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PACKAGE OPTION ADDENDUM www.ti.com 25-Sep-2013 PACKAGING INFORMATION Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples (1) Drawing Qty (2) (3) (4/5) 5962-9558101QJA ACTIVE CDIP J 24 1 TBD Call TI N / A for Pkg Type -55 to 125 5962-9558101QJ A SNJ54154J 5962-9558101QKA ACTIVE CFP W 24 1 TBD A42 N / A for Pkg Type -55 to 125 5962-9558101QK A SNJ54154W 5962-9558101QKA ACTIVE CFP W 24 1 TBD A42 N / A for Pkg Type -55 to 125 5962-9558101QK A SNJ54154W SN54154J ACTIVE CDIP J 24 1 TBD Call TI N / A for Pkg Type -55 to 125 SN54154J SN54154J ACTIVE CDIP J 24 1 TBD Call TI N / A for Pkg Type -55 to 125 SN54154J SN74154DW OBSOLETE SOIC DW 24 TBD Call TI Call TI 0 to 70 SN74154DW OBSOLETE SOIC DW 24 TBD Call TI Call TI 0 to 70 SN74154N ACTIVE PDIP N 24 15 Pb-Free CU NIPDAU N / A for Pkg Type 0 to 70 SN74154N (RoHS) SN74154N ACTIVE PDIP N 24 15 Pb-Free CU NIPDAU N / A for Pkg Type 0 to 70 SN74154N (RoHS) SN74154N3 OBSOLETE PDIP N 24 TBD Call TI Call TI 0 to 70 SN74154N3 OBSOLETE PDIP N 24 TBD Call TI Call TI 0 to 70 SN74154NE4 ACTIVE PDIP N 24 15 Pb-Free CU NIPDAU N / A for Pkg Type 0 to 70 SN74154N (RoHS) SN74154NE4 ACTIVE PDIP N 24 15 Pb-Free CU NIPDAU N / A for Pkg Type 0 to 70 SN74154N (RoHS) SNJ54154J ACTIVE CDIP J 24 1 TBD Call TI N / A for Pkg Type -55 to 125 5962-9558101QJ A SNJ54154J SNJ54154J ACTIVE CDIP J 24 1 TBD Call TI N / A for Pkg Type -55 to 125 5962-9558101QJ A SNJ54154J SNJ54154W ACTIVE CFP W 24 1 TBD A42 N / A for Pkg Type -55 to 125 5962-9558101QK A SNJ54154W SNJ54154W ACTIVE CFP W 24 1 TBD A42 N / A for Pkg Type -55 to 125 5962-9558101QK Addendum-Page 1

PACKAGE OPTION ADDENDUM www.ti.com 25-Sep-2013 Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples (1) Drawing Qty (2) (3) (4/5) A SNJ54154W (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF SN54154, SN74154 : •Catalog: SN74154 Addendum-Page 2

PACKAGE OPTION ADDENDUM www.ti.com 25-Sep-2013 •Military: SN54154 NOTE: Qualified Version Definitions: •Catalog - TI's standard catalog product •Military - QML certified for Military and Defense Applications Addendum-Page 3

MECHANICAL DATA MCDI004A – JANUARY 1995 – REVISED NOVEMBER 1997 J (R-GDIP-T**) CERAMIC DUAL-IN-LINE PACKAGE 24 PINS SHOWN B 24 13 C 1 12 0.065 (1,65) Lens Protrusion (Lens Optional) 0.045 (1,14) 0.010 (0.25) MAX 0.090 (2,29) 0.175 (4,45) A 0.060 (1,53) 0.140 (3,56) Seating Plane 0.018 (0,46) MIN 0.022 (0,56) 0.125 (3,18) MIN 0.100 (2,54) 0.014 (0,36) 0.012 (0,30) 0.008 (0,20) PINS ** 24 28 32 40 DIM NARR WIDE NARR WIDE NARR WIDE NARR WIDE MAX 0.624(15,85) 0.624(15,85) 0.624(15,85) 0.624(15,85) 0.624(15,85) 0.624(15,85) 0.624(15,85) 0.624(15,85) ”A” MIN 0.590(14,99) 0.590(14,99) 0.590(14,99) 0.590(14,99) 0.590(14,99) 0.590(14,99) 0.590(14,99) 0.590(14,99) MAX 1.265(32,13) 1.265(32,13) 1.465(37,21) 1.465(37,21) 1.668(42,37) 1.668(42,37) 2.068(52,53) 2.068(52,53) ”B” MIN 1.235(31,37) 1.235(31,37) 1.435(36,45) 1.435(36,45) 1.632(41,45) 1.632(41,45) 2.032(51,61) 2.032(51,61) MAX 0.541(13,74) 0.598(15,19) 0.541(13,74) 0.598(15,19) 0.541(13,74) 0.598(15,19) 0.541(13,74) 0.598(15,19) ”C” MIN 0.514(13,06) 0.571(14,50) 0.514(13,06) 0.571(14,50) 0.514(13,06) 0.571(14,50) 0.514(13,06) 0.571(14,50) 4040084/C 10/97 NOTES: A. All linear dimensions are in inches (millimeters). B. This drawing is subject to change without notice. C. Window (lens) added to this group of packages (24-, 28-, 32-, 40-pin). D. This package can be hermetically sealed with a ceramic lid using glass frit. E. Index point is provided on cap for terminal identification. • POST OFFICE BOX 655303 DALLAS, TEXAS 75265

MECHANICAL DATA MCFP007 – OCTOBER 1994 W (R-GDFP-F24) CERAMIC DUAL FLATPACK 0.375 (9,53) Base and Seating Plane 0.340 (8,64) 0.006 (0,15) 0.004 (0,10) 0.090 (2,29) 0.395 (10,03) 0.045 (1,14) 0.045 (1,14) 0.360 (9,14) 0.026 (0,66) 0.360 (9,14) 0.360 (9,14) 0.240 (6,10) 0.240 (6,10) 0.019 (0,48) 1 24 0.015 (0,38) 0.050 (1,27) 0.640 (16,26) 0.490 (12,45) 0.030 (0,76) 0.015 (0,38) 12 30° TYP 13 1.115 (28,32) 0.840 (21,34) 4040180-5/B 03/95 NOTES: A. All linear dimensions are in inches (millimeters). B. This drawing is subject to change without notice. C. This package can be hermetically sealed with a ceramic lid using glass frit. D. Falls within MIL-STD-1835 GDFP2-F24 and JEDEC MO-070AD E. Index point is provided on cap for terminal identification only. • POST OFFICE BOX 655303 DALLAS, TEXAS 75265

MECHANICAL DATA MPDI006B – SEPTEMBER 2001 – REVISED APRIL 2002 N (R–PDIP–T24) PLASTIC DUAL–IN–LINE 1.222 (31,04) MAX 24 13 0.360 (9,14) MAX 1 12 0.070 (1,78) MAX 0.200 (5,08) MAX 0.425 (10,80) MAX 0.020 (0,51) MIN Seating Plane 0.125 (3,18) MIN 0.100 (2,54) 0’–15’ 0.021 (0,53) 0.010 (0,25) 0.015 (0,38) 0.010 (0,25) NOM 4040051–3/D 09/01 NOTES: A. All linear dimensions are in inches (millimeters). B. This drawing is subject to change without notice. C. Falls within JEDEC MS–010 • POST OFFICE BOX 655303 DALLAS, TEXAS 75265

MECHANICAL DATA MPDI008 – OCTOBER 1994 N (R-PDIP-T**) PLASTIC DUAL-IN-LINE PACKAGE 24 PIN SHOWN A 24 13 0.560 (14,22) 0.520 (13,21) 1 12 0.060 (1,52) TYP 0.200 (5,08) MAX 0.610 (15,49) 0.020 (0,51) MIN 0.590 (14,99) Seating Plane 0.100 (2,54) 0.125 (3,18) MIN 0°–15° 0.021 (0,53) 0.010 (0,25) M 0.015 (0,38) 0.010 (0,25) NOM PINS ** 24 28 32 40 48 52 DIM 1.270 1.450 1.650 2.090 2.450 2.650 A MAX (32,26) (36,83) (41,91) (53,09) (62,23) (67,31) 1.230 1.410 1.610 2.040 2.390 2.590 A MIN (31,24) (35,81) (40,89) (51,82) (60,71) (65,79) 4040053/B 04/95 NOTES: A. All linear dimensions are in inches (millimeters). B. This drawing is subject to change without notice. C. Falls within JEDEC MS-011 D. Falls within JEDEC MS-015 (32 pin only) • POST OFFICE BOX 655303 DALLAS, TEXAS 75265

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