK 5 3000 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 125 (BE3, BEG, BEJ, BE & no Sb/Br) L, BES) 74AHCT1G08DCKRG4 ACTIVE SC70 DCK 5 3000 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 125 (BE3, BEG, BEJ, BE & no Sb/Br) L, BES) 74AHCT1G08DCKTG4 ACTIVE SC70 DCK 5 250 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 125 (BE3, BEG, BEL, BE & no Sb/Br) S) 74AHCT1G08DRLRG4 ACTIVE SOT-5X3 DRL 5 4000 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 125 (BEB, BES) & no Sb/Br) SN74AHCT1G08DBV3 ACTIVE SOT-23 DBV 5 3000 Pb-Free CU SNBI Level-1-260C-UNLIM -40 to 125 B08Y (RoHS) SN74AHCT1G08DBVR ACTIVE SOT-23 DBV 5 3000 Green (RoHS CU NIPDAU | CU SN Level-1-260C-UNLIM -40 to 125 (B083, B08G, B08J, & no Sb/Br) B08L, B08S) SN74AHCT1G08DBVT ACTIVE SOT-23 DBV 5 250 Green (RoHS CU NIPDAU | CU SN Level-1-260C-UNLIM -40 to 125 (B083, B08G, B08J, & no Sb/Br) B08L, B08S) SN74AHCT1G08DCK3 ACTIVE SC70 DCK 5 3000 Pb-Free CU SNBI Level-1-260C-UNLIM -40 to 125 BEY (RoHS) SN74AHCT1G08DCKR ACTIVE SC70 DCK 5 3000 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 125 (BE3, BEG, BEJ, BE & no Sb/Br) L, BES) SN74AHCT1G08DCKT ACTIVE SC70 DCK 5 250 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 125 (BE3, BEG, BEL, BE & no Sb/Br) S) SN74AHCT1G08DRLR ACTIVE SOT-5X3 DRL 5 4000 Green (RoHS CU NIPDAU | Level-1-260C-UNLIM -40 to 125 (BEB, BES) & no Sb/Br) CU NIPDAUAG (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. Addendum-Page 1

PACKAGE OPTION ADDENDUM www.ti.com 4-Apr-2019 (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement. (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2

PACKAGE MATERIALS INFORMATION www.ti.com 31-Oct-2018 TAPE AND REEL INFORMATION *Alldimensionsarenominal Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1 Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant (mm) W1(mm) 74AHCT1G08DBVRG4 SOT-23 DBV 5 3000 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3 SN74AHCT1G08DBVR SOT-23 DBV 5 3000 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3 SN74AHCT1G08DBVR SOT-23 DBV 5 3000 178.0 9.2 3.3 3.23 1.55 4.0 8.0 Q3 SN74AHCT1G08DBVR SOT-23 DBV 5 3000 180.0 8.4 3.23 3.17 1.37 4.0 8.0 Q3 SN74AHCT1G08DBVR SOT-23 DBV 5 3000 178.0 9.0 3.3 3.2 1.4 4.0 8.0 Q3 SN74AHCT1G08DBVT SOT-23 DBV 5 250 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3 SN74AHCT1G08DBVT SOT-23 DBV 5 250 178.0 9.0 3.3 3.2 1.4 4.0 8.0 Q3 SN74AHCT1G08DCKR SC70 DCK 5 3000 178.0 9.0 2.4 2.5 1.2 4.0 8.0 Q3 SN74AHCT1G08DCKR SC70 DCK 5 3000 180.0 8.4 2.47 2.3 1.25 4.0 8.0 Q3 SN74AHCT1G08DCKT SC70 DCK 5 250 178.0 9.0 2.4 2.5 1.2 4.0 8.0 Q3 SN74AHCT1G08DCKT SC70 DCK 5 250 178.0 9.2 2.4 2.4 1.22 4.0 8.0 Q3 SN74AHCT1G08DCKT SC70 DCK 5 250 180.0 9.2 2.3 2.55 1.2 4.0 8.0 Q3 SN74AHCT1G08DRLR SOT-5X3 DRL 5 4000 180.0 8.4 1.98 1.78 0.69 4.0 8.0 Q3 PackMaterials-Page1

PACKAGE MATERIALS INFORMATION www.ti.com 31-Oct-2018 *Alldimensionsarenominal Device PackageType PackageDrawing Pins SPQ Length(mm) Width(mm) Height(mm) 74AHCT1G08DBVRG4 SOT-23 DBV 5 3000 180.0 180.0 18.0 SN74AHCT1G08DBVR SOT-23 DBV 5 3000 180.0 180.0 18.0 SN74AHCT1G08DBVR SOT-23 DBV 5 3000 180.0 180.0 18.0 SN74AHCT1G08DBVR SOT-23 DBV 5 3000 202.0 201.0 28.0 SN74AHCT1G08DBVR SOT-23 DBV 5 3000 180.0 180.0 18.0 SN74AHCT1G08DBVT SOT-23 DBV 5 250 180.0 180.0 18.0 SN74AHCT1G08DBVT SOT-23 DBV 5 250 180.0 180.0 18.0 SN74AHCT1G08DCKR SC70 DCK 5 3000 180.0 180.0 18.0 SN74AHCT1G08DCKR SC70 DCK 5 3000 202.0 201.0 28.0 SN74AHCT1G08DCKT SC70 DCK 5 250 180.0 180.0 18.0 SN74AHCT1G08DCKT SC70 DCK 5 250 180.0 180.0 18.0 SN74AHCT1G08DCKT SC70 DCK 5 250 205.0 200.0 33.0 SN74AHCT1G08DRLR SOT-5X3 DRL 5 4000 202.0 201.0 28.0 PackMaterials-Page2

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PACKAGE OUTLINE DBV0005A SOT-23 - 1.45 mm max height SCALE 4.000 SMALL OUTLINE TRANSISTOR C 3.0 2.6 0.1 C 1.75 1.45 B A 1.45 MAX PIN 1 INDEX AREA 1 5 2X 0.95 3.05 2.75 1.9 1.9 2 4 3 0.5 5X 0.3 0.15 0.2 C A B (1.1) TYP 0.00 0.25 GAGE PLANE 0.22 TYP 0.08 8 TYP 0.6 0 0.3 TYP SEATING PLANE 4214839/D 11/2018 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. Refernce JEDEC MO-178. 4. Body dimensions do not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.15 mm per side. www.ti.com

EXAMPLE BOARD LAYOUT DBV0005A SOT-23 - 1.45 mm max height SMALL OUTLINE TRANSISTOR PKG 5X (1.1) 1 5 5X (0.6) SYMM (1.9) 2 2X (0.95) 3 4 (R0.05) TYP (2.6) LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE:15X SOLDER MASK SOLDER MASK METAL UNDER METAL OPENING OPENING SOLDER MASK EXPOSED METAL EXPOSED METAL 0.07 MAX 0.07 MIN ARROUND ARROUND NON SOLDER MASK SOLDER MASK DEFINED DEFINED (PREFERRED) SOLDER MASK DETAILS 4214839/D 11/2018 NOTES: (continued) 5. Publication IPC-7351 may have alternate designs. 6. Solder mask tolerances between and around signal pads can vary based on board fabrication site. www.ti.com

EXAMPLE STENCIL DESIGN DBV0005A SOT-23 - 1.45 mm max height SMALL OUTLINE TRANSISTOR PKG 5X (1.1) 1 5 5X (0.6) SYMM 2 (1.9) 2X(0.95) 3 4 (R0.05) TYP (2.6) SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL SCALE:15X 4214839/D 11/2018 NOTES: (continued) 7. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 8. Board assembly site may have different recommendations for stencil design. www.ti.com

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