SDC15 TVS Diode Array for ESD Protection of 12V Data and Power Lines PPRROOTTEECCTTIIOONN PPRROODDUUCCTTSS Description Features The SDC15 transient voltage suppressor (TVS) is (cid:139) 300 watts peak pulse power (t = 8/20µs) p designed to protect components which are connected (cid:139) 40 watts peak pulse power (t = 10/1000µs) to data and transmission lines from voltage surges p (cid:139) Transient protection for data and power lines to caused by electrostatic discharge (((((EEEEESSSSSDDDDD))))), electrical fast IEC 61000-4-2 (ESD) ±15kV (air), ±8kV (contact) transients (((((EEEEEFFFFFTTTTT))))) , and llllliiiiiggggghhhhhtttttnnnnniiiiinnnnnggggg. IEC 61000-4-4 (EFT) 40A (5/50ns) TVS diodes are characterized by their high surge IEC 61000-4-5 (Lightning) 12A (1.2/50µs) capability, low operating and clamping voltages, and (cid:139) Protects one bidirectional line fast response time. This makes them ideal for use as (cid:139) Low clamping voltage board level protection of sensitive semiconductor (cid:139) Low leakage current components. The dual-junction common-cathode (cid:139) High surge capability design allows the user to protect one data or power (cid:139) Solid-state silicon avalanche technology line operating at ±12 volts. The low profile SOT23 package allows flexibility in the design of “crowded” Mechanical Characteristics circuit boards. (cid:139) JEDEC SOT23 package The SDC15 TVS will meet the surge requirements of (cid:139) Molding compound flammability rating: UL 94V-0 IEC 61000-4-2 (Formerly IEC 801-2), Level 4, “Human (cid:139) Marking : DC15 Body Model” for air and contact discharge. (cid:139) Packaging : Tape and Reel per EIA 481 Applications (cid:139) RS-232 Data Lines (cid:139) Portable Electronics (cid:139) Industrial Controls (cid:139) Set-Top Box (cid:139) Servers, Notebook, and Desktop PC (cid:139) 12V DC Supply Protection Circuit Diagram Schematic & PIN Configuration SOT23 (Top View) Revision 12/15/04 1 www.semtech.com

SDC15 PPRROOTTEECCTTIIOONN PPRROODDUUCCTTSS Absolute Maximum Rating Rating Symbol Value Units PeakPulsePower (tp = 8/20µs) P 300 Watts pk PeakPulseCurrent (tp = 8/20µs) I 10 A PP Non-RepetitivePeakForward Current(tp=100µs) I 4 A FSMAX Thermal Resistance,Junction toAmbient θ 556 °C/W JA Lead Soldering Temperature T 260 (10 sec.) °C L Operating Temperature T -55 to+125 °C J StorageTemperature T -55 to+150 °C STG Electrical Characteristics SDC15 Parameter Symbol Conditions Minimum Typical Maximum Units ReverseStand-Off Voltage V 12.8 V RWM ReverseBreakdown Voltage V I= 1mA, 14.3 16.4 V BR t Between Pin 1 and 2 (each direction) ReverseLeakageCurrent I V = 12.8V, T=25°C 100 nA R RWM Between Pin 1 and 2 (each direction) Forward Voltage V I= 100mA, 1.3 V F F Pin 1 to3 and Pin 2 to3 TemperatureCoefficientof VBR αVBR 12 mV/°C Clamping Voltage V I = 1.9A, 21.2 V C PP tp = 10/10000µs Between Pin 1 and 2 (each direction) Junction Capacitance C V = 0V, f = 1MHz 120 pF j R Pin 1 to2  2004 Semtech Corp. 2 www.semtech.com

SDC15 PROTECTION PRODUCTS Typical Characteristics Non-Repetitive Peak Pulse Power vs. Pulse Time Power Derating Curve 10 110 100 W) 90 P (kpk 1 or IPP 80 er - wer 70 w o 60 Po d P 50 k Pulse 0.1 % of Rate 3400 a e 20 P 10 0 0.01 0 25 50 75 100 125 150 0.1 1 10 100 1000 Ambient Temperature - TA (oC) Pulse Duration - t (µs) p Pulse Waveform Clamping Voltage vs. Peak Pulse Current 110 25 Waveform 100 Parameters: 90 tr = 8µs td = 20µs V) 80 (C Percent of IPP 45670000 e-t td = IPP/2 mping Voltage - V 1250 30 a Waveform Cl Parameters: 20 tr = 8µs 10 td = 20µs 10 0 0 5 10 15 20 25 30 1 2 3 4 5 6 7 8 9 10 11 12 Time (µs) Peak Pulse Current - IPP (A) Forward Voltage vs. Forward Current 3 2.5 V) V (F 2 e - g a olt 1.5 V d orwar 1 Waveform F Parameters: 0.5 tr = 8µs td = 20µs 0 0 1 2 3 4 5 6 7 8 9 10 11 12 Forward Current - I (A) F  2004 Semtech Corp. 3 www.semtech.com

SDC15 PPRROOTTEECCTTIIOONN PPRROODDUUCCTTSS Applications Information Device Connection for Protection of One Data Line Device Schematic and Pin Configuration The SDC15 is designed to protect one data or I/O line operating at ±12 volts. Connection options are as follows: (cid:122) Common mode protection: Pin 1 is connected to the data line and pin 2 is connected to ground. For best results, this pin should be connected directly to a ground plane on the board. The path length should be kept as short as possible to minimize parasitic inductance. Pin 3 is not connected. (cid:122) Differential protection: Pin 1 is connected to one line and pin 2 is connected to the second line. Pin 3 is not connected. Circuit Board Layout Recommendations for Suppres- RS-232 Transceiver Protection Example sion of ESD. Good circuit board layout is critical for the suppression of fast rise-time transients such as ESD. The following guidelines are recommended: (cid:122) Place the SDC15 near the input terminals or connectors to restrict transient coupling. (cid:122) Minimize the path length between the SDC15 and the protected line. (cid:122) Minimize all conductive loops including power and ground loops. (cid:122) The ESD transient return path to ground should be kept as short as possible. (cid:122) Never run critical signals near board edges. (cid:122) Use ground planes whenever possible. Matte Tin Lead Finish Matte tin has become the industry standard lead-free replacement for SnPb lead finishes. A matte tin finish is composed of 100% tin solder with large grains. Since the solder volume on the leads is small com- pared to the solder paste volume that is placed on the land pattern of the PCB, the reflow profile will be determined by the requirements of the solder paste. Therefore, these devices are compatible with both lead-free and SnPb assembly techniques. In addition, unlike other lead-free compositions, matte tin does not have any added alloys that can cause degradation of the solder joint.  2004 Semtech Corp. 4 www.semtech.com

SDC15 PROTECTION PRODUCTS Outline Drawing - SOT23 D A DIMENSIONS INCHES MILLIMETERS e1 DIM MIN NOMMAX MINNOMMAX 3 H AA1 ..000305 -- ..000444 00..0819 -- 01..1102 B A2 .035 .037 .040 0.88 0.95 1.02 b .012 - .020 0.30 - 0.51 GAUGE 0 c c .003 - .007 0.08 - 0.18 SEATING PLANE D .110 .114 .120 2.80 2.90 3.04 E PLANE E .082 .093 .104 2.10 2.37 2.64 E1 0.25 E1 .047 .051 .055 1.20 1.30 1.40 C e .075 1.90 BSC L e1 .037 0.95 BSC L1 L .015 .020 .024 0.40 0.50 0.60 DETAIL A L1 .022 (0.55) N 3 3 1 2 0 0° - 8° 0° - 8° aaa .004 0.10 bxN bbb .008 0.20 e bbb C A B A A2 3X aaa C SEE DETAIL A SIDE VIEW SEATING PLANE A1 C NOTES: 1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). 2. DATUMS - A - AND - B - TO BE DETERMINED AT DATUM PLANE -H- 3. DIMENSIONS "E1" AND "D" DO NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. Land Pattern - SOT23 X Y DIMENSIONS DIM INCHES MILLIMETERS C (.087) (2.20) Z G C E .037 0.95 E1 .075 1.90 G .031 0.80 X .039 1.00 Y .055 1.40 Z .141 3.60 Y E E1 NOTES: 1. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR COMPANY'S MANUFACTURING GUIDELINES ARE MET. Note 1 : Grid placement cou2.rtyRaEFrEdR EisN C8E xIP C8- SeMl-e78m2Ae.nts (4mm x 4mm) in accordance with the international grid detailed in IEC Publication 97.  2004 Semtech Corp. 5 www.semtech.com

SDC15 PPRROOTTEECCTTIIOONN PPRROODDUUCCTTSS Ordering Information Lead Qtyper Part Number ReelSize Finish Reel SDC15.TC SnPb 3,000 7Inch SDC15.TCT Pb Free 3,000 7Inch Contact Information Semtech Corporation Protection Products Division 200 Flynn Road, Camarillo, CA 93012 Phone: (805)498-2111 FAX (805)498-3804  2004 Semtech Corp. 6 www.semtech.com